Datasheet NPe405L Datasheet (AMCC)

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AMCC NPe405L PowerNP Data Sheet
PowerNP NPe405L Data Sheet
Document Issue 1.00
September 2004
C
OVER
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AMCC reserves the right to make changes to its products, its datasheets, or related documentation, without notice and warrants its products solely pursuant to its terms and conditions of sale, only to substantially comply with the latest available datasheet. Please consult AMCC’s Term and Conditions of Sale for its warranties and other terms, conditions and limitations. AMCC may discontinue any semiconductor product or service without notice, and advises its customers to obtain the latest version of relevant information to verify, before placing orders, that the information is current. AMCC does not assume any liability arising out of the application or use of any product or circuit described herein, neither does it convey any license under its patent rights nor the rights of others. AMCC reserves the right to ship devices of higher grade in place of those of lower grade.
AMCC SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED, OR WARRANTED TO BE SUITABLE FOR USE IN LIFE­SUPPOR T APPLICATIONS, DEVICES OR SYSTEMS OR OTHER CRITICAL APPLICATIONS.
AMCC is a registered Trademark of Applied Micro Circuits Corporation. Copyright © 2004 Applied Micro Circuits Corporation.
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Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
Features
•PowerNP technology using an IBM PowerPC 405 32-bit RISC processor core operating up to 266 MHz
• PC-133 synchronous DRAM (SDRAM) interf ace
- 32-bit interface for non-ECC applications
- 40-bit interface serves 32 bits of data plus 8 check bits for ECC applications
• External bus for peripheral devices
- Flash and ROM interface
- Direct support for 8-, or 16-bit SRAM and external peripherals
- Up to 4 devices
• DMA support for external peripherals, internal UARTs and memory
- Scatter-gather chaining supported
- Four channels
• Two 10/100 Ethernet MACs supporting up to two external PHYs via MII, RMII, or SMII interfaces
• HDLC interface with 32 channels through two ports at up to 4.096 Mbps each or 8.192 Mbps for a single port
• Programmable interrupt controller
- Seven external and 29 internal
- Edge triggered or level-sensitive
- Positive or negative active
- Non-critical or critical interrupt to processor core
- Programmable critical interrupt priority ordering
- Programmable critical interrupt vector
• Programmable timers
• Two serial ports (16550 compatible UART)
• One IIC interface
• General Purpose I/O (GPIO) available
• Supports JTAG for board level testing
• Internal processor local bus (PLB) runs at SDRAM interface frequency
Description
Designed specifically to address embedded applications, the NPe405L provides a high­performance, low-power solution that interfaces to a wide range of peripherals by incorporating on-chip power management features and lower power dissipation requirements.
This chip contains a high-perfo rmanc e RISC processor core, SDRAM controller, Ethernet EMACs, HDLC controller, external bus controller for
While the information contained herein is believed to be accurate, such information is preliminary, and should not be relied upon for accuracy or completeness, and no representations or warranties of accuracy or completeness are made.
ROM, Flash, and peripherals, DMA with scatter­gather support, serial ports, IIC interface, and general purpose I/O.
Technology: IBM CMOS SA-12E 0.25
µm L
(0.18 Package: 23mm, 324-ball enhanced plastic ball grid
array (E-PBGA) Power (typical): 1.3W at 133MHz, 1.7W at 200MHz, 1.8W at 266MHz
eff
)
µm
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Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
Contents
Ordering, PVR, and JTAG Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Address Map Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
SDRAM Memory Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
External Bus Controller (EBC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
DMA Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Serial Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
IIC Bus Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
HDLCEX Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
General Purpose IO (GPIO) Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Universal Interrupt Controller (UIC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
10/100 Mbps Ethernet MAC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
JTAG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Signal Lists . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Spread Spectrum Clocking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
Initialization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
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Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
Tables
System Address Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
DCR Address Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Signals Listed Alphabetically . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Signals Listed by Ball Assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Pin Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Signal Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Package Thermal Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Recommended DC Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Input Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
DC Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Clocking Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Peripheral Interface Clock Timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
I/O Specifications—All . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
I/O Specifications—133 and 200MHz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
I/O Specifications—266MHz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
Figures
NPe405L Embedded Controller Functional Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
23mm, 324-Ball E-PBGA Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Input Setup and Hold Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Output Delay and Float Timing Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
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Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
Ordering, PVR, and JTAG Information
Product Name
NPe405L IBM25NPe405L-3FA133C 133M H z 23mm, 324 E-PBGA A 0x416100C0 0x04247409 NPe405L IBM25NPe405L-3FA133CZ 133M H z 23mm, 324 E-PBGA A 0x416100C0 0x04247409 NPe405L IBM25NPe405L-3FA200C 200M H z 23mm, 324 E-PBGA A 0x416100C0 0x04247409 NPe405L IBM25NPe405L-3FA200CZ 200M H z 23mm, 324 E-PBGA A 0x416100C0 0x04247409 NPe405L IBM25NPe405L-3FA266C 266M H z 23mm, 324 E-PBGA A 0x416100C0 0x04247409 NPe405L IBM25NPe405L-3FA266CZ 266M H z 23mm, 324 E-PBGA A 0x416100C0 0x04247409
Note 1: Z at the end of the Order Part Number indicates a tape and reel shipping package. Otherwise, the chips are shipped in a tray.
Order Part Number
1
Processor
Frequency
Package
Rev
Level
PVR Value JTAG ID
This section provides the part numbering nomenclature for the NPe405L. For availability, contact your local IBM sales office.
The part number contains a part modifier. This modifier provides for identification of future enhancements (for example, higher performance).
Each part number also contains a revision code. This refers to the die mask revision number and is specified in the part numbering scheme for identification purposes only.
The PVR (Processor Version Register) is software accessible and contains additional information about the revision level of the part. Refer to the NPe405L User’s Manual for details on the register content.
IBM Part Number Key
IBM25NPe405L-3FA200Cx
Shipping Package
Blank = Tray
Z = Tape and reel
IBM Part Number
Grade 3 Reliability
Package (E-PBGA)
4
Operational Case Temperature Range
(-40°C to +85°C)
Processor Speed
133MHz
200MHz 266MHz
Revision Level
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PowerNP NPe405L Embedded Processor Data Sheet
NPe405L Embedded Controller Functional Block Diagram
Preliminary
Universal
Interrupt
Controller
x2
8KB
D-Cache
Clock Control Reset
PPC405
Processor Core
JTAG
DCU
SDRAM
Controller
Timers
MMU
Power
Mgmt
DCRs
DCR Bus
Trace
ICU
Processor Local Bus (PLB)
External
Bus
Controller
16KB
I-Cache
Arb
DMA
Controller
(4-Channel)
MAL1
See Peripheral Interface Clock Timing table
GPIO
IIC
On-chip Peripheral Bus (OPB)
OPB
Bridge
MAL0
HDLCEX
UART
x2
Ethernet
x2
ZMII
13-bit addr 32-bit data
28-bit addr 16-bit data
Two
32-channel
ports
MII, RMII, SMII
The NPe405L is designed using the IBM Microelectronics Blue Logic methodology in which major functional blocks are integrated to create an application-specific ASIC product. This approach provides a consistent way
to generate complex ASICs using IBM CoreConnect
Bus Architecture.
Address Map Support
The NPe405L incorporates two separate address maps. The first is a fixed processor address map that serves the PowerPC family of processors. This address map defines the possible contents of various address regions which the processor can access. The second address map is for Device Configuration Registers (DCRs). The DCRs are accessed by software running on the NPe405L processor through the use of mtdcr and mfdcr commands.
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Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
System Address Map 4GB Total System Memory
Function Subfunction Start Address End Address Size
0x00000000 0xE7FFFFFF 3712MB
SDRAM, External peripherals
General use
Boot-up
Internal peripherals
Notes:
1. When external peripheral bus boot is selected, peripheral bank 0 is automatically configured at reset to the address range listed above.
2. After the boot process, software may reassign the boot memory regions for other uses.
3. All address ranges not listed above are reserved.
Note: Any of the address ranges listed at right may be use for any of the above functions.
External peripheral bus boot UART0 0xEF600300 0xEF600307 8B UART1 0xEF600400 0xEF600407 8B IIC0 0xEF600500 0xEF60051F 32B OPB Arbiter 0xEF600600 0xEF60063F 64B GPIO0 controller registers 0xEF600700 0xEF60077F 128B GPIO1 controller registers 0xEF600780 0xEF6007FF 128B Ethernet MAC 0 registers 0xEF600800 0xEF6008FF 256B Ethernet MAC 1 registers 0xEF600900 0xEF6009FF 256B ZMII control registers 0xEF600C10 0xEF600C1F 16B HDLCEX 0xEF610000 0xEF61FFFF 64KB
1
0xE8010000 0xE87FFFFF 8MB 0xEC000000 0xEEBFFFFF 44MB 0xEEE00000 0xEF3FFFFF 6MB
0xEF500000 0xEF5FFFFF 1MB
0xEF900000 0xFFFFFFFF 263MB
0xFFE00000 0xFFFFFFFF 2MB
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Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
DCR Address Map 4KB Device Configuration Register
Function Start End Size
DCR address space
Reserved 0x000 0x00F 16W Memory controller registers 0x010 0x011 2W External bus controller registers 0x012 0x013 2W Reserved 0x014 0x07F 108W PLB registers 0x080 0x08F 16W Reserved 0x090 0x09F 16W OPB bridge-out registers 0x0A0 0x0A7 8W Reserved 0x0A8 0x0AF 8W Clock, control and reset 0x0B0 0x0B7 8W Power management 0x0B8 0x0BF 8W Interrupt controller 0 0x0C0 0x0CF 16W Interrupt controller 1 0x0D0 0x0DF 16W Reserved 0x0E0 0x0EF 16 W Miscellaneous 0x0F0 0x0FF 16W DMA controller registers 0x100 0x13F 64W Reserved 0x140 0x17F 64W MAL0 registers (Ethernet) 0x180 0x1FF 128W MAL1 registers (HDLCEX) 0x200 0x27F 128W Reserved 0x280 0x3FF 384W
Notes:
1. DCR address space is addressable with up to 10 bits (1024 or 1K unique addresses). Each unique address represents a single 32-bit (word) register, or 1 kiloword (KW) (which equals 4 KB).
1
0x000 0x3FF
1KW (4KB)
1
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Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
SDRAM Memory Controller
The NPe405L Memory Controller provides a low latency access path to SDRAM memory. The memory controller supports four logical banks. Up to 256MB per bank are supported, for a maximum of 1GB total. Memory access and refresh timing, address and bank sizes, and memory addressing modes are programmable.
