Datasheet nRF402 Datasheet (Nordic VLSI)

PRODUCT SPECIFICATION
433MHz Single Chip RF Transmitter
FEATURES
True single chip FSK transmitter
Few external components required
On chip UHF synthesiser
20kbit/s data rate
2 channels
Very low power consumption
Standby mode
APPLICATIONS
Alarm Systems
Automatic Meter Reading (AMR)
Keyless entry
Home Automation
Remote Control
Surveillance
Automotive
Telemetry
nRF402
Toys
Wireless Communication
GENERAL DESCRIPTION
nRF402 is a true single chip UHF transmitter designed to operate in the 433MHz ISM (Industrial, Scientific and Medical) frequency band. It features Frequency Shift Keying (FSK) modulation capability. nRF402 operates at data rates up to 20kbits/s. Transmit power can be adjusted to a maximum of +10dBm. Antenna interface is differential and suited for low cost PCB antennas. nRF402 operates from a single 3V DC supply and has a standby mode which makes power saving easy and efficient. As a primary application, nRF402 is intended for UHF radio equipment in compliance with the European Telecommunication Standard Institute (ETSI) specification EN 300 220-1 V1.2.1.
QUICK REFERENCE DATA
Parameter Value Unit
Frequency, Channel#1/Channel#2 433.92 / 434.33 MHz Modulation FSK Frequency deviation
Max. RF output power @ 400, 3V Maximum bit rate 20 kbit/s Supply voltage 2.7 – 3.6 V Transmit supply current @ -10 dBm RF output power 8 mA Standby supply current 8
±15
10 dBm
Table 1. nRF402 quick reference data
ORDERING INFORMATION
Type number Description Version
nRF402-IC 14 pin SSOIC A
nRF402-EVKIT Evaluation kit with nRF402 IC 1.0
Table 2. nRF402 ordering information
kHz
µA
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PRODUCT SPECIFICATION
nRF402 Single Chip RF Transmitter
BLOCK DIAGRAM
CS
DIN
PWR_UP
7
9
13
REFERENCE
1
OSC
PLL
14
LOOP
FILTER
LPF
Figure 1. nRF402 block diagram with external components
PIN FUNCTIONS
Pin Name Pin function Description
1
XC1 Input Crystal oscillator input
2
VSS Ground Ground (0V)
3
VDD Power Power supply (+3V DC)
4
VCO1 Input External inductor for VCO
5
VCO2 Input External inductor for VCO
6
LPF Test Loop filter voltage test pin *
7
CS Input Channel selection
CS=“0” 433.92MHz, (Channel#1) CS=“1” 434.33MHz, (Channel#2)
8
RF_PWR Input Transmit power setting
9
DIN Input Data input
10
ANT2 Output Antenna terminal
11
ANT1 Output Antenna terminal
12
VSS Ground Ground (0V)
13
PWR_UP Input Power on/off
PWR_UP = “1” Power up (Transmit mode) PWR_UP = “0” Power down (Standby mode)
14
XC2 Output Crystal oscillator output
11
PAVCO
4
6
INDUCTOR
5
VCO
8
RF_PWR
ANT1 ANT2
10
Table 3. nRF402 pin functions
*) This pin is only for test purposes and is intended for use when measuring the loop filter voltage.
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PRODUCT SPECIFICATION
DD
DD
nRF402 Single Chip RF Transmitter
ELECTRICAL SPECIFICATIONS
Conditions: VDD = +3V DC, VSS = 0V, TA= -25°C to +85°C
Symbol Parameter (condition) Min. Typ. Max. Units
VDD Supply voltage 2.7 3 3.6 V
VSS Ground 0 V
I
Current consumption in transmit mode
DD
@ -10 dBm RF power 8 mA
I
P V V
f
XTAL
Current consumption in standby mode 8
DD
Max. RF output power @ 400 load
RF
Logic “1” input voltage
IH
Logic “0” input voltage 0
IL
I
Logic “1” input current (VI = VDD) +20
H
I
Logic “0” input current (VI = VSS) -20
L
f
Channel#1 frequency 433.92 MHz
1
f
Channel#2 frequency 434.33 MHz
2
Modulation type FSK Frequency deviation
f
Crystal frequency Bit rate 0 20 kbit/s
Z
Recommend antenna port differential load
I
impedance Spurious emission Compliant with EN 300-220-1 V1.2.1
1)
0.7V
10 dBm
0.3V
±15
4.000 MHz
400
V
DD
µA
µA µA
kHz
V V
2)
Table 4. nRF402 electrical specifications
1) Crystal stability requirement must match the receiver requirement. For use with nRF401, the
crystal frequency stability should be better than ±45 ppm.
