AMCC reserves the right to make changes to its products, its datasheets, or related
documentation, without notice and warrants its products solely pursuant to its
terms and conditions of sale, only to substantially comply with the latest available
datasheet. Please consult AMCC’s Term and Conditions of Sale for its warranties
and other terms, conditions and limitations. AMCC may discontinue any
semiconductor product or service without notice, and advises its customers to
obtain the latest version of relevant information to verify, before placing orders,
that the information is current. AMCC does not assume any liability arising out of
the application or use of any product or circuit described herein, neither does it
convey any license under its patent rights nor the rights of others. AMCC reserves
the right to ship devices of higher grade in place of those of lower grade.
AMCC SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, INTENDED,
AUTHORIZED, OR WARRANTED TO BE SUITABLE FOR USE IN LIFESUPPOR T APPLICATIONS, DEVICES OR SYSTEMS OR OTHER CRITICAL
APPLICATIONS.
• Internal processor local bus (PLB) runs at
SDRAM interface frequency
Description
Designed specifically to address embedded
applications, the NPe405L provides a highperformance, low-power solution that interfaces to a
wide range of peripherals by incorporating on-chip
power management features and lower power
dissipation requirements.
This chip contains a high-perfo rmanc e RISC
processor core, SDRAM controller, Ethernet
EMACs, HDLC controller, external bus controller for
While the information contained herein is believed to be accurate, such information is preliminary, and should not be
relied upon for accuracy or completeness, and no representations or warranties of accuracy or completeness are made.
ROM, Flash, and peripherals, DMA with scattergather support, serial ports, IIC interface, and
general purpose I/O.
NPe405LIBM25NPe405L-3FA133C133M H z23mm, 324 E-PBGAA0x416100C00x04247409
NPe405LIBM25NPe405L-3FA133CZ133M H z23mm, 324 E-PBGAA0x416100C00x04247409
NPe405LIBM25NPe405L-3FA200C200M H z23mm, 324 E-PBGAA0x416100C00x04247409
NPe405LIBM25NPe405L-3FA200CZ200M H z23mm, 324 E-PBGAA0x416100C00x04247409
NPe405LIBM25NPe405L-3FA266C266M H z23mm, 324 E-PBGAA0x416100C00x04247409
NPe405LIBM25NPe405L-3FA266CZ266M H z23mm, 324 E-PBGAA0x416100C00x04247409
Note 1: Z at the end of the Order Part Number indicates a tape and reel shipping package. Otherwise, the chips are shipped in a tray.
Order Part Number
1
Processor
Frequency
Package
Rev
Level
PVR ValueJTAG ID
This section provides the part numbering nomenclature for the NPe405L. For availability, contact your local
IBM sales office.
The part number contains a part modifier. This modifier provides for identification of future enhancements (for
example, higher performance).
Each part number also contains a revision code. This refers to the die mask revision number and is specified
in the part numbering scheme for identification purposes only.
The PVR (Processor Version Register) is software accessible and contains additional information about the
revision level of the part. Refer to the NPe405L User’s Manual for details on the register content.
The NPe405L is designed using the IBM Microelectronics Blue Logic methodology in which major functional
blocks are integrated to create an application-specific ASIC product. This approach provides a consistent way
to generate complex ASICs using IBM CoreConnect
Bus Architecture.
Address Map Support
The NPe405L incorporates two separate address maps. The first is a fixed processor address map that
serves the PowerPC family of processors. This address map defines the possible contents of various address
regions which the processor can access. The second address map is for Device Configuration Registers
(DCRs). The DCRs are accessed by software running on the NPe405L processor through the use of mtdcr
and mfdcr commands.
5
Page 8
Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
System Address Map 4GB Total System Memory
FunctionSubfunctionStart AddressEnd AddressSize
0x000000000xE7FFFFFF3712MB
SDRAM, External peripherals
General use
Boot-up
Internal peripherals
Notes:
1. When external peripheral bus boot is selected, peripheral bank 0 is automatically configured at reset to the address range listed
above.
2. After the boot process, software may reassign the boot memory regions for other uses.
3. All address ranges not listed above are reserved.
Note: Any of the address ranges listed at
right may be use for any of the above
functions.
