Datasheet ntd4809n-d Datasheet

NTD4809N

Power MOSFET

30 V, 58 A, Single N--Channel, DPAK/IPAK

Features

• Low R

• Low Capacitance to Minimize Driver Losses

• Optimized Gate Charge to Minimize Switching Losses

• These are Pb--Free Devices

Applications

• CPU Power Delivery

• DC--DC Converters

• Low Side Switching

MAXIMUM RATINGS (T

Drain--to--Source Voltage V

Gate--to--Source Voltage V

Continuous Drain Current (R

Power Dissipation (R

)(Note1)

θ

JA

Continuous Drain Current (R

Power Dissipation (R

)(Note2)

θ

JA

Continuous Drain Current (R (Note 1)

Power Dissipation (R

)(Note1)

θ

JC

Pulsed Drain Current

Current Limited by Package TA=25°C I

Operating Junction and Storage Temperature TJ,T

Source Current (Body Diode) I

Drain to Source dV/dt dV/dt 6.0 V/ns

Single Pulse Drain --to-- Source Avalanche Energy (V L=1.0mH,I

Lead Temperature for Soldering Purposes (1/8″ from case for 10 s)

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.

to Minimize Conduction Losses

DS(on)

=25°C unless otherwise noted)

J

Parameter Symbol Value Unit

DSS

GS

)(Note1)

θ

JA

)(Note2)

θ

JA

)

θ

JC

=24V,VGS=10V,

DD

= 13.5 A, RG=25Ω)

L(pk)

Steady

State

tp=10ms

TA=25°C

TA=85°C 9.0

TA=25°C P

TA=25°C

TA=85°C 7.0

TA=25°C P

TC=25°C

TC=85°C 45

TC=25°C P

TA=25°C I

I

D

I

D

I

D

DM

DmaxPkg

stg

S

E

AS

T

L

30 V

20 V

11. 5

2.0 W

9.0

1.3 W

58

52 W

130 A

45 A

-- 5 5 t o 175

43 A

91.0 mJ

260 °C

A

°C

(BR)DSS

30 V

2

1

3

CASE 369AA

DPAK

(Bent Lead)

STYLE 2

4

Drain

YWW4809NG

2

Drain

1

Gate

Source

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MAX

R

DS(on)

9.0 mΩ @10V

14 m Ω @4.5V

D

G

S

4

1

2

3

CASE 369AD

IPAK

(Straight Lead)

MARKING DIAGRAMS

& PIN ASSIGNMENTS

4

Drain

YWW4809NG

2

1

3

Gate

Y = Year WW = Work Week 4809N = Device Code G = Pb-- Free Package

Drain

3

Source

Gate

IDMAXV

58 A

N--Channel

4

1

2

3

CASE 369D

IPAK

(Straight Lead

DPAK)

4

Drain

YWW4809NG

2

1

3

Drain

Source

June, 2010 -- Rev. 11

ORDERING INFORMATION

See detailed ordering and shipping information in the package dimensions section on page 6 of this data sheet.

1 Publication Order Number:

NTD4809N/D

NTD4809N

THERMAL RESISTANCE MAXIMUM RATINGS

Parameter Symbol Value Unit

Junction--to--Case (Drain)

Junction--to--TAB (Drain)

Junction--to--Ambient -- Steady State (Note 1)

Junction--to--Ambient -- Steady State (Note 2)

1. Surface--mounted on FR4 board using 1 in sq pad size, 1 oz Cu.

2. Surface--mounted on FR4 board using the minimum recommended pad size.

R

θ

R

θ

JC

JC--TAB

R

θ

JA

R

θ

JA

2.9

3.5

74

116

°C/W

ELECTRICAL CHARACTERISTICS (T

Parameter

=25°C unless otherwise noted)

J

Symbol Test Condition Min Typ Max Unit

OFF CHARACTERISTICS

Drain--to--Source Breakdown Voltage

V

(BR)DSS

V

(BR)DSS/TJ

VGS=0V,ID= 250 mA

30 V

25 mV/°C

Temperature Coefficient

Zero Gate Voltage Drain Current I

Gate--to--Source Leakage Current I

DSS

GSS

VGS=0V,

V

=24V

DS

VDS=0V,VGS= 20 V 100 nA

TJ=25°C 1.0 mA

TJ= 125°C 10

ON CHARACTERISTICS (Note 3)

