Datasheet OP450, OP250 Datasheet (Analog Devices)

Page 1
OP250
OUT A
–IN A
+IN A
OUT B
–IN B
+IN B
V+
1
2
3
4
8
7
6
5
(Not to Scale) –IN A +IN A
OUT B –IN B +IN B
V+
1
4
5
8
OUT A
OP250
OUT A
–IN A +IN A
V+
–IN D +IN D V–
OUT D1 2 3 4
14 13 12
11 +IN B –IN B
OUT B
–IN C OUT C
+IN C5 6 7
10
9 8
OP450
(Not to Scale)
AD8532
OUT A
–IN A +IN A
V+
–IN D +IN D V–
OUT D
1
14
+IN B –IN B
OUT B
–IN C OUT C
+IN C
78
OP450
1
14
78
CMOS Single-Supply Rail-to-Rail
a
Input/Output Operational Amplifiers
FEATURES Single-Supply Operation: 2.7 V to 6 V High Output Current: 6100 mA Low Supply Current: 800 mA/Amp Wide Bandwidth: 1 MHz Slew Rate: 2.2 V/ms No Phase Reversal Low Input Currents Unity Gain Stable
APPLICATIONS Battery Powered Instrumentation Medical Remote Sensors ASIC Input or Output Amplifier Automotive
GENERAL DESCRIPTION
The OP250 and OP450 are dual and quad CMOS single-supply, amplifiers featuring rail-to-rail inputs and outputs. Both are guar­anteed to operate from a +2.7 V to +5 V single supply.
These amplifiers have very low input bias currents. Outputs are capable of driving 100 mA loads and are stable with capacitive loads. Supply current is less than 1 mA per amplifier.
Applications for these amplifiers include portable medical equipment, safety and security, and interface to transducers with high output impedance.
The ability to swing rail-to-rail at both the input and output en­ables designers to build multistage filters in single-supply sys­tems and maintain high signal-to-noise ratios.
The OP250 and OP450 are specified over the extended indus­trial (–40°C to +125°C) temperature range. The OP250, dual, is available in 8-lead TSSOP and SO surface mount packages. The OP450, quad, is available in 14-lead thin shrink small out­line (TSSOP) and narrow 14-lead SO packages.
OP250/OP450
PIN CONFIGURATIONS
8-Lead Narrow Body SO
(SO-8)
8-Lead TSSOP
(RU-8)
14-Lead Narrow Body SO
(N-14)
14-Lead TSSOP
(RU-14)
REV. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
One Technology Way, P.O. Box 9106, Norwood. MA 02062-9106, U.S.A. Tel: 781/329-4700 World Wide Web Site: http://www.analog.com Fax: 781/326-8703 © Analog Devices, Inc., 1997
Page 2
OP250/OP450–SPECIFICA TIONS
ELECTRICAL CHARACTERISTICS
(V
= 13.0 V, TA = 1258C, VCM = 1.5 V unless otherwise noted)
S
Parameter Symbol Conditions Min Typ Max Units
INPUT CHARACTERISTICS
Offset Voltage V Input Bias Current I
Input Offset Current I
B
OS
OS
–40°C < T –40°C < T
–40°C < T –40°C < T
< +125°C20mV
A
< +85°C60pA
A
< +125°C 500 pA
A
< +125°C60pA
A
8mV
240 pA
0.5 25 pA
Input Voltage Range 03V Common-Mode Rejection Ratio CMRR V
Large Signal Voltage Gain A Offset Voltage Drift V Bias Current Drift I
VO
/T10µV/°C
OS
/T 1.8 pA/°C
B
= 0 V to 3 V 40 55 dB
CM
–40°C < T
< +125°C35 dB
A
RL = 2 k , VO = 0.3 V to 2.7 V 800 V/mV
Offset Current Drift IOS/T 0.07 pA/°C
OUTPUT CHARACTERISTICS
Output Voltage High V
OH
IL = 100 µA 2.99 V I
= 10 mA 2.85 2.94 V
L
–40°C to +125°C 2.8 V
Output Voltage Low V
OL
IL = 100 µA1mV I
= 10 mA 55 100 mV
L
–40°C to +125°C 125 mV Output Current I Open Loop Impedance Z
OUT
OUT
f = 1 MHz, AV = 1 180
100 mA
POWER SUPPLY
Power Supply Rejection Ratio PSRR V Supply Current/Amplifier I
SY
= 2.7 V to 6 V 60 80 dB
S
–40°C < T
< +125°C55 dB
A
VO = 0 V 700 1,000 µA
–40°C < TA < +125°C 1,250 µA
DYNAMIC PERFORMANCE
Slew Rate SR R Settling Time t
S
= 10 k 1.9 V/µs
L
To 0.01% 4 µs Gain Bandwidth Product GBP 0.95 MHz Phase Margin Øo 46 Degrees Channel Separation CS f = 1 kHz, RL = 10 k 100 dB
NOISE PERFORMANCE
Voltage Noise e Voltage Noise Density e
n n
p–p
0.1 Hz to 10 Hz 10 µV
f = 1 kHz 45 nV/Hz
p–p
f = 10 kHz 30 nV/ Current Noise Density i
Specifications subject to change without notice.
