Datasheet nRF401 Datasheet (Nordic VLSI)

PRODUCT SPECIFICATION
433MHz Single Chip RF Transceiver
FEATURES
True single chip FSK transceiver
Few external components required
No set up or configuration
20kbit/s data rate
2 channels
Wide supply range
Very low power consumption
Standby mode
APPLICATIONS
Alarm and Security Systems
Automatic Meter Reading (AMR)
Home Automation
Remote Control
Surveillance
Automotive
Telemetry
Toys
Wireless Communication
nRF401
GENERAL DESCRIPTION
nRF401 is a true single chip UHF transceiver designed to operate in the 433MHz ISM (Industrial, Scientific and Medical) frequency band. It features Frequency Shift Keying (FSK) modulation and demodulation capability. nRF401 operates at bit rates up to 20kbit/s. Transmit power can be adjusted to a maximum of 10dBm. Antenna interface is differential and suited for low cost PCB antennas. nRF401 features a standby mode which makes power saving easy and efficient. nRF401 operates from a single +3-5V DC supply. As a primary application, nRF401 is intended for UHF radio equipment in compliance with the European Telecommunication Standard Institute (ETSI) specification EN 300 220-1 V1.2.1.
QUICK REFERENCE DATA
Parameter Value Unit
Frequency, Channel#1/Channel#2 433.92 / 434.33 MHz Modulation FSK Frequency deviation
Max. RF output power @ 400, 3V Sensitivity @ 400, BR=20 kbit/s, BER<10 Maximum bit rate 20 kbit/s Supply voltage 2.7 – 5.25 V Receive supply current 250 Transmit supply current @ -10 dBm output power 8 mA Standby supply current 8
-3
±15
10 dBm
-105 dBm
*
kHz
µA
µA
Table 1. nRF401 quick reference data.
ORDERING INFORMATION
Type number Description Version
nRF401-IC 20 pin SSOIC A
nRF401-EVKIT Evaluation kit with nRF401 IC 1.0
Table 2. nRF401 ordering information.
*
The PWR_UP pin is used for power duty cycling. The duty-cycle is 2 % with a period of 200msec.
Nordic VLSI ASA - Vestre Rosten 81, N-7075 Tiller, Norway - Phone +4772898900 - Fax +4772898989 Revision: 1.5 Page 1 of 18 May 2000
PRODUCT SPECIFICATION
nRF401 Single Chip RF Transceiver
BLOCK DIAGRAM
DOUT
TXEN
CS
DIN
PWR_UP
10
19
12
9
18
REFERENCE
PLLOSC VCO
20
LOOP
FILTER
5 6 1141
INDUCTOR
Figure 1. nRF401 block diagram with external components.
PIN FUNCTIONS
Pin Name Pin function Description
1
XC1 Input Crystal oscillator input
2
VDD Power Power supply (+3-5V DC)
3
VSS Ground Ground (0V)
4
FILT1 Input Loop filter
5
VCO1 Input External inductor for VCO
6
VCO2 Input External inductor for VCO
7
VSS Ground Ground (0V)
8
VDD Power Power supply (+3-5V DC)
9
DIN Input Data input
10
DOUT Output Data output
11
RF_PWR Input Transmit power setting
12
CS Input Channel selection
CS=“0” 433.92MHz (Channel#1) CS=“1” 434.33MHz (Channel#2)
13
VDD Power Power supply (+3-5V DC)
14
VSS Ground Ground (0V)
15
ANT2 Input/Output Antenna terminal
16
ANT1 Input/Output Antenna terminal
17
VSS Ground Ground (0V)
18
PWR_UP Input Power on/off
PWR_UP = “1” Power up (Operating mode) PWR_UP = “0” Power down (Standby mode)
19
TXEN Input Transmit enable
TXEN = “1” Transmit mode TXEN = “0” Receive mode
20
XC2 Output Crystal oscillator output
VCO
PA
LNADEM
RF_PWR
16
ANT1
ANT2
15
Table 3. nRF401 pin functions.
