Datasheet OM4068P-F1 Datasheet (Philips)

DATA SH EET

Product specification
File under Integrated Circuits, IC12

1998 Jun 18

INTEGRATED CIRCUITS

OM4068

LCD driver for low multiplex rates

1998 Jun 18 2

Philips Semiconductors Product specification

LCD driver for low multiplex rates

OM4068

FEATURES

• Single-chip LCD controller/driver

• Static/duplex/triplex drive modes with up to

32/64/96 LCD segments drive capability per device

• Selectable backplane drive configuration: static or
2 or 3 backplane multiplexing

• Selectable display bias configuration drive: static,1⁄2 or

1

⁄

3

• 32 segment drivers

• Serial data input (word length 32 to 96 bits)

• On-chip generation of intermediate LCD bias voltages

• 2 MHz fast serial bus interface

• CMOS compatible

• Compatible with any 4-bit, 8-bit or 16-bit

microprocessors/microcontrollers

• May be cascaded for large LCD applications

• Logic supply voltage range (V

DD

− VSS) of 2.5 to 5.5 V

• Display supply voltage range (V

LCD

− VSS) of

3.5 to 6.5 V

• Low power consumption, suitable for battery operated
systems

• No external components needed by the oscillator

• Manufactured in silicon gate CMOS process.

APPLICATIONS

• Telecom equipment

• Portable instruments

• Alarm systems

• Automotive equipment.

GENERAL DESCRIPTION

The OM4068 is a low-power CMOS LCD driver, designed
to drive Liquid Crystal Displays (LCDs) with low multiplex
rates. It generates the drive signals for any static or
multiplexed LCD containing up to three backplanes and up
to 32 segment lines and can be easily cascaded for larger
LCD applications. All necessary functions for the display
are provided in a single chip, including on-chip generation
of LCD bias voltages, resulting in a minimum of external
components and lower power consumption. A 3-line bus
structure enables serial data transfer with most
microprocessors/microcontrollers. All inputs are CMOS
compatible.

ORDERING INFORMATION

Notes

1. Gull Wing package.

2. For details see Chapter “Bonding pad locations”.

TYPE NUMBER

PACKAGE

NAME DESCRIPTION VERSION

OM4068H

(1)

QFP44 plastic quad flat package; 44 leads (lead length 1.3 mm);

body 10 × 10 × 1.75 mm

SOT307-2

OM4068P DIP40 plastic dual in-line package; 40 leads (600 mil) SOT129-1
OM4068U/5

(2)

die unsawn wafer −

OM4068U tray chip in tray −

1998 Jun 18 3

Philips Semiconductors Product specification

LCD driver for low multiplex rates

OM4068

BLOCK DIAGRAM

Fig.1 Block diagram.

handbook, full pagewidth

MBK817

BACKPLANE OUTPUTS

OM4068

LCD VOLTAGE

SELECTOR

(CONTROL LOGIC)

BP2BP1 BP3 SEG1 to SEG32

(1)

DISPLAY SEGMENT OUTPUTS

TIMING

GENERATOR

VSSV

DD

DISPLAY LATCH

OSCILLATOR

BIAS

VOLTAGE

GENERATOR

POWER-ON

RESET

4

4

M0
M1

V

LCD

32

4

SHIFT REGISTER

SCE
SCLK

SDIN
SDOUT

(1) SEG1, SEG6, SEG15 and SEG25 are not available in DIP40 package.

1998 Jun 18 4

Philips Semiconductors Product specification

LCD driver for low multiplex rates

OM4068

PINNING

See notes 1 to 8.

SYMBOL

PIN

DESCRIPTION

QFP44 DIP40

V

LCD

4 19 LCD supply voltage

V

DD

5 20 positive supply voltage

V

SS

6 21 ground
M0 7 22 drive mode select input 0
M1 8 23 drive mode select input 1
SDIN 9 24 serial bus data input
SCLK 10 25 serial bus clock input
SCE 11 26 serial bus clock enable
SDOUT 12 27 serial bus data output
BP1 13 28 LCD backplane driver output 1
BP2 14 29 LCD backplane driver output 2
BP3 15 30 LCD backplane driver output 3
SEG1 16 − LCD segment driver output 1
SEG2 17 31 LCD segment driver output 2
SEG3 18 32 LCD segment driver output 3
SEG4 19 33 LCD segment driver output 4
SEG5 20 34 LCD segment driver output 5
SEG6 21 − LCD segment driver output 6
SEG7 22 35 LCD segment driver output 7
SEG8 23 36 LCD segment driver output 8
SEG9 24 37 LCD segment driver output 9
SEG10 25 38 LCD segment driver output 10
SEG11 26 39 LCD segment driver output 11
SEG12 27 40 LCD segment driver output 12
SEG13 28 1 LCD segment driver output 13
SEG14 29 2 LCD segment driver output 14
SEG15 30 − LCD segment driver output 15
SEG16 31 3 LCD segment driver output 16
SEG17 32 4 LCD segment driver output 17
SEG18 33 5 LCD segment driver output 18
SEG19 34 6 LCD segment driver output 19
SEG20 35 7 LCD segment driver output 20
SEG21 36 8 LCD segment driver output 21
SEG22 37 9 LCD segment driver output 22
SEG23 38 10 LCD segment driver output 23
SEG24 39 11 LCD segment driver output 24
SEG25 40 − LCD segment driver output 25
SEG26 41 12 LCD segment driver output 26

1998 Jun 18 5

Philips Semiconductors Product specification

LCD driver for low multiplex rates

OM4068

Notes

1. SEG1 to SEG32 (LCD segment driver outputs) output the multi-level signals for the LCD segments.

2. BP0, BP1 and BP2 (LCD backplane driver outputs) output the multi-level signals for the LCD backplanes.

3. V

LCD

(LCD power supply): power supply for the LCD.