n
f = 1 kHz 0.05 pA/Hz
Hz
–2–
REV. 0
Page 3
OP250/OP450
ELECTRICAL CHARACTERISTICS
(V
= 15.0 V, TA = 1258C, VCM =2.5 V unless otherwise noted)
S
Parameter Symbol Conditions Min Typ Max Units
INPUT CHARACTERISTICS
Offset Voltage V Input Bias Current I
Input Offset Current I
B
OS
OS
–40°C < T –40°C < T
–40°C < T –40°C < T
< +125°C20mV
A
< +85°C60pA
A
< +125°C 500 pA
A
< +125°C60pA
A
2 7.5 mV 240 pA
0.5 25 pA
Input Voltage Range 05V Common-Mode Rejection Ratio CMRR V
Large Signal Voltage Gain A Offset Voltage Drift V Bias Current Drift I
VO
/T –40°C < TA < +125°C10µV/°C
OS
/T 1.8 pA/°C
B
= 0 V to 5 V 45 60 dB
CM
–40°C < T
< +125°C40 dB
A
RL = 2 k , Vo = 0.3 V to 4.7 V 1,000 V/mV
Offset Current Drift IOS/T 0.07 pA/°C
OUTPUT CHARACTERISTICS
Output Voltage High V
OH
IL = 100 µA 4.99 V I
= 10 mA 4.9 4.94 V
L
–40°C to +125°CmV
Output Voltage Low V
OL
IL = 100 µA1V I
= 10 mA 40 100 mV
L
–40°C to +125°C 125 mV Output Current I Open Loop Impedance Z
OUT
OUT
f =1 MHz, AV = 1 200
±100 mA
POWER SUPPLY
Power Supply Rejection Ratio PSRR V Supply Current/Amplifier I
SY
= 2.7 V to 6 V 60 80 dB
S
–40°C < T
< +125°C55 dB
A
VO = 0 V 800 1,250 µA
–40°C < TA < +125°C 750 1,750 µA
DYNAMIC PERFORMANCE
Slew Rate SR R Full-Power Bandwidth BW Settling Time t
P
S
= 10 k 2.2 V/µs
L
1% Distortion 100 kHz
To 0.01% 3 µs Gain Bandwidth Product GBP 1 MHz Phase Margin Øo 48 Degrees Channel Separation CS f = 1 kHz, RL = 10 k 100 dB
NOISE PERFORMANCE
Voltage Noise e Voltage Noise Density e
n n
p–p
0.1 Hz to 10 Hz 10 µV
f = 1 kHz 45 nV/Hz
p–p
f = 10 kHz 30 nV/ Current Noise Density i
Specifications subject to change without notice.
n
f = 1 kHz 0.05 pA/Hz
Hz
REV. 0
–3–
Page 4
OP250/OP450
WARNING!
ESD SENSITIVE DEVICE
ABSOLUTE MAXIMUM RATINGS
Supply Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +6 V
Input Voltage
2
. . . . . . . . . . . . . . . . . . . . . . . . . . . . GND to V
Common-Mode Input Voltage . . . . . . . . . . . . . . . . . . . . ±6 V
Output Short-Circuit
Duration to GND . . . . . . . . . . . . . Observe Derating Curves
ESD Susceptibility. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2000 V
Storage Temperature Range
S, RU Package . . . . . . . . . . . . . . . . . . . . . 265°C to +150°C
Operating Temperature Range
1, 2
Package Type u
8-Lead SOIC (S) 158 43 °C/W
S
8-Lead TSSOP (RU) 240 43 °C/W 14-Lead SOIC (N) 120 36 °C/W 14-Lead TSSOP (RU) 180 35 °C/W
*θJA is specified for the worst case conditions, i.e., θ
in circuit board for surface mount packages.