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PRODUCT SPECIFICATION
DD
DD
DD
DD
nRF401 Single Chip RF Transceiver
ELECTRICAL SPECIFICATIONS
Conditions: VDD = +3V DC, VSS = 0V, TA= -25°C to +85°C
Symbol Parameter (condition) Min. Typ. Max. Units
VDD Supply voltage 2.7 3 5.25 V
VSS Ground 0 V
I
Total current consumption
DD
Receive mode Transmit mode @ -10 dBm RF power Stand by mode
P
Max. RF output power @ 400 load
RF
V
Logic “1” input voltage
IH
V
Logic “0” input voltage 0
IL
V V
Logic “1” output voltage (IOH = - 1.0mA)
OH
Logic “0” output voltage (IOL = 1.0mA) 0
OL
I
Logic “1” input current (VI = VDD) +20
H
I
Logic “0” input current (VI = VSS) -20
L
f
Channel#1 frequency 433.92 MHz
1
f
Channel#2 frequency 434.33 MHz
2
0.7V
0.7V
Dynamic range 90 dB Modulation type FSK Frequency deviation
f f
IF frequency 400 kHz
IF
BWIF IF bandwidth 65 85 kHz f
Crystal frequency 4.0 MHz
XTAL
Crystal frequency stability requirement Sensitivity @ 400,BR=20 kbit/s, BER < 10
1)
-3
Bit rate 0 20 kbit/s
Z
Recommended antenna port differential impedance 400
I
Spurious emission Compliant with EN 300-220-1 V1.2.1
11
8 8
mA mA
µA
10 dBm
V
DD
0.3V
V
DD
0.3V
µA µA
±15
±45
kHz
ppm
-105 dBm
V V V V
2)
Table 4. nRF401 electrical specifications.
1)
Maximum 5dB sensitivity degradation at temperature extremes. See also page 11.
2)
With a PCB loop antenna or a differential to single ended matching network to a 50 antenna.
ABSOLUTE MAXIMUM RATINGS
Supply voltages
VDD..............................- 0.3V to +6V
VSS ................................................0V
Input voltage
VI......................- 0.3V to VDD + 0.3V
Output voltage
VO.....................- 0.3V to VDD + 0.3V
Note: Stress exceeding one or more of the limiting values may cause permanent damage to the device.
ATTENTION!
Electrostatic Sensitive Device Observe Precaution for handling
Power dissipation
PD (TA=25°C)...........................250mW
Temperatures
Operating Temperature…. -25°C to +85°C Storage Temperature…... -40°C to +125°C
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PRODUCT SPECIFICATION
α
nRF401 Single Chip RF Transceiver
PIN ASSIGNMENT
XC1 VDD
FILT1 VCO1 VCO2 VSS VDD DIN
10
1 2 3 4 5 6 7 8 9
nRF401
20 pin SSOIC
Figure 2. nRF401 pin assignment.
PACKAGE OUTLINE
nRF401, 20 pin SSOIC. (Dimensions in mm.)
20
19 18 17
16
15
14 13
12
11
XC2 TXEN PWR_UPVSS VSS ANT1 ANT2
VSS VDD
CS RF_PWRDOUT
20 19 18
E H
1 2 3
D
A
A
1
e b L
Package Type D E H A A
20 pin SSOIC
(Wide)
Min
Max
6.90
7.50
5.00
5.60
7.40
8.20 2.00
0.05
e b L Copl.
1
0.65
0.22
0.38
0.55
0.95 0.10
αα
0° 8°
Figure 3. SSOIC-20 Package outline.
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PRODUCT SPECIFICATION
nRF401 Single Chip RF Transceiver
IMPORTANT TIMING DATA
Timing information
The timing information for the different operations is summarised in Table 5. (TX is transmit mode, RX is receive mode and Std.by is Standby mode.)
Change of Mode Name Max Delay Condition TX è RX t RX è TX t Std.byè TX t Std.byè RX t VDD=0 è TX t VDD =0 è RX t
TR RT
ST SR VT VR
Table 5 Switching times for nRF401.
Switching TX ↔ RX (operational mode).
When switching from RX-mode to TX-mode data (DIN) may not be sent before the TXEN-input has been high for at least 1ms, see Figure 4(a). When switching from TX-mode to RX-mode the receiver may not receive data (DOUT) before the TXEN-input has been low for at least 3ms, see Figure 4(b).