2) With PCB loop antenna or differential to single ended matching network to a 50 antenna.
ABSOLUTE MAXIMUM RATINGS
Supply voltages
VDD..............................- 0.3V to +6V
VSS ................................................0V
Input voltage
VI......................- 0.3V to VDD + 0.3V
Note: Stress exceeding one or more of the limiting values may cause permanent damage to the device.
ATTENTION!
Electrostatic Sensitive Device Observe Precaution for handling.
Total power dissipation
PD (TA=85°C)..........................230 mW
Temperatures
Operating Temperature -25°C to +85°C Storage Temperature - 40°C to +125°C
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PRODUCT SPECIFICATION
α
e b
nRF402 Single Chip RF Transmitter
PIN ASSIGNMENT
XC1 VSS
VCO1 VCO2 LPF CS
1 2 3 4 5 6 7
nRF402
14 pin SSOIC
Figure 2. nRF402 pin assignment
PACKAGE OUTLINE
nRF402, 14 pin SSOIC. Dimensions in mm
14 13 12
14
13 12 11
10
9 8
XC2 PWR_UP VSSVDD ANT1 ANT2 DIN
RF_PWR
E H
1 2 3
D
A
1
A
L
Package Type D E H A A
14 pin SSOIC
(5.3 mm)
Min
Max
5.90
6.50
5.00
5.60
7.40
8.20 2.00
0.05
e b L Copl.
1
0.65
0.22
0.38
0.55
0.95 0.10
Figure 3. SSOIC-14 Package outline
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αα
0° 8°
PRODUCT SPECIFICATION
nRF402 Single Chip RF Transmitter
IMPORTANT TIMING DATA
Timing information
The timing information for the different operations is summarised in Table 5. (TX is transmit mode, Std.by is standby mode.)
Change of Mode Name Max Delay Condition Std.byè TX t
VDD=0 è TX t
ST
VT
Table 5 Switching times for nRF402
Switching between standby and TX-mode.
The maximum time from the PWR_UP input is set to “1”, until the synthesised frequency is stable is tST, see Table 5 and Figure 4.
Std.by to TX
VDD
2ms Operational
mode
4ms Start-up
PWR_UP
DIN
2ms
ms
0 2 4
Figure 4 Timing diagram for nRF402 when going from standby to TX-mode
Powering up to transmit-mode (start-up).
Due to spurious emission when the power supply is switched on, the PWR_UP-input must be kept low for 2ms after VDD > 2.7 V. Data (DIN) is valid within 2ms after PWR_UP is high.
VDD=0 to TX
VDD
PWR_UP
DIN
2ms 2ms
ms
0
2 4
Figure 5. Timing diagram for nRF402, when powering up to TX-mode
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PRODUCT SPECIFICATION
RF out 50 ohm
nRF402 Single Chip RF Transmitter
APPLICATION INFORMATION
Antenna output
The ANT1 and ANT2 pins provide RF output from the output stage (PA) for nRF402. The antenna connection to nRF402 is differential and the recommended load
impedance at the antenna port is 400Ω.
Figure 11 shows a typical application schematic with a differential loop antenna on a Printed Circuit Board (PCB). The output stage (PA) consists of two open collector transistors in a differential pair configuration. VDD to the PA must be supplied through the collector load. When connecting a differential loop antenna to the ANT1/ANT2 pins, VDD should be supplied through the centre of the loop antenna as shown in Figure 11.