Features include:
• 11x8 to 13x11 row-column address modes (2- and 4-bank devices supported)
• Memory bus operates at same frequency as PLB
• 32-bit memory interface support
• Programmable address range for each bank of memory
- 4GB address space
• Industry standard 168-pin DIMMS are supported (some configurations)
• 200 MHz NPe405H supports up to 100 MHz memory with PC100 support
• 266 MHz NPe405H supports up to 133 MHz memory with PC133 support
• 4MB to 256MB per bank
• Programmable timing
• Auto refresh
• Page Mode Accesses with up to 4 open pages
• Power Management (self-refresh)
• Error Checking and Correction (ECC) support
- Standard single error correct, double error detect coverage
- Aligned nibble error detect
- Address error logging
External Bus Controller (EBC)
• Supports four ROM, EPROM, SRAM, Flash, and Slave Peripheral I/O banks supported
• Up to 66.66MHz operation
• Burst and non-burst devices
• 8-, 16-bit byte-addressable data bus width support
• Latch data on Ready, Synchronous or Asynchronous
• Programmable 2K clock-cycle time-out counter with disable for R eady
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PowerNP NPe405L Embedded Processor Data Sheet
• Programmable access timing per device
- 0–255 wait states for non-bursting devices
- 0 –31 Burst Wait States for first access and up to 7 Wait States for subsequent accesses
- Programmable chip select assertion/negation relative to driving address bus
- Programmable output and write-enable assertion/negation relative to assertion of chip select
• Programmable address mapping
• Peripheral device wait via “Ready”
DMA Controller
• Supports the following transfers:
- Memory-to-memory transfers
- Buffered peripheral to memory transfers
- Buffered memory to peripheral transfers
Preliminary
• Four channels
• Scatter/Gather capability for programming multiple DMA operations
• 8-, 16-, 32-bit peripheral support (OPB and external bus attached)
• 32-bit addressing
• Address increment or decrement
• Internal 32-byte data buffering capability
• Supports internal and external peripherals
• Support for memory mapped peripherals
• Support for peripherals running on slower frequency buses
Serial Interface
• Two 8-pin UART interfaces provided
• Selectable internal or external serial clock to allow wide range of baud rates
• Register compatibility with NS16550 register set
• Complete status reporting capability
• Transmitter and receiver are each buffered with 16-byte FIFOs when in FIFO mode
• Fully programmable serial-interface characteristics
• Supports DMA using internal DMA engine
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Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
IIC Bus Interface
• Compliant with Phillips® Semiconductors I2C Specification, dated 1995
• Operation at 100kHz or 400kHz
• 8-bit data
• 10- or 7-bit address
• Slave transmitter and receiver
• Master transmitter and receiver
• Multiple bus masters
• Supports fixed V
• Two independent 4 x 1 byte data buffers
• One programmable interrupt request signal
• Provides full management of all IIC bus protocol
• Programmable error recovery
IIC interface
DD
HDLCEX Interface
• 32-channel HDLC controller
• Two full-duplex Pulse Code Modulation (PCM) Highway ports at speeds up to 4.096 Mbps per port or
8.192 Mbps when using a single port
• Supports HDLC protocol as well as a Transparent mode
• For a single channel per port, autonomous management of I-Frames and S-Frames of the Normal Response mode (NRM) pr otocol on one channel per port. U-frames are handled by software.
• Supports software emulation of NRM on all channels
General Purpose IO (GPIO) Controller
• Most GPIOs are pin-shared with other functions. Configuration registers are provided to determine whether a particular pin that has GPIO capabilities acts as a GPIO or is used for another purpose. The GPIO function has 32 I/Os.
• Each GPIO output is separately programmable to emulate an open-drain driver (drives to zero, three­stated if output bit is 1)
Universal Interrupt Controller (UIC)
Two cascaded Universal Interrupt Controllers (UICs) provide the control, status, and communications necessary for the interrupt sources and the PowerPC processor.
Features include:
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Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
• Seven external and 29 internal interrupts
• Edge triggered or level-sensitive
• Positive or negative active
• Selectable non-critical or critical interrupt requests to the PPC405 processor core
• Programmable critical interrupt priority ordering
• Programmable critical interrupt vector generation for reduced latency interrupt handling
10/100 Mbps Ethernet MAC
• Two units capable of full- and half-duplex, 10 Mbps or 100 Mbps operation
• Integrated ZMII Bridge supports use of MII, SMII or RMII connections to external PHYs (PHYs not included on chip)
- Reduced Media Independent Interface (RMII) or Serial Media Independent Interface (SMII) for one to two PHY applications
- Media Independent Interface (MII) for single or dual PHY applications
• Dedicated media access layer (MAL) provides DMA support
JTAG
• IEEE 1149.1 Test Access Port
• Debugger support
• JT AG boundary scan support (BSDL file available)
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Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
23mm, 324-Ball E-PBGA Package
Top View
Gold gate release
corresponds to
A01 ball location
Bottom View
AB
Y V T P
M
K H F D B
Note:
All dimensions are in mm.
AA
W
U R N
L J
G
E C A
01 03 050709 11 13 15 17
02 04
Thermal balls
0810
06
23.0
12 14
1.0
19
21
20
22
16 18
0.60 Solder Ball
0.60 nom
0.30 nom
1.0
23.0
2.65 max
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Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
Signal Lists
The following table lists all the external signals in alphabetical order and shows the ball number on which the signal appears. Multiplexed signals are shown with the default signal (following reset) not in brackets and the alternate signal or signals in brackets. Multiplexed signals appear alphabetically multiple times in the list— once for each signal name on the ball. The page number listed gives the page in “Signal Functional Description” on page 32 where the signals in the indicated interface group begin.
Signals Listed Alphabetically (Part 1 of 11)
Signal Name Ball Interface Group Page
AV
DD
BA0 AB15 BA1 Y14 BankSel0 BankSel1 BankSel2 BankSel3 CAS ClkEn0 Y13 ClkEn1 AA13 [DMAAck0 [DMAAck1 [DMAAck2 [DMAAck3 [DMAReq0 [DMAReq1 [[DMAReq2 [DMAReq3 DQM0 U03 DQM1 U01 DQM2 R02 DQM3 L01 DQMCB AA04 SDRAM 33 ECC0 AA05 ECC1 Y06 ECC2 AB04 ECC3 AA03 ECC4 Y05 ECC5 AB03 ECC6 Y04 ECC7 W06 EMC0MDClk AB16 Ethernet 32 EMC0MDIO AA16 Ethernet 32 [EMC0Sync]EMC0TxEn[EMC0Tx0En] AB21 Ethernet 32
]GPIO13 U22 ]GPIO14 U21 ]GPIO15 T20 ]GPIO16 D17
]GPIO09 P19 ]GPIO10 T22
]GPIO11 T21
]GPIO12 R20
H21 Power 37
SDRAM 33
AA07
Y08 AB06 AA06 AA12 SDRAM 33
SDRAM 33
SDRAM 33
External Peripheral Bus 34
External Peripheral Bus 34
SDRAM 33
SDRAM 33
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Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
Signals Listed Alphabetically (Part 2 of 11)
Signal Name Ball Interface Group Page
EMC0TxD0[EMC0Tx0D0][EMC0Tx0D] AA22 EMC0TxD1[EMC0Tx0D1][EMC0Tx1D] U19 EMC0TxD2[EMC0Tx1D0] W20 EMC0TxD3[EMC0Tx1D1] Y22 EMC0TxEn[EMC0Tx0En][EMC0Sync] AB21 Ethernet 32 EMC0TxErr[EMC0Tx1En] AB20 Ethernet 32 [EMC0Tx0En]EMC0TxEn[EMC0S ync] AB21 [EMC0Tx1En]EMC0TxErr AB20 [EOT0
/TC0]GPIO24 B19 /TC1]GPIO25 B18
[EOT1 [EOT2
/TC2]GPIO26 C16 /TC3]GPIO27 B17
[EOT3 GND A01 GND A05 GND A09 GND A14 GND A18 GND A22 GND B02 GND B21 GND C03 GND C20 GND D04 GND D08 GND D11 GND D12 GND D15 GND D19 GND E01 GND E22 GND H04 GND H19 GND J01 GND J09-J14 GND J22 GND K09-K14 GND L04 GND L09-L14 GND L19
Ethernet 32
Ethernet 32
External Peripheral Bus 34
Power Note: J09-J14, K09-K14, L09-L14, M09-M14, N09-
N14, and P09-P14 are also thermal balls.
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PowerNP NPe405L Embedded Processor Data Sheet
Signals Listed Alphabetically (Part 3 of 11)
Signal Name Ball Interface Group Page
GND M04 GND M09-M14 GND M19 GND N09-N14 GND P01 GND P09-P14 GND P22 GND R04 GND R19 GND V01 GND V22 GND W04 GND W08 GND W11 GND W12 GND W15 GND W19 GND Y03 GND Y20 GND AA02 GND AA21 GND AB01 GND AB05 GND AB09 GND AB14 GND AB18 GND AB22
Power Note: J09-J14, K09-K14, L09-L14, M09-M14, N09-
N14, and P09-P14 are also thermal balls.
Preliminary
37
15
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PowerNP NPe405L Embedded Processor Data Sheet
Signals Listed Alphabetically (Part 4 of 11)
Signal Name Ball Interface Group Page
GPIO00[TrcClk] B20 GPIO01[TS1E]GPIO08[TS6] C18 GPIO02[TS2E] A20 GPIO03[TS1O] N20 GPIO04[TS2O] N22 GPIO05[TS3] P21 GPIO06[TS4] P20 GPIO07[TS5] R22 GPIO08[TS6] R21 GPIO09[DMAReq0 GPIO10[DMAReq1 GPIO11[DMAReq2 GPIO12[DMAReq3 GPIO13[DMAAck0 GPIO14[DMAAck1 GPIO15[DMAAck2 GPIO16[DMAAck3 GPIO17[IRQ0] F20 GPIO18[IRQ1] J20 GPIO19[IRQ2] L21 GPIO20[IRQ3] M21 GPIO21[IRQ4] A A17 GPIO22[IRQ5] A B17 GPIO23[IRQ6] W14 GPIO24[EOT0 GPIO25[EOT1 GPIO26[EOT2 GPIO27[EOT3 GPIO28[UART1_DCD GPIO29[UART1_RI GPIO30 T03 GPIO31[PerWE Halt HDLCEXRxClk L20 HDLC 32-Channel 32 HDLCEXRxDataA M 22 HDLCEXRxDataB N21 HDLCEXRxFS M20 HDLC 32-Channel 32 HDLCEXTxClk K20 HDLC 32-Channel 32 HDLCEXTxDataA K21 HDLCEXTxDataB L22 [HDLCEXTxEnA]GPIO28[UART1_DCD [HDLCEXTxEnB]GPIO29[UART1_RI HDLCEXTxFS K22 HDLC 32-Channel 32
]P19 ]T22 ]T21
]R20 ]U22 ]U21 ]T20 ]D17
/TC0]B19 /TC1]B18 /TC2]C16 /TC3]B17
][HDLCEXTxEnA] AA15
][HDLCEXTxEnB] T01
]A13
]AA15
]T01
System 37
F22 System 37
HDLC 32-Channel 32
HDLC 32-Channel 32
HDLC 32-Channel 32
16
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PowerNP NPe405L Embedded Processor Data Sheet
Signals Listed Alphabetically (Part 5 of 11)
Signal Name Ball Interface Group Page
IICSCL[IECSCL] C17 IICSDA[IECSDA] A19 [IRQ0]GPIO17 F20 [IRQ1]GPIO18 J20 [IRQ2]GPIO19 L21 [IRQ3[GPIO20 M21 [IRQ4[GPIO21 AA17 [IRQ5]GPIO22 AB17 [IRQ6[GPIO23 W14 MemAddr00 Y12 MemAddr01 Y11 MemAddr02 AB11 MemAddr03 AA11 MemAddr04 AA10 MemAddr05 Y10 MemAddr06 AB10 MemAddr07 AA09 MemAddr08 Y09 MemAddr09 AB08 MemAddr10 AA08 MemAddr11 W09 MemAddr12 AB07 MemClkOut0 AA14 MemClkOut1 AB13
Internal Peripheral 35
Interrupts 36
SDRAM Note: During a CAS
significant bit (lsb) on this bus.