ORDERING GUIDE
OP250G/OP450G . . . . . . . . . . . . . . . . . . 240°C to +125°C
Junction Temperature Range
S, RU Package . . . . . . . . . . . . . . . . . . . . . 265°C to +150°C
Lead Temperature Range (Soldering, 60 sec) . . . . . . . +300°C
NOTES
1
Absolute maximum ratings apply at +25°C, unless otherwise noted.
2
Stresses above those listed under Absolute Maximum Ratings may cause perma­nent damage to the device. This is a stress rating only; the functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Model Range Description Options
OP250GS –40°C to +125°C 8-Lead SOIC SO-8 OP250GRU –40°C to +125°C 8-Lead TSSOP RU-8 OP450GS –40°C to +125°C 14-Lead SOIC N-14 OP450GRU –40°C to +125°C 14-Lead TSSOP RU-14
Temperature Package Package
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the OP250/OP450 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
*
JA
u
JC
specified for device soldered
JA
Units
–4–
REV. 0
Page 5
T ypical Performance Characteristics–OP250/OP450
10k
VS = +2.7V
= +25 C
T
A
1k
100
10
OUTPUT VOLTAGE – mV
1
0.1
0.001 1000.01
0.1 1 10
LOAD CURRENT – mA
SOURCE
SINK
Figure 1. Output Voltage to Supply Rail vs. Load Current
1k
VS = +5V
= +25 C
T
A
100
10
SOURCE
SINK
0.9 TA = +25 C
0.8
0.7
0.6
0.5
0.4
0.3
0.2
SUPPLY CURRENT / AMPLIFIER – mA
0.1
0
0.75 31
1.25 1.5 1.75 2 2.25 2.5 2.75 SUPPLY VOLTAGE – V
Figure 4. Supply Current per Amplifier vs. Supply Voltage
1
VS = +5V V
= +2.5V
CM
0.5
0
OUTPUT VOLTAGE – mV
1
0.1
0.001 1000.01
0.1 1 10
LOAD CURRENT – mA
Figure 2. Output Voltage to Supply Rail vs. Load Current
0.85
0.8
0.75
0.7
SUPPLY CURRENT / AMPLIFIER – mA
0.65 –55 145–5
–35 –15 45 85 125
25 65 105
TEMPERATURE – C
VS = +5V
VS = +3V
Figure 3. Supply Current per Amplifier vs. Temperature
–0.5
INPUT OFFSET VOLTAGE – mV
–1
–55 145–5
–35 –15 45 85 125
25 65 105
TEMPERATURE – C
Figure 5. Input Offset Voltage vs. Temperature
400
VS = +5V, +3V V
= VS/2
CM
300
200
100
INPUT BIAS CURRENT – pA
0 –55 145–5
–35 –15 45 85 125
25 65 105
TEMPERATURE – C
Figure 6. Input Bias Current vs. Temperature
REV. 0
–5–
Page 6
OP250/OP450–Typical Performance Characteristics
5
VS = +5V, +3V V
= VS/2
CM
4
3
2
INPUT OFFSET CURRENT – pA
1
0 –55 145–5
25 65 105–35 –15 45 85 125
TEMPERATURE – C
Figure 7. Input Offset Current vs. Temperature
2
V
= +5V, +3V
S
= +25 C
T
A
1
80
60
40
20
0
GAIN – dB
–20
–40
–60
–80
1k 100M10k
VS = +5V
= NO LOAD
R
L
= +25 C
T
A
100k 1M 10M
FREQUENCY – Hz
Figure 10. Open-Loop Gain and Phase
5
VS = +2.7V
= 2 k
R
L
VIN = 2.5 V TA = +25 C
P–P
4
P–P
3
0
–45
–90
–135
–180
–225
PHASE SHIFT – DEGREES
–270
–315
–360
0
INPUT BIAS CURRENT – pA
–1
051
234
COMMON-MODE VOLTAGE – V
Figure 8. Input Bias Current vs. Common-Mode Voltage
80
60
40
20
0
GAIN – dB
–20
–40
–60
–80
1k 100M10k
VS = +2.7V
= NO LOAD
R
L
= +25 C
T
A
100k 1M 10M
FREQUENCY – Hz
0
–45
–90
–135
–180
–225
PHASE SHIFT – DEGREES
–270
–315
–360
Figure 9. Open-Loop Gain and Phase
2
OUTPUT SWING – V
1
0
1 10k10
