Datasheet nta7002n-d Datasheet

Page 1
NTA7002N
Small Signal MOSFET
30 V, 154 mA, Single, N-Channel, Gate ESD Protection, SC-75
•Low Gate Charge for Fast Switching
•Small 1.6 x 1.6 mm Footprint
•ESD Protected Gate
•Pb-Free Package is Available
Applications
•Power Management Load Switch
•Level Shift
•Portable Applications such as Cell Phones, Media Players,
Digital Cameras, PDA's, Video Games, Hand-Held Computers, etc.
MAXIMUM RATINGS (T
Parameter Symbol Value Unit
Drain-to-Source Voltage V
Gate-to-Source Voltage V
Continuous Drain Current (Note 1)
Power Dissipation (Note 1)
Pulsed Drain Current
Operating Junction and Storage Temperature TJ,
Continuous Source Current (Body Diode) I
Lead Temperature for Soldering Purposes (1/8″ from case for 10 s)
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
THERMAL RESISTANCE RATINGS
Parameter Symbol Max Unit
Junction-to-Ambient – Steady State (Note 1)
1. Surface-mounted on FR4 board using 1 in sq pad size (Cu area = 1.127 in sq [1 oz] including traces).
= 25°C unless otherwise noted)
J
DSS
GS
Steady State = 25°C I
Steady State = 25°C P
tP v 10 ms
T
R
I
DM
STG
SD
T
D
D
L
q
JA
30 V
"10 V
154 mA
300 mW
618 mA
-55 to 150
154 mA
260 °C
416 °C/W
°C
http://onsemi.com
R
DS(on)
V
(BR)DSS
30 V 154 mA
Typ @ V
1.4 W @ 4.5 V
2.3 W @ 2.5 V
1
GS
3
2
N-Channel
PIN CONNECTIONS
SC-75 (3-Leads)
Gate31
Source
SC-75 / SOT-416
CASE 463
2
(Top View)
3
2
1
STYLE 5
T6 = Specific Device Code M = Date Code G = Pb-Free Package (Note: Microdot may be in either location)
MARKING DIAGRAM
3
T6 MG
G
1
2
ORDERING INFORMATION
ID MAX
(Note 1)
Drain
© Semiconductor Components Industries, LLC, 2008
January, 2008 - Rev. 3
Device Package Shipping†
NTA7002NT1 SC-75 3000 Tape & Reel
NTA7002NT1G SC-75
(Pb-Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D.
1 Publication Order Number:
3000 Tape & Reel
NTA7002N/D
Page 2
NTA7002N
ELECTRICAL CHARACTERISTICS (T
Parameter
= 25°C unless otherwise specified)
J
Symbol Test Condition Min Typ Max Unit
OFF CHARACTERISTICS
Drain-to-Source Breakdown Voltage
Zero Gate Voltage Drain Current I
Zero Gate Voltage Drain Current I
Gate-to-Source Leakage Current I
Gate-to-Source Leakage Current I
Gate-to-Source Leakage Current I
V
(BR)DSS
DSS
DSS
GSS
GSS
GSS
VGS = 0 V, ID = 100 mA
VGS = 0 V, VDS = 30 V 1.0
VGS = 0 V, VDS = 20 V,
VDS = 0 V, VGS = ±10 V ±25
VDS = 0 V, VGS = ±5 V ±1.0
VDS = 0 V, VGS = ±5 V
ON CHARACTERISTICS (Note 2)
Gate Threshold Voltage
Drain-to-Source On Resistance R
V
GS(TH)
DS(on)
VDS = VGS, ID = 100 mA
VGS = 4.5 V, ID = 154 mA 1.4 7.0
VGS = 2.5 V, ID = 154 mA 2.3 7.5
Forward Transconductance g
FS
VDS = 3 V, ID = 154 mA 80 mS
CAPACITANCES
Input Capacitance
Output Capacitance C
Reverse Transfer Capacitance C
C
ISS
OSS
RSS
VDS = 5.0 V, f = 1 MHz,
SWITCHING CHARACTERISTICS (Note 3)
Turn-On Delay Time
Rise Time t
Turn-Off Delay Time t
Fall Time t
t
d(ON)
r
d(OFF)