SDRAM 33
cycle MemAddr00 is the least
Preliminary
33
17
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Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
Signals Listed Alphabetically (Part 6 of 11)
Signal Name Ball Interface Group Page
MemData00 AB02 MemData01 AA01 MemData02 U04 MemData03 W03 MemData04 Y01 MemData05 V03 MemData06 Y02 MemDatar07 W01 MemData08 W02 MemData09 V02 MemData10 U02 MemData11 R03 MemData12 T02 MemData13 P04 MemData14 R01 MemData15 P03 MemData16 P02 MemData17 N01 MemData18 N03 MemData19 N02 MemData20 M02 MemData21 M01 MemData22 M03 MemData23 L03 MemData24 L02 MemData25 K02 MemData26 K03 MemData27 K01 MemData28 J02 MemData29 J03 MemData30 H01 MemData31 H02
SDRAM
Notes:
1. MemData00 is the most significant bit (msb).
2. MemData31 is the least significant bit (lsb)
33
18
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PowerNP NPe405L Embedded Processor Data Sheet
Signals Listed Alphabetically (Part 7 of 11)
Signal Name Ball Interface Group Page
OV OV OV OV OV OV OV OV OV OV OV OV OV OV OV OV
DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD
D05 D07 D16 D18 E04 E19 G04 G19
Power 37
T19 T04 V04
V19 W05 W07 W16 W18
Preliminary
19
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Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
Signals Listed Alphabetically (Part 8 of 11)
Signal Name Ball Interface Group Page
PerAddr04 D06 PerAddr05 PerAddr06 PerAddr07 PerAddr08 PerAddr09 PerAddr10 PerAddr11 PerAddr12 PerAddr13 PerAddr14 PerAddr15 PerAddr16 PerAddr17 PerAddr18 PerAddr19 PerAddr20 PerAddr21 PerAddr22 PerAddr23 PerAddr24 PerAddr25 PerAddr26 PerAddr27 PerAddr28 PerAddr29 PerAddr30 PerAddr31 PerBLast PerClk A17 External Peripheral Bus 34 PerCS0 PerCS1 PerCS2 PerCS3
C04 A03 C05 B03 A04 C06 B04 B05 C07 B06 C08 B07 A07
External Peripheral Bus 34
D09 B08 A08 C09 B09 A10 C10 B10 B11 A11 C11 C12 A12 B12 C15 External Peripheral Bus 34
B14 C14
External Peripheral Bus 34
A15 B15
20
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Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
Signals Listed Alphabetically (Part 9 of 11)
Signal Name Ball Interface Group Page
PerData00 J04 PerData01 G01 PerData02 G02 PerData03 H03 PerData04 F01 PerData05 F02 PerData06 G03 PerData07 E02 PerData08 D02 PerData09 F03 PerData10 D01 PerData11 C02 PerData12 E03 PerData13 C01 PerData14 D03 PerData15 F04 PerErr J21 External Peripheral Bus 34 PerOE PerPar0 B01 PerPar1 A02 PerR/W PerReady B16 External Peripheral Bus 34 PerWBE0 PerWBE1
]GPIO31 A13 External Peripheral Bus 34
[PerWE PHY0Col[PHY0Rx1Er] W17 Ethernet 32 PHY0CrS[PHY0CrS0DV] Y18 Ethernet 32 [PHY0CrS1DV]PHY0RxDV Y17 Ethernet 32 PHY0RxClk AB19 Ethernet 32 [PHY0RefClk]PHY0TxClk Y19 Ethernet 32 PHY0RxD0[PHY0Rx0 D 0 ][PHY0Rx0D] Y15 PHY0RxD1[PHY0Rx0 D 1 ][PHY0Rx1D] Y16 PHY0RxD2[PHY0Rx1D0] AA18 PHY0RxD3[PHY0Rx1D1] AA19 PHY0RxDV[PHY0CrS1D V] Y17 Ethernet 32 PHY0RxErr[PHY0Rx0Er] AA20 Ethernet 32 [PHY0Rx0Er]PHY0RxErr AA20 Ethernet 32 PHY0TxClk[PHY0RefClk] Y19 Ethernet 32 RAS SysClk G22 System 37 SysErr C21 System 37 SysReset TCK J19 JTAG 36
AB12 SDRAM 33
External Peripheral Bus Note: PerData00 is the most significant bit (msb)
on this bus.
D14 External Peripheral Bus 34
External Peripheral Bus 34
A16 External Peripheral Bus 34
B13
External Peripheral Bus 34
C13
Ethernet 32
A21 System 37
34
21
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Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
Signals Listed Alphabetically (Part 10 of 11)
Signal Name Ball Interface Group Page
[TC0/EOT0]GPIO24 B19
/EOT1]GPIO25 B18
[TC1
/EOT2]GPIO26 C16
[[TC2 [TC3
/EOT3]GPIO27 B17 TDI G21 JTAG 36 TDO F21 JTAG 36 TestEn H20 System 37 TmrClk D20 System 37 TMS E21 JTAG 36 [TrcClk]GPIO00 B20 Trace 37 TRST [TS1E]GPIO01 C18 [TS2E]GPIO02 A20 [TS1O]GPIO03 N20 [TS2O]GPIO04 N22 [TS3]GPIO05 P21 [TS4]GPIO06 P20 [TS5]GPIO07 R22 [TS6]GPIO08 R21 UART0_CTS UART0_DCD UART0_DSR UART0_DTR UART0_RI UART0_RTS UART0_Rx C22 UART0_Tx F19 UART1_CTS [UART1_DCD UART1_DSR UART1_DTR [UART1_RI UART1_RTS UART1_Rx V20 UART1_Tx Y21 UARTSerClk E20
]GPIO28[HDLCEXTxEnA] AA15
]GPIO29[HDLCEXTxEnB] T01
External Peripheral Bus 34
H22 JTAG 36
Trace 37
Trace 37
Trace 37
B22 C19 A06
G20
Internal Peripheral 35
D22 D21
W22
W21 U20
Internal Peripheral 35
V21
22
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PowerNP NPe405L Embedded Processor Data Sheet
Signals Listed Alphabetically (Part 11 of 11)
Signal Name Ball Interface Group Page
V V V V V V V V WE
DD
DD
DD
DD
DD
DD
DD
DD
D10 D13 K19 K04
Power 37
N19
N04 W10 W13
Y07 SDRAM 33
Preliminary
23
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Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
Signals Listed by Ball Assignment (Part 1 of 6)
Ball Signal Name Ball S ignal Name Ball Signal Name Ball Signal Name
A01 GND B01 PerPar0 C01 PerData13 D01 PerData10 A02 PerPar1 B02 GND C02 PerData11 D02 PerData08 A03 PerAddr06 B03 PerAddr08 C03 GND D03 PerData14 A04 PerAddr09 B04 PerAddr11 C04 PerAddr05 D04 GND A05 GND B05 Pe rAddr12 C05 PerAdd7 D05 A06 UAR T0_D SR B06 PerAddr14 C06 PerAddr10 D06 P erAddr04 A07 PerAddr17 B07 PerAddr16 C07 PerAddr13 D07 A08 PerAddr20 B08 PerAddr19 C08 PerAddr15 D08 GND A09 GND B09 Pe rAddr22 C09 P erAddr21 D09 P erAddr18 A10 PerAddr23 B10 PerAddr25 C10 PerAddr24 D10 A11 PerAddr27 B11 PerAddr26 C11 PerAddr28 D11 GND A12 PerAddr30 B12 PerAddr31 C12 PerAddr29 D12 GND A13 GPI O31[PerWE A14 GND B14 PerCS0 C14 P erCS1 D14 PerOE A15 PerCS2 B15 PerCS3 C15 PerBLast D15 GND A16 PerR /W A17 PerC lk B17 GPIO27[EOT3/TC3] C17 IICSCL[IECSCL] D17 GPIO16[DMAAck3] A18 GND B18 GPIO25[EOT1 A19 IICSDA[IECSDA] B19 GPIO24[EOT0/TC0] C19 UA RT0_DCD D19 GND A20 GPIO02[TS2E] B20 GPIO00[TrcClk] C20 GND D20 TmrClk A21 SysReset A22 GND B22 UART0_CTS C22 UART0_Rx D22 UART0_RI
] B13 PerWBE0 C13 PerWBE1 D13
B16 PerReady C16 G PI O 26[ EOT2/TC2]D16
/TC1] C18 GPIO01[TS1E] D18
B21 GND C21 SysErr D21 UART0_RTS
OV
OV
V
V
OV
OV
DD
DD
DD
DD
DD
DD
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Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
Signals Listed by Ball Assignment (Part 2 of 6)
Ball Signal Name Ball S ignal Name Ball Signal Name Ball Signal Name
E01 GND F01 PerData04 G01 PerData01 H01 MemData30 E02 PerData07 F02 PerData05 G02 PerData02 H02 MemData31 E03 PerData12 F03 PerData09 G03 PerData06 H03 PerData03
OV
E04 E05 No ball F05 No ball G05 No ball H05 No ball E06 No ball F06 No ball G06 No ball H06 No ball E07 No ball F07 No ball G07 No ball H07 No ball E08 No ball F08 No ball G08 No ball H08 No ball E09 No ball F09 No ball G09 No ball H09 No ball E10 No ball F10 No ball G10 No ball H10 No ball E11 No ball F11 No ball G11 No ball H11 No ball E12 No ball F12 No ball G12 No ball H12 No ball E13 No ball F13 No ball G13 No ball H13 No ball E14 No ball F14 No ball G14 No ball H14 No ball E15 No ball F15 No ball G15 No ball H15 No ball E16 No ball F16 No ball G16 No ball H16 No ball E17 No ball F17 No ball G17 No ball H17 No ball E18 No ball F18 No ball G18 No ball H18 No ball E19 E20 UARTSerClk F20 GPIO17[IRQ0] G20 UART0_DTR E21 TMS F21 TDO G21 TDI H21 E22 GND F22 Halt G22 SysClk H22 TRS T
OV
DD
DD
F04 PerData15 G04
F19 UART0_Tx G19
OV
OV
DD
DD
H04 GND
H19 GND H20 TestEn
AV
DD
25
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Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
Signals Listed by Ball Assignment (Part 3 of 6)
Ball Signal Name Ball S ignal Name Ball Signal Name Ball Signal Name
J01 GND K01 M emDat a27 L01 DQM3 M01 MemData21 J02 MemData28 K02 MemData25 L02 MemData24 M02 MemData20 J03 MemData29 K03 MemData26 L03 MemData23 M03 MemData22 J04 PerData00 K04 J05 No ball K05 No ball L05 No ball M05 No ball J06 No ball K06 No ball L06 No ball M06 No ball J07 No ball K07 No ball L07 No ball M07 No ball J08 No ball K08 No ball L08 No ball M08 No ball J09 GND K09 GND L09 G ND M09 GND J10 GND K10 GND L10 G ND M10 GND J11 GND K11 GND L11 G ND M11 GND J12 GND K12 GND L12 G ND M12 GND J13 GND K13 GND L13 G ND M13 GND J14 GND K14 GND L14 G ND M14 GND J15 No ball K15 No ball L15 No ball M15 No ball J16 No ball K16 No ball L16 No ball M16 No ball J17 No ball K17 No ball L17 No ball M17 No ball J18 No ball K18 No ball L18 No ball M18 No ball J19 TCK K19 J20 GPIO18[IRQ1] K20 HDLCEXTxClk L20 HDLCEXRxClk M20 HDLCEXRxFS J21 PerErr K21 HDLCEXTxDataA L21 GPIO19[IRQ2] M21 GPIO20[IRQ3] J22 GND K22 HDLCEXTxFS L22 HDLCEXTxDataB M22 HDLCEXRxDataA
V
DD
V
DD
L04 GND M04 GND
L19 GND M19 GND
26
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Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
Signals Listed by Ball Assignment (Part 4 of 6)
Ball Signal Name Ball S ignal Name Ball Signal Name Ball Signal Name
N01 MemData17 P01 GND R01 MemData14 T01 N02 MemData19 P02 MemData16 R02 DQM2 T02 MemData12
N03 MemData18 P03 MemData15 R03 MemData11 T03 GPIO30
V
