nRF401 is a true single chip UHF transceiver designed to operate in the 433MHz ISM
(Industrial, Scientific and Medical) frequency band. It features Frequency Shift
Keying (FSK) modulation and demodulation capability. nRF401 operates at bit rates
up to 20kbit/s. Transmit power can be adjusted to a maximum of 10dBm. Antenna
interface is differential and suited for low cost PCB antennas. nRF401 features a
standby mode which makes power saving easy and efficient. nRF401 operates from a
single +3-5V DC supply.
As a primary application, nRF401 is intended for UHF radio equipment in compliance
with the European Telecommunication Standard Institute (ETSI) specification
EN 300 220-1 V1.2.1.
QUICK REFERENCE DATA
ParameterValueUnit
Frequency, Channel#1/Channel#2433.92 / 434.33MHz
ModulationFSK
Frequency deviation
Max. RF output power @ 400Ω, 3V
Sensitivity @ 400Ω, BR=20 kbit/s, BER<10
Maximum bit rate20kbit/s
Supply voltage2.7 – 5.25V
Receive supply current250
Transmit supply current @ -10 dBm output power8mA
Standby supply current8
-3
±15
10dBm
-105dBm
*
kHz
µA
µA
Table 1. nRF401 quick reference data.
ORDERING INFORMATION
Type numberDescriptionVersion
nRF401-IC20 pin SSOICA
nRF401-EVKITEvaluation kit with nRF401 IC1.0
Table 2. nRF401 ordering information.
*
The PWR_UP pin is used for power duty cycling. The duty-cycle is 2 % with a period of 200msec.
The timing information for the different operations is summarised in Table 5.
(TX is transmit mode, RX is receive mode and Std.by is Standby mode.)
Change of ModeNameMax DelayCondition
TX è RXt
RX è TXt
Std.byè TXt
Std.byè RXt
VDD=0 è TXt
VDD =0 è RXt
TR
RT
ST
SR
VT
VR
Table 5 Switching times for nRF401.
Switching TX ↔↔ RX (operational mode).
When switching from RX-mode to TX-mode data (DIN) may not be sent before the
TXEN-input has been high for at least 1ms, see Figure 4(a).
When switching from TX-mode to RX-mode the receiver may not receive data
(DOUT) before the TXEN-input has been low for at least 3ms, see Figure 4(b).
3ms
1ms
2ms
3ms
4ms
5ms
Operational
mode
Start-up
RX to TX
VDD
PWR_UP
TXEN
DIN
PWR_UP
1ms
ms
024
TX to RX
VDD
TXEN
DOUT
3ms
024
(a)(b)
Figure 4. Timing diagram for nRF401for switching from RX to TX (a)
and TX to RX (b).
Switching between standby and RX-mode (operational mode).
The time from the PWR_UP input is set to “1”, until the data (DOUT) is valid is t
see Table 5. Worst case tSR is 3ms for nRF401 as can be seen in Figure 5 (a).
SR,
ms
,
Switching between standby and TX-mode (operational mode).
The time from the PWR_UP input is set to “1”, until the synthesised frequency is
stable is tST, see Table 5.
Figure 5 Timing diagram for nRF401 when going from standby to RX-mode (a) or
TX-mode (b).
Power up to transmit-mode (start-up).
To avoid spurious emission outside the ISM-band when the power supply is switched
on, the TXEN-input must be kept low until the synthesised frequency is stable, see
Figure 6 (a).
ms
When enabling transmit-mode, TXEN-input should be high for at least 1 ms before
data (DIN) is transmitted, see Figure 6 (a).
VDD
PWR_UP
TXEN
DIN
VDD=0 to TX
3ms1ms
0
(a)
VDD
PWR_UP
TXEN
DOUT
ms
24
VDD=0 to RX
5ms
024
(b)
6
Figure 6. Timing diagram for nRF401 when powering up to TX-mode (a)
or RX-mode (b).
Power up to receive mode (start up).
In transition from power up to receive mode, the receiver may not receive data
(DOUT) until VDD has been stable (VDD > 2.7 V) for at least 5ms, see Figure 6(b).
If an external reference oscillator is used, the receiver may receive data (DOUT) after
3ms.