3ms 1ms 2ms 3ms 4ms 5ms
Operational mode
Start-up
RX to TX
VDD
PWR_UP
TXEN
DIN
PWR_UP
1ms
ms
0 2 4
TX to RX
VDD
TXEN
DOUT
3ms
0 2 4
(a) (b)
Figure 4. Timing diagram for nRF401for switching from RX to TX (a)
and TX to RX (b).
Switching between standby and RX-mode (operational mode).
The time from the PWR_UP input is set to “1”, until the data (DOUT) is valid is t see Table 5. Worst case tSR is 3ms for nRF401 as can be seen in Figure 5 (a).
SR,
ms
,
Switching between standby and TX-mode (operational mode).
The time from the PWR_UP input is set to “1”, until the synthesised frequency is stable is tST, see Table 5.
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PRODUCT SPECIFICATION
nRF401 Single Chip RF Transceiver
VDD
PWR_UP
TXEN
DOUT
Std.by to RX
VDD
PWR_UP
TXEN
DIN
3ms
ms
0 2 4
(a)
Std.by to TX
1ms1ms
0 2 4
(b)
Figure 5 Timing diagram for nRF401 when going from standby to RX-mode (a) or
TX-mode (b).
Power up to transmit-mode (start-up).
To avoid spurious emission outside the ISM-band when the power supply is switched on, the TXEN-input must be kept low until the synthesised frequency is stable, see Figure 6 (a).
ms
When enabling transmit-mode, TXEN-input should be high for at least 1 ms before data (DIN) is transmitted, see Figure 6 (a).
VDD
PWR_UP
TXEN
DIN
VDD=0 to TX
3ms 1ms
0
(a)
VDD
PWR_UP
TXEN
DOUT
ms
2 4
VDD=0 to RX
5ms
0 2 4
(b)
6
Figure 6. Timing diagram for nRF401 when powering up to TX-mode (a)
or RX-mode (b).
Power up to receive mode (start up).
In transition from power up to receive mode, the receiver may not receive data (DOUT) until VDD has been stable (VDD > 2.7 V) for at least 5ms, see Figure 6(b). If an external reference oscillator is used, the receiver may receive data (DOUT) after 3ms.
ms
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PRODUCT SPECIFICATION
RF in/out 50 ohm
nRF401 Single Chip RF Transceiver
APPLICATION INFORMATION
Antenna input/output
The ANT1 and ANT2 pins provide RF input to the LNA (Low Noise Amplifier) when nRF401 is in receive mode, and RF output from the PA (Power Amplifier) when nRF401 is in transmit mode. The antenna connection to nRF401 is differential and the recommended load impedance at the antenna port is 400Ω.
Figure 12 shows a typical application schematic with a differential loop antenna on a Printed Circuit Board (PCB). The output stage (PA) consists of two open collector transistors in a differential pair configuration. VDD to the PA must be supplied through the collector load. When connecting a differential loop antenna to the ANT1/ANT2 pins, VDD should be supplied through the centre of the loop antenna as shown in Figure 12.
A single ended antenna or 50 test instrument may be connected to nRF401 by using a differential to single ended matching network (BALUN) as shown in Figure 7.
180nH
18nH
ANT1
470pF
nRF401
ANT2
1.8pF
VDD
18nH
Figure 7. Connection of nRF401 to single ended antenna by using
a differential to single ended matching network.
The 180nH inductor to VDD in Figure 7, need to have a Self-Resonance Frequency (SRF) above 433 MHz to be effective. Suitable inductors are listed in Table 6.
Vendors WWW address Part. no., 180 nH inductors,
0603 size
Stetco http://www.stetco.com 0603G181KTE Coilcraft http://www.coilcraft.com 0603CS-R18XJBC muRata http://www.murata.com LQW1608AR18J00
Table 6. Vendors and part. no. for suitable 180nH inductors.
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PRODUCT SPECIFICATION
Total Chip Current
Current Consumption [mA]
RF Output Power
nRF401 Single Chip RF Transceiver
An additional notch filter (L and C) at the 50 RF input/output may be necessary dependent on the application requirements (see application note nAN400-05).