A single ended antenna or 50 test instrument may be connected to nRF402 by using a differential to single ended matching network (BALUN) as shown in Figure 6.
VDD
180nH
22nH
ANT1
470pF
nRF402
ANT2
1.8pF
22nH
VDD
1nF
1.5pF
22nH
Figure 6. Connection of nRF402 to single ended antenna by using
a differential to single ended matching network
The 180nH inductor to VDD in Figure 6, need to have a Self-Resonance Frequency (SRF) above 433 MHz to be effective. Suitable inductors are listed in Table 6.
Vendors WWW address Part. no., 180 nH inductors,
0603 size
Stetco http://www.stetco.com 0603G181KTE Coilcraft http://www.coilcraft.com 0603CS-R18XJBC muRata http://www.murata.com LQW1608AR18J00
Table 6. Vendors and part. no. for suitable 180nH inductors.
A single ended antenna may also be connected to nRF402 using an 8:1 impedance RF transformer. The RF transformer must have a centre tap at the primary side for VDD supply.
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PRODUCT SPECIFICATION
Total Chip Current
Current Consumption [mA]
RF Output Power
Power [dBm]
nRF402 Single Chip RF Transmitter
RF output power
The external bias resistor R3 connected between the RF_PWR pin and VSS sets the output power. The RF output power may be set to levels up to +10dBm. In Figure 7 the output power is plotted for power levels down to, but not limited to, –8.5dBm for a differential load of 400. DC power supply current versus external bias resistor value is shown in Figure 8.
10
8 6 4 2 0
-2
-4
-6
-8
-10 0 20 40 60 80 100 120 140 160 180 200
22
27
33
39
47
56
68
82
100
120
150
180
Resistor Value [kΩΩ]
Figure 7. RF Output power vs. external power setting resistor (R3) for nRF402
30,0
25,0
20,0
15,0
10,0
5,0
22
27
33
39
47
56
68
82
100
120
150
180
0,0
0 20 40 60 80 100 120 140 160 180 200
Resistor Value [kΩΩ]
Figure 8. Total chip current consumption vs. external power setting resistor (R3) for
nRF402
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PRODUCT SPECIFICATION
nRF402 Single Chip RF Transmitter
VCO inductor
An external 22nH inductor connected between the VCO1 and VCO2 pins is required for the on-chip voltage controlled oscillator (VCO). This inductor should be a high quality chip inductor, Q > 45 @ 433 MHz, with a maximum tolerance of ± 2%. The following 22 nH inductors (0603) are suitable for use with nRF402, see Table 7.
Vendors WWW address Part. no., 22 nH inductors,
0603 size
Pulse http://www.pulseeng.com PE-0603CD220GTT Coilcraft http://www.coilcraft.com 0603CS-22NXGBC muRata http://www.murata.com LQW1608A22NG00 Stetco http://www.stetco.com 0603G220GTE KOA http://www.koaspeer.com KQ0603TE22NG
Table 7. Vendors and part no. of suitable 22 nH inductors
See page 10 for PCB layout guidelines regarding placement of the inductor.
Crystal specification
To achieve an active crystal oscillator (XOSC) with low power consumption, certain requirements apply for crystal loss and capacitive load.
The crystal specification is:
f= 4.0000 MHz Crystal parallel resonant frequency
pFCo 5
ohmESR 150
Crystal parallel equivalent capacitance
. Crystal equivalent series resistance
pFCL14 Total crystal load capacitance, including capacitance in
PCB layout.
For the crystal oscillator shown in Figure 9 the load capacitance becomes
C
= ,
L
´2´1CCCC
Where C1´ = C1 + C
´2´1
+
and C2´ = C2 + C
PCB1
PCB2
C1 and C2 are 0603 SMD capacitors as shown in the application schematic, see Figure 11 and Table 8. C
PCB1
and C
are the layout parasitic capacitance on the
PCB2
circuit board.
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PRODUCT SPECIFICATION
nRF402 Single Chip RF Transmitter
Internal
External
components
Crystal
oscillator
Crystal
C1
R
C2
Crystal
equivalent
Co
Cs L
ESR
Figure 9. Crystal oscillator and crystal equivalent
Sharing a reference crystal with a micro-controller
Figure 10 shows circuit diagram of a typical application where nRF402 and a micro controller share the reference crystal.