Gate Threshold Voltage

Negative Threshold Temperature Coefficient V

Drain--to--Source On Resistance R

V

GS(TH)

GS(TH)/TJ

DS(on)

VGS=VDS,ID= 250 mA

VGS=10to

11. 5 V

VGS=4.5V

ID=30A 7.0 9.0 mΩ

ID=15A 7.0

ID=30A 12 14

1.5 2.5 V

5.7 mV/°C

ID=15A 11

Forward Transconductance gFS VDS=15V,ID=15A 9.0 S

CHARGES AND CAPACITANCES

Input Capacitance

Output Capacitance C

Reverse Transfer Capacitance C

Total Gate Charge Q

Threshold Gate Charge Q

Gate--to--Source Charge Q

Gate--to--Drain Charge Q

Total Gate Charge Q

C

iss

oss

rss

G(TOT)

G(TH)

GS

GD

G(TOT)

VGS=0V,f=1.0MHz,

V

=12V

DS

VGS=4.5V,VDS=15V,

I

=30A

D

VGS=11.5V,VDS=15V,

I

=30A

D

1456

315

200

11 13

2.5

4.8

5.0

25 nC

SWITCHING CHARACTERISTICS (Note 4)

Turn--On Delay Time

Rise Time t

Turn--Off Delay Time t

Fall Time t

Turn--On Delay Time t

Rise Time t

Turn--Off Delay Time t

Fall Time t

t

d(on)

d(off)

d(on)

d(off)

12.3

r

f

VGS=4.5V,VDS=15V,

I

=15A,RG=3.0Ω

D

21.3

15.1

5.3

7.0

r

f

VGS=11.5V,VDS=15V,

I

=15A,RG=3.0Ω

D

22.7

25.3

2.8

3. Pulse Test: Pulse Width ≤ 300 ms, Duty Cycle ≤ 2%.

4. Switching characteristics are independent of operating junction temperatures.

pF

nC

ns

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2

NTD4809N

ELECTRICAL CHARACTERISTICS (T

Parameter

=25°C unless otherwise noted)

J

Symbol Test Condition Min Typ Max Unit

DRAIN--SOURCE DIODE CHARACTERISTICS

Forward Diode Voltage

Reverse Recovery Time t

Charge Time ta 10.7

Discharge Time tb 8.8

Reverse Recovery Time Q

V

SD

RR

VGS=0V,

I

=30A

S

TJ=25°C 0.95 1.2

TJ= 125°C 0.83

VGS= 0 V, dIs/dt = 100 A/ms,

I

=30A

S

RR

PACKAGE PARASITIC VALUES

Source Inductance

Drain Inductance, DPAK L

Drain Inductance, IPAK L

Gate Inductance L

Gate Resistance R

L

S

D

G

TA=25°C

19.5

9.2 nC

2.49

0.0164

1.88

3.46

2.4

V

ns

nH

Ω

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3

NTD4809N

TYPICAL PERFORMANCE CURVES

120

7V

110

6.5 V

100

90

80

70

60

50 40

30

, DRAIN CURRENT (AMPS)

D

20

I

10

0

05

V

, DRAIN--TO--SOURCE VOLTAGE (VOLTS)

DS

6V

5.5 V

21

3

TJ=25°C

5V

4.5 V

4.2 V

4V

3.8 V

3.6 V

3.4 V

3.2 V

4

120

100

80

60

40

, DRAIN CURRENT (AMPS)

D

20

I

0

VDS≥ 10 V

TJ= 125°C

TJ=25°C

10

, GATE--TO--SOURCE VOLTAGE (VOLTS)

V

GS

23

Figure 1. On--Region Characteristics Figure 2. Transfer Characteristics

0.045

0.040

0.035

0.030

0.025

0.020

0.015

0.010

, DRAIN--TO--SOURCE RESISTANCE (Ω)

0.005

DS(on)

R

0

3

4

5

VGS, GATE--TO--SOURCE VOLTAGE (VOLTS)

789

610

Figure 3. On--Resistance vs. Gate--to --Source

Volta g e

ID=30A T

=25°C

J

0.020 TJ=25°C

0.015

VGS=4.5V

0.010

VGS=11.5V

0.005

, DRAIN--TO--SOURCE RESISTANCE (Ω)

0

DS(on)

10

R

15 20

30

25 35 45 55

ID, DRAIN CURRENT (AMPS)