4. SDIN (serial data line): input for the bus data line.

5. SCL (serial clock line): input for the bus clock line.

6. SDOUT (serial data output): output of the shift register to allow serial cascading of the OM4068 with other devices.

7. SCE (serial clock enable): input for enable/disable acquisition on the data input line. If disabled, data on the serial
bus are not accepted by the device.

8. M0 and M1 (display mode select inputs): inputs to select the LCD drive configurations; static, duplex or triplex.

SEG27 42 13 LCD segment driver output 27
SEG28 43 14 LCD segment driver output 28
SEG29 44 15 LCD segment driver output 29
SEG30 1 16 LCD segment driver output 30
SEG31 2 17 LCD segment driver output 31
SEG32 3 18 LCD segment driver output 32

SYMBOL

PIN

DESCRIPTION

QFP44 DIP40

1998 Jun 18 6

Philips Semiconductors Product specification

LCD driver for low multiplex rates

OM4068

Fig.2 Pin configuration (QFP44).

handbook, full pagewidth

OM4068H

MBK814

1SEG30
SEG31
SEG32

M0
M1

SDIN

SCLK

SCE

SDOUT

BP1

BP2

BP3

SEG1

SEG2

SEG3

SEG4

SEG5

SEG6

SEG7

SEG8

SEG9

SEG10

SEG11

SEG12

SEG13

SEG14

SEG15

SEG16

SEG17

SEG18

SEG19

SEG20

SEG21

SEG22

SEG23

SEG24

SEG25

SEG26

SEG27

SEG28

SEG29

V

LCD
V

DD

V

SS

2

3

4

5

6

7

8

9

10
11

33
32
31
30
29
28
27
26
25
24
23

12

13

14

15

16

17

18

19

20

21

22

44

43

42

41

40

39

38

37

36

35

34

1998 Jun 18 7

Philips Semiconductors Product specification

LCD driver for low multiplex rates

OM4068

Fig.3 Pin configuration (DIP40).

handbook, halfpage

OM4068P

MBK815

1
2
3
4
5
6
7
8

9
10
11
12
13
14
15
16
17
18
19
20

40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21

SEG13 SEG12
SEG14 SEG11
SEG16 SEG10

SEG17 SEG9
SEG18 SEG8
SEG19 SEG7
SEG20 SEG5
SEG21 SEG4
SEG22 SEG3
SEG23 SEG2
SEG24 BP3
SEG26 BP2
SEG27 BP1
SEG28 SDOUT
SEG29 SCE
SEG30 SCLK
SEG31 SDIN
SEG32 M1

V

LCD

M0

V

DD

V

SS

1998 Jun 18 8

Philips Semiconductors Product specification

LCD driver for low multiplex rates

OM4068

FUNCTIONAL DESCRIPTION

The OM4068 is a low-power LCD driver designed to
interface with any microprocessor/microcontroller and a
wide variety of LCDs. It can drive any static or multiplexed
LCD containing up to three backplanes and
up to 96 segments.

The display configurations possible with the OM4068
depend on the number of active backplane outputs
required; a selection of display configurations is given in
Table 1.

A typical system (MUX 1 : 3) is shown in Fig.4.

Table 1 Selection of display configurations

NUMBER OF 7-SEGMENTS NUMERIC

DOT MATRIX

BACKPLANES

DISPLAY

SEGMENTS

DIGITS

INDICATOR

SYMBOLS

3 96 12 12 96 dots (3 × 32)
2 64 8 8 64 dots (2 × 32)
1 32 4 4 32 dots (1 × 32)

Fig.4 Typical system configuration.

handbook, full pagewidth

HOST
MICROPROCESSOR/
MICROCONTROLLER

SCLK

SDOUT

SCE

SDIN

32 segment drivers

(1)

3 backplanes

LCD PANEL

(up to 96

elements)

OM4068

M1 M0

V

DD

V

DD

V

LCD

V

SS

V

SS

MBK818

(1) 28 segment drivers for DIP40 package.

The host microprocessor/microcontroller maintains the
3-line bus communication channel with OM4068.
The internal oscillator requires no external components.
The appropriate intermediate biasing voltage for the
multiplexed LCD waveforms are generated on-chip.

The only other connections required to complete the
system are to the power supplies (VSS, VDDand V

LCD

) and

suitable capacitors to decouple the V

LCD

and VDD pins to

VSS.