XC1
micro
controller
X1 X2
4.0 MHz
C1
22pF
R
C
5.6pF
C2
22pF
1.0M
nRF402
XC2
Figure 10. nRF402 and a micro-controller sharing the reference crystal
The crystal reference line from the micro-controller should not be routed close to full swing digital data or control signals.
Channel#1 / Channel#2 selection
CS is a digital input for selection of either channel#1 (f1=433.92MHz) or channel#2 (f2=434.33MHz). CS = “0” selects channel#1. CS = “1” selects channel#2.
DIN (data input)
The DIN pin is the input to the digital modulator of the transmitter. The input signal to this pin should be standard CMOS logic level at data rates up to 20 kbit/s.
DIN = “1” f = f0 + ∆f DIN = “0” f = f0 - ∆f
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PRODUCT SPECIFICATION
nRF402 Single Chip RF Transmitter
Power up
PWR_UP is a digital input for selection of normal operating mode or standby mode. PWR_UP = “1” selects normal operating mode. PWR_UP = “0” selects standby mode.
LPF pin
LPF is the loop filter test pin. This may be used for measurement of the loop filter voltage. In a normal application this pin should only be connected to a solder pad. No PCB lines should be connected to this pin.
Frequency difference between transmitter and receiver
Assuming the nRF401 transceiver chip is used for demodulation, the total frequency difference between transmitter and receiver should not exceed 70 ppm (30 kHz). This yields a crystal stability requirement of ±35 ppm for the transmitter and receiver. Frequency difference exceeding this will result in a 12dB/octave drop in receiver sensitivity. The functional window of the transmission link is typically 450 ppm (200 kHz).
Example: A crystal with ±20 ppm frequency tolerance and ±25 ppm frequency stability over temperature has a worst case frequency difference of ±45 ppm. If the transmitter and receiver operate in different temperature environments, the resulting worst-case frequency difference may be as high as 90 ppm. Resulting drop in sensitivity due to the extra 20 ppm, is then approx. 5dB.
PCB layout and decoupling guidelines
A well-designed PCB is necessary to achieve good RF performance. A PCB with a minimum of two layers including a ground plane is recommended for optimum performance.
The nRF402 DC supply voltage should be decoupled as close as possible to the VDD pins with high performance RF capacitors, see Table 8. It is preferable to mount a large surface mount capacitor (e.g. 2.2 µF ceramic) in parallel with the smaller value capacitors. The nRF402 supply voltage should be filtered and routed separately from the supply voltages of any digital circuitry.
Long power supply lines on the PCB should be avoided. All device grounds, VDD connections and VDD bypass capacitors must be connected as close as possible to the nRF402 IC. For a PCB with a topside RF ground plane, the VSS pins should be connected directly to the ground plane. For a PCB with a bottom ground plane, the best technique is to have via holes in or close to the VSS pads.
Full swing digital data or control signals should not be routed close to the external VCO inductor or the LPF pin.
The VCO inductor placement is important. The optimum placement of the VCO inductor gives a PLL loop filter voltage of 1.1 ±0.2 V, which can be measured at LPF (pin 6). For a 22nH, 0603 size inductor the length between the centre of the
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PRODUCT SPECIFICATION
nRF402 Single Chip RF Transmitter
VCO1/VCO2 pad and the centre of the inductor pad should be 5.4 mm, see Figure 12 (c) (layout, top view), for a 2 layer, 1.6 mm thick FR4 PCB.
PCB layout example
Figure 12 shows a PCB layout example for the application schematic in Figure 11. A double-sided FR-4 board of 1.6mm thickness is used. This PCB has a continuous ground plane on the bottom layer. Additionally, there are ground areas on the component side of the board to ensure sufficient grounding of critical components. A large number of via holes connect the top layer ground areas to the bottom layer ground plane. There is no ground plane beneath the antenna.