External peripheral bus boot
UART00xEF6003000xEF6003078B
UART10xEF6004000xEF6004078B
IIC00xEF6005000xEF60051F32B
OPB Arbiter0xEF6006000xEF60063F64B
GPIO0 controller registers0xEF6007000xEF60077F128B
GPIO1 controller registers0xEF6007800xEF6007FF128B
Ethernet MAC 0 registers0xEF6008000xEF6008FF256B
Ethernet MAC 1 registers0xEF6009000xEF6009FF256B
ZMII control registers0xEF600C100xEF600C1F16B
HDLCEX0xEF6100000xEF61FFFF64KB
Reserved0x0000x00F16W
Memory controller registers0x0100x0112W
External bus controller registers0x0120x0132W
Reserved0x0140x07F108W
PLB registers0x0800x08F16W
Reserved0x0900x09F16W
OPB bridge-out registers0x0A00x0A78W
Reserved0x0A80x0AF8W
Clock, control and reset0x0B00x0B78W
Power management0x0B80x0BF8W
Interrupt controller 00x0C00x0CF16W
Interrupt controller 10x0D00x0DF16W
Reserved0x0E00x0EF16 W
Miscellaneous0x0F00x0FF16W
DMA controller registers0x1000x13F64W
Reserved0x1400x17F64W
MAL0 registers (Ethernet)0x1800x1FF128W
MAL1 registers (HDLCEX)0x2000x27F128W
Reserved0x2800x3FF384W
Notes:
1. DCR address space is addressable with up to 10 bits (1024 or 1K unique addresses). Each unique address represents a single
32-bit (word) register, or 1 kiloword (KW) (which equals 4 KB).
1
0x0000x3FF
1KW (4KB)
1
7
Page 10
Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
SDRAM Memory Controller
The NPe405L Memory Controller provides a low latency access path to SDRAM memory. The memory
controller supports four logical banks. Up to 256MB per bank are supported, for a maximum of 1GB total.
Memory access and refresh timing, address and bank sizes, and memory addressing modes are
programmable.
Features include:
• 11x8 to 13x11 row-column address modes (2- and 4-bank devices supported)
• Memory bus operates at same frequency as PLB
• 32-bit memory interface support
• Programmable address range for each bank of memory
- 4GB address space
• Industry standard 168-pin DIMMS are supported (some configurations)
• 200 MHz NPe405H supports up to 100 MHz memory with PC100 support
• 266 MHz NPe405H supports up to 133 MHz memory with PC133 support
• 4MB to 256MB per bank
• Programmable timing
• Auto refresh
• Page Mode Accesses with up to 4 open pages
• Power Management (self-refresh)
• Error Checking and Correction (ECC) support
- Standard single error correct, double error detect coverage
- Aligned nibble error detect
- Address error logging
External Bus Controller (EBC)
• Supports four ROM, EPROM, SRAM, Flash, and Slave Peripheral I/O banks supported
• Up to 66.66MHz operation
• Burst and non-burst devices
• 8-, 16-bit byte-addressable data bus width support
• Latch data on Ready, Synchronous or Asynchronous
• Programmable 2K clock-cycle time-out counter with disable for R eady
8
Page 11
PowerNP NPe405L Embedded Processor Data Sheet
• Programmable access timing per device
- 0–255 wait states for non-bursting devices
- 0 –31 Burst Wait States for first access and up to 7 Wait States for subsequent accesses
- Programmable chip select assertion/negation relative to driving address bus
- Programmable output and write-enable assertion/negation relative to assertion of chip select
• Programmable address mapping
• Peripheral device wait via “Ready”
DMA Controller
• Supports the following transfers:
- Memory-to-memory transfers
- Buffered peripheral to memory transfers
- Buffered memory to peripheral transfers
Preliminary
• Four channels
• Scatter/Gather capability for programming multiple DMA operations
• 8-, 16-, 32-bit peripheral support (OPB and external bus attached)
• 32-bit addressing
• Address increment or decrement
• Internal 32-byte data buffering capability
• Supports internal and external peripherals
• Support for memory mapped peripherals
• Support for peripherals running on slower frequency buses
Serial Interface
• Two 8-pin UART interfaces provided
• Selectable internal or external serial clock to allow wide range of baud rates
• Register compatibility with NS16550 register set
• Complete status reporting capability
• Transmitter and receiver are each buffered with 16-byte FIFOs when in FIFO mode
• Compliant with Phillips® Semiconductors I2C Specification, dated 1995
• Operation at 100kHz or 400kHz
• 8-bit data
• 10- or 7-bit address
• Slave transmitter and receiver
• Master transmitter and receiver
• Multiple bus masters
• Supports fixed V
• Two independent 4 x 1 byte data buffers
• One programmable interrupt request signal
• Provides full management of all IIC bus protocol
• Programmable error recovery
IIC interface
DD
HDLCEX Interface
• 32-channel HDLC controller
• Two full-duplex Pulse Code Modulation (PCM) Highway ports at speeds up to 4.096 Mbps per port or
8.192 Mbps when using a single port
• Supports HDLC protocol as well as a Transparent mode
• For a single channel per port, autonomous management of I-Frames and S-Frames of the Normal
Response mode (NRM) pr otocol on one channel per port. U-frames are handled by software.
