Datasheet ntud3128n Datasheet

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Page 1

NTUD3128N

Small Signal MOSFET

20 V, 200 mA, Dual N-Channel, 1.0 mm x

1.0 mm SOT-963 Package

Features

•Dual N-Channel MOSFET

•Offers a Low R

Package

Solution in the Ultra Small 1.0 x 1.0 mm

DS(ON)

•1.5 V Gate Voltage Rating

•Ultra Thin Profile (< 0.5 mm) Allows It to Fit Easily into Extremely

Thin Environments such as Portable Electronics

•These are Pb-Free Devices

Applications

•General Purpose Interfacing Switch

•Optimized for Power Management in Ultra Portable Equipment

MAXIMUM RATINGS (T

Parameter Symbol Value Unit

Drain-to-Source Voltage V

Gate-to-Source Voltage V

Continuous Drain Current (Note 1)

Power Dissipation

(Note 1)

Pulsed Drain Current

Operating Junction and Storage Temperature TJ,

Source Current (Body Diode) (Note 2) I

Lead Temperature for Soldering Purposes

(1/8” from case for 10 s)

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.

1. Surface-mounted on FR4 board using the minimum recommended pad size, 1 oz Cu.

2. Pulse Test: pulse width v300 ms, duty cycle v2%

= 25°C unless otherwise specified)

DSS

Steady

State

t v 5 s

Steady

State

t v 5 s

TA = 25°C

TA = 85°C 115

TA = 25°C 200

TA = 25°C P

tp = 10 ms

STG

20 V

±8 V

160

125

200

800 mA

-55 to 150

200 mA

260 °C

°C

(BR)DSS

20 V

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PINOUT: SOT-963

SOT-963

CASE 527AA

MAX ID Max

DS(ON)

3.0 W @ 4.5 V

4.0 W @ 2.5 V

6.0 W @ 1.8 V

10 W @ 1.5 V

N-Channel

MOSFET

Top View

0.2 A

MARKING DIAGRAM

N MG

© Semiconductor Components Industries, LLC, 2007

June, 2007 - Rev. 0

N = Specific Device Code M = Date Code G = Pb-Free Package

ORDERING INFORMATION

See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet.

1 Publication Order Number:

NTUD3127C/D

Page 2

NTUD3128N

THERMAL RESISTANCE RATINGS

Parameter Symbol Max Unit

Junction-to-Ambient – Steady State (Note 3)

Junction-to-Ambient – t = 5 s (Note 3) 600

3. Surface-mounted on FR4 board using the minimum recommended pad size, 1 oz Cu.

1000

°C/W

ELECTRICAL CHARACTERISTICS (T

= 25°C unless otherwise specified)

Parameter Symbol Test Condition Min Typ Max Unit

OFF CHARACTERISTICS

Drain-to-Source Breakdown Voltage

(BR)DSS

VGS = 0 V, ID = 250 mA

Zero Gate Voltage Drain Current

DSS

VGS = 0 V, VDS = 5 V

VGS = 0 V, VDS = 16 V TJ = 25°C 100

Gate-to-Source Leakage Current I

GSS

VDS = 0 V, VGS = ±5.0 V 100 nA

ON CHARACTERISTICS (Note 4)

Gate Threshold Voltage

Drain-to-Source On Resistance

GS(TH)

VGS = VDS, ID = 250 mA

VGS = 4.5 V, ID = 100 mA 1.5 3.0

VGS = 2.5 V, ID = 50 mA 2.0 4.0

DS(ON)

VGS = 1.8 V, ID = 20 mA 3.0 6.0

VGS = 1.5 V, ID = 10 mA 4.0 10

VGS = 1.2 V, ID = 1.0 mA 5.5

Forward Transconductance g

Source-Drain Diode Voltage V

VDS = 5.0 V, ID = 125 mA 0.35 S

VGS = 0 V, ID = 10 mA 0.6 1.0 V

CHARGES, CAPACITANCES AND GATE RESISTANCE

Input Capacitance

Output Capacitance C

Reverse Transfer Capacitance C

ISS

OSS

RSS

f = 1.0 MHz, VGS = 0 V

SWITCHING CHARACTERISTICS, VGS = 4.5 V (Note 4)

Turn-On Delay Time

Rise Time t

Turn-Of f Delay Time t

Fall Time t

d(ON)

d(OFF)