1998 Jun 18 9

Philips Semiconductors Product specification

LCD driver for low multiplex rates

OM4068

Power-on reset

The on-chip power-on reset block initializes the chip after
power-on or power failures. The OM4068 resets to a
starting condition as follows:

• All backplane and segment outputs are set to V

SS

(display off)

• All shift registers and latches are set in 3-state

• SDOUT (allowing serial cascading) is set to logic 0 (with

SCE LOW)

• Power-down mode.
Data transfers on the serial bus should be avoided for

0.5 ms following power-on to allow completion of the reset
action.

Power-down

After power-on the chip is in power-down mode as long as
the serial clock is not active. During power-down all static
currents are switched off (no internal oscillator, no timing
and no bias level generation) and all LCD-outputs are
3-stated. The power-on reset functions remain enabled.

The power-down mode is disabled at the first rising edge
of the serial clock SCLK.

LCD bias voltage generator

The intermediate bias voltages for the LCD display are
generated on-chip. This removes the need for an external
resistive bias chain and significantly reduces the system
power consumption. The full-scale LCD voltage V

OP

equals V

LCD

− VSS. The optimum value of VOP depends on
the LCD threshold voltage (Vth) and the number of bias
levels.

Fractional LCD biasing voltages are obtained from an
internal voltage divider of three series resistors (1⁄3bias)
connected between V

LCD

and VSS. The centre resistor can
be switched out of the circuit to provide a1⁄2bias voltage
level for the 1 : 2 multiplex configuration.

The bias levels depend on the multiplex rate and are
selected automatically when the display configuration is
selected using M1 and M0.

LCD voltage selector

The LCD voltage selector (control logic) coordinates the
multiplexing of the LCD in accordance with the selected
drive or display configuration. The operation of the voltage
selector is controlled by the input pins M0 and M1
(see Table 2).

Table 2 Drive mode selection

For multiplex rates of 1 : 2 three bias levels are used
including V

LCD

and VSS. Four bias level are used for the
1 : 3 multiplex rate. The various biasing configurations
together with the biasing characteristics as functions of
VOP=V

LCD

− VSS and the resulting discrimination ratios

(D), are given in Table 3.
A practical value for VOP is determinated by equating

V

off(rms)

with a defined LCD threshold voltage (Vth),
typically when the LCD exhibits approximately 10%
contrast. In static mode a suitable choice is VOP>3Vth.

M1 M0 DRIVE MODE

0 0 test mode (not user accessible)
0 1 static drive (1 : 1)
1 0 duplex drive (1 : 2)
1 1 triplex drive (1 : 3)

1998 Jun 18 10

Philips Semiconductors Product specification

LCD driver for low multiplex rates

OM4068

Table 3 LCD drive modes: summary of characteristics

LCD drive mode waveforms

The static LCD drive mode is used when a single backplane is provided in the LCD. Backplane and segment drive
waveforms for this mode are shown in Fig.5.

LCD DRIVE

MODE

NUMBER OF

LCD BIAS

CONFIGURATION

BACKPLANES LEVELS

Static 1 2 static 0 1 −

1:2 2 3

1

⁄

2

0.354 0.791 2.2236

1:3 3 4

1

⁄

3

0.333 0.638 1.915

V

off rms()

V

OP

-----------------------

V

on rms()

V

OP

---------------------- -

D

V

on rms()

V

off rms()

-----------------------

=

Fig.5 Static drive mode waveforms (VOP=V

LCD

− VSS).

BACKPLANE

DRIVER OUTPUT

SEGMENTS

SEGN SEGN+1

BP1 off on

handbook, full pagewidth

MBK819

V

LCD

BP1

V

SS

T

frame

V

LCD

SEG N

(off)

SEG − BP1

V

SS

V

LCD

V

LCD

0 V

−V

LCD

SEG N + 1

(on)

V

SS

V

LCD

0 V

−V

LCD

1998 Jun 18 11

Philips Semiconductors Product specification

LCD driver for low multiplex rates

OM4068

1:2MULTIPLEX DRIVE MODE
When two backplanes are provided in the LCD, the 1 : 2 multiplex mode applies, as shown in Fig.6.

1:3MULTIPLEX DRIVE MODE
When three backplanes are provided in the LCD, the 1 : 3 multiplex mode applies, as shown in Fig.7.

handbook, full pagewidth

MBK820

V

LCD

1/2V

LCD

BP1

BP2

V

SS

T

frame

SEG - BP1 SEG - BP2

T

frame

T

frame

1/2V

LCD

V

LCD

0 V

−1/2V

LCD

−V

LCD

1/2V

LCD

V

LCD

0 V

−1/2V

LCD

−V

LCD

1/2V

LCD

V

LCD

0 V

−1/2V

LCD

−V

LCD

1/2V

LCD

V

LCD

0 V

−1/2V

LCD

−V

LCD

V

LCD

1/2V

LCD
V

SS

SEG N

SEG N + 1

SEG N + 2

SEG N + 3

V

LCD

1/2V

LCD
V

SS

V

LCD

1/2V

LCD
V

SS

V

LCD

1/2V

LCD
V

SS

V

LCD

1/2V

LCD
V

SS

1/2V

LCD

V

LCD

0 V

−1/2V

LCD

−V

LCD

1/2V

LCD

V

LCD

0 V

−1/2V

LCD

−V

LCD

1/2V

LCD

V

LCD

0 V

−1/2V

LCD

−V

LCD

1/2V

LCD

V

LCD

0 V

−1/2V

LCD

−V

LCD

Fig.6 Waveforms for 1 : 2 multiplex drive mode (VOP=V

LCD

− VSS).