The ANT1 and ANT2 pins provide RF input to the LNA (Low Noise Amplifier) when
nRF401 is in receive mode, and RF output from the PA (Power Amplifier) when
nRF401 is in transmit mode. The antenna connection to nRF401 is differential and the
recommended load impedance at the antenna port is 400Ω.
Figure 12 shows a typical application schematic with a differential loop antenna on a
Printed Circuit Board (PCB). The output stage (PA) consists of two open collector
transistors in a differential pair configuration. VDD to the PA must be supplied
through the collector load. When connecting a differential loop antenna to the
ANT1/ANT2 pins, VDD should be supplied through the centre of the loop antenna as
shown in Figure 12.
A single ended antenna or 50Ω test instrument may be connected to nRF401 by using
a differential to single ended matching network (BALUN) as shown in Figure 7.
180nH
18nH
ANT1
470pF
nRF401
ANT2
1.8pF
VDD
18nH
Figure 7. Connection of nRF401 to single ended antenna by using
a differential to single ended matching network.
The 180nH inductor to VDD in Figure 7, need to have a Self-Resonance Frequency
(SRF) above 433 MHz to be effective. Suitable inductors are listed in Table 6.
An additional notch filter (L and C) at the 50Ω RF input/output may be necessary
dependent on the application requirements (see application note nAN400-05).
A single ended antenna may also be connected to nRF401 using an 8:1 impedance RF
transformer. The RF transformer must have a centre tap at the primary side for VDD
supply.
RF output power
The external bias resistor R3 connected between the RF_PWR pin and VSS sets the
output power. The RF output power may be set to levels up to +10dBm. In Figure 8
the output power is plotted for power levels down to, but not limited to, -8.5dBm for a
differential load of 400Ω. DC power supply current versus external bias resistor value
is shown in Figure 9.
10
8
6
4
2
0
-2
-4
-6
-8
-10
020406080100120140160180200
22
27
33
39
47
56
68
82
100
120
150
180
Resistor Value [kΩΩ]
Figure 8. RF output power vs. external power setting resistor (R3) for nRF401.
30,0
25,0
20,0
15,0
10,0
5,0
22
27
33
39
47
56
68
82
100
120
150
180
0,0
020406080100120140160180200
Resistor Value [kΩΩ]
Figure 9. Total chip current consumption vs. external power setting resistor (R3) for
The synthesiser loop filter is an external, single-ended second order lag-lead filter.
The recommended filter component values are: C3 = 820 pF, C4 =15 nF, and
R2 = 4.7 kΩ, see Figure 12.
VCO inductor
An external 22nH inductor connected between the VCO1 and VCO2 pins is required
for the on-chip voltage controlled oscillator (VCO). This inductor should be a high
quality chip inductor, Q > 45 @ 433 MHz, with a maximum tolerance of ± 2%. The
following 22 nH inductors (0603) are suitable for use with nRF401.
Figure 10. Crystal oscillator and crystal equivalent.
Sharing a reference crystal with a micro-controller
Figure 11 shows circuit diagram of a typical application where nRF401 and a micro
controller share the reference crystal.
XC1
micro
controller
X1X2
4.0 MHz
C1
22pF
R
C
5.6pF
C2
22pF
1.0M
nRF401
XC2
Figure 11. nRF401 and a micro-controller sharing the reference crystal.
The crystal reference line from the micro-controller should not be routed close to full
swing digital data or control signals.
Transmit/receive mode selection
TXEN is a digital input for selection of transmit or receive mode.
TXEN = “1” selects transmit mode.
TXEN = “0” selects receive mode.
Channel#1 / Channel#2 selection
CS is a digital input for selection of either channel#1 (f1=433.92MHz)
or channel#2 (f2=434.33MHz).
CS = “0” selects channel#1.
CS = “1” selects channel#2.
Table 8. Required setting for standby and channel selection in RX and TX.
DIN (data input) and D
(data output)
OUT
The DIN pin is the input to the digital modulator of the transmitter. The input signal
to this pin should be standard CMOS logic level at data rates up to 20 kbit/s. No
coding of data is required.