100 1k
FREQUENCY – Hz
Figure 11. Closed-Loop Output Voltage Swing vs. Frequency
5
4
P–P
3
2
OUTPUT SWING – V
1
0
1 10k10
100 1k
FREQUENCY – Hz
VS = +5.0V
= 2 k
R
L
VIN = 4.9 V TA = +25 C
P–P
Figure 12. Closed-Loop Output Voltage Swing vs. Frequency
–6–
REV. 0
Page 7
400
FREQUENCY – Hz
100
60
1k 10k
POWER SUPPLY REJECTION RATIO – dB
100k 1M 10M
40
20
0
VS = +5V T
A
= +25 C
+PSRR
100
–PSRR
80
350
300
250
VS = +5V
= NO LOAD
R
L
= +25 C
T
A
OP250/OP450
AV = +1
200
150
IMPEDANCE –
100
50
0
1k
10k 100k
FREQUENCY – Hz
AV = +10
1M 10M 100M
Figure 13. Closed-Loop Output Impedance vs. Frequency
80
VS = +5V
70
= +25 C
T
A
60 50
40 30
20
10
0
COMMON-MODE REJECTION – dB
–10 –20
1 10k10
100 1k
FREQUENCY – Hz
Figure 16. Power Supply Rejection vs. Frequency
70
VS = +2.7V
= 2 k
R
L
60
TA = +25 C
50
40
30
20
SMALL SIGNAL OVERSHOOT – %
10
0
10 1k100
CAPACITANCE – pF
+O
–O
S
S
Figure 14. Common-Mode Rejection vs. Frequency
100
80
60
40
20
0
POWER SUPPLY REJECTION RATIO – dB
–20
100
Figure 15. Power Supply Rejection vs. Frequency
REV. 0
VS = +2.7V
= +25 C
T
A
–PSRR
1k 10k
FREQUENCY – Hz
+PSRR
100k 1M 10M
Figure 17. Small Signal Overshoot vs. Load Capacitance
70
VS = +5.0V
= 2 k
R
L
60
TA = +25 C
50
40
30
20
SMALL SIGNAL OVERSHOOT – %
10
0
10 1k100
CAPACITANCE – pF
–O
S
+O
S
Figure 18. Small Signal Overshoot vs. Load Capacitance
–7–
Page 8
OP250/OP450–Typical Performance Characteristics
VS = 1.35V V
= 50mV
IN
= 1
A
V
R
= 2k
L
CL = 100pF T
= 25 C
A
2µs
25mV
Figre 19. Small Signal Transient Response
VS = 2.5V V
= 50mV
IN
= 1
A
V
R
= 2k
L
CL = 100pF T
= 25 C
A
VS = 2.5V A
= 1
V
= 2k
R
L
TA = 25 C
2µs
1V
Figure 22. Large Signal Transient Response
2µs
25mV
Figure 20. Small Signal Transient Response
VS = 1.35V A
= 1
V
= 2k
R
L
TA = 25 C
2µs
500mV
Figure 21. Large Signal Transient Response
50µs
1V
Figure 23. No Phase Reversal
1
0.1
CURRENT NOISE DENSITY – pA/
0.01 10 100k100
1k 10k
FREQUENCY – Hz
Figure 24. Current Noise Density vs. Frequency
–8–
REV. 0
Page 9
OP250/OP450
VS = 5V FREQUENCY = 10kHz
= 25 C
T
A
30nV/
200nV
Figure 25. Voltage Noise Density vs. Frequency
VS = 5V FREQUENCY = 1kHz
= 25 C
T
A
45nV/
100nV
Figure 26. Voltage Noise Density vs. Frequency
REV. 0
–9–
Page 10
OP250/OP450
THEORY OF OPERATION
The OPx50 family of amplifiers are CMOS rail-to-rail input and output single supply amplifiers designed for low cost and high output current drive. These features make the OPx50 op amps ideal for multimedia and telecom applications.
Figure 27 shows the simplified schematic for an OPx50 ampli­fier. Two input differential pairs consisting of an n-channel pair (M1–M2) and a p-channel pair (M3–M4) provide a rail-to-rail input common-mode range. The outputs of the input differen­tial pairs are combined in a compound folded-cascode stage, which drives the input to a second differential pair gain stage. The outputs of the second gain stage provide the gate voltage drive to the rail-to-rail output stage.