BACKPLANE

DRIVER OUTPUTS

SEGMENTS

SEGN SEGN+1 SEGN+2 SEGN+3

BP1 off on off on
BP2 off off on on

1998 Jun 18 12

Philips Semiconductors Product specification

LCD driver for low multiplex rates

OM4068

handbook, full pagewidth

MBK821

SEG N

SEG N + 1

SEG N + 2

SEG - BP3

SEG N + 3

SEG N + 4

SEG N + 5

SEG N + 6

SEG N + 7

2/3V

LCD

−2/3V

LCD

−V

LCD

V

LCD

0 V

2/3V

LCD

−2/3V

LCD

−V

LCD

V

LCD

0 V

2/3V

LCD

−2/3V

LCD

−V

LCD

V

LCD

0 V

2/3V

LCD

−2/3V

LCD

−V

LCD

V

LCD

0 V

2/3V

LCD

−2/3V

LCD

−V

LCD

V

LCD

0 V

2/3V

LCD

−2/3V

LCD

−V

LCD

V

LCD

0 V

2/3V

LCD

−2/3V

LCD

−V

LCD

V

LCD

0 V

2/3V

LCD

−

2/3V

LCD

−

V

LCD

V

LCD

0 V

2/3V

LCD

−2/3V

LCD

−V

LCD

V

LCD

0 V

2/3V

LCD

−2/3V

LCD

−V

LCD

V

LCD

0 V

2/3V

LCD

−2/3V

LCD

−V

LCD

V

LCD

0 V

2/3V

LCD

−2/3V

LCD

−V

LCD

V

LCD

0 V

2/3V

LCD

−2/3V

LCD

−V

LCD

V

LCD

0 V

2/3V

LCD

−2/3V

LCD

−V

LCD

V

LCD

0 V

2/3V

LCD
V

SS

V

LCD

1/3V

LCD

2/3V

LCD

−2/3V

LCD

−V

LCD

V

LCD

0 V

2/3V

LCD

−2/3V

LCD

−V

LCD

V

LCD

0 V

2/3V

LCD

−2/3V

LCD

−V

LCD

V

LCD

0 V

2/3V

LCD

−2/3V

LCD

−V

LCD

V

LCD

0 V

2/3V

LCD

−2/3V

LCD

−V

LCD

V

LCD

0 V

2/3V

LCD

−

2/3V

LCD

−

V

LCD

V

LCD

0 V

2/3V

LCD

−2/3V

LCD

−V

LCD

V

LCD

0 V

2/3V

LCD

−2/3V

LCD

−V

LCD

V

LCD

0 V

2/3V

LCD

−

2/3V

LCD

−

V

LCD

V

LCD

0 V

2/3V

LCD

−2/3V

LCD

−V

LCD

V

LCD

0 V

T

frame

T

frame

T

frame

T

frame

SEG - BP2

BP2 BP3

2/3V

LCD
V

SS

V

LCD

1/3V

LCD

2/3V

LCD
V

SS

V

LCD

1/3V

LCD

2/3V

LCD
V

SS

V

LCD

1/3V

LCD

SEG - BP1

BP1

2/3V

LCD
V

SS

V

LCD

1/3V

LCD

2/3V

LCD
V

SS

V

LCD

1/3V

LCD

2/3V

LCD
V

SS

V

LCD

1/3V

LCD

2/3V

LCD
V

SS

V

LCD

1/3V

LCD

2/3V

LCD
V

SS

V

LCD

1/3V

LCD

2/3V

LCD
V

SS

V

LCD

1/3V

LCD

2/3V

LCD
V

SS

V

LCD

1/3V

LCD

Fig.7 Waveforms for 1 : 3 multiplex drive motive (VOP=V

LCD

− VSS).

BACKPLANE

DRIVER OUTPUTS

SEGMENTS

N N+1 N+2 N+3 N+4 N+5 N+6 N+7

BP1 off on off on off on off on
BP2 off off on on off off on on
BP3 off off off off on on on on

1998 Jun 18 13

Philips Semiconductors Product specification

LCD driver for low multiplex rates

OM4068

Oscillator

The internal logic and the multi-level LCD drive signals of
the OM4068 are generated by the built-in RC oscillator.
No external components are required.

In order to minimize radio frequency interference, the
oscillator operates with symmetrical and slew-rate limited
capacitor charge/discharge.

The oscillator runs continuously once the power down
state after power-on has been left.

Interface to microprocessor unit: serial interface

A three-line bus structure enables serial unidirectional
data transfer with microprocessors/microcontrollers.
The three lines are a serial data input line (SDIN), a serial
clock line (SCLK) and a data line enable (SCE). All inputs
are CMOS compatible. These lines must always be in a
defined state VSSor VDD.Floating inputs could damage the
chip.