N04 N05 No ball P05 No ball R05 No ball T05 No ball N06 No ball P06 No ball R06 No ball T06 No ball N07 No ball P07 No ball R07 No ball T07 No ball N08 No ball P08 No ball R08 No ball T08 No ball N09 GND P09 GND R09 No ball T09 No ball N10 GND P10 GND R10 No ball T10 No ball N11 GND P11 GND R11 No ball T11 No ball N12 GND P12 GND R12 No ball T12 No ball N13 GND P13 GND R13 No ball T13 No ball N14 GND P14 GND R14 No ball T14 No ball N15 No ball P15 No ball R15 No ball T15 No ball N16 No ball P16 No ball R16 No ball T16 No ball N17 No ball P17 No ball R17 No ball T17 No ball N18 No ball P18 No ball R18 No ball T18 No ball N19 N20 GPIO3[TS1O] P20 GPIO06[TS4] R20 GPIO12[DMAReq3] T20 GPIO15[DMAAck2] N21 HDLCEXRxDataB P21 GPIO 05[TS3 ] R21 GPIO08[TS6] T21 GPIO11[DMAReq2 N22 GPIO4[TS2O] P22 GND R22 GPIO07[TS5] T22 GPIO10[DMAReq1
DD
V
DD
P04 MemData13 R04 GND T04
P19 GPI O 09[D MAReq0] R19 GND T19
GPIO29[UART1_RI [HDLCEXTxEnB]
OV
DD
OV
DD
]
] ]
27
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Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
Signals Listed by Ball Assignment (Part 5 of 6)
Ball Signal Name Ball S ignal Name Ball Signal Name Ball Signal Name
U01 DQM1 V01 GND W01 MemData07 Y01 MemData04 U02 MemData10 V02 MemData09 W02 MemData08 Y02 MemData06 U03 DQM0 V03 MemData05 W03 MemData03 Y03 GND U04 MemData02 V04
U05 No ball V05 No ball W05 U06 No ball V06 No ball W06 ECC7 Y06 ECC1 U07 No ball V07 No ball W07 U08 No ball V08 No ball W08 GND Y08 BankSel1 U09 No ball V09 No ball W09 MemAddr11 Y09 MemAddr08 U10 No ball V10 No ball W10 U11 No ball V11 No ball W11 GND Y11 MemAddr01 U12 No ball V12 No ball W12 GND Y12 MemAddr00 U13 No ball V13 No ball W13 U14 No ball V14 No ball W14 GPIO23[IRQ6] Y14 BA1
U15 No ball V15 No ball W15 GND Y15
U16 No ball V16 No ball W16
U17 No ball V17 No ball W17 PHY0Col[PHY0Rx1Er] Y17
U18 No ball V18 No ball W18
EMC0TxD1
U19
[EMC0Tx0D1]
[EMC0Tx1D] U20 UART1_DTR U21 GPIO14[DMAAck1 U22 GPIO13[DMAAck0
] V21 UART1_RTS W 21 UART1_DSR Y21 UART1_Tx ] V22 GND W22 UART1_CTS Y22
OV
DD
OV
V19
V20 UAR T1_Rx W20
DD
W04 GND Y04 ECC6
W19 GND Y19
OV
DD
OV
DD
V
DD
V
DD
OV
DD
OV
DD
EMC0TxD2 [EMC0Tx1D0]
Y05 ECC4
Y07 WE
Y10 MemAddr05
Y13 ClkEn0
PHY0RxD0 [PHY0Rx0D0] [PHY0Rx0D]
PHYRxD1
Y16
[PHY0Rx0D1] [PHY0Rx1D]
PHY0RxDV [PHY0CrS1DV]
PHY0CrS
Y18
[PHY0CrS0DV] PHY0TxClk
[PHY0RefClk]
Y20 GND
EMC0TxD3 [EMC0Tx1D1]
28
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Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
Signals Listed by Ball Assignment (Part 6 of 6)
Ball Signal Name Ball S ignal Name Ball Signal Name Ball Signal Name
AA01 MemData01 AB01 GND AA02 GND AB02 MemData00 AA03 ECC3 AB03 ECC5 AA04 DQMCB AB04 ECC2 AA05 ECC0 AB05 GND AA06 BankSel3 AB06 BankSel2 AA07 BankSel0 AB07 MemAddr12 AA08 MemAddr10 AB08 MemAddr09 AA09 MemAddr07 AB09 GND AA10 MemAddr04 AB10 MemAddr06 AA11 MemAddr03 AB11 MemAddr02 AA12 CAS AB12 RAS AA13 ClkEn1 AB13 M emClkOut1 AA14 MemClkOut0 AB14 GND
GPIO28[UART1_DCD
AA15
[HDLCEXTxEnA] AA16 EMC0MDIO AB16 EMC0MDClk AA17 GPIO21[IRQ4] AB17 GPIO22[IRQ5]
PHY0RxD2
AA18
[PHY0Rx1D0]
PHY0RxD3
AA19
[PHY0Rx1D1]
PHY0RxErr
AA20
[PHY0Rx0Er]
AA21 GND AB21
EMC0TxD0 AA22
[EMC0Tx0D0]
[EMC0Tx0D]
]
AB15 BA0
AB18 GND
AB19 PHY0RxClk
EMC0TxErr
AB20
[EMC0Tx1En] EMC0TxEn
[EMC0Tx0En] [EMC0Sync]
AB22 GND
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Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
Signal Description
The following table provides a summary of the number of package pins (balls) associated with each functional interface group.
Pin Summary
Group No. of Pins
Nonmultiplexed Signals 167
Multiplexed Signals 48
Total Signal Pins 215
AV
DD
OV
DD
V
DD
Gnd 48
Gnd (and thermal) 36
Reserved 0
Total Pins 324
1
16
8
Multiplexed pins
In the table “Signal Functional Description” on page 32, each external signal is listed along with a short description of the signal function. The signals are grouped together according to their function. Some signals are multiplexed on the same package pin (ball) so that the pin can be used for different functions. In most cases, the signal name is shown in this table unaccompanied by multiplexed signal names that may be associated with it. In cases where multiplexed signals are in the same functional group, the names appear as a default signal followed by secondary signals in square brackets (for example, EMC0TxErr[EMC0Tx1En]). Active-low signals (for example, RAS
) are marked with an overline. Any signal that is not the primary (default)
signal on a multiplexed pin is shown in square brackets. The active signal on a multiplexed pin is controlled by programming. It is expected that in any single
application, a particular pin will always be programmed to serve the same function. The flexibility of multiplexing allows a single chip to offer a richer pin selection than would otherwise be possible.
Initialization Strapping
One group of pins is used as strapped inputs during system reset. These pins function as strapped inputs only during reset and are used for other functions during normal operation (see “Initialization” on page 51). Note that the use of these pins for strapping is not considered multiplexing since the strapping function is not programmable.
Pull-up and Pull-down Resistors
Pull-up and pull-down resistors are used for strapping during reset and to retain unused or undriven inputs in an appropriate state. The recommended pull-up value of 3k tolerant I/Os) and pull-down value of 1k
to GND, applies only to individually terminated signals. To prevent
to +3.3V (10k to +5V can be used on 5V
possible damage to the device, I/Os capable of becoming outputs must never be tied together and terminated through a common resistor.
If your system-level test methodology permits, input-only signals can be connected together and terminated through either a common resistor or directly to +3.3V or GND. When a resistor is used, its value must ensure
30
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Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
that the grouped I/Os reach a valid logic zero or logic one state when accounting for the total input current into the NPe405L.
Unused I/Os
Strapping of some pins may be necessary when they are unused. Although the NPe405L requires only the pull-up and pull-down terminations as specified in the “Signal Functional Description” on page 32, good design practice is to terminate all unused inputs or to configure I/Os such that they always drive. If unused, the peripheral and SDRA M bus should be configured and terminated as follows:
• Peripheral interface—PerAddr00:31, PerData00:31, and all of the control signals are driven by default. Terminate PerReady high and PerError low.
• SDRAM—Program SDRAM0_CFG[EMDULR]=1 and SDRAM0_CFG[DCE]=1. This causes the NPe405L to actively drive all of the SDRAM address, data, and control signals.
External Peripheral Bus Control Signals
All external peripheral bus control signals (PerCS0: set to the high-impedance state when ExtReset Embedded Processor User’s Manual, the peripheral bus controller can be programmed via EBC0_CFG to float some of these control signals between transactions. As a result, a pull-up resistor should be added to those control signals where an undriven state may affect any devices receiving that particular signal.
The following table lists all of the I/O signals provided by the NPe405L. Please see “Signals Listed Alphabetically” on page 13 for the pin number to which each signal is assigned. In cases where a multiplexed signal (indicated by the square brackets) is shown without the other signals that are assigned to that pin, you can see what the other signals are by referring to the same table.
3, PerR/W, PerWBE0:1, PerOE, PerWE, PerBLast) are
=0. In addition, as detailed in the PowerNP NPe405L
31
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Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
Signal Functional Description (Part 1 of 6)
Notes:
1. Receiver input has hy steresis.
2. Must pull up. See “Pull-up and Pull-down Resistors” on page 30 for recommen ded termination values.
3. Must pull down. See “Pull-up and Pull-down R esistors” on page 30 for recommended termination values.
4. If not used, must pull up.
5. If not used, must pull down.
6. Strapping input during reset; pull up or pull down as required.
7. Pull-up may be required. See “External Peripheral Bus Control Signals” on page 31.
Signal Name Description I/O Type
HDLCEX Interface
HDLCEXTxClk Transmit Clock I 3.3V LVTTL
HDLCEXTxFS Transmit Frame Synchronization I 3.3V LVTTL HDLCEXTxDataA Transmit Data port A O 3.3V LVTTL HDLCEXTxDataB Transmit Data port B O 3.3V LVTTL
HDLCEXRxClk Receive Clock I 3.3V LVTTL
HDLCEXRxFS Receive Frame Synchronization I 3.3V LVTTL HDLCEXRxDataA Receive Data port A I 3.3V LVTTL HDLCEXRxDataB Receive Data port B I 3.3V LVTTL
[HDLCEXTxEnA] Transmit Enable port A O
[HDLCEXTxEnB] Transmit Enable port B O
Ethernet Interface
EMC0MDClk
EMC0MDIO
EMC0TxD0[EMC0Tx0D0][EMC0Tx0D] EMC0TxD1[EMC0Tx0D1][EMC0Tx1D]
EMC0TxD2[EMC0Tx1D0] EMC0TxD3[EMC0Tx1D1]
EMC0TxEn[EMC0Tx0E n][EMC0Sync]
EMC0TxErr[EMC0Tx1En]
Management Data Clock. The MDClk is sourced to the PHY. Management information is transferred synchronously with respect to this clock (MII, RMII, and SMII).