The rail-to-rail output stage consists of M15 and M16, which are configured in a complementary common-source configura­tion. As with any rail-to-rail output amplifier, the gain of the output stage, and thus the open loop gain of the amplifier, is de­pendent on the load resistance. Also, the maximum output volt­age swing is directly proportional to the load current. The difference between the maximum output voltage to the supply rails, known as the dropout voltage, is determined by the OPx50’s output transistors’ on-channel resistance. The output dropout voltage is given in Figures 1 and 2.
Input Voltage Protection
Although not shown on the simplified schematic, there are ESD protection diodes connected from each input to each power supply rail. These diodes are normally reversed biased, but will turn on if either input voltage exceeds either supply rail by more than 0.6 V. Should this condition occur the input current should be limited to less than ±5 mA. This can be done by placing a resistor in series with the input. The minimum resistor value should be:
V
,
R
IN MAX
IN
(1)
mA
5
Output Phase Reversal
The OPx50 is immune to output voltage phase reversal with an input voltage within the supply voltages of the device. However, if either of the device’s inputs exceeds 0.6 V outside of the sup­ply rails, the output could exhibit phase reversal. This is due to the ESD protection diodes becoming forward biased, thus caus­ing the polarity of the input terminals of the device to switch.
The technique recommended in the Input Overvoltage Protec­tion section should be applied in applications where the possibil­ity of input voltages exceeding the supply voltages exists.
Output Short Circuit Protection
To achieve high quality rail-to-rail performance, the outputs of the OPx50 family are not short-circuit protected. Although these amplifiers are designed to sink or source as much as 250 mA of output current, shorting the output directly to ground could damage or destroy the device when excessive volt­ages or currents are applied. If to protect the output stage, the maximum output current should be limited to ± 250 mA.
By placing a resistor in series with the output of the amplifier as shown in Figure 28, the output current can be limited. The minimum value for R
can be found from Equation 2.
X
V
250
SY
(2)
mA
R
X
For a +5 V single supply application, RX should be at least 20 . Because R fected. The trade-off in using R voltage swing under heavy output current loads. R
is inside the feedback loop, V
X
is a slight reduction in output
X
is not af-
OUT
will also
X
increase the effective output impedance of the amplifier to R
+ RX, where RO is the output impedance of the device.
O
V
CC
BIAS
–V
IN
M1 M2
BIAS
M3 M4
BIAS
+V
IN
V
EE
M5
M6
V
OUT
Figure 27. OPx50 Simplified Schematic
–10–
REV. 0
Page 11
+5V
R
V
IN
OP250
20
X
V
OUT
Figure 28. Output Short-Circuit Protection
Power Dissipation
Although the OPx50 family of amplifiers are able to provide load currents of up to 250 mA, proper attention should be given to not exceed the maximum junction temperature for the device. The equation for finding the junction temperature is given as:
T
=+PT
JJA
×
θ
DISS A
(3)
500mV
OP250/OP450
1µs
Where TJ = OPx50 junction temperature
P
= OPx50 power dissipation
DISS
θ
= OPx50 junction-to-ambient thermal resistance of
JA
the package; and
T
= The ambient temperature of the circuit
A
In any application, the absolute maximum junction temperature must be limited to +150°C. If this junction temperature is ex­ceeded, the device could suffer premature failure. If the output voltage and output current are in phase, for example, with a purely resistive load, the power dissipated by the OPx50 can be found as:
P
=×−
Where I
IVV
DISS
= OPx50 output load current
LOAD
V
= OPx50 supply voltage; and
SY
V
= The output voltage
OUT
LOAD SY OUT
()
(4)
By calculating the power dissipation of the device and using the thermal resistance value for a given package type, the maximum allowable ambient temperature for an application can be found using Equation 3.
Overdrive Recovery
The overdrive, or overload, recovery time of an amplifier is the time required for the output voltage to return to a rated output voltage from a saturated condition. This recovery time can be important in applications where the amplifier must recover quickly after a large transient event. The circuit in Figure 29 was used to evaluate the recovery time for the OPx50. Figures 30 and 31 show the overload recovery of the OP250 from the positive and negative rails. It takes approximately 0.5 ms for the amplifier to recover from output overload.
Figure 30. Saturation Recovery from the Positive Rail
500mV
1µs
Figure 31. Saturation Recovery from the Negative Rail
Capacitive Loading
The OPx50 family of amplifiers is well suited to driving capaci­tive loads. The device will remain stable at unity gain even un­der heavy capacitive load conditions. However, a capacitive load does not come without a penalty in bandwidth. Figure 32 shows a graph of the OPx50 unity-gain bandwidth under various ca­pacitive loads.