On the bus, one data bit is transferred during each clock
pulse. The data on the SDIN line remains stable during the
whole clock period. Data changes arrive with the falling
edge of the serial clock SCLK (see Fig.8).

Fig.8 Bit transfer on bus.

handbook, full pagewidth

MBK822

data line

stable;

data valid

change

of data

allowed

SDIN

SDOUT

SCLK

Shift register

Data present on the SDIN pin is shifted into a shift register
with the rising edge of the serial clock SCLK in a
synchronous manner. The shift register serves to transfer
display information from the serial bus to the (display) latch
while previous data is displayed.

The shift register is organized as three 32-bit shift
registers. Depending on the display driving mode selected
(see Table 3), one, two or three registers are used and
cascaded resulting in a shift register length of 32, 64 or
96 bits. Figure 9 shows the shift register organization with
the display data bits after a shift operation is completed.
The shift sequence begins with data bit D32 and finishes
with data bit D1. The correspondence between the data bit

numbers and the LCD display segments is shown in
Table 4.

Data from the last stage of the register is supplied to the
SDOUT pin to allow serial cascading of the OM4068 with
other peripheral devices. Depending on the display driving
mode selected, SDOUT corresponds to bit 32, 64 or 96 of
the register (see Fig.10). Data on the SDOUT pin is shifted
out with the falling edge of the SCLK clock. SDOUT is
therefore delayed by

1

⁄2SCLK cycle before it is applied to

the SDIN pin of the next IC in the serial chain (see Fig.8).
The clock enable SCE signal must be HIGH in order to

enable the shift operation. SDOUT output is latched with
the last data after SCE returned to HIGH (shift operation
terminated).

SDOUT is in 3-state mode when SCE is LOW.

1998 Jun 18 14

Philips Semiconductors Product specification

LCD driver for low multiplex rates

OM4068

Display latch

The 96-bit display latch holds the display data while the
corresponding multiplex signals are generated. There is a
one-to-one relationship between the data in the display
latch and the LCD segment outputs. An LCD segment is
activated when the corresponding data bit in the display
latch is HIGH.

Display latches are in HOLD mode (SCE HIGH) during the
shift operation to maintain the display data constant.

Data are latched into the display latch with the internal
frame clock. Thus there is a delay of up to one half frame
before new data are latched after signal SCE returns to
zero.

Timing

The timing of the OM4068 organizes the internal data flow
of the device. This includes the transfer of display data
from the shift register to the display segments outputs.
The timing also generates the LCD frame frequency which
is derived from the clock frequency generated in the
internal clock generator:

f

fr(LCD)

f

osc

2400

------------ -

=

Shift register configuration

Fig.9 Display data bit position in shift register.

handbook, full pagewidth

1

D1A D32A

SDIN SDOUT

32

96-bit shift register

64 96

32-bit register

driving mode: static; (M1, M0) = 01

driving mode: duplex (1 : 2); (M1, M0) = 10

D1A D1BD32A D32B

SDIN

32-bit register

SDOUT

32-bit register

driving mode: triplex (1 : 3); (M1, M0) = 11

D1A D1BD32A D32B

SDIN

32-bit register 32-bit register

D1C D32C

MBK823

SDOUT

32-bit register

1998 Jun 18 15

Philips Semiconductors Product specification

LCD driver for low multiplex rates

OM4068

Fig.10 Shift register structure.

handbook, full pagewidth

MUX

SDOUT

SDIN

D32A D32B D32C

SCLK

M0
M1

MBK825

1998 Jun 18 16

Philips Semiconductors Product specification

LCD driver for low multiplex rates

OM4068

Table 4 Relationships between data bit numbers and the LCD segment outputs

Segment outputs

The LCD drive section includes 32 segment outputs SEG1 to SEG32 which should be connected directly to the LCD.
The segment output signals are generated in accordance with the multiplex backplane signals and with data in the
display latch. When less than 32 segments are required the unused segment outputs should be left open-circuit.

SEGMENT

NUMBER

DRIVING MODE

STATIC DUPLEX TRIPLEX

SEG1 D1A D1A D1B D1A D1B D1C
SEG2 D2A D2A D2B D2A D2B D2C
SEG3 D3A D3A D3B D3A D3B D3C
SEG4 D4A D4A D4B D4A D4B D4C
SEG5 D5A D5A D5B D5A D5B D5C
SEG6 D6A D6A D6B D6A D6B D6C
SEG7 D7A D7A D7B D7A D7B D7C
SEG8 D8A D8A D8B D8A D8B D8C