Management Data Input/Output is a bidirectional signal between the Ethernet controller and the PHY. It is used to transfer control and status information (MII, RMII, and SMII).
Transmit Data. A nibble wide data bus towards the net. The data is synchronous with PHY0TxClk (MII 0[RMII 0, 1][SMII 0, 1]).
Transmit Enable. This signal is driven by EMAC2 to the PHY. Data is valid during the active state of this signal. Deassertion of this signal indicates end of frame transmission. This signal is synchronous with PHYTxClk (MII 0[RM II 0]).
or SMII Sync.
Transmit Error. This signal is generated by the Ethernet controller, is connected to the PHY and is synchronous with the PHY0TxClk. It informs the PHY that an error was detected (MII 0).
or Transmit Enable [RMII 1].
5V tolerant
3.3V LVTTL 5V tolerant
3.3V LVTTL
O3.3V LVTTL
5V tolerant
I/O
3.3V LVTTL
O 3.3V LVTTL
O 3.3V LVTTL
O3.3V LVTTL
Notes
1, 4
32
Page 35
PowerNP NPe405L Embedded Processor Data Sheet
Signal Functional Description (Part 2 of 6)
Notes:
1. Receiver input has hysteresis.
2. Must pull up. See “Pull-up and Pull-down Resistors” on page 30 for recommended termination values.
3. Must pull down. See “Pull-up and Pull-down R esistors” on page 30 for recommended termination values.
4. If not used, must pull up.
5. If not used, must pull down.
6. Strapping input during reset; pull up or pull down as required.
7. Pull-up may be required. See “External Peripheral Bus Control Signals” on page 31.
Preliminary
Signal Name Description I/O Type
PHY0Col[PHY0Rx1Er]l
PHY0CrS[PHY0CrS0DV]
PHY0RxClk
PHY0RxD0[PHY0Rx 0 D 0][PHY0Rx0D] PHY0RxD1[PHY0Rx 0 D 1][PHY0Rx1D]
PHY0RxD2[PHY0Rx1 D 0] PHY0RxD3[PHY0Rx1 D 1]
PHY0RxDV[PHY0CrS1DV]
PHY0RxErr[PHY0Rx 0Er]
PHY0TxClk[PHY0RefClk]
SDRAM Interface
MemAddr00:31
MemAddr12:00
BA1:0 Bank Address support ing up to 4 internal b anks O 3.3V LVTTL
RAS CAS
DQM0:3
DQMCB DQM for ECC check bits. O 3.3V LVTTL
Collision [receive error] signal from the PHY. This is an asynchronous signal (MII 0).
or Receive Error ([RMII 1]).
Carrier Sense signal from the PHY. This is an asynchronous signal (MII 0).
or Carrier sense data valid ([RMII 0]).
Receiver medium clock. This signal is generated by the PHY (MII 0).
Received Data. This is a nibble wide bus from the PHY. The data is synchronous with PHY0RxClk (MII 0[RMII 0, 1][SMII 0, 1]).
Receive Data Valid. Data on the Data Bus is valid when this signal is activated. Deassertion of this signal indicates end of the frame reception (MII 0).
or Carrier sense data valid ([RMII 1])
Receive Error. This signal comes from the PHY and is synchronous with PHY0RxClk (MII 0 [RMII 0]).
Transmit medium clock. This signal is generated the PHY ([MII 0]).
or Reference Clock [RMII and SMII].
Memory Data bus
Notes:
1. MemAddr00 is the most significant bit (msb).
2. MemData31 is the least significant bit (lsb). Memory Address bus.
Notes:
1. MemAddr12 is the most significant bit (msb).
2. MemAddr00 is the least significant bit (lsb).
Row Address Strobe. O 3.3V LVTTL Column Address Strobe. O 3.3V LVTTL DQM for byte lane 0 (MemAddr00:7),
1 (MemAddr08:15), 2 (MemData16:23), and 3 (MemData24:31)
I/O 3.3V LVTTL
5V tolerant
I
3.3V LVTTL
5V tolerant
I
3.3V LVTTL
5V tolerant
I
3.3V LVTTL
5V tolerant
I
3.3V LVTTL
5V tolerant
I
3.3V LVTTL
5V tolerant
I
3.3V LVTTL
5V tolerant
I
3.3V LVTTL
O3.3V LVTTL
O3.3V LVTTL
Notes
1, 5
1, 4
1, 4
1, 5
1, 5
1, 4
33
Page 36
Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
Signal Functional Description (Part 3 of 6)
Notes:
1. Receiver input has hy steresis.
2. Must pull up. See “Pull-up and Pull-down Resistors” on page 30 for recommen ded termination values.
3. Must pull down. See “Pull-up and Pull-down R esistors” on page 30 for recommended termination values.
4. If not used, must pull up.
5. If not used, must pull down.
6. Strapping input during reset; pull up or pull down as required.
7. Pull-up may be required. See “External Peripheral Bus Control Signals” on page 31.
Signal Name Description I/O Type Notes
ECC0:7 ECC check bits 0:7. I/O 3.3V LVTTL
BankSel0:3
ClkEn0:1 SDRAM Clock Enable. O 3.3V LVTTL
MemClkOut0:1
External Peripheral Bus Interface
PerData00:15
PerAddr04:31 External peripheral address bus . O
PerPar0:1 External peripheral byte parity signals. I/O
PerWBE0:
[PerWE
PerCS0
PerOE
PerR/W
Select up to four external SDRAM banks. O 3.3V LVTTL
WE
1
]
:3
Write Enable. O 3.3V LVTTL
Two copies of an SDRAM clock allows, in some cases, glueless SDRAM attachment without requiring this signal to be repowered by a PLL or zero-delay buffer.
External peripheral data bus . Note: PerData00 is the most significant bit (msb) on this
bus.
Peripheral write-bte enable. Byte-enables which are valid for an entire cycle or write-byte-enables which are valid for each byte on each data transfer, allowing partial word transactions. Used by either external bus controller or DMA controller depending upon the type of transfer involved.
Peripheral write enable. Low when any of the two PerWBE signals are low.
Peripheral Chip Selects O
Peripheral output enable. Used by either the external bus controller or the DMA controller depending upon the type of transfer involved. When the NPe405L is the bus master, it enables the peripherals to drive the bus.
Peripheral read/write. Used by either the external bus controller or DMA controller depending upon the type of transfer involved. High indicates a read from memory, low indicates a write to memory.
O3.3V LVTTL
I/O
O
I/O
O
O
5V tolerant
3.3V LVTTL
5V tolerant
3.3V LVTTL 5V tolerant
3.3V LVTTL
5V tolerant
3.3V LVTTL
5V tolerant
3.3V LVTTL 5V tolerant
3.3V LVTTL
5V tolerant
3.3V LVTTL
5V tolerant
3.3V LVTTL
1
1
2, 7
7
7
34
PerReady Indicates peripheral is ready to transfer data. I
PerBLast
PerClk Peripheral Clock. Used by synchronous peripherals. O
PerErr Used to indicate errors from peripherals. I
Peripheral burst last. Used to indicate the last transfer of a memory access.
O
5V tolerant
3.3V LVTTL 5V tolerant
3.3V LVTTL 5V tolerant
3.3V LVTTL 5V tolerant
3.3V LVTTL
1
7
1, 5
Page 37
PowerNP NPe405L Embedded Processor Data Sheet
Signal Functional Description (Part 4 of 6)
Notes:
1. Receiver input has hysteresis.
2. Must pull up. See “Pull-up and Pull-down Resistors” on page 30 for recommended termination values.
3. Must pull down. See “Pull-up and Pull-down R esistors” on page 30 for recommended termination values.
4. If not used, must pull up.
5. If not used, must pull down.
6. Strapping input during reset; pull up or pull down as required.
7. Pull-up may be required. See “External Peripheral Bus Control Signals” on page 31.
Preliminary
Signal Name Description I/O Type
[DMAReq0:3]
[DMAAck0:3
[EOT0:3
]
/TC0:3]
Internal Peripheral Interface
UARTSerClk
UART0_Rx UART0 Receive data. I
UART0_Tx UA RT0 Transmit data. O
[UART0_DCD
[UART0_DSR
[UART0_CTS
[UART0_DTR
[UART0_RTS
[UART0_RI
] UAR T 0 Data C arrier Detec t. I
] UART0 Data Set Ready. I
] UART0 Clear To Send. I
] UART0 Data Terminal Ready. O
] UART0 Request To Send. O
] UART0 Ring Indicator. I
DMA request. Used by peripherals to request a data transfer. Following a system reset, the default mode of the signals is active-low. They may be programmed to active­high using the DMA0_POL register.
DMA acknowledge. Used to indicate to peripherals that data transfer is complete. Following a system reset, the default mode of the signals is active-low. They may be programmed to active-high using the DMA0_POL register.
End Of Transfer/Terminal Count. Indication by peripherals that all data has been transfered, or by DMA controller that programmed amount of data has been transfered. Following a system reset, the default mode of the signals is active-low. They may be programmed to active-high using the DMA0_POL register.
Serial Clock used to provide an alternative clock to the internally generated serial clock. Used in cases where the allowable internally generated baud rates are not satisfactory. This input can be individually connected to either or both UART0 and UART1.
I
O
I/O
I
5V tolerant
3.3V LVTTL
5V tolerant
3.3V LVTTL
5V tolerant
3.3V LVTTL
5V tolerant
3.3V LVTTL
5V tolerant
3.3V LVTTL 5V tolerant
3.3V LVTTL 5V tolerant
3.3V LVTTL 5V tolerant
3.3V LVTTL 5V tolerant
3.3V LVTTL 5V tolerant
3.3V LVTTL 5V tolerant
3.3V LVTTL 5V tolerant
3.3V LVTTL r
Notes
1
1
1
1
1
1
1
1
35
Page 38
Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
Signal Functional Description (Part 5 of 6)
Notes:
1. Receiver input has hy steresis.
2. Must pull up. See “Pull-up and Pull-down Resistors” on page 30 for recommen ded termination values.
3. Must pull down. See “Pull-up and Pull-down R esistors” on page 30 for recommended termination values.
4. If not used, must pull up.
5. If not used, must pull down.
6. Strapping input during reset; pull up or pull down as required.
7. Pull-up may be required. See “External Peripheral Bus Control Signals” on page 31.
Signal Name Description I/O Type Notes
I
5V tolerant
3.3V LVTTL 5V tolerant
3.3V LVTTL 5V tolerant
3.3V LVTTL 5V tolerant
3.3V LVTTL 5V tolerant
3.3V LVTTL 5V tolerant
3.3V LVTTL 5V tolerant
3.3V LVTTL 5V tolerant
3.3V LVTTL 5V tolerant
3.3V LVTTL 5V tolerant
3.3V LVTTL
5V tolerant
3.3V LVTTL
5V tolerant
3.3V LVTTL 5V tolerant
3.3V LVTTL 5V tolerant
3.3V LVTTL 5V tolerant
3.3V LVTTL 5V tolerant
3.3V LVTTL
UART1_Rx UART1 Receive data. I
UART1_Tx UA RT1 Transmit data. O
[UART1_DCD
[UART1_DSR
[UART1_CTS
[UART1_DTR
[UART1_RTS
[UART1_RI
IICSCL IIC Serial Clock. I/O
IICSDA IIC Serial Data. I/O
Interrupts Interface
[IRQ0:6] Interrupt Requests. I
JTAG Interface
TDI Test Data In. I
TMS Test Mode Select. I
TDO Test Data Out. O
TCK Test Clock. I
TRST
] UAR T 1 Data C arrier D etec t. I
] UART1 Data Set Ready. I
] UART1 Clear To Send. I
] UART1 Data Terminal Ready. O
] UART1 Request To Send. O
] UART1 Ring Indicator. I
Test Reset. TRST must be low at power-on to reset the JTAG boundary scan state machine.