A single ended antenna may also be connected to nRF401 using an 8:1 impedance RF transformer. The RF transformer must have a centre tap at the primary side for VDD supply.
RF output power
The external bias resistor R3 connected between the RF_PWR pin and VSS sets the output power. The RF output power may be set to levels up to +10dBm. In Figure 8 the output power is plotted for power levels down to, but not limited to, -8.5dBm for a differential load of 400. DC power supply current versus external bias resistor value is shown in Figure 9.
10
8 6 4 2 0
-2
-4
-6
-8
-10 0 20 40 60 80 100 120 140 160 180 200
22
27
33
39
47
56
68
82
100
120
150
180
Resistor Value [kΩΩ]
Figure 8. RF output power vs. external power setting resistor (R3) for nRF401.
30,0
25,0
20,0
15,0
10,0
5,0
22
27
33
39
47
56
68
82
100
120
150
180
0,0
0 20 40 60 80 100 120 140 160 180 200
Resistor Value [kΩΩ]
Figure 9. Total chip current consumption vs. external power setting resistor (R3) for
nRF401.
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PRODUCT SPECIFICATION
nRF401 Single Chip RF Transceiver
PLL loop filter
The synthesiser loop filter is an external, single-ended second order lag-lead filter. The recommended filter component values are: C3 = 820 pF, C4 =15 nF, and R2 = 4.7 k, see Figure 12.
VCO inductor
An external 22nH inductor connected between the VCO1 and VCO2 pins is required for the on-chip voltage controlled oscillator (VCO). This inductor should be a high quality chip inductor, Q > 45 @ 433 MHz, with a maximum tolerance of ± 2%. The following 22 nH inductors (0603) are suitable for use with nRF401.
Vendors WWW address Part. no., 22 nH inductors, 0603
size
Pulse http://www.pulseeng.com PE-0603CD220GTT Coilcraft http://www.coilcraft.com 0603CS-22NXGBC muRata http://www.murata.com LQW1608A22NG00 Stetco http://www.stetco.com 0603G220GTE KOA http://www.koaspeer.com KQ0603TE22NG
Table 7. Vendors and part no. for suitable 22nH inductors.
See page 11 and 12 for PCB layout guidelines regarding placement of the inductor.
Crystal specification
To achieve an active crystal oscillator (XOSC) with low power consumption, certain requirements apply for crystal loss and capacitive load.
The crystal specification is:
f= 4.0000 MHz Crystal parallel resonant frequency
pFCo 5
ohmESR 150
Crystal parallel equivalent capacitance
. Crystal equivalent series resistance
pFCL14 Total crystal load capacitance, including capacitance in PCB
layout.
For the crystal oscillator shown in Figure 10 the load capacitance becomes:
C
= ,
L
´2´1CCCC
Where C1´ = C1 + C
´2´1
+
and C2´ = C2 + C
PCB1
PCB2
C1 and C2 are 0603 SMD capacitors as shown in the application schematic, see Figure 12 and Table 9. C
PCB1
and C
are the layout parasitic capacitance on the
PCB2
circuit board.
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PRODUCT SPECIFICATION
nRF401 Single Chip RF Transceiver
Internal
External
components
Crystal
oscillator
Crystal
C1
R
C2
Crystal
equivalent
Co
Cs L
ESR
Figure 10. Crystal oscillator and crystal equivalent.
Sharing a reference crystal with a micro-controller
Figure 11 shows circuit diagram of a typical application where nRF401 and a micro controller share the reference crystal.
XC1
micro
controller
X1 X2
4.0 MHz
C1
22pF
R
C
5.6pF
C2
22pF
1.0M
nRF401
XC2
Figure 11. nRF401 and a micro-controller sharing the reference crystal.
The crystal reference line from the micro-controller should not be routed close to full swing digital data or control signals.
Transmit/receive mode selection
TXEN is a digital input for selection of transmit or receive mode. TXEN = “1” selects transmit mode. TXEN = “0” selects receive mode.
Channel#1 / Channel#2 selection
CS is a digital input for selection of either channel#1 (f1=433.92MHz) or channel#2 (f2=434.33MHz). CS = “0” selects channel#1. CS = “1” selects channel#2.