Figure 4. On--Resistance vs. Drain Current and

Gate Voltage

TJ=--55°C

45

40

50

6

60

2.0

ID=30A V

=10V

GS

1.5

1.0

(NORMALIZED)

, DRAIN--TO--SOURCE RESISTANCE

0.5

DS(on)

--50 50250--25 75 125100

R

TJ, J UNCTION TEMPERATURE (°C)

Figure 5. On-- Resistance Variation with

Temperature

100,000

10,000

1000

, LEAKAGE (nA)

DSS

I

100

10

175

150

http://onsemi.com

4

VGS=0V

TJ= 175°C

TJ= 125°C

1510 255

VDS, DRAIN--TO--SOURCE VOLTAGE (VOLTS)

20

Figure 6. Drain--to--Source Leakage Current

vs. Drain Voltage

NTD4809N

TYPICAL PERFORMANCE CURVES

2500

C

2000

iss

1500

C

1000

C, CAPACITANCE (pF)

rss

500

0

10 0 10 15 25

55

VGS=0VVDS=0V

C

rss

TJ=25°C

C

iss

C

oss

20

V

GS

V

DS

GATE--TO- -SOURCE OR DRAIN--TO--SOURCE VOLTAGE (VOLTS)

Figure 7. Capacitance Variation

1000

VDD=15V I

=30A

D

V

=11.5V

GS

100

t

d(off)

t

d(on)

r

t

f

t, TIME (ns)

10

1

1 10 100

RG, G ATE RESISTANCE (OHMS)

Figure 9. Resistive Switching Time

Variation vs. Gate Resistance

12

11

Q

T

10

9

8

7 6

5

Q

1

4

3 2

1

0

, GATE--TO--SOURCE VOLTAGE (VOLTS)

0

1 2 3 4 6 7 8 9 111213141516171819202122232425

GS

V

Q

2

105

Q

, TOTAL GATE CHARGE (nC)

G

ID=30A 0V<V T

=25°C

J

Figure 8. Gate--To--Source and Drain--To--Source

Voltage vs. Total Charge

30

VGS=0V

TJ=25°C

25

20

15

10

, SOURCE CURRENT (AMPS)

5

S

I

0

0.5

0.6 0.7 1.0

, SOURCE--TO--DRAIN VOLTAGE (VOLTS)

V

SD

0.8 0.9

Figure 10. Diode Forward Voltage vs. Current

<11.5V

GS

26

1000

100

10

1

, DRAIN CURRENT (AMPS)

0.1

D

I

0.01

0.01 10 100

VGS=20V SINGLE PULSE T

=25°C

A

R

LIMIT

DS(on)

THERMAL LIMIT PACKAGE LIMIT

0.1

1

VDS, DRAIN--TO--SOURCE VOLTAGE (VOLTS)

Figure 11. Maximum Rated Forward Biased

Safe Operating Area

120

100

10 ms

100 ms

1ms

80

60

10 ms

40

dc

AVALANCHE ENERGY (mJ)

20

0

25

EAS, SINGLE PULSE DRAIN--TO-- SOURCE

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5

ID=15A

50 75 175

T

, J UNCTION TEMPERATURE (°C)

J

100 125

150

Figure 12. Maximum Avalanche Energy vs.

Starting Junction Temperature

100

NTD4809N

TYPICAL PERFORMANCE CURVES

r(t) (°C/W)

100

10

1

D=0.5

0.2

0.1

0.05

0.02

0.01

10

1

, DRAIN CURRENT (AMPS)

D

I

0.1

100°C

125°C

10

PULSE WIDTH (ms)

25°C

Figure 13. Avalanche Characteristics

10001 100

0.1

SINGLE PULSE

0.01

0.000001 0.00001 0.0001 0.001 0.01 0.1 1 10 100 1000

t, TIME (s)

Figure 14. Thermal Response

ORDERING INFORMATION

Order Number Package Shipping

NTD4809NT4G DPAK

(Pb--Free)

NTD4809N--1G IPAK

(Pb--Free)

NTD4809N--35G IPAK Trimmed Lead

(3.5  0.15 mm)

(Pb--Free)

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.