f
VGS = 4.5 V, VDS = 5.0 V,
I
DRAIN-SOURCE DIODE CHARACTERISTICS
Forward Diode Voltage
V
SD
VGS = 0 V, IS = 154 mA 0.77 0.9 V
2. Pulse Test: pulse width v 300 ms, duty cycle v 2%.
3. Switching characteristics are independent of operating junction temperatures.
T = 85 °C
T = 85 °C
V
= 0 V
GS
= 75 mA, RG = 10 W
D
30 V
1.0
±1.0
0.5 1.0 1.5 V
11.5 20
10 15
3.5 6.0
13 ns
15
98
60
mA
mA
mA
mA
mA
W
pF
ns
http://onsemi.com
2
Page 3
NTA7002N
TYPICAL PERFORMANCE CURVES
0.2
0.18
0.16
0.14
5 V
2.8 V
2.4 V
0.12
0.1
0.08
0.06
DRAIN CURRENT (AMPS)
0.04
D,
I
0.02
0
0
VDS, DRAIN-TO-SOURCE VOLTAGE (VOLTS)
Figure 1. On-Region Characteristics
2.5 VGS = 4.5 V
2
1.5
VGS = 10 V
TJ = 125°C
TJ = 25°C
0.2 VDS = 5 V
0.16
2 V
0.12
0.08
DRAIN CURRENT (AMPS)
0.04
D,
2.0
I
0
0.6 1.4 2
0.8 1.6
1.4 V
1.2 V
1.20.8
1.60.4
TJ = 25°C
TJ = 125°C
1.2
TJ = -55°C
1.81
VGS, GATE-TO-SOURCE VOLTAGE (VOLTS)
Figure 2. Transfer Characteristics
2.5 TJ = 25°C
2
1.5
VGS = 2.5 V
TJ = 25°C
1
TJ = -55°C
DRAIN-TO-SOURCE RESISTANCE (W)
0.5 0 0.15
DS(on),
R
0.05
ID, DRAIN CURRENT (AMPS)
0.1
Figure 3. On-Resistance vs. Drain Current and
Temperature
2
ID = 0.15 A
1.8 V
= 4.5 V
GS
1.6
1.4
1.2
1
0.8
DRAIN-TO-SOURCE
0.6
0.4
DS(on),
R
RESISTANCE (NORMALIZED)
0.2
0
-50 0-25 25
TJ, JUNCTION TEMPERATURE (°C)
50 150
75
1
DRAIN-TO-SOURCE RESISTANCE (W)
0.5
0.2
DS(on),
R
1000
100
, LEAKAGE (nA)
10
DSS
I
1
125100 0
VGS = 4.5 V
0.050 0.150.1
ID, DRAIN CURRENT (AMPS)
Figure 4. On-Resistance vs. Drain Current and
Gate Voltage
VGS = 0 V
TJ = 150°C
TJ = 125°C
105
VDS, DRAIN-TO-SOURCE VOLTAGE (VOLTS)
15
20
25
0.2
30
Figure 5. On-Resistance Variation with
Temperature
http://onsemi.com
Figure 6. Drain-to-Source Leakage Current
vs. Voltage
3
Page 4
NTA7002N
TYPICAL PERFORMANCE CURVES
25
20
C
iss
C
rss
TJ = 25°C
15
10
C
iss
C, CAPACITANCE (pF)
5
0
10 0 5 105
VDS = 0 V VGS = 0 V
V
V
DS
GS
15
C
oss
C
rss
20
GATE-TO-SOURCE OR DRAIN-TO-SOURCE VOLTAGE (VOLTS)
Figure 7. Capacitance Variation
0.16 VGS = 0 V
0.14
T
= 25°C
J
0.12
0.1
1000
VDD = 5.0 V I
= 75 mA
D
= 4.5 V
V
GS
t
100
t, TIME (ns)
10
1
1 10 100
d(off)
t
d(on)
t
f
t
r
RG, GATE RESISTANCE (OHMS)
Figure 8. Resistive Switching Time
Variation vs. Gate Resistance
0.08
0.06
0.04
, SOURCE CURRENT (AMPS)
S
0.02
I
0
0.5 0.65 V
, SOURCE-TO-DRAIN VOLTAGE (VOLTS)
SD
Figure 9. Diode Forward Voltage vs. Current
0.70.55
0.75
0.80.6
http://onsemi.com
4
Page 5
NTA7002N
PACKAGE DIMENSIONS
SC-75 / SOT-416
CASE 463-01
ISSUE F
3 PL
b
0.20 (0.008) D
M
C
-E-
3
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2
e
-D-
1
0.20 (0.008) E
H
E
A
2. CONTROLLING DIMENSION: MILLIMETER.
MILLIMETERS
DIM MIN NOM MAX
A 0.70 0.80 0.90
A1 0.00 0.05 0.10
b
0.15 0.20 0.30 0.006 0.008 0.012
C 0.10 0.15 0.25 D 1.55 1.60 1.65 E
0.70 0.80 0.90 0.027 0.031 0.035
e 1.00 BSC L 0.10 0.15 0.20
H
1.50 1.60 1.70
E
STYLE 5:
PIN 1. GATE
2. SOURCE
3. DRAIN
INCHES
MIN NOM MAX
0.027 0.031 0.035
0.000 0.002 0.004
0.004 0.006 0.010
0.059 0.063 0.067
0.04 BSC
0.004 0.006 0.008
0.061 0.063 0.065
A1
SOLDERING FOOTPRINT*
0.356
0.014
1.803
0.071
0.787
0.031
0.508
0.020
1.000
0.039
SCALE 10:1
ǒ
inches
mm
Ǔ
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
 Literature Distribution Center for ON Semiconductor  P.O. Box 5163, Denver, Colorado 80217 USA  Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada  Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada  Email: [email protected]
N. American Technical Support: 800-282-9855 Toll Free  USA/Canada
Europe, Middle East and Africa Technical Support:
 Phone: 421 33 790 2910
Japan Customer Focus Center
 Phone: 81-3-5773-3850
http://onsemi.com
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local Sales Representative
NTA7002N/D
5
Loading...