DIN = “1” → f = f0 + ∆f
DIN = “0” → f = f0 - ∆f
The demodulated digital output data appear at the D
pin at standard CMOS logic
OUT
levels.
f0 + ∆f → DOUT=“1”,
f0 - ∆f → DOUT=“0”.
Power up
PWR_UP is a digital input for selection of normal operating mode or standby mode.
PWR_UP = “1” selects normal operating mode.
PWR_UP = “0” selects standby mode.
Frequency difference between transmitter and receiver
For optimum performance, the total frequency difference between transmitter and
receiver should not exceed 70 ppm (30 kHz). This yields a crystal stability
requirement of ±35 ppm for the transmitter and receiver. Frequency difference
exceeding this will result in a -12dB/octave drop in receiver sensitivity. The
functional frequency window of the transmission link is typically 450 ppm (200 kHz).
Example: A crystal with ±20 ppm frequency tolerance and ±25 ppm frequency
stability over the operating temperature has a worst case frequency difference of ±45
ppm. If the transmitter and receiver operate in different temperature environments, the
resulting worst-case frequency difference may be as high as 90 ppm. Resulting drop
in sensitivity due to the extra 20 ppm, is then approx. 5dB.
PCB layout and decoupling guidelines
A well-designed PCB is necessary to achieve good RF performance. A PCB with a
minimum of two layers including a ground plane is recommended for optimum
performance.
The nRF401 DC supply voltage should be decoupled as close as possible to the VDD
pins with high performance RF capacitors, see Table 9. It is preferable to mount a
large surface mount capacitor (e.g. 2.2 µF ceramic) in parallel with the smaller value
capacitors. The nRF401 supply voltage should be filtered and routed separately from
the supply voltages of any digital circuitry.
Long power supply lines on the PCB should be avoided. All device grounds, VDD
connections and VDD bypass capacitors must be connected as close as possible to the
nRF401 IC. For a PCB with a topside RF ground plane, the VSS pins should be
connected directly to the ground plane. For a PCB with a bottom ground plane, the
best technique is to have via holes in or close to the VSS pads.
Full swing digital data or control signals should not be routed close to the PLL loop
filter components or the external VCO inductor.
The VCO inductor placement is important. The optimum placement of the VCO
inductor gives a PLL loop filter voltage of 1.1 ±0.2 V, which can be measured at
FILT1 (pin4). For a 0603 size inductor the length between the centre of the
VCO1/VCO2 pad and the centre of the inductor pad should be 5.4 mm, see Figure 13
(c) (layout, top view), for a 2 layer, 1.6 mm thick FR4 PCB.
PCB layout example
Figure 13 shows a PCB layout example for the application schematic in Figure 12.
A double-sided FR-4 board of 1.6mm thickness is used. This PCB has a continuous
ground plane on the bottom layer. Additionally, there are ground areas on the
component side of the board to ensure sufficient grounding of critical components. A
large number of via holes connect the top layer ground areas to the bottom layer
ground plane. There is no ground plane beneath the antenna.
For more layout information, please refer to application note nAN400-05,
“nRF401 RF and antenna layout.
Stress above one or more of the limiting values may cause permanent damage to the device. These are stress
ratings only and operation of the device at these or at any other conditions above those given in the
Specifications sections of the specification is not implied. Exposure to limiting values for extended periods may
affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
Nordic VLSI ASA reserves the right to make changes without further notice to the
product to improve reliability, function or design. Nordic VLSI does not assume any
liability arising out of the application or use of any product or circuits described
herein.
This datasheet contains preliminary data; supplementary data may be
published from Nordic VLSI ASA later.
reserves the right to make changes at any time without notice in order to
improve design and supply the best possible product.
Table 10. Definitions.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems
where malfunction of these products can reasonably be expected to result in personal
injury. Nordic VLSI ASA customers using or selling these products for use in such
applications do so at their own risk and agree to fully indemnify Nordic VLSI ASA
for any damages resulting from such improper use or sale.
Product specification: Revision Date: 26.05.2000.
Datasheet order code: 260500nRF401
All rights reserved ®. Reproduction in whole or in part is prohibited without the prior
written permission of the copyright holder.