SEG9 D9A D9A D9B D9A D9B D9C
SEG10 D10A D10A D10B D10A D10B D10C
SEG11 D11A D11A D11B D11A D11B D11C
SEG12 D12A D12A D12B D12A D12B D12C
SEG13 D13A D13A D13B D13A D13B D13C
SEG14 D14A D14A D14B D14A D14B D14C
SEG15 D15A D15A D15B D15A D15B D15C
SEG16 D16A D16A D16B D16A D16B D16C
SEG17 D17A D17A D17B D17A D17B D17C
SEG18 D18A D18A D18B D18A D18B D18C
SEG19 D19A D19A D19B D19A D19B D19C
SEG20 D20A D20A D20B D20A D20B D20C
SEG21 D21A D21A D21B D21A D21B D21C
SEG22 D22A D22A D22B D22A D22B D22C
SEG23 D23A D23A D23B D23A D23B D23C
SEG24 D24A D24A D24B D24A D24B D24C
SEG25 D25A D25A D25B D25A D25B D25C
SEG26 D26A D26A D26B D26A D26B D26C
SEG27 D27A D27A D27B D27A D27B D27C
SEG28 D28A D28A D28B D28A D28B D28C
SEG29 D29A D29A D29B D29A D29B D29C
SEG30 D30A D30A D30B D30A D30B D30C
SEG31 D31A D31A D31B D31A D31B D31C
SEG32 D32A D32A D32B D32A D32B D32C

1998 Jun 18 17

Philips Semiconductors Product specification

LCD driver for low multiplex rates

OM4068

Backplane outputs

The LCD drive section includes three backplane outputs (BP1 to BP3) which should be connected directly to the LCD.
The backplane output signals are generated in accordance with the selected LCD drive mode. If less than three
backplane outputs are required the unused outputs should be left open-circuit. In 1 : 2 multiplex drive mode, BP3 is set
to1⁄2V

LCD

. In static drive mode BP3 and BP2 are set to VSS.

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

Notes

1. Equivalent to discharging a 100 pF capacitor via a 1.5 kΩ series resistor (human body model).

2. Equivalent to discharging a 200 pF capacitor via a 0.75 µH series inductor (machine model).

HANDLING

Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is
desirable to take normal precautions appropriate to handling MOS devices (see

“Handling MOS Devices”

).

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V

DD

supply voltage −0.5 +6.5 V

V

LCD

LCD supply voltage −0.5 +7.5 V

V

I

input voltage (any input) −0.5 VDD+ 0.5 V

V

O

output voltage
(BP1, BP2, BP3, S1 to S32 and V

LCD

)

−0.5 V

LCD

+ 0.5 V

I

I

DC input current −10 +10 mA

I

O

DC output current −10 +10 mA

I

DD

, ISS, I

LCD

VDD, VSS or V

LCD

current −50 +50 mA

P

tot(pack)

total power dissipation per package − 500 mW
P/out power dissipation per output − 10 mW
T

amb

operating ambient temperature −40 +105 °C
T

stg

storage temperature −65 +150 °C
T

j

junction temperature − 150 °C
V

es

electrostatic handling note 1 −2000 +2000 V

note 2 −150 +150 V

1998 Jun 18 18

Philips Semiconductors Product specification

LCD driver for low multiplex rates

OM4068

DC CHARACTERISTICS

V

DD

= 2.5 to 5.5 V; VSS=0V; V

LCD

= 3.5 to 6.5 V; T

amb

= −40 to +105 °C; unless otherwise specified.

Notes

1. Power-down state. After power-on the chip is in power-down state as long as the serial clock is not activated. During
power-down all static currents are switched off except the power-on reset block.

2. Output SDOUT is open-circuit; inputs at V

DD

or VSS; bus inactive.

3. Drive mode: static, duplex and triplex.

4. LCD outputs are open-circuit, CL= 50 pF typical, inputs at VDD or VSS; bus inactive.

5. Resets all logic when VDD<V

POR

.

6. Resistance of output terminal (S1 to S32 and BP1, BP2 and BP3) with a load current of 20 µA; outputs measured
one at a time.

7. LCD outputs open-circuits.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supplies

V

DD

supply voltage VSS+ 2.5 − 5.5 V

V

LCD

LCD supply voltage VSS+ 3.5 − 6.5 V

I

DD

supply current power-down state;

note 1

− 410µA

normal mode;
f

osc

= intern;

notes 2 and 3

− 12 25 µA

I

LCD

V

LCD

current power-down state;

note 1

−−1.5 µA

normal mode;
f

osc

= intern;

notes 3 and 4

−−40 µA

V

POR

power-on reset voltage level note 5 0.8 1.25 1.6 V

Logic

V

IL

LOW-level input voltage V

SS

− 0.3V

DD

V

V

IH

HIGH-level input voltage 0.7V

DD

− V

DD

V

I

OL

LOW-level output current (SDOUT) VOL= 0.5 V; VDD= 5 V 1.0 −− mA

I

OH

HIGH-level output current (SDOUT) VOH=VDD− 0.5 V;

VDD=5V

−−−1mA

I

pu

pull-up current M1 and M0 VI=V

SS

0.04 0.15 1 µA

I

L

leakage current VI=VDD or V

SS

−1 − +1 µA

Segment and backplane outputs

R

(o)seg

segment output resistance
SEG1 to SEG32

note 6 − 15 40 kΩ

R

(o)back

backplane output resistance
BP1 to BP3

note 6 − 15 40 kΩ

V

seg(bias)(tol)

bias tolerance SEG1 to SEG32 note 7 −100 0 +100 mV

V

back(bias)(tol)

bias tolerance BP1, BP2 and BP3 note 7 −100 0 +100 mV

1998 Jun 18 19

Philips Semiconductors Product specification

LCD driver for low multiplex rates

OM4068

AC CHARACTERISTICS

V

DD

= 2.5 to 5.5 V; VSS=0V; V

LCD

= 5.0 V; T

amb

= −40 to +105 °C; unless otherwise specified.