VGS = 4.5 V, VDD = 10 V, ID = 200 mA,

4. Switching characteristics are independent of operating junction temperatures.

= 15 V

= 2.0 W

20 V

TJ = 25°C 50

TJ = 85°C 200

0.4 1.0 V

9.0

3.0

2.2

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Page 3

NTUD3128N

TYPICAL PERFORMANCE CURVES

0.4 0.4 TJ = 25°C

2.0 V

0.3

VGS = 3 V to 5 V

2.5 V

0.2

1.5 V

0.1

DRAIN CURRENT (AMPS)

1.0 V

, DRAIN-TO-SOURCE VOLTAGE (VOLTS)

Figure 1. On-Region Characteristics

ID = 200 mA

TJ = 25°C

0.3

0.2

0.1

2.5

2.0

1.5

VDS ≥ 5 V

TJ = -55°C

TJ = 25°C

VGS, GATE-T O-SOURCE VOLTAGE (VOLTS)

Figure 2. Transfer Characteristics

TJ = 25°C

VGS = 2.5 V

VGS = 4.5 V

TJ = 125°C

1.0

0.5

DRAIN-T O-SOURCE RESISTANCE (W)

035

DS(on),

, GATE-T O-SOURCE VOLTAGE (VOLTS)

Figure 3. On-Resistance vs. Gate Voltage

1.75

ID = 200 mA

1.5 V

= 4.5 V

1.25

DRAIN-T O-SOURCE RESISTANCE (W)

DS(on),

0.1 0.40.05 0.2 0.350.15

Figure 4. On-Resistance vs. Drain Current and

1000

VGS = 0 V

100

1.0

0.75

DRAIN-T O-SOURCE

0.5

DS(on),

0.25

RESISTANCE (NORMALIZED)

-50 0-25 25

50 150

TJ, JUNCTION TEMPERATURE (°C)

125100

, LEAKAGE (nA)

DSS

VDS, DRAIN-TO-SOURCE VOLTAGE (VOLTS)

0.30.25

ID, DRAIN CURRENT (AMPS)

Gate Voltage

TJ = 150°C

TJ = 125°C

1648

Figure 5. On-Resistance Variation with

Temperature

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Figure 6. Drain-to-Source Leakage Current

vs. Voltage

Page 4

NTUD3128N

TYPICAL PERFORMANCE CURVES

VGS = 0 V T

= 25°C

iss

C, CAPACITANCE (pF)

02 12

46810

14 16

oss

rss

GATE-T O-SOURCE OR DRAIN-TO-SOURCE VOLTAGE (VOLTS)

Figure 7. Capacitance Variation Figure 8. Resistive Switching Time

0.2

VGS = 0 V T

= 25°C

0.15

1000

VDD = 10 V I

= 200 mA

= 4.5 V

100

t, TIME (ns)

1 10 100

, GATE RESISTANCE (OHMS)

Variation vs. Gate Resistance

d(off)

d(on)

0.1

0.05

, SOURCE CURRENT (AMPS)

0.60.2

0.80.4

1.0

VSD, SOURCE-TO-DRAIN VOLTAGE (VOLTS)

Figure 9. Diode Forward Voltage vs. Current

ORDERING INFORMATION

Device Package Shipping

NTUD3128NT5G SOT-963

8000 / Tape & Reel

(Pb-Free)

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.

†

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Page 5

NTUD3128N

PACKAGE DIMENSIONS

SOT-963

CASE 527AA-01

ISSUE A

456

12 3

-Y-

-X-

X0.08

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETERS

3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL.

MILLIMETERS

DIM MIN NOM MAX

A 0.40 0.45 0.50

b 0.10 0.15 0.20 C 0.05 0.10 0.15 D 0.95 1.00 1.05 E 0.75 0.80 0.85

e 0.35 BSC

L 0.05 0.10 0.15

0.95 1.00 1.05

INCHES

MIN NOM MAX

0.016 0.018 0.020

0.004 0.006 0.008

0.002 0.004 0.006

0.037 0.039 0.041

0.03 0.032 0.034

0.014 BSC

0.002 0.004 0.006

0.037 0.039 0.041

SOLDERING FOOTPRINT*

0.35

0.014

0.90

0.0354

0.20

0.08

0.20

0.08

SCALE 20:1

inches

*For additional information on our Pb-Free strategy and soldering

details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.

ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

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NTUD3128N/D