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PRODUCT SPECIFICATION
nRF401 Single Chip RF Transceiver
Input Response
TXEN CS PWR_UP Channel # Mode
0 0 1 1 RX 0 1 1 2 RX 1 0 1 1 TX 1 1 1 2 TX
X X 0 -- Standby
Table 8. Required setting for standby and channel selection in RX and TX.
DIN (data input) and D
(data output)
OUT
The DIN pin is the input to the digital modulator of the transmitter. The input signal to this pin should be standard CMOS logic level at data rates up to 20 kbit/s. No coding of data is required.
DIN = “1” f = f0 + ∆f DIN = “0” f = f0 - ∆f
The demodulated digital output data appear at the D
pin at standard CMOS logic
OUT
levels.
f0 + f DOUT=“1”, f0 - f DOUT=“0”.
Power up
PWR_UP is a digital input for selection of normal operating mode or standby mode. PWR_UP = “1” selects normal operating mode. PWR_UP = “0” selects standby mode.
Frequency difference between transmitter and receiver
For optimum performance, the total frequency difference between transmitter and receiver should not exceed 70 ppm (30 kHz). This yields a crystal stability requirement of ±35 ppm for the transmitter and receiver. Frequency difference exceeding this will result in a -12dB/octave drop in receiver sensitivity. The functional frequency window of the transmission link is typically 450 ppm (200 kHz).
Example: A crystal with ±20 ppm frequency tolerance and ±25 ppm frequency stability over the operating temperature has a worst case frequency difference of ±45 ppm. If the transmitter and receiver operate in different temperature environments, the resulting worst-case frequency difference may be as high as 90 ppm. Resulting drop in sensitivity due to the extra 20 ppm, is then approx. 5dB.
PCB layout and decoupling guidelines
A well-designed PCB is necessary to achieve good RF performance. A PCB with a minimum of two layers including a ground plane is recommended for optimum performance.
The nRF401 DC supply voltage should be decoupled as close as possible to the VDD pins with high performance RF capacitors, see Table 9. It is preferable to mount a
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PRODUCT SPECIFICATION
nRF401 Single Chip RF Transceiver
large surface mount capacitor (e.g. 2.2 µF ceramic) in parallel with the smaller value capacitors. The nRF401 supply voltage should be filtered and routed separately from the supply voltages of any digital circuitry.
Long power supply lines on the PCB should be avoided. All device grounds, VDD connections and VDD bypass capacitors must be connected as close as possible to the nRF401 IC. For a PCB with a topside RF ground plane, the VSS pins should be connected directly to the ground plane. For a PCB with a bottom ground plane, the best technique is to have via holes in or close to the VSS pads.
Full swing digital data or control signals should not be routed close to the PLL loop filter components or the external VCO inductor.
The VCO inductor placement is important. The optimum placement of the VCO inductor gives a PLL loop filter voltage of 1.1 ±0.2 V, which can be measured at FILT1 (pin4). For a 0603 size inductor the length between the centre of the VCO1/VCO2 pad and the centre of the inductor pad should be 5.4 mm, see Figure 13 (c) (layout, top view), for a 2 layer, 1.6 mm thick FR4 PCB.
PCB layout example
Figure 13 shows a PCB layout example for the application schematic in Figure 12. A double-sided FR-4 board of 1.6mm thickness is used. This PCB has a continuous ground plane on the bottom layer. Additionally, there are ground areas on the component side of the board to ensure sufficient grounding of critical components. A large number of via holes connect the top layer ground areas to the bottom layer ground plane. There is no ground plane beneath the antenna.
For more layout information, please refer to application note nAN400-05, “nRF401 RF and antenna layout.