• Supports software emulation of NRM on all channels
General Purpose IO (GPIO) Controller
• Most GPIOs are pin-shared with other functions. Configuration registers are provided to determine
whether a particular pin that has GPIO capabilities acts as a GPIO or is used for another purpose. The
GPIO function has 32 I/Os.
• Each GPIO output is separately programmable to emulate an open-drain driver (drives to zero, threestated if output bit is 1)
Universal Interrupt Controller (UIC)
Two cascaded Universal Interrupt Controllers (UICs) provide the control, status, and communications
necessary for the interrupt sources and the PowerPC processor.
Features include:
10
Page 13
Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
• Seven external and 29 internal interrupts
• Edge triggered or level-sensitive
• Positive or negative active
• Selectable non-critical or critical interrupt requests to the PPC405 processor core
• Two units capable of full- and half-duplex, 10 Mbps or 100 Mbps operation
• Integrated ZMII Bridge supports use of MII, SMII or RMII connections to external PHYs (PHYs not
included on chip)
- Reduced Media Independent Interface (RMII) or Serial Media Independent Interface (SMII) for one to
two PHY applications
- Media Independent Interface (MII) for single or dual PHY applications
• Dedicated media access layer (MAL) provides DMA support
JTAG
• IEEE 1149.1 Test Access Port
• Debugger support
• JT AG boundary scan support (BSDL file available)
11
Page 14
Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
23mm, 324-Ball E-PBGA Package
Top View
Gold gate release
corresponds to
A01 ball location
Bottom View
AB
Y
V
T
P
M
K
H
F
D
B
Note:
All dimensions are in mm.
AA
W
U
R
N
L
J
G
E
C
A
01 03 050709 11 13 15 17
02 04
Thermal balls
0810
06
23.0
12 14
1.0
19
21
20
22
16 18
0.60 Solder Ball
0.60 nom
0.30 nom
1.0
23.0
2.65 max
12
Page 15
Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
Signal Lists
The following table lists all the external signals in alphabetical order and shows the ball number on which the
signal appears. Multiplexed signals are shown with the default signal (following reset) not in brackets and the
alternate signal or signals in brackets. Multiplexed signals appear alphabetically multiple times in the list—
once for each signal name on the ball. The page number listed gives the page in “Signal Functional
Description” on page 32 where the signals in the indicated interface group begin.
The following table provides a summary of the number of package pins (balls) associated with each functional
interface group.
Pin Summary
GroupNo. of Pins
Nonmultiplexed Signals 167
Multiplexed Signals 48
Total Signal Pins215
AV
DD
OV
DD
V
DD
Gnd48
Gnd (and thermal)36
Reserved0
Total Pins324
1
16
8
Multiplexed pins
In the table “Signal Functional Description” on page 32, each external signal is listed along with a short
description of the signal function. The signals are grouped together according to their function. Some signals
are multiplexed on the same package pin (ball) so that the pin can be used for different functions. In most
cases, the signal name is shown in this table unaccompanied by multiplexed signal names that may be
associated with it. In cases where multiplexed signals are in the same functional group, the names appear as
a default signal followed by secondary signals in square brackets (for example, EMC0TxErr[EMC0Tx1En]).
Active-low signals (for example, RAS
) are marked with an overline. Any signal that is not the primary (default)
signal on a multiplexed pin is shown in square brackets.
The active signal on a multiplexed pin is controlled by programming. It is expected that in any single
application, a particular pin will always be programmed to serve the same function. The flexibility of
multiplexing allows a single chip to offer a richer pin selection than would otherwise be possible.
Initialization Strapping
One group of pins is used as strapped inputs during system reset. These pins function as strapped inputs
only during reset and are used for other functions during normal operation (see “Initialization” on page 51).
Note that the use of these pins for strapping is not considered multiplexing since the strapping function is not
programmable.
Pull-up and Pull-down Resistors
Pull-up and pull-down resistors are used for strapping during reset and to retain unused or undriven inputs in
an appropriate state. The recommended pull-up value of 3k
tolerant I/Os) and pull-down value of 1k
Ω to GND, applies only to individually terminated signals. To prevent
Ω to +3.3V (10kΩ to +5V can be used on 5V
possible damage to the device, I/Os capable of becoming outputs must never be tied together and terminated
through a common resistor.
If your system-level test methodology permits, input-only signals can be connected together and terminated
through either a common resistor or directly to +3.3V or GND. When a resistor is used, its value must ensure
30
Page 33
Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
that the grouped I/Os reach a valid logic zero or logic one state when accounting for the total input current into
the NPe405L.