For more layout information, please refer to application note nAN400-06, “nRF402 RF and antenna layout”.
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PRODUCT SPECIFICATION
nRF402 Single Chip RF Transmitter
APPLICATION SCHEMATIC
+3V
R1
C5
2.2uF 1206
C3
4.7nF 0603
C4 100pF 0603
L1 22nH 0603
1 2 3 4 5 6 7
CS
1M 0603
X1
C1
4.000 MHz
22pF 0603
REFERENCE
U1
XC1 VSS VDD VCO1 VCO2 LPF CS
nRF402 433MHz Single chip RF Transmitter SSOIC14
XC2
PWR_UP
VSS ANT1 ANT2
DIN
RF_PWR
C2 22pF 0603
14 13
PWR_UP
12 11 10 9
DIN
8
R3 22K 0603
J1 Loop antenna 18x10mm Q=55
C6 100pF 0603
C7
5.6pF 0603
C8 10pF 0603
R2 18K 0603
aaaaaaaa
Figure 11. nRF402 application Schematic
Component Description Size Value Tolerance Units
C1 NP0 ceramic chip capacitor, (Crystal oscillator) 0603 22 pF C2 NP0 ceramic chip capacitor, (Crystal oscillator) 0603 22 pF C3 X7R ceramic chip capacitor, (Supply decoupling) 0603 4.7 nF C4 NP0 ceramic chip capacitor, (Supply decoupling) 0603 100 pF C5 X7R ceramic chip capacitor, (Supply decoupling) 1206 2.2 C6 NP0 ceramic chip capacitor, (Supply decoupling) 0603 100 pF C7 NP0 ceramic chip capacitor, (Antenna tuning) 0603 5.6 C8 NP0 ceramic chip capacitor, (Antenna tuning) 0603 10 L1 VCO inductor, Q>45 @ 433 MHz (See table 6.) 0603 22
±0.25 ±0.25
±2%
R1 1/8W chip resistor, (Crystal oscillator) 0603 1.0 R2 1/8W chip resistor, (Antenna Q reduction) 0603 18 R3 1/8W chip resistor, (Transmitter power setting) 0603 22 X1 Crystal - 4.000 MHz
µF
pF pF
nH
M
k k
Table 8 Recommended External Components
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PRODUCT SPECIFICATION
nRF402 Single Chip RF Transmitter
a) Top silk screen b) Bottom silk screen
c) Top view d) Bottom view
Figure 12. PCB layout (example) for nRF402 with loop antenna
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PRODUCT SPECIFICATION
nRF402 Single Chip RF Transmitter
DEFINITIONS
Data sheet status
Objective product specification This datasheet contains target specifications for product development. Preliminary product specification Product specification This datasheet contains final product specifications. Nordic VLSI ASA
Limiting values
Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Specifications sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
Nordic VLSI ASA reserves the right to make changes without further notice to the product to improve reliability, function or design. Nordic VLSI does not assume any liability arising out of the application or use of any product or circuits described herein.
This datasheet contains preliminary data; supplementary data may be published from Nordic VLSI ASA later.
reserves the right to make changes at any time without notice in order to improve design and supply the best possible product.
Table 9. Definitions
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Nordic VLSI ASA customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Nordic VLSI ASA for any damages resulting from such improper use or sale.
Product specification: Revision Date: 29.02.2000.
Datasheet order code: 290200nRF402.
All rights reserved ®. Reproduction in whole or in part is prohibited without the prior written permission of the copyright holder.
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PRODUCT SPECIFICATION
nRF402 Single Chip RF Transmitter
YOUR NOTES
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PRODUCT SPECIFICATION
nRF402 Single Chip RF Transmitter
Nordic VLSI - World Wide Distributors
For Your nearest dealer, please see http://www.nvlsi.no
Main Office:
Vestre Rosten 81, N-7075 Tiller, Norway
Phone: +47 72 89 89 00, Fax: +47 72 89 89 89
E-mail: nRF@nvlsi.no
Visit the Nordic VLSI ASA website at http://www.nvlsi.no
Revision: 2.1 Page 16 of 16 February 2000
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