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PRODUCT SPECIFICATION
aaaaaaaa
nRF401 Single Chip RF Transceiver
APPLICATION SCHEMATIC
+3V
C5
2.2uF 1206
C4 15nF 0603
R2
4.7K 0603
L1 22nH 0603
C6 100nF 0603
C7 1nF 0603
DIN
DOUT
C3 820pF 0603
PLL FILTER
R1 1M
0603
X1
C1
4.000 MHz 22pF 0603
REFERENCE
U1
1
XC1
2
VDD
3
VSS
4
FILT1
5
VCO1
6
VCO2
7
VSS
8
VDD
9
DIN
10
DOUT
nRF401 433MHz Single Chip RF Transceiver SSOIC20
XC2
TXEN
PWR_UP
VSS ANT1 ANT2
VSS
VDD
RF_PWR
C2 22pF 0603
20 19
TXEN
18
PWR_UP
17 16 15 14 13 12
CS
CS
11
R3 22K 0603
C8 100pF 0603
J1 Loop antenna 25x15mm Q=55
C9 100pF 0603
C10
3.3pF 0603
C11
5.6pF 0603
R4 18K 0603
Figure 12. nRF401 application schematic.
Component Description Size Value Tolerance Units
C1 NP0 ceramic chip capacitor, (Crystal oscillator) 0603 22 pF C2 NP0 ceramic chip capacitor, (Crystal oscillator) 0603 22 pF C3 X7R ceramic chip capacitor, (PLL loop filter) 0603 820 pF C4 X7R ceramic chip capacitor, (PLL loop filter) 0603 15 nF C5 X7R ceramic chip capacitor, (Supply decoupling) 1206 2.2 C6 X7R ceramic chip capacitor, (Supply decoupling) 0603 100 nF C7 X7R ceramic chip capacitor, (Supply decoupling) 0603 1 nF C8 NP0 ceramic chip capacitor, (Supply decoupling) 0603 100 pF
C9 NP0 ceramic chip capacitor, (Supply decoupling) 0603 100 pF C10 NP0 ceramic chip capacitor, (Antenna tuning) 0603 3.3 ±0.1 pF C11 NP0 ceramic chip capacitor, (Antenna tuning) 0603 5.6 ±0.25 pF
L1 VCO inductor, Q>45 @ 433 MHz 0603 22
±2%
R1 0.1W chip resistor, (Crystal oscillator) 0603 1.0
R2 0.1W chip resistor, (PLL loop filter) 0603 4.7
R3 0.1W chip resistor, (Transmitter power setting) 0603 22
R4 0.1W chip resistor, (Antenna Q reduction) 0603 18
X1 Crystal - 4.000 MHz
µF
nH
M
k k k
Table 9. Recommended External Components.
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PRODUCT SPECIFICATION
nRF401 Single Chip RF Transceiver
a) Top silk screen b) Bottom silk screen
c) Top view d) Bottom view
Figure 13. PCB layout (example) for nRF401 with loop antenna.
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PRODUCT SPECIFICATION
nRF401 Single Chip RF Transceiver
DEFINITIONS
Data sheet status
Objective product specification This datasheet contains target specifications for product development. Preliminary product specification Product specification This datasheet contains final product specifications. Nordic VLSI ASA
Limiting values
Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Specifications sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
Nordic VLSI ASA reserves the right to make changes without further notice to the product to improve reliability, function or design. Nordic VLSI does not assume any liability arising out of the application or use of any product or circuits described herein.
This datasheet contains preliminary data; supplementary data may be published from Nordic VLSI ASA later.
reserves the right to make changes at any time without notice in order to improve design and supply the best possible product.
Table 10. Definitions.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Nordic VLSI ASA customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Nordic VLSI ASA for any damages resulting from such improper use or sale.
Product specification: Revision Date: 26.05.2000.
Datasheet order code: 260500nRF401
All rights reserved ®. Reproduction in whole or in part is prohibited without the prior written permission of the copyright holder.
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PRODUCT SPECIFICATION
nRF401 Single Chip RF Transceiver
YOUR NOTES
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PRODUCT SPECIFICATION
nRF401 Single Chip RF Transceiver
YOUR NOTES
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PRODUCT SPECIFICATION
nRF401 Single Chip RF Transceiver
Nordic VLSI - World Wide Distributors
For Your nearest dealer, please see http://www.nvlsi.no
Main Office:
Vestre Rosten 81, N-7075 Tiller, Norway
Phone: +47 72 89 89 00, Fax: +47 72 89 89 89
E-mail: nRF@nvlsi.no
Visit the Nordic VLSI ASA website at http://www.nvlsi.no
Revision: 1.5 Page 18 of 18 May 2000
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