sinusoidal; Tj = 125 ˚C prior to
surge; with reapplied V
RRM(max)
Peak repetitive reversepulse width and repetition rate-1A
surge currentlimited by T
Operating junction-150˚C
j max
temperature
Storage temperature- 65175˚C
1 It is not possible to make connection to pin 2 of the SOT404 package
March 19981Rev 1.100
Page 2
Philips SemiconductorsProduct specification
Rectifier diodesPBYR10100B series
Schottky barrier
THERMAL RESISTANCES
SYMBOL PARAMETERCONDITIONSMIN.TYP. MAX. UNIT
R
th j-mb
R
th j-a
ELECTRICAL CHARACTERISTICS
Tj = 25 ˚C unless otherwise specified
SYMBOL PARAMETERCONDITIONSMIN.TYP. MAX. UNIT
V
F
I
R
C
d
Thermal resistance junction--2K/W
to mounting base
Thermal resistance junctionpcb mounted, minimum footprint, FR4-50-K/W
to ambientboard
Forward voltageIF = 10 A; Tj = 125˚C-0.610.7V
IF = 20 A; Tj = 125˚C-0.740.85V
IF = 20 A-0.880.95V
Reverse currentVR = V
Junction capacitanceVR = 5 V; f = 1 MHz, Tj = 25˚C to 125˚C-420-pF
VR = V
RWM
; Tj = 125˚C-515mA
RWM
-5150µA
March 19982Rev 1.100
Page 3
Philips SemiconductorsProduct specification
Rectifier diodesPBYR10100B series
Schottky barrier
PF / W
15
Vo = 0.550 V
Rs = 0.015 Ohms
10
5
0
010
PBYR10100
0.2
0.1
5
IF(AV) / A
0.5
I
Tmb / C
D = 1.0
t
D =
p
T
t
t
p
T
Fig.1. Maximum forward dissipation PF = f(I
square current waveform where I
10
8
6
4
2
PF / W
Vo = 0.550 V
Rs = 0.015 Ohms
PBYR10100
2.2
2.8
4
F(AV)
1.9
=I
F(RMS)
Tmb / C
a = 1.57
120
130
140
150
15
F(AV)
x √D.
130
134
138
142
146
100
10
IR / mA
150 C
PBYR10100
125 C
1
100 C
75 C
0.1
Tj = 50 C
0.01
0
50100
VR/ V
);
Fig.4. Typical reverse leakage current; IR = f(VR);
10000
1000
100
parameter T
Cd/ pF
j
PBYR20100CT
0
0246810
IF(AV) / A
Fig.2. Maximum forward dissipation PF = f(I
sinusoidal current waveform where a = form
factor = I
IF / A
50
Tj = 25 C
Tj = 125 C
40
TypMax
30
20
10
0
012
0.51.5
F(RMS)
VF / V
/ I
.
F(AV)
PBYR10100
150
F(AV)
);
Fig.3. Typical and maximum forward characteristic
IF = f(VF); parameter T
j
10
110100
VR/ V
Fig.5. Typical junction capacitance; Cd = f(VR);
f = 1 MHz; Tj = 25˚C to 125 ˚C.
Transient thermal impedance, Zth j-mb (K/W)
10
1
0.1
p
p
t
0.01
0.001
1us10us 100us 1ms10ms 100ms1s10s
P
D
pulse width, tp (s)
T
Fig.6. Transient thermal impedance; Z
t
D =
T
t
PBYR10100
th j-mb
= f(tp).
March 19983Rev 1.100
Page 4
Philips SemiconductorsProduct specification
Rectifier diodesPBYR10100B series
Schottky barrier
MECHANICAL DATA
Dimensions in mm
Net Mass: 1.4 g
2.54 (x2)
MOUNTING INSTRUCTIONS
Dimensions in mm
10.3 max
11 max
15.4
0.85 max
(x2)
4.5 max
1.4 max
0.5
Fig.7. SOT404 : centre pin connected to mounting base.
11.5
2.5
Notes
1. Epoxy meets UL94 V0 at 1/8".
9.0
17.5
2.0
3.8
5.08
Fig.8. SOT404 : soldering pattern for surface mounting
.
March 19984Rev 1.100
Page 5
Philips SemiconductorsProduct specification
Rectifier diodesPBYR10100B series
Schottky barrier
DEFINITIONS
Data sheet status
Objective specificationThis data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specificationThis data sheet contains final product specifications.
Limiting values
Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and
operation of the device at these or at any other conditions above those given in the Characteristics sections of
this specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
Philips Electronics N.V. 1998
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the
copyright owner.
The information presented in this document does not form part of any quotation or contract, it is believed to be
accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under patent or other
industrial or intellectual property rights.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices or systems where malfunction of these
products can be reasonably expected to result in personal injury. Philips customers using or selling these products
for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting
from such improper use or sale.
March 19985Rev 1.100
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