1.0
0.8
0.6
VS = 2.5V R
= 10k
L
TA = +25 C
P–P
OP250
10kV
9kV
1
V
1V
IN
2
1kV
Figure 29. Overload Recovery Time Test Circuit
REV. 0
V
OUT
0.4
BANDWIDTH – MHz
0.2
0
01k1
CAPACITIVE LOAD – nF
10 100
Figure 32. Unity-Gain Bandwidth vs. Capacitive Load
As with any amplifier, an increase in capacitive load will also re­sult in an increase in overshoot and ringing. To improve the output response, a series R-C network, known as a snubber, can
–11–
Page 12
OP250/OP450
be connected from the output to ground in parallel with the ca­pacitive load as shown in Figure 33. The proper snubber net­work on the output can significantly reduce output overshoot, although it will not increase the bandwidth. Table I shows some snubber network values for a given capacitive load. In practice, these values are best determined empirically based on the exact capacitive load for the application.
+5V
C
L
47nF
V
OUT
V
IN
100mV p-p
OP250
R 5
C 1 F
S
S
Figure 33. Schematic for Using a Snubber Network
Table I. Snubber Network for Large Capacitive Loads
Load Capacitance (CL) Snubber Network (RS, CS)
1 nF 60 , 30 nF 10 nF 20 , 1 µF 100 nF 3 , 10 µF
Figure 34 shows the output of an OP250 in a unity gain configu­ration with a 1 nF capacitive load. Figure 35 shows the improve­ment in the output response with the snubber network added.
VIN = 100mV
@ 100kHz
p-p
CL = 1nF RL = 10k
For more information on methods to drive a capacitive load with an op amp, please refer to the Ask the Applications Engineer ar­ticle in Analog Dialogue, Vol. 31, Number 2, 1997.
Single Supply Differential Line Driver
Figure 36 shows a single supply differential line driver circuit that can drive a 600 load with less than 0.1% distortion. The design uses an OP450 to mimic the performance of a fully bal­anced transformer based solution. However, this design occupies much less board space while maintaining low distortion and can operate down to dc. Like the transformer based design, either output can be shorted to ground for unbalanced line driver ap­plications without changing the circuit gain of 1.
R3
2
C1
22
F
V
IN
A1, A2 = 1/2 OP250 GAIN =
SET: R7, R10, R11 = R2 SET: R6, R12, R13 = R3
3
R3 R2
+5V
A1
10k
10k
R1
10k
1
R10
10k
100k
10k
6
5
R5
50
R6
+5V
R8 100k
C2
R9
1
F
R14 50
2
1
A2
3
R2
R7 10k
+12V
7
A1
R11
R12
10k
10k
6
7
A2
5
R13
10k
C3
47
600
C4
47µF
F
V
O1
R
L
V
O2
Figure 36. A Low Noise, Single Supply Differential Line Driver
R8 and R9 set up the common mode output voltage equal to half of the supply voltage. C1 is used to couple the input signal and can be omitted if the input’s dc voltage is equal to half of the supply voltage.
The circuit can also be configured to provide additional gain if desired. The gain of the circuit is:
50mV
2µs
Figure 34. Output of OP250 without Snubber Network
CL = 1nF RL = 10k VIN = 100mV
50mV
@ 100kHz
p-p
2µs
Figure 35. Output of OP250 with Snubber Network
Where: V
= VO1– VO2,
OUT
V
A
==
V
V
OUT
IN
R
3
(5)
R
2
R2 = R7 = R10 = R11 and, R3 = R6 = R12 = R13
Multimedia Headphone Amplifier
Because of its large output drive, the OP250 makes an excellent headphone amplifier, as illustrated in Figure 37. Its low supply operation and rail-to-rail inputs and outputs can maximize out­put signal swing on a single +5 V supply. In Figure 37, the am­plifier inputs are biased halfway between the supply voltages, which in this application is 2.5 V. A 10 µF capacitor prevents power supply noise from contaminating the audio signal.
