Datasheet OM3105P Datasheet (Philips)

DISCRETE SEMICONDUCTORS

DATA SH EET

OM3105P

Hybrid integrated circuits for
inductive proximity detectors

Preliminary specification
File under Discrete Semiconductors, SC17

Philips Semiconductors

January 1994

Philips Semiconductors Preliminary specification

Hybrid integrated circuits for inductive
proximity detectors

FEATURES

• Extra small dimensions (3 x 20 mm max.)

• Wide supply voltage range (6 to 35 V)

• Supply current typical 1.5 mA (output stage

switched off)

• High output current (250 mA max.)

• RC filter on the supply lines

• PNP output transistor protected against transients from

the inductive load

• Circuit protected against wrong polarity connection of
the supply voltage

• Electronic short-circuit protection

• Detection distance adjustable by a chip resistor (Rd),

type 1206

• Only a simple coil in one part is required; e.g. the
OM2860 requires a coil in two parts

• Hysteresis adjustable by a chip resistor (Rh), type 0603,
for using the OM3105P with other then M5 coils

• Status of the output is shown by a yellow or red LED
mounted on the substrate surface

• The OM3105P is also available without a LED, but with
an output pad for external LED connection

• A version with a NPN output transistor is available
(OM3105P).

OM3105P

DESCRIPTION

The OM3105P is a hybrid integrated circuit intended for
inductive proximity detectors in a tubular construction,
especially the M5 hollow stud. The circuit performs a make
function (version 1): when actuated, the current flows
through the load, which can be for example a LED or an
optocoupler. It is also possible to perform a break function
when using version OM3115P.

Available versions:

OM3105P: pnp output; make function
OM3115P: pnp output; break function
OM3105N: npn output; make function
OM3115N: npn output; break function
OM31.5./0: for external LED connection.

QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITIONS TYP. MAX. UNIT

V

B

I

O

f

sw

T

s

January 1994 2

DC supply voltage 6 35 V
output current VB = 24 V; Ts= 25 °C − 250 mA
operating switching frequency M5 coil − 5 kHz
operating substrate temperature −20 +70 °C

Philips Semiconductors Preliminary specification

inductive
load

3

1

20 max

8

7

3

max

5

4

7.75 0.3

6

2

Dimensions in mm.
Coil: Ø 0.063 mm Cu wire, 80 turns.
Potcore: 3.3 x 1.3 mm.

Fig.1 Outline and connections.

Hybrid integrated circuits for inductive
proximity detectors

MECHANICAL DATA

OM3105P

MSA936 - 1

PAD INFORMATION

PAD NUMBER DESCRIPTION

1 output
2 negative supply (−)
3 positive supply (+)
4 coil connection
5 coil connection
6 Rd resistor (type 1206) for adjusting the detection distance
7 Rt resistor (type 0603) for adjusting the stability with temperature variations
8 Rh resistor (type 0603) for adjusting the hysteresis

January 1994 3

Philips Semiconductors Preliminary specification

0.9

0 20 40 60

d

(mm)

T ( C)

o

s

d

off

d

on

Fig.2 Switching distance as a function of the

substrate temperature.

0.9

12 18 24 30

d

(mm)

V (V)

B

d

off

d

on

Fig.3 Switching distance as a function of the DC

supply voltage.

Hybrid integrated circuits for inductive

OM3105P

proximity detectors

LIMITING VALUES

Limiting values in accordance with the Absolute Maximum Rating System (IEC 134).

SYMBOL PARAMETER MIN. MAX. UNIT

V

B

I

O

T

stg

T

s

CHARACTERISTICS

V

= 24 V (DC); Ts = 25 °C; unless otherwise specified.

B

SYMBOL PARAMETER CONDITIONS TYP. MAX. UNIT

I

B

V

d

d detection distance coil M5 0.8 − mm

DC supply voltage 6 35 V
output current; Ts= 25 °C − 250 mA
storage temperature −40 +125 °C
operating substrate temperature −20 +70 °C

supply current output stage ON 11 − mA

output stage OFF 1.5 − mA

voltage drop IO = 250 mA 1 1.5 V

1.0

0.8
20 80

MBD233

1.0

0.8

MBD235

6

January 1994 4

Philips Semiconductors Preliminary specification

0 20 40 60

I

T ( C)

o

s

O max

(mA)

350

300

250

200

150

Fig.4 Overload protection as a function of the substrate temperature.

Fig.5 Insertion of potcore in brass tube.

MSB318

d

Hybrid integrated circuits for inductive
proximity detectors

400

20 80

OM3105P

MBD234

MOUNTING RECOMMENDATIONS
General

If a protective cap is incorporated, it should be as thin as
possible, because its thickness “d” forms part of the
operating distance “S”.
A brass stud wall should not extend beyond the potcore.
The exact value of “S” with its spread is determined by a
number of variables, e.g.:

value of the adjustment resistor Rx,
the oscillator coil,
the metal of the actuator,
the material and shape of the housing.

Soldering recommendations

• Use normal 60/40 solder.

• Use a soldering iron with a fine point.

• Soldering time should be kept to a minimum, not

exceeding 2.5 s per soldering point (T

= 250 °C

sld

maximum).

• The substrate should preferably be pre-heated to a
temperature of 100 °C with a minimum of 80 °C and a
maximum of 125 °C.

Potting recommendations

First cover the hybrid IC with about 0.5 mm of silicone
rubber, let it harden and with the parts inserted in the tube,
fill up the tube with epoxy.

January 1994 5

Philips Semiconductors Preliminary specification

Hybrid integrated circuits for inductive

OM3105P

proximity detectors

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

January 1994 6

Philips Semiconductors Preliminary specification

Hybrid integrated circuits for inductive
proximity detectors

NOTES

OM3105P

January 1994 7

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