1
6
1, 4
1, 4
1, 4
6
6
1, 4
1, 2
1, 2
1
1, 4
1, 4
1, 4
5
36
Page 39
PowerNP NPe405L Embedded Processor Data Sheet
Signal Functional Description (Part 6 of 6)
Notes:
1. Receiver input has hysteresis.
2. Must pull up. See “Pull-up and Pull-down Resistors” on page 30 for recommended termination values.
3. Must pull down. See “Pull-up and Pull-down R esistors” on page 30 for recommended termination values.
4. If not used, must pull up.
5. If not used, must pull down.
6. Strapping input during reset; pull up or pull down as required.
7. Pull-up may be required. See “External Peripheral Bus Control Signals” on page 31.
Preliminary
Signal Name Description I/O Type
System Interface
SysClk Main System Clock input. I
SysReset
SysErr Set to 1 when a Machine Check is generated. O
Halt
GPIO00:31
TestEn
TmrClk
Trace Interface
[TS1E] [TS2E]
[TS1O] [TS2O]
[TS3:6]
[TrcClk]
Power Pins
GND
V
OV
AV
Other Pins
Reserved Do not connect signals, voltage, or ground to these pins. n/a n/a
DD
DD
DD
3.3V Analog Wire w/ESD
Main System Reset. I/O
Halt from external debugger. I General Purpose I/O. To access this function, software
must toggle a DCR bit. Test Enable. Used only for manufacturing tests. Pull down
for normal operation. This input must toggle at a rate of less than one half the
CPU core frequency (less than 100MHz in most cases). In most cases this input toggles much slower (in the 1MHz to 10MHz range).
Even Trace execution status.To access this function, software must toggle a DCR bit.
Odd Trace execution status. To access this function, software must toggle a DCR bit.
Trace Status. To access this function, software must toggle a DCR bit.
Trace interface clock. A toggling signal that is always half of the CPU core frequency. To access this function, software must toggle a DCR bit.
Ground Note: J09-J14, K09-K14, L09-L14, M09-M14, N09-N14,
and P09-P14 are also thermal balls. Logic voltage—2.5V I Hardwire Output driver voltage—3.3V I Hardwire
Filtered PLL voltage—2.5V I
I/O
5V tolerant
3.3V LVTTL 5V tolerant
3.3V LVTTL 5V tolerant
3.3V LVTTL 5V tolerant
3.3V LVTTL
3.3V LVTTL
I
Rcvr w/PD
5V tolerant
I
3.3V LVTTL
5V tolerant
O
3.3V LVTTL 5V tolerant
O
3.3V LVTTL 5V tolerant
O
3.3V LVTTL
5V tolerant
O
3.3V LVTTL
I Hardwire
3.3V DC
Wire w/ESD
Notes
1, 2
1
1
1
1
37
Page 40
Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
Absolute Maximum Ratings
The absolute maximum ratings below are stress ratings only. Operation at or beyond these maximum ratings can cause permanent damage to the device.
Characteristic Symbol Value Unit
Supply Voltage (Internal Logic) Supply Voltage (I/O Interface)
PLL Supply Voltage Input Voltage (3.3V LVTTL receivers) Input Voltage (5.0V LVTTL receivers) Storage Temperature Range Case temperature under bias
Notes:
1. All voltages are specified with respect to ground (GND).
2. AV
should be derived from VDD using the following circuit:
DD
2
V OV AV
T
V V
STG
T
DD
DD
DD
IN
IN
C
0 to +2.7 V 0 to +3.6 V 0 to +2.7 V
-0.6 to (OVDD + 0.6)
-0.6 to (OVDD + 2.4)
-55 to +150 °C
-40 to +120 °C
V V
L1 – 2.2µH SMT inductor (equivalent to MuRata
V
DD
L1
C1
C2
C3
AV
DD
LQH3C2R2M34) or SMT chip ferrite bead (equivalent to MuRata BLM31A700S)
C1 – 3.3
C2 –
C3 – 0.01
µF SMT tantalum
0.1µF SMT monolithic ceramic capacitor with X7R
dielectric or equivalent
µF SMT monolithic ceramic capacitor with X7R
dielectric or equivalent
Package Thermal Specifications
The NPe405L is designed to operate within a case temperature range of -40°C to 85°C. Thermal resistance values for the E-PBGA packages in a convection environment are as follows:
Airflow
Package—Thermal Resistance
23mm, 324-balls—Junction-to-Case
23mm, 324-balls—Case-to-Ambient
Notes:
1. For a chip mounted on a JEDEC 2S2P card without a heat sink.
2. For a chip mounted on a card with at least one signal and two power planes, the following relationships exist: a. Case temperature, T
b. T
= TC – P×θCA, where TA is ambient temperature and P is power consumption.
A
= T
c. T
CMax
– P×θJC, where T
JMax
, is measured at top center of case surface with device soldered to circuit board.
C
1
is maximum junction temperature and P is power consumption.
JMax
Symbol
θ
JC
θ
CA
0 (0) 100 (0.51) 200 (1.02)
222°C/W
17 15 14 °C/W
ft/min (m/sec)
Unit
38
Page 41
Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
Recommended DC Operating Conditions
Device operation beyond the conditions specified is not recommended. Extended operation beyond the recommended conditions can affect device reliability.
Parameter Symbol Minimum Typical Maximum Unit Notes
Logic Supply Voltage I/O Supply Voltage PLL Supply Voltage Input Logic High (3.3V LVTTL
receivers) Input Logic High (2.5V CMOS
receivers) Input Logic High (5.0V LVTTL
receivers) Input Logic Low Output Logic High Output Logic Low
3.3V I/O input current (no pull-up or pull-down)
Input Current (with internal pull­down)
Input Current (with internal pull-up) Input Max Allowable Overshoot
(2.5V CMOS receivers) Input Max Allowable Overshoot
(3.3V LVTTL receivers) Input Max Allowable Overshoot
(5.0V LVTTL receivers) Input Max Allowable Undershoot
(3.3V or 5.0V receivers) Output Max Allowable Overshoot
(3.3V or 5.0V receivers) Output Max Allowable Undershoot
(3.3V and 5.0V receivers) Case Temperature
V OV AV
V
V
V
V V V
I
I
I
V
IMAO25
V
IMAO3
V
IMAO5
V
IMAU
V
OMAO
V
OMAU3
T
DD
DD
DD
IH
IH
IH
IL
OH
OL
IL1
IL2
IL3
C
Notes:
1. See “5V-Tolerant I/O Input Current” on page 40
+2.3 +2.5 +2.7 V +3.0 +3.3 +3.6 V +2.3 +2.5 +2.7 V
+2.0
+1.7
OV
V
DD
DD
V
V
+2.0 +5.5 V
0+0.8V
+2.4
OV
DD
V
0+0.4V
±10
±10 (@ 0V) 400 (@ 3.6V)
-250 (@ 0V) ±10 (@ 3.6V)
VDD + 0.6
OV
+ 0.6
DD
µA
µA µA
V
V
+5.5 V
0.6
0.6
40
OVDD + 0.3
+85
V
V
V
°C
39
Page 42
Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
5V-Tolerant I/O Input Current
100
0
-100
A)
-200
µ
-300
-400
Input Current (
-500
-600
-700
Input Capacitance
3.3V LVTTL I/O) 5 V tolerant LVTTL I/O RX only pins
1.0 2.0 3.0 4.0 5.00.0
Input Voltage (V)
Parameter Symbol Maximum Unit Notes
C
IN1
C
IN2
C
IN4
2.5 pF
3.5 pF
0.75 pF
40
Page 43
PowerNP NPe405L Embedded Processor Data Sheet
DC Electrical Characteristics
Parameter Symbol Minimum Typical Maximum Unit
Active Operating Current for V Active Operating Current for V Active Operating Current for V Active Operating Current for O V Active Operating Current for O V Active Operating Current for O V Active Operating Current for AV
Active Operating Power @ 133MHz Active Operating Power @ 200MHz Active Operating Power @ 266MHz
Notes:
1. Maximum power is characterized at V while running an application designed to maximize power consumption. The maximum power values are measured with the following clock rate combinations: a. CPU=133.33MHz, PLB=66.66MHz, OPB=66.66MHz, EBC=33.33MH z b. CPU=200 MHz, PLB=100MHz, OPB=50MHz, EBC=50MHz c. CPU=266.66MHz, PLB=66.66MHz, OPB=66.66MHz, EBC=33.33MHz
@ 133MHz I
DD
@ 200MHz I
DD
@ 266MHz I
DD
@ 133MHz I
DD
@ 200MHz I
DD
@ 266MHz I
DD
DD
=2.7V, OVDD=3.6V, TC=85°C, across the silicon process (worse case to best case),
DD
ODD
ODD
ODD
I
ADD
P P P
DD
DD
DD
DD
DD
DD
444 497 543 mA 468 565 676 mA 490 590 700 mA
17 23 36 mA 24 36 51 mA 27 44 61 mA
5.566.5mA
1.1 1.3
1.4 1.7
1.5 1.8
1.6
2.1
1
1
2
1
Preliminary
W W W
Test Conditions
Clock timing and switching characteristics are specified in accordance with operating conditions shown in the table “Recommended DC Operating Conditions.” AC specifications are characterized at
= 3.00V and TJ = 85°C with the 50pF test load shown in the
OV
DD
figure at right.
Output
Pin
50pF
41
Page 44
Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
Clocking Specifications
Symbol Parameter Min Max Units
SysClk Input
F
C
T
C
T
CS
T
CH
T
CL
Note: Input slew rate > 2V/ns MemClkOut Output
F
C
T
C
F
C
T
C
F
C
T
C
T
CH
T
CL
Other Clocks
F
C
F
C
F
C
F
C
F
C
F
C
F
C
Notes:
1. If HDLCEX is not used, the maximum OPB frequency is 66.66MHz.
SysClk clock input frequency 25 66.66 MHz SysClk clock period 15 40 ns Clock edge stability (phase jitter, cycle to cycle) 0.15 ns Clock input high time 40% of nominal period 60% of nominal period ns Clock input low time 40% of nominal period 60% of nominal period ns
MemClkOut clock output frequency–133MHz 66.66 MHz MemClkOut clock period–133MHz 15 ns MemClkOut clock output frequency–200MHz 100 MHz MemClkOut clock period–200MHz 10 ns MemClkOut clock output frequency–266MHz 133.33 MHz MemClkOut clock period–266MHz 7.5 ns Clock output high time 45% of nominal period 55% of nominal period ns Clock output low time 45% of nominal period 55% of nominal period ns
VCO frequency 400 800 MHz PLB frequency–133MHz 66.66 MHz PLB frequency–200MHz 100 MHz PLB frequency–266MHz 133.33 MHz OPB frequency–133MHz
50
1
OPB frequency–200MHz 50 MHz OPB frequency–266MHz
50
1
MHz
MHz
Clocking W aveform
42
2.0V
1.5V
0.8V
T
CH
T
C
T
CL
Page 45
Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
Spread Spectrum Clocking
Care must be taken when using a spread spectrum clock generator (SSCG) with the NPe405L. This controller uses a PLL for clock generation inside the chip. The accuracy with which the PLL follows the SSCG is referred to as tracking skew. The PLL bandwidth and phase angle determine how much tracking skew there is between the SSCG and the PLL for a given frequency deviation and modulation frequency. When using an SSCG with the NPe405L the following conditions must be met:
• The frequency deviation must not violate the minimum clock cycle time. Therefore, when operating the NPe405L with one or more internal clocks at their maximum supported frequency, the SSCG can only lower the frequency.