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OP250/OP450
+V + 5V
LEFT
INPUT
RIGHT INPUT
50k
50k
10 F
50k
10 F
50k
+V + 5V
10 F
100k
+V
10 F
100k
1/2
OP250
1/2
OP250
1 F/0.1 F
20
20
270 F
270 F
50k
50k
LEFT
HEADPHONE
RIGHT
HEADPHONE
Figure 37. A Single-Supply Stereo Headphone Driver
1
VSY = 2.5V A
= +1
V
V
= 300mV rms
IN
0.1
THD + N – %
0.01
0.001 20 20k100
FREQUENCY – Hz
RL = 500
RL = 2k
RL 10k
1k
10k
Figure 38. THD vs. Frequency
Headphone Driver
The audio signal is coupled into each input through a 10 µF ca­pacitor. This large value insures the resulting high pass filter cutoff is below 20 Hz, preserving full audio fidelity. If the input already has the proper dc bias, then the coupling capacitor and biasing resistors are not required. A 270 µF capacitor is used at the output to couple the amplifier to the headphone speaker. This value is much larger than the input capacitor because of the low impedance of the headphones, which can range from 32 to 600 or more. An additional 20 resistor is used in series with the output capacitor to protect the op amp’s output in the event the output accidentally becomes shorted to ground.
Direct Access Arrangement for Modems
Figure 39 illustrates a +5 V transmit/receive telephone line inter­face for 600 systems. It allows full duplex transmission of sig­nals on a transformer coupled 600 line in a differential manner. Amplifier A1 provides gain which can be adjusted to meet the modem output drive requirements. Both A1 and A2 are config­ured so as to apply the largest possible signal on a single supply to the transformer. Because of the OP450’s high output current drive and low dropout voltages, the largest signal available on a single +5 V supply is approximately 4.5 V p-p into a 600 trans­mission system. Amplifier A3 is configured as a difference ampli­fier for two reasons: (1) It prevents the transmit signal from interfering with the receive signal and (2) it extracts the receive signal from the transmission line for amplification by A4. Ampli­fier A4’s gain can be adjusted in the same manner as A1’s to meet the modem’s input signal requirements. Standard resistor values permit the use of SIP (Single In-line Package) format resistor ar­rays. Couple this with the OP450 14-lead TSSOP or SOIC foot­print and this circuit offers a compact, cost-effective solution.
P1
TX GAIN
TO TELEPHONE
LINE
1:1
Z
O
600
MIDCOM 671-8005
A1, A2, A3, A4 = 1/4 OP450
6.2V
6.2V
T1
R11
10k
10k
10k
R9
360
R12
ADJUST
R3
R5
10k
R6
10k
R10
10k
2
A3
3
R2
9.09k
2k 1
1
2
A1
3
6
7
A2
5
R13
14.3k
10k
6
5
R14
10k
A4
R1
C1
0.1
+5V DC
F
10
P2 RX GAIN ADJUST
2k
7
F
0.1
R7 10k
R8 10k
C2
F
TRANSMIT
TXA
RECEIVE
RXA
Figure 39. A Single-Supply Direct Access Arrangement for Modems
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OP250/OP450
* OP250 SPICE Macro-Model Typical Values