Note

1. All timing values are valid within the operating supply voltage and ambient temperature range and are referenced to
V

IL

and VIH with an input voltage swing of VSS to VDD.

SYMBOL PARAMETER MIN. TYP. MAX. UNIT

f

fr(LCD)

LCD frame frequency (internal clock) 50 84 175 Hz

f

osc

oscillator frequency (not available at any pin) 116 224 405 kHz
Bus timing characteristics: serial bus interface; note 1
f

SCLK

SCLK clock frequency 0 − 2.1 MHz
t

SCLKL

SCLK clock LOW period 190 −−ns
t

SCLKH

SCLK clock HIGH period 190 −−ns
t

su(D)

data set-up time 100 −−ns
t

h(D)

data hold time 100 −−ns
t

r

SCLK, SDIN rise time − 10 − ns
t

f

SCLK, SDIN fall time − 10 − ns
t

su(en)(SDEH-SCLKH)

enable set-up time (SDE HIGH to SCLK HIGH) 250 −−ns
t

su(dis)(SCLKL-SDEL)

disable set-up time (SCLK LOW to SDE LOW) 250 −−ns
t

PHL(SDOUT)

SDOUT HIGH-to-LOW propagation delay 100 −−ns

Fig.11 Serial data timing.

handbook, full pagewidth

MBK824

t

SCLKH

t

SCLKL

t

h(D)

t

su(en)(SDEH-SCLKH)

t

su(dis)(SCLKL-SDEL)

t

su(D)

t

r

t

f

t

PHL(SDOUT)

SDOUT

SCLK

SDIN

SCE

1998 Jun 18 20

Philips Semiconductors Product specification

LCD driver for low multiplex rates

OM4068

BONDING PAD LOCATIONS

Fig.12 Bonding pad locations.

Dimensions in mm.
Bonding pad dimensions: 80 × 80 µm.

handbook, full pagewidth

MBK816

2.03 mm

2.01
mm

x

y

0

0

2SEG31

4

V

LCD

5

V

DD

6

V

SS

7M0

8M1

9SDIN

10

11

SCE

12

SDOUT

13

BP114BP215BP3

16

SEG117SEG218SEG319SEG420SEG521SEG622SEG7

23 SEG8

24 SEG9

25 SEG10

26 SEG11

27 SEG12

28 SEG13

29 SEG14

30 SEG15

31 SEG16

32 SEG17

33 SEG18

34

SEG19

35

SEG20

36

SEG21

37

SEG22

38

SEG23

39

SEG24

40

SEG25

41

SEG26

42

SEG27

43

SEG28

44

SEG29

1

SEG30

SCLK

3SEG32

OM4068

1998 Jun 18 21

Philips Semiconductors Product specification

LCD driver for low multiplex rates

OM4068

Table 5 Bonding pad locations (dimensions in µm).

All x/y coordinates are referenced to bottom left
corner of chip (see Fig.12).

SYMBOL PAD x y

V

DD

5 43.100 970.500

V

SS

6 42.900 791.850
M0 7 43.100 661.750
M1 8 43.100 531.750
SDIN 9 43.100 401.750
SCLK 10 43.100 271.750
SCE 11 310.450 43.100
SDOUT 12 447.350 43.100
BP1 13 604.800 43.100
BP2 14 714.850 43.100
BP3 15 824.850 43.100
SEG1 16 924.850 43.100
SEG2 17 1024.850 43.100
SEG3 18 1124.850 43.100
SEG4 19 1224.850 43.100
SEG5 20 1327.250 43.100
SEG6 21 1432.450 43.100
SEG7 22 1532.650 43.100
SEG8 23 1783.600 293.850
SEG9 24 1783.600 458.850
SEG10 25 1783.600 603.850
SEG11 26 1783.600 703.850
SEG12 27 1783.600 803.850
SEG13 28 1783.600 903.850
SEG14 29 1783.600 1003.850
SEG15 30 1783.600 1103.850
SEG16 31 1783.600 1203.850
SEG17 32 1783.600 1323.850
SEG18 33 1783.600 1453.850
SEG19 34 1514.600 1711.100
SEG20 35 1370.550 1711.100
SEG21 36 1270.500 1711.100
SEG22 37 1170.500 1711.100
SEG23 38 1070.500 1711.100
SEG24 39 970.550 1711.100
SEG25 40 870.550 1711.100
SEG26 41 770.550 1711.100
SEG27 42 660.550 1711.100

SEG28 43 550.550 1711.100
SEG29 44 430.550 1711.100
SEG30 1 300.550 1711.100
SEG31 2 43.100 1460.050
SEG32 3 43.100 1274.950
V