2500 Tape & Reel

75 Units/Rail

†

http://onsemi.com

6

L3

L4

b2

e

E

b3

4

12 3

A

B

D

b

0.005 (0.13) C

DETAIL A

M

NTD4809N

PACKAGE DIMENSIONS

DPAK (SINGLE GUAGE)

CASE 369AA--01

ISSUE B

C

A

c2

H

c

GAUGE

L2

PLANE

L

L1

DETAIL A

ROTATED 90 CW°

SOLDERING FOOTPRINT*

6.20

0.244

0.102

2.58

A1

H

3.00

0.118

Z

C

SEATING PLANE

NOTES:

1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: INCHES.

3. THERMAL PAD CONTOUR OPTIONAL WITHIN DIMENSIONS b3, L3 and Z.

4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR BURRS. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.006 INCHES PER SIDE.

5. DIMENSIONS D AND E ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY.

6. DATUMS A AND B ARE DETERMINED AT DATUM PLANE H.

DIM MIN MAX MIN MAX

A 0.086 0.094 2.18 2.38

A1 0.000 0.005 0.00 0.13

b 0.025 0.035 0.63 0.89 b2 0.030 0.045 0.76 1.14 b3 0.180 0.215 4.57 5.46

c 0.018 0.024 0.46 0.61

c2 0.018 0.024 0.46 0.61 D 0.235 0.245 5.97 6.22 E 0.250 0.265 6.35 6.73

e 0.090 BSC 2.29 BSC

H 0.370 0.410 9.40 10.41

L 0.055 0.070 1.40 1.78 L1 0.108 REF 2.74 REF L2 0.020 BSC 0.51 BSC L3 0.035 0.050 0.89 1.27 L4 -- -- -- 0 . 0 4 0 -- -- -- 1 . 0 1

Z 0.155 ------ 3.93 ------

STYLE 2:

PIN 1. GATE

2. DRAIN

3. SOURCE

4. DRAIN

MILLIMETERSINCHES

5.80

0.228

1.60

0.063

SCALE 3:1

6.17

0.243



inches

mm



*For additional information on our Pb--Free strategy and soldering

details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.

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7

T

l

SEATING PLANE

L2

L1

NTD4809N

PACKAGE DIMENSIONS

3.5 MM IPAK, STRAIGHT LEAD

CASE 369AD--01

ISSUE O

E

E3

D

L

b1

e

2X

b

3X

M

0.13 T

A1

A

A1

E2

D2

A2

E2

OPTIONAL

CONSTRUCTION

D2

NOTES:

1.. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2.. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b APPLIES TO PLATED TERMINAL

AND IS MEASURED BETWEEN 0.15 AND

0.30mm FROM TERMINAL TIP.

4. DIMENSIONS D AND E DO NOT INCLUDE

MOLD GATE OR MOLD FLASH.

MILLIMETERS

DIM MIN MAX

A 2.19 2.38 A1 0.46 0.60 A2 0.87 1.10

b 0.69 0.89 b1 0.77 1.10

D 5.97 6.22 D2 4 . 8 0 -- -- --

E 6.35 6.73 E2 4 . 7 0 -- -- -- E3 4.45 5.46

e 2.28 BSC

L 3.40 3.60 L1 -- -- -- 2 . 1 0 L2 0.89 1.27

IPAK (STRAIGHT LEAD DPAK)

CASE 369D--01

ISSUE B

NOTES:

B

V

S

R

4

A

123

C

E

Z

-- T --

SEATING PLANE

F

G

ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice

to any products herein. SCILLC makes no warranty,representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights o f others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers,employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

K

3PL

D

0.13 (0.005) T

J

H

M

1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

DIM MIN MAX MIN MAX

A 0.235 0.245 5.97 6.35 B 0.250 0.265 6.35 6.73 C 0.086 0.094 2.19 2.38 D 0.027 0.035 0.69 0.88

E 0.018 0.023 0.46 0.58 F 0.037 0.045 0.94 1.14

0.090 BSC 2.29 BSC

G H 0.034 0.040 0.87 1.01

J 0.018 0.023 0.46 0.58 K 0.350 0.380 8.89 9.65 R 0.180 0.215 4.45 5.45

S 0.025 0.040 0.63 1.01

V 0.035 0.050 0.89 1.27

Z 0.155 ------ 3.93 ------

STYLE 2:

PIN 1. GATE

2. DRAIN

3. SOURCE

4. DRAIN

MILLIMETERSINCHES

PUBLICATION ORDERING INFORMATION

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For additional information, please contact your loca Sales Representative

NTD4809N/D

8