Datasheet NUP4000 Datasheet (ON)

Page 1
NUP4000
Bi-directional TVS Array for High-Speed Data Line Protection
Features:
• SO−8 Package
• Peak Power − 400 W 8 x 20 mS
• ESD Rating:
IEC 61000−4−2 (ESD) ±15 kV (air) ±8 kV (contact) IEC 61000−4−4 (EFT) 40 A (5/50 ns) IEC 61000−4−5 (lightning) 12 A (8/20 ms)
• UL Flammability Rating of 94 V−0
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Typical Applications:
• High Speed Communication Line Protection
• 15 V Data and I/O Lines
• Microprocessor Based Equipment
• LAN/WAN Equipment
• Servers
• Notebook and Desktop PC
• Serial and Parallel Ports
• Peripherals
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SO−8
VOLTAGE SUPPRESSOR
400 WATTS PEAK POWER
15 VOLTS
PIN CONFIGURATION
AND SCHEMATIC
1
2
3
4
8
SO−8
CASE 751
8
7
6
5
1
MAXIMUM RATINGS
Rating Symbol Value Unit
Peak Power Dissipation 8 x 20 ms @ T
Peak Pulse Current 8 x 20 ms @ T
Junction and Storage Temperature Range
Lead Solder Temperature − Maximum 10 Seconds Duration
1. Non−repetitive current pulse 8 x 20 mS exponential decay waveform
= 25°C (Note 1)
A
= 25°C (Note 1)
A
P
I
TJ, T
T
PP
stg
400 W
10 A
−55 to +150
260 °C
pk
L
°C
MARKING DIAGRAM
8
NUP40
AYWWG
G
1
A = Assembly Location Y = Year WW = Work Week G = Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device Package Shipping
NUP4000DR2G SO−8
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D.
2500 / Tape & Reel
†
© Semiconductor Components Industries, LLC, 2009
August, 2009 − Rev. 0
1 Publication Order Number:
NUP4000/D
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NUP4000
ELECTRICAL CHARACTERISTICS
Characteristic Symbol Min Typ Max Unit
Reverse Working Voltage V
Reverse Breakdown Voltage @ It = 1.0 mA V
Reverse Leakage Current @ V
Maximum Clamping Voltage @ IPP = 1.0 A, 8 x 20 mS
Maximum Clamping Voltage @ IPP = 5.0 A, 8 x 20 mS
Maximum Peak Pulse Current I
Junction Capacitance @ VR = 0 V, f = 1 MHz C
= 15 Volts I
RWM
RWM
BR
R
V
C
V
C
PP
J
− − 15 V
16.7 − − V
N/A − 1.0
N/A − 24 V
N/A − 30 V
− − 10 A
− − 75 pF
mA
1000
100
10
NOTE: Non−Repetitive Surge.
, PEAK SURGE POWER (WATTS)
pk
P
1
1 10 100 1000
t, TIME (ms)
Figure 1. Pulse Width
100
90
80
70
60
50
t
r
PEAK VALUE I
PULSE WIDTH (tP) IS DEFINED AS THAT POINT WHERE THE PEAK CURRENT DECAY = 8 ms
HALF VALUE I
RSM
@ 8 ms
RSM
/2 @ 20 ms
40
30
20
10
% OF PEAK PULSE CURRENT
0
t
P
020406080
t, TIME (ms)
Figure 2. 8 × 20 ms Pulse Waveform
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2
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−Y−
−Z−
NUP4000
PACKAGE DIMENSIONS
SOIC−8 NB
CASE 751−07
ISSUE AJ
−X−
B
H
A
58
1
4
G
D
0.25 (0.010) Z
M
S
0.25 (0.010)
M
M
Y
K
Y
C
SXS
SEATING PLANE
0.10 (0.004)
N
X 45
_
M
J
SOLDERING FOOTPRINT*
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION.
6. 751−01 THRU 751−06 ARE OBSOLETE. NEW STANDARD IS 751−07.
MILLIMETERS
DIMAMIN MAX MIN MAX
4.80 5.00 0.189 0.197
B 3.80 4.00 0.150 0.157 C 1.35 1.75 0.053 0.069 D 0.33 0.51 0.013 0.020 G 1.27 BSC 0.050 BSC H 0.10 0.25 0.004 0.010 J 0.19 0.25 0.007 0.010 K 0.40 1.27 0.016 0.050 M 0 8 0 8
____
N 0.25 0.50 0.010 0.020 S 5.80 6.20 0.228 0.244
INCHES
1.52
0.060
7.0
0.275
0.6
0.024
4.0
0.155
1.270
0.050
SCALE 6:1
ǒ
inches
mm
Ǔ
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
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NUP4000/D
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