LCD

4 43.100 1158.700

Alignment marks

C1 − 1769.6 1696.9
C2 − 1770.1 58.4
F − 172.0 1705.2

SYMBOL PAD x y

1998 Jun 18 22

Philips Semiconductors Product specification

LCD driver for low multiplex rates

OM4068

PACKAGE OUTLINES

UNIT A1A2A3bpcE

(1)

eH

E

LL

p

Zywv θ

REFERENCES

OUTLINE
VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC JEDEC EIAJ

mm

0.25

0.05

1.85

1.65

0.25

0.40

0.20

0.25

0.14

10.1

9.9

0.8 1.3

12.9

12.3

1.2

0.8

10

0

o

o

0.15 0.10.15

DIMENSIONS (mm are the original dimensions)

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

0.95

0.55

SOT307-2

95-02-04
97-08-01

D

(1) (1)(1)

10.1

9.9

H

D

12.9

12.3

E

Z

1.2

0.8

D

e

E

B

11

c

E

H

D

Z

D

A

Z

E

e

v M

A

X

1

44

34

33 23

22

12

y

θ

A

1

A

L

p

detail X

L

(A )

3

A

2

pin 1 index

D

H

v M

B

b

p

b

p

w M

w M

0 2.5 5 mm

scale

QFP44: plastic quad flat package; 44 leads (lead length 1.3 mm); body 10 x 10 x 1.75 mm

SOT307-2

A

max.

2.10

1998 Jun 18 23

Philips Semiconductors Product specification

LCD driver for low multiplex rates

OM4068

UNIT

A

max.

1 2

b

1

cD E e M

H

L

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC JEDEC EIAJ

mm

inches

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

SOT129-1

92-11-17
95-01-14

A

min.

A

max.

b

Z

max.

w

M

E

e

1

1.70

1.14

0.53

0.38

0.36

0.23

52.50

51.50

14.1

13.7

3.60

3.05

0.2542.54 15.24

15.80

15.24

17.42

15.90

2.254.7 0.51 4.0

0.067

0.045

0.021

0.015

0.014

0.009

2.067

2.028

0.56

0.54

0.14

0.12

0.010.10 0.60

0.62

0.60

0.69

0.63

0.089 0.19 0.020 0.16

051G08 MO-015AJ

M

H

c

(e )

1

M

E

A

L

seating plane

A

1

w M

b

1

e

D

A

2

Z

40

1

21

20

b

E

pin 1 index

0 5 10 mm

scale

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

(1)

(1)(1)

DIP40: plastic dual in-line package; 40 leads (600 mil)

SOT129-1

1998 Jun 18 24

Philips Semiconductors Product specification

LCD driver for low multiplex rates

OM4068

SOLDERING
Introduction

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

“Data Handbook IC26; Integrated Circuit Packages”

(order code 9398 652 90011).

DIP

S

OLDERING BY DIPPING OR BY WAVE

The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.

The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T

stg max

). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.

R

EPAIRING SOLDERED JOINTS

Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.

QFP

REFLOW SOLDERING
Reflow soldering techniques are suitable for all QFP

packages.

The choice of heating method may be influenced by larger
plastic QFP packages (44 leads, or more). If infrared or
vapour phase heating is used and the large packages are
not absolutely dry (less than 0.1% moisture content by
weight), vaporization of the small amount of moisture in
them can cause cracking of the plastic body. For details,
refer to the Drypack information in the

“Data Handbook
IC26; Integrated Circuit Packages; Section: Packing
Methods”

.

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 50 and 300 seconds depending on heating
method. Typical reflow peak temperatures range from
215 to 250 °C.

W

AVE SOLDERING

Wave soldering is not recommended for QFP packages.
This is because of the likelihood of solder bridging due to
closely-spaced leads and the possibility of incomplete
solder penetration in multi-lead devices.

If wave soldering cannot be avoided, for QFP
packages with a pitch (e) larger than 0.5 mm, the
following conditions must be observed:

• A double-wave (a turbulent wave with high upward

pressure followed by a smooth laminar wave)
soldering technique should be used.

• The footprint must be at an angle of 45° to the board

direction and must incorporate solder thieves
downstream and at the side corners.

CAUTION

Wave soldering is NOT applicable for all QFP
packages with a pitch (e) equal or less than 0.5 mm.

1998 Jun 18 25

Philips Semiconductors Product specification

LCD driver for low multiplex rates

OM4068

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

R

EPAIRING SOLDERED JOINTS

Fix the component by first soldering two diagonally­opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.

DEFINITIONS

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

1998 Jun 18 26

Philips Semiconductors Product specification

LCD driver for low multiplex rates

OM4068

NOTES

1998 Jun 18 27

Philips Semiconductors Product specification

LCD driver for low multiplex rates

OM4068

NOTES

Internet: http://www.semiconductors.philips.com

Philips Semiconductors – a worldwide company

© Philips Electronics N.V. 1998 SCA60
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

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Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,

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20124 MILANO, Tel. [phone], Fax. [phone]

Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku,
TOKYO 108-8507, Tel. [phone], Fax. [phone]

Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. [phone], Fax. [phone]

Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. [phone], Fax. [phone]

Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. [phone]

Printed in The Netherlands 415106/1200/01/pp28 Date of release: 1998 Jun 18 Document order number: 9397 750 03802