Datasheet NSR0320MW2T1G Datasheet

NSR0320MW2T1G,
NSVR0320MW2T1G,
NSR0320MW2T3G

Schottky Barrier Diodes

These Schottky barrier diodes are designed for high current,

handling capability, and low forward voltage performance.

Features

 Low Forward Voltage − 0.24 Volts (Typ) @ I
 High Current Capability
 ESD Rating:

 Human Body Model: CLASS 3B
 Machine Model: C

 AEC Qualified and PPAP Capable
 NSV Prefix for Automotive and Other Applications Requiring

Unique Site and Control Change Requirements

 These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS

Compliant*

MAXIMUM RATINGS (T

Rating

Reverse Voltage V

Peak Revese Voltage V

Forward Power Dissipation

@ T

= 25C

A

Derate above 25C

Forward Current (DC)

Continuous

Forward Current

t = 8.3 ms Half Sinewave

Junction Temperature Range T

Storage Temperature Range T

Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.

= 125C unless otherwise noted)

J

Symbol Value Unit

R

RM

P

F

I

F

I

F

J

stg

= 10 mAdc

F

20 Vdc

23 V

200

2.0

1

5

−55 to +125 C

−55 to +150 C

mW

mW/C

A

A

http://onsemi.com

HIGH CURRENT

SCHOTTKY BARRIER DIODE

SOD−323

CASE 477

STYLE 1

1

CATHODE

MARKING DIAGRAM

RD MG

RD = Specific Device Code
M = Date Code
G = Pb−Free Package

(Note: Microdot may be in either location)

ORDERING INFORMATION

Device Package Shipping†

NSR0320MW2T1G SOD−323

(Pb−Free)

NSVR0320MW2T1G SOD−323

(Pb−Free)

NSR0320MW2T3G SOD−323

(Pb−Free)

†For information on tape and reel specifications,

including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.

2

ANODE

G

3,000 /

Tape & Reel

3,000 /

Tape & Reel

10,000 /

Tape & Reel

*For additional information on our Pb−Free strategy and soldering details, please

download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.

 Semiconductor Components Industries, LLC, 2011

November, 2011 − Rev. 4

Publication Order Number:

NSR0320MW2T1/D

NSR0320MW2T1G, NSVR0320MW2T1G, NSR0320MW2T3G

ELECTRICAL CHARACTERISTICS (T

Characteristic

= 25C unless otherwise noted)

A

Symbol Min Typ Max Unit

Total Capacitance (VR = 5.0 V, f = 1.0 MHz) C

Reverse Leakage (VR = 15 V) I

Reverse Leakage (VR = 2.0 V @ 85C) I

Reverse Leakage (VR = 15.0 V @ 85C) I

Forward Voltage (IF = 10 mA) V

Forward Voltage (IF = 100 mA) V

Forward Voltage (IF = 900 mA) V

1000

10000

1000

100

150C

100

10

IF, FORWARD CURRENT (mA)

1

0.0 0.1 0.2 0.3 0.4 0.5 0.6

25C

85C

−45C

−55C

10

IR, REVERSE CURRENT (mA)

1

0 5 10 15 20 25

VF, FORWARD VOLTAGE (V)

T

R

R

R

F

F

F

150C

125C

− 25 29 pF

− 10 50

− 200 300

− 450 1000

− 0.24 0.27 V

− 0.30 0.35 V

− 0.45 0.50 V

85C

25C

VR, REVERSE VOLTAGE (V)

mA

mA

mA

Figure 1. Forward Voltage

140

120

100

80

60

40

CT, CAPACITANCE (pF)

20

0

0 5 10 15 20

Figure 2. Leakage Current

VR, REVERSE VOLTAGE (V)

Figure 3. Total Capacitance

http://onsemi.com

2

C

NOTE 3

NSR0320MW2T1G, NSVR0320MW2T1G, NSR0320MW2T3G

PACKAGE DIMENSIONS

SOD−323

CASE 477−02

ISSUE H

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. LEAD THICKNESS SPECIFIED PER L/F DRAWING
WITH SOLDER PLATING.

4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.

5. DIMENSION L IS MEASURED FROM END OF
RADIUS.

MILLIMETERS

DIM MIN NOM MAX

A 0.80 0.90 1.00
A1 0.00 0.05 0.10
A3 0.15 REF

b 0.25 0.32 0.4

C 0.089 0.12 0.177

D 1.60 1.70 1.80

E 1.15 1.25 1.35

0.08

L

H

2.30 2.50 2.70

E

STYLE 1:

PIN 1. CATHODE

2. ANODE

0.031 0.035 0.040

0.000 0.002 0.004

0.010 0.012 0.016

0.003 0.005 0.007

0.062 0.066 0.070

0.045 0.049 0.053

0.003

0.090 0.098 0.105

1

L

NOTE 5

H

E

D

E

2b

A3

A

A1

INCHES

MIN NOM MAX

0.006 REF

SOLDERING FOOTPRINT*

0.63

0.025

0.83

0.033

1.60

0.063

2.85

0.112

SCALE 10:1

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.

ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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NSR0320MW2T1/D