* 10/97, Ver. 1 * TAM / ADSC * * Node assignments * noninverting input * | inverting input * | | positive supply * | | | negative supply * ||||output * ||||| * ||||| .SUBCKT OP250 1 2 99 50 45 * * INPUT STAGE * M1 4 3 6 6 MNIN L=2u W=66u M2 5 2 6 6 MNIN L=2u W=66u M3 7 3 9 9 MPIN L=2u W=66u M4 8 2 9 9 MPIN L=2u W=66u RD1 99 4 5E3 RD2 99 5 5E3 RD3 7 50 5E3 RD4 8 50 5E3 VCM1 10 50 -.3 VCM2 99 11 -.3 D1 10 6 DX D2 9 11 DX EOS 3 1 POLY(3) (61,98) (73,98) (81,0) 3E-3
+1 1 1 IOS 1 2 .25E-12 IBIAS1 6 50 700E-6 IBIAS2 99 9 700E-6 * * CMRR=60 dB, ZERO AT 20kHz * ECM1 60 98 POLY(2) (1,98) (2,98) 0 .5 .5 RCM1 60 61 159.2E3 RCM2 61 98 159 CCM1 60 61 50E-12 * * PSRR=90dB, ZERO AT 200Hz * RPS1 70 0 1E6 RPS2 71 0 1E6 CPS1 99 70 1E-5 CPS2 50 71 1E-5 EPSY 98 72 POLY(2) (70,0) (0,71) 0 1 1 RPS3 72 73 1.59E6 CPS3 72 73 500E-12 RPS4 73 98 50 *
* INTERNAL VOLTAGE REFERENCE * RSY1 99 91 100E3 RSY2 50 90 100E3 VSN1 91 90 DC 0 EREF 98 0 (90,0) 1 GSY 99 50 POLY(1) (99,50) -1.81E-3 1.5E-5 * * VOLTAGE NOISE REFERENCE OF 30nV/rt(Hz) * VN1 80 0 0 RN1 80 0 16.45E-3 HN 81 0 VN1 30 RN2 81 0 1 * * POLE AT 1.25MHz * G2 98 20 POLY(2) (4,5) (7,8) 0 5E-5 5E-5 R2 20 98 10E3 C2 20 98 12.7E-12 * * GAIN STAGE * G1 98 30 (20,98) 3.5E-4 R1 30 98 6.25E6 CF 30 45 135E-12 D4 31 99 DX D5 50 32 DX V1 31 30 0.7 V2 30 32 0.7 * * OUTPUT STAGE * M5 45 41 99 99 MPOUT L=2u W=6660u M6 45 42 50 50 MNOUT L=2u W=6660u EO1 99 41 POLY(1) (98,30) .9232 1 EO2 42 50 POLY(1) (30,98) .8914 1 * * MODELS * .MODEL MNIN NMOS(LEVEL=2,VTO=0.75,
+KP=20E-6,CGSO=0,KF=2.5E-31,AF=1) .MODEL MPIN PMOS(LEVEL=2,VTO=-0.75,
+KP=20E-6,CGSO=0,KF=2.5E-31,AF=1) .MODEL MNOUT NMOS(LEVEL=2,VTO=0.75,
+KP=30E-6,LAMBDA=0.04,CGSO=0) .MODEL MPOUT PMOS(LEVEL=2,VTO=-0.75,
+KP=20E-6,LAMBDA=0.04,CGSO=0) .MODEL DX D(IS=1E-16) .ENDS OP250
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OUTLINE DIMENSIONS
8
5
4
1
0.122 (3.10)
0.114 (2.90)
0.256 (6.50)
0.246 (6.25)
0.177 (4.50)
0.169 (4.30)
PIN 1
0.0256 (0.65) BSC
SEATING
PLANE
0.006 (0.15)
0.002 (0.05)
0.0118 (0.30)
0.0075 (0.19)
0.0433 (1.10) MAX
0.0079 (0.20)
0.0035 (0.090)
0.028 (0.70)
0.020 (0.50)
8° 0°
Dimensions shown in inches and (mm).
OP250/OP450
0.1574 (4.00)
0.1497 (3.80)
0.0098 (0.25)
0.0040 (0.10)
SEATING
0.210 (5.33) MAX
0.160 (4.06)
0.115 (2.93)
8-Lead SOIC
(SO-8)
0.1968 (5.00)
0.1890 (4.80)
8
5
0.2440 (6.20)
41
0.2284 (5.80)
PIN 1
PLANE
0.0500 (1.27)
BSC
0.0688 (1.75)
0.0532 (1.35)
0.0192 (0.49)
0.0138 (0.35)
14-Lead Plastic DIP
(N-14)
0.795 (20.19)
0.725 (18.42)
14
17
PIN 1
0.022 (0.558)
0.014 (0.356)
0.100 (2.54)
BSC
8
0.280 (7.11)
0.240 (6.10)
0.060 (1.52)
0.015 (0.38)
0.070 (1.77)
0.045 (1.15)
0.0098 (0.25)
0.0075 (0.19)
0.130 (3.30) MIN
SEATING PLANE
0.0196 (0.50)
0.0099 (0.25)
8° 0°
0.0500 (1.27)
0.0160 (0.41)
0.325 (8.25)
0.300 (7.62)
x 45°
0.195 (4.95)
0.115 (2.93)
0.015 (0.381)
0.008 (0.204)
0.177 (4.50)
0.006 (0.15)
0.002 (0.05)
SEATING
PLANE
0.201 (5.10)
0.193 (4.90)
14 8
0.169 (4.30)
1
PIN 1
0.0256 (0.65)
BSC
8-Lead TSSOP
(RU-8)
14-Lead TSSOP
(RU-14)
0.256 (6.50)
7
0.0433 (1.10)
0.0118 (0.30)
0.0075 (0.19)
MAX
0.246 (6.25)
0.0079 (0.20)
0.0035 (0.090)
8° 0°
0.028 (0.70)
0.020 (0.50)
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C3236–8–10/97PRINTED IN U.S.A.
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