• The maximum frequency deviation cannot exceed 40kHz. In some cases, on-board NPe405L peripherals impose more stringent requirements (see Note 1).
• Use the peripheral bus clock (PerClk) for logic that is synchronous to the peripheral bus since this clock tracks the modulation.
• Use the SDRAM MemClkOut since it also tracks the modulation.
Please refer to the application note Using a Spread Spectrum Clock Generator with the PowerPC 405GP for additional details. This application note is available on the IBM Microelectronics web site at http://www.chips.ibm.com.
Notes:
1. The serial port baud rates are synchronous to the modulated clock. The serial port has a tolerance of approximately 1.5% on baud rate before framing errors begin to occur. The 1.5% tolerance assumes that the connected device is running at precise baud rates. If an external serial clock is used the baud rate is unaffected by the modulation
2. Ethernet operation is unaffected.
3. IIC operation is unaffected.
Caution: It is up to the system designer to ensure that any SSCG used with the NPe405L meets the above requirements and does not adversely affect other aspects of the system.
3%, and the modulation frequency cannot exceed
43
Page 46
Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
Peripheral Interface Clock Timings
Parameter Min Max Units
EMC0MDClk output frequency 2.5 MHz EMC0MDClk period 400 ns EMC0MDClk output high time 160 ns EMC0MDClk output low time 160 ns PHY0TxClk input frequency 2.5 25 MHz PHY0TxClk period 40 400 ns PHY0TxClk input high time 35% of nominal period ns PHY0TxClk input low time 3 5% of no minal period ns PHY0RxClk input frequency 2.5 25 MHz PHY0RxClk period 40 400 ns PHY0RxClk input high time 35% of nominal period ns PHY0RxClk input low time 35% of nominal period ns PerClk output frequency–133MHz 33.33 MHz PerClk period–133MHz 30 ns PerClk output frequency–200MHz 50 MHz PerClk period–200MHz 20 ns PerClk output frequency–266MHz) 66.66 MHz PerClk period–266MHz 15 ns PerClk output high time 45% of nominal period 55% of nominal period ns PerClk output low time 45% of nominal period 55% of nominal period ns
UARTSerClk input frequency UARTSerClk period UARTSerClk input high time UARTSerClk input low time TmrClk input frequency–133MHz 33.33 MHz TmrClk period–133MHz 30 ns TmrClk input frequency–200MHz 50 MHz TmrClk period–200MHz 20 ns TmrClk input frequency–266MHz 66.66 MHz TmrClk period–266MHz 15 ns TmrClk input high time 40% of nominal period 60% of nominal period ns TmrClk input low time 40% of nominal period 60% of nominal period ns HDLCEXTxClk, HDLCEXRxClk 0 8.192 MHz
Notes:
1. T
is the period in ns of the OPB clock. The maximum OPB clock frequency is 33.33 MHz for 133MHz parts, 50 MHz for
OPB
200MHz parts, and 66.66MHz for 266MHz parts.
(Note 1)
2T
T T
OPB OPB OPB
+ 2 + 1
+ 1
1000/(2T
+ 2ns)
OPB
–ns –ns –ns
MHz
44
Page 47
PowerNP NPe405L Embedded Processor Data Sheet
Input Setup and Hold Waveform
Preliminary
SysClk
Inputs
1.5V
1.5V
T
IS
MIN
Output Delay and Float Timing Waveform
SysClk
Outputs
1.5V
1.5V
T
OV
MAX
Valid
Valid
T
IH
MIN
T
OH
MIN
Outputs
1.5V
T
OF
MIN
MAX
45
Page 48
Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
I/O Specifications—All
Input (ns) Output (ns) Output Current (mA)
Signal
Internal Peripheral Interface
IICSCL as ync async async async 17 11 IICSDA async async async async 17 11 UART0_CTS UART0_DCD UART0_DSR UART0_DTR UART0_RI UART0_RTS UART0_Rx async async n/a n/a n/a n/a UART0_Tx n/a n/a async async 12 8 UART1_CTS [UART1_DCD UART1_DSR UART1_DTR [UART1_RI UART1_RTS UART1_Rx async async n/a n/a n/a n/a UART1_Tx n/a n/a async async 12 8 UARTSerClk async async n/a n/a n/a n/a
] [async] [async] n/a n/a n/a n/a
] [async] [async] n/a n/a n/a n/a
Interrupts Interface
[IRQ0:6] async async n/a n/a n/a n/a
JTAG Interface
TCK async async n/a n/a n/a n/a TDI async async n/a n /a n/a n/a TDO n/a n/a async async 12 8 TMS async async n/a n/a n/a n/a TRST
System Interface
GPIO30 async async async async 12 8 Halt SysClk n/a n/a n/a n/a n/a n/a SysErr n/a n/a 5.5 1.7 12 8 SysReset TestEn dc dc n/a n/a n/a n/a TmrClk n/a n/a async async n/a n/a
Setup Time
(T
min)
IS
async async n/a n/a n/a n/a async async n/a n/a n/a n/a async async n/a n/a n/a n/a
n/a n/a async async 12 8
async async n/a n/a n/a n/a
n/a n/a async async 12 8
async async n/a n/a n/a n/a
async async n/a n/a n/a n/a
n/a n/a async async 12 8
n/a n/a async async 12 8
async async n/a n/a n/a n/a
async async n/a n/a n/a n/a
n/a n/a n/a n/a 12 8
Hold Time
TIH min)
Valid Delay
(TOV max)
Hold Time
(TOH min)
I/O H
(maximum)
I/O L
(minimum)
Clock Notes
46
Page 49
Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
I/O Specifications—133 and 200 MHz (Part 1 of 2)
Notes:
1. Ethernet interface meets timing requirements as defined by IEEE 802.3 standard.
2. The SDRAM command interface is configurable through SDRAM0_TR[LDF] to provide a 2 to 4 cycle delay before the command is used by SDRAM. Output times in table a re in cycle 1.
3. SDRAM I/O timings are specified relative to a SysClk terminated in a lumped 10pF load.
4. SDRAM interface hol d times are guaranteed at the NPe405L package pin. System designers must use the NPe405L
IBIS model (available from www.chips.ibm.com) to ensure their clock distribution topology minimizes loading and reflections, and that the relative delays on clock wiring do not exceed the delays on other SDRAM signal wiring.
5. PerClk rising edge at package pin with a 10pF load trails the internal PLB clock by approximately 0.8ns.
Input (ns) Output (ns) Output Current (mA)
Signal
Setup Time
(T
min)
IS
Hold Time
TIH min)
Valid Delay
(TOV max)
Hold Time
(TOH min)
I/O H
(maximum)
I/O L
(minimum)
Ethernet Interface
EMC0MDClk n/a n/a 7.4 1.5 12 8 1, async EMC0MDIO n/a n/a 8.8 1.2 12 8 EMC0MDClk 1 EMC0TxD0:3
[EMC0Tx0:1D0:1] [EMC0Tx0:1D]
EMC0TxEn [EMC0Tx0En] [EMC0Sync]
EMC0TxErr[EMC0Tx1En] n/a n/a 11.8[7.4] 2.9[2.4] 12 8 PHYTX 1 PHY0Col[PHY0Rx1Er] async[0.2] async[1.7] n/a n/a n/a n/a 1 PHY0CrS[PHY0CrS0DV] async[0.1] async[1.9] n/a n/a n/a n/a 1 PHY0RxClk n/a n/a n/a n/a n/a n/a 1, async PHY0RxD0:3
[PHY0Rx0 :1D0:1] [PHY0Rx0 :1D]
PHY0RxDV[PHY0CRS1DV] 1.3[0.7] 1.7[1.7] n/a n/a n/a n/a PHYRX 1 PHY0RxErr[PHY0Rx0Er] 1.3[0.7] 1.8[1.9] n/a n/a n/a n/a PHYRX 1 PHY0TxClk[PHY0RefClk] n/a n/a n/a n/a n/a n/a 1, async
n/a n/a
n/a n/a
1.5 [0.8] [0.9]
[1.7] [0.3]
1.7
10.5 [7.3] [5.0]
11.8 [7.2] [5.6]
n/a n/a n/a n/a PHYRX 1
3.0 [2.3] [1.7]
2.9 [2.3] [1.7]
12 8 PHYTX 1
12 8 PHYTX 1
HDLCEX Interface
HDLCEXRxClk n/a n/a n/a n/a n/a n/a HDLCEXRxDataA:B 23.8 2.1 n/a n/a n/a n/a HDLCEXRxFS 24.2 1.1 n/a n/a n/a n/a HDLCEXTxClk n/a n/a n/a n/a n/a n/a HDLCEXTxDataA:B n/a n/a 10.5 3.3 12 8 HDLCEXTxFS 20.3 1.0 n/a n/a n/a n/a [HDLCEXTxEnA] n/a n/a 11.3 3.5 12 8 [HDLCEXTxEnB]] n/a n/a 11. 8 3.8 12 8
Trace Interface
[TrcClk]GPIO00 n/a n/a 11.2 1.2 12 8 [TS1E]GPIO01 n/a n/a 7.0 1.2 12 8 [TS2E]GPIO02 n/a n/a 7.0 1.2 12 8 [TS1O]GPIO03 n/a n/a 6.5 1.0 12 8 [TS2O]GPIO04 n/a n/a 6.4 1.0 12 8 [TS3:6]GPIO05:08 n/a n/a 6.4 1.0 12 8
Clock Notes
47
Page 50
Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
I/O Specifications—133 and 200MHz (Part 2 of 2)
Notes:
1. Ethernet interface meets timing requirements as defined by IEEE 802.3 standard.
2. The SDRAM command interface is configurable through SDRAM0_TR[LDF] to provide a 2 to 4 cycle delay before the command is used by SDRAM. Output times in table a re in cycle 1.
3. SDRAM I/O timings are specified relative to a SysClk terminated in a lumped 10pF load.
4. SDRAM interface hol d times are guaranteed at the NPe405L package pin. System designers must use the NPe405L
IBIS model (available from www.chips.ibm.com) to ensure their clock distribution topology minimizes loading and reflections, and that the relative delays on clock wiring do not exceed the delays on other SDRAM signal wiring.
5. PerClk rising edge at package pin with a 10pF load trails the internal PLB clock by approximately 0.8ns.
Input (ns) Output (ns) Output Current (mA)
Signal
Setup Time
(T
min)
IS
Hold Time
TIH min)
Valid Delay
(TOV max)
Hold Time
(TOH min)
I/O H
(maximum)
I/O L
(minimum)
SDRAM Interface
BA1:0 n/a n/a 7.2 1.5 1 9 12 Sys Clk 2, 3 BankSel3:0 CAS ClkEn0:1 n/a n/a 4.9 1.0 40 25 SysClk 3 DQM0:3 n/a n/a 5.9 1.0 19 12 SysClk 3 DQMCB n/a n/a 5.9 1.0 19 12 SysClk 3 ECC0:7 2.0 0.3 5.7 1.0 19 12 SysClk 3 MemAddr12:00 n/a n/a 7.2 1.4 19 12 SysClk 2, 3 MemClkOut0:1 n/a n/a 0.4 -1.2 19 12 SysClk 3, 4 MemData00:31 2.0 0.3 5.6 1.0 19 12 SysClk 3 RAS WE
n/a n/a 5.8 1.0 19 12 SysClk 3 n/a n/a 7.0 1.4 19 12 SysClk 2, 3
n/a n/a 7.4 1.6 19 12 SysClk 2, 3 n/a n/a 7.1 1.4 19 12 SysClk 2, 3
External Peripheral Bus Interface
[DMAReq0:3] [4.8] [0.0] [7.0] [ 1.1] n/a n/a PerClk [DMAAck0:3 [EOT0:3 PerAddr04:31 n/a n/a 8.5 0.9 17 11 PerClk PerBLast PerCS0:3 PerData00:15 4.8 1.0 9.3 1.0 17 11 PerClk PerOE PerPar0:1 3.1 0.0 8.3 0.9 17 11 PerClk PerR/W PerReady 7.5 -0.5 n/a n/a n/a n/a PerClk PerWBE0:1 PerClk n/a n/a 0.5 -0.9 17 11 PLB Clk 5 PerErr 4. 0 -0.6 n/a n/a n/a n/a PerClk [PerWE
] n/a n/a [7.5] [1.1] 12 8 PerClk
/TC0:3] [4.3] [-0.1] [8.5] [1.2] 12 8 PerClk
n/a n/a 7.4 1.4 12 8 PerClk n/a n/a 7.2 1.3 12 8 PerClk
n/a n/a 7.6 1.4 12 8 PerClk
n/a n/a 7.5 1.4 12 8 PerClk
n/a n/a 7.5 1.3 12 8 PerClk
] n/a n/a [8.3] [1.3] 12 8
Clock Notes
48
Page 51
Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
I/O Specifications—266MHz (Part 1 of 2)
Notes:
1. Ethernet interface meets timing requirements as defined by IEEE 802.3 standard.
2. The SDRAM command interface is configurable through SDRAM0_TR[LDF] to provide a 2 to 4 cycle delay before the command is used by SDRAM. Output times in table a re in cycle 1.
3. SDRAM I/O timings are specified relative to a SysClk terminated in a lumped 10pF load.
4. SDRAM interface hol d times are guaranteed at the NPe405L package pin. System designers must use the NPe405L
IBIS model (available from www.chips.ibm.com) to ensure their clock distribution topology minimizes loading and reflections, and that the relative delays on clock wiring do not exceed the delays on other SDRAM signal wiring.
5. PerClk rising edge at package pin with a 10pF load trails the internal PLB clock by approximately 0.8ns.
Input (ns) Output (ns) Output Current (mA)
Signal
Setup Time
(T
min)
IS
Hold Time
TIH min)
Valid Delay
(TOV max)
Hold Time
(TOH min)
I/O H
(maximum)
I/O L
(minimum)
Ethernet Interface
EMC0MDClk n/a n/a 7.4 1.5 12 8 1, async EMC0MDIO n/a n/a 6.7 1.2 12 8 EMC0MDClk 1 EMC0TxD0:3
[EMC0Tx0:1D0:1 [EMC0Tx0:1D]
EMC0TxEn [EMC0Tx0En] [EMC0Sync]
EMC0TxErr[EMC0Tx1En] n/a n/a 9.4[5.7] 2.9[2.4] 12 8 PHYTX 1 PHY0Col[PHY0Rx1Er]l async[0.1] async[1.4] n/a n/a n/a n/a 1 PHY0CrS[PHY0CrS0DV] async[0.1] async[1.5] n/a n/a n/a n/a 1 PHY0RxClk n/a n/a n/a n/a n/a n/a 1, async PHY0RxD0:3
[PHY0Rx0 :1D0:1] [PHY0Rx0 :1D]
PHY0RxDV[PHY0CRS1DV] 1.3[0.7] 1.3[1.3] n/a n/a n/a n/a PHYRX 1 PHY0RxErr[PHY0Rx0Er] 1.3[0.7] 1.4[1.5] n/a n/a n/a n/a PHYRX 1 PHY0TxClk[PHY0RefClk] n/a n/a n/a n/a n/a n/a 1, async
n/a n/a
n/a n/a
1.5 [0.8] [0.8]
[1.3] [0.2]
1.4
7.7 [5.6] [4.6]
9.4 [5.5] [4.2]
n/a n/a n/a n/a PHYRX 1
3 [2.3] [1.7]
2.9 [2.3] [1.7]
12 8 PHYTX 1
12 8 PHYTX 1
HDLCEX Interface
HDLCEXRxClk n/a n/a n/a n/a n/a n/a HDLCEXRxDataA:B 23.9 1.6 n/a n/a n/a n/a HDLCEXRxFS 24.2 0.8 n/a n/a n/a n/a HDLCEXTxClk n/a n/a n/a n/a n/a n/a HDLCEXTxDataA:B n/a n/a 7.6 3.3 12 8 HDLCEXTxFS 24.2 0.8 n/a n/a n/a n / a [HDLCEXTxEnA] n/a n/a [8.5] [3.5] 12 8 [HDLCEXTxEnB] n/a n/a [8.9] [3.8] 12 8
Clock Notes
49
Page 52
Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
I/O Specifications—266MHz (Part 2 of 2)
Notes:
1. Ethernet interface meets timing requirements as defined by IEEE 802.3 standard.
2. The SDRAM command interface is configurable through SDRAM0_TR[LDF] to provide a 2 to 4 cycle delay before the command is used by SDRAM. Output times in table a re in cycle 1.
3. SDRAM I/O timings are specified relative to a SysClk terminated in a lumped 10pF load.
4. SDRAM interface hol d times are guaranteed at the NPe405L package pin. System designers must use the NPe405L
IBIS model (available from www.chips.ibm.com) to ensure their clock distribution topology minimizes loading and reflections, and that the relative delays on clock wiring do not exceed the delays on other SDRAM signal wiring.
5. PerClk rising edge at package pin with a 10pF load trails the internal PLB clock by approximately 0.8ns.
Input (ns) Output (ns) Output Current (mA)
Signal
Setup Time
(T
min)
IS
Hold Time
TIH min)
Valid Delay
(TOV max)
Hold Time
(TOH min)
I/O H
(maximum)
I/O L
(minimum)
Trace Interface
[TrcClk] n/a n/a 8.7 1.2 12 8 [TS1E] n/a n/a 5.8 1.2 12 8 [TS2E] n/a n/a 5.7 1.2 12 8 [TS1O] n/a n/a 5.3 1 12 8 [TS2O] n/a n/a 5.3 1 12 8 [TS3:6] n/a n/a 5.4 1 12 8
SDRAM Interface
BA1:0 n/a n/a 5.5 1.5 19 12 SysClk 1, 2 BankSe3:0 CAS ClkEn0:1 n/a n/a 3.9 1 40 25 SysClk 2 DQM0:3 n/a n/a 4.7 1 19 12 SysClk 2 DQMCB n/a n/a 4.7 1 19 12 SysClk 2 ECC0:7 1.8 0.3 4.5 1 19 12 SysClk 2 MemAddr12:00 n/a n/a 5.5 1.4 19 12 SysClk 1, 2 MemClkOut0:1 n/a n/a 0.4 -1.2 19 12 SysClk 2, 3 MemData00:31 1.8 0.3 4.4 1 19 12 SysClk 2 RAS WE
n/a n/a 4.6 1 19 12 SysClk 2 n/a n/a 5.3 1.4 19 12 SysClk 1, 2
n/a n/a 5.7 1.6 19 12 SysClk 1, 2 n/a n/a 5.4 1.4 19 12 SysClk 1, 2
External Peripheral Bus Interface
[DMAReq0:3] 4.1 0 5.5 1.1 n/a n/a PerClk [DMAAck0:3 [EOT0:3 PerAddr04:31 n/a n/a 6.5 0.9 17 11 PerC lk PerBLast PerCS0:3 PerData00:15 3.9 1 7.1 1 17 11 PerClk PerOE PerPar0:1 2.7 0 6.4 0.9 17 11 PerClk PerR/W PerReady 6.2 -0.5 n/a n/a n/a n/a PerClk PerWBE0:1 PerClk n/a n/a 0.5 -0.9 17 11 PLB Clk 4 PerErr 3.5 -0.6 n/a n/a n/a n/a PerClk [PerWE
] n/a n/a 5.9 1.1 12 8 PerClk
/TC0:3] 3.7 -0.1 6.7 1.2 12 8 PerClk
n/a n/a 5.6 1.4 12 8 PerClk n/a n/a 5.5 1.3 12 8 PerClk
n/a n/a 5.7 1.4 12 8 PerClk
n/a n/a 5.7 1.4 12 8 PerClk
n/a n/a 5.7 1.3 12 8 PerClk
] n/a n/a 7 1.3 12 8
Clock Notes
50
Page 53
Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
Initialization
The following describes the method by which initial chip settings are established when a system reset occurs.
Strapping
While the SysReset
input pin is low (system reset), the state of certain I/O pins is read to enable default initial conditions prior to NPe405L start-up. The actual capture instant is the nearest SysClk edge before the deassertion of reset. These pins must be strapped using external pull-up (logical 1) or pull-down (logical 0) resistors to select the desired default conditions. The recommended pull-up is 3k the recommended pull-down is 1k
to GND.These pins are used for strap functions only during reset. They
to +3.3V or 10k to +5V,
are used for other signals during normal operation. The following table lists the strapping pins along with their functions and strapping options.
Strapping Pin Assignments
Function Option Ball Strapping
EXT_BootW Width of boot device on EBC data bus
8 bits 0
16 bits 1
ZMII_Mode Ethernet ZMII mode
MII mode 0 0
SMII mode 0 1
RMII 10 Mbps mode 1 0
RMII 100 Mbps mode 1 1
Y21
(UART1_Tx)
V21
(UART1_RTS
U20
)
(UART1_DTR)
51
Page 54
Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
(c) Copyright International Business Machines Corporation 1999, 2002
All Rights Reserved Printed in the United States of America, October 2, 2002 The following are trademarks of International Business Machines Corporation in
the United States, or other countries, or both:
Blue Logic IBM PowerPC CodePack IBM Logo CoreConnect PowerNP
Other company, product, and service names may be trademarks or service marks of others.
Preliminary Edition (October 2, 2002)
This document contains information on a new product under development by IBM. IBM reserves the right to change or discontinue this product without notice.
This document is a preliminary edition of the PowerNP NPe405L data sheet. Make sure you are using the correct edition for the level of the product.
While the information contained herein is believed to be accurate, such information is preliminary, and should not be relied upon for accuracy or completeness, and no representations or warranties of accuracy or completeness are made.
All information contained in this document is subject to change without notice. The products described in this document are NOT intended for use in applications such as implantation, life support, or other hazardous uses where malfunction could result in death, bodily injury, or catastrophic property damage. The information contained in this document does not affect or change IBM product specifications or warranties. Nothing in this document shall operate as an express or implied license or indemnity under the intellectual property rights of IBM or third parties. All information contained in this document was obtained in specific environments, and is presented as an illustration. The results obtained in other operating environments may vary.
THE INFORMATION CONTAINED IN THIS DOCUMENT IS PROVIDED ON AN "AS IS" BASIS. In no event will IBM be liable for damages arising directly or indirectly from any use of the information contained in this document.
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The IBM home page is www. ibm.com.
52
The IBM Microelectronics Division home is www.chips.ibm.com. SA14-2558-10
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