Unused I/Os
Strapping of some pins may be necessary when they are unused. Although the NPe405L requires only the
pull-up and pull-down terminations as specified in the “Signal Functional Description” on page 32, good
design practice is to terminate all unused inputs or to configure I/Os such that they always drive. If unused,
the peripheral and SDRA M bus should be configured and terminated as follows:
• Peripheral interface—PerAddr00:31, PerData00:31, and all of the control signals are driven by default.
Terminate PerReady high and PerError low.
• SDRAM—Program SDRAM0_CFG[EMDULR]=1 and SDRAM0_CFG[DCE]=1. This causes the NPe405L
to actively drive all of the SDRAM address, data, and control signals.
External Peripheral Bus Control Signals
All external peripheral bus control signals (PerCS0:
set to the high-impedance state when ExtReset
Embedded Processor User’s Manual, the peripheral bus controller can be programmed via EBC0_CFG to
float some of these control signals between transactions. As a result, a pull-up resistor should be added to
those control signals where an undriven state may affect any devices receiving that particular signal.
The following table lists all of the I/O signals provided by the NPe405L. Please see “Signals Listed
Alphabetically” on page 13 for the pin number to which each signal is assigned. In cases where a multiplexed
signal (indicated by the square brackets) is shown without the other signals that are assigned to that pin, you
can see what the other signals are by referring to the same table.
3, PerR/W, PerWBE0:1, PerOE, PerWE, PerBLast) are
=0. In addition, as detailed in the PowerNP NPe405L
31
Page 34
Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
Signal Functional Description (Part 1 of 6)
Notes:
1. Receiver input has hy steresis.
2. Must pull up. See “Pull-up and Pull-down Resistors” on page 30 for recommen ded termination values.
3. Must pull down. See “Pull-up and Pull-down R esistors” on page 30 for recommended termination values.
4. If not used, must pull up.
5. If not used, must pull down.
6. Strapping input during reset; pull up or pull down as required.
7. Pull-up may be required. See “External Peripheral Bus Control Signals” on page 31.
Signal NameDescriptionI/OType
HDLCEX Interface
HDLCEXTxClkTransmit ClockI3.3V LVTTL
HDLCEXTxFSTransmit Frame SynchronizationI3.3V LVTTL
HDLCEXTxDataATransmit Data port AO3.3V LVTTL
HDLCEXTxDataBTransmit Data port BO3.3V LVTTL
HDLCEXRxClkReceive ClockI 3.3V LVTTL
HDLCEXRxFSReceive Frame SynchronizationI3.3V LVTTL
HDLCEXRxDataAReceive Data port AI3.3V LVTTL
HDLCEXRxDataBReceive Data port BI3.3V LVTTL
Management Data Clock. The MDClk is sourced to the
PHY. Management information is transferred
synchronously with respect to this clock (MII, RMII, and
SMII).
Management Data Input/Output is a bidirectional signal
between the Ethernet controller and the PHY. It is used to
transfer control and status information (MII, RMII, and
SMII).
Transmit Data. A nibble wide data bus towards the net.
The data is synchronous with PHY0TxClk
(MII 0[RMII 0, 1][SMII 0, 1]).
Transmit Enable. This signal is driven by EMAC2 to the
PHY. Data is valid during the active state of this signal.
Deassertion of this signal indicates end of frame
transmission. This signal is synchronous with PHYTxClk
(MII 0[RM II 0]).
or
SMII Sync.
Transmit Error. This signal is generated by the Ethernet
controller, is connected to the PHY and is synchronous
with the PHY0TxClk. It informs the PHY that an error was
detected (MII 0).
or
Transmit Enable [RMII 1].
5V tolerant
3.3V LVTTL
5V tolerant
3.3V LVTTL
O3.3V LVTTL
5V tolerant
I/O
3.3V LVTTL
O 3.3V LVTTL
O 3.3V LVTTL
O3.3V LVTTL
Notes
1, 4
32
Page 35
PowerNP NPe405L Embedded Processor Data Sheet
Signal Functional Description (Part 2 of 6)
Notes:
1. Receiver input has hysteresis.
2. Must pull up. See “Pull-up and Pull-down Resistors” on page 30 for recommended termination values.
3. Must pull down. See “Pull-up and Pull-down R esistors” on page 30 for recommended termination values.
4. If not used, must pull up.
5. If not used, must pull down.
6. Strapping input during reset; pull up or pull down as required.
7. Pull-up may be required. See “External Peripheral Bus Control Signals” on page 31.
Preliminary
Signal NameDescriptionI/OType
PHY0Col[PHY0Rx1Er]l
PHY0CrS[PHY0CrS0DV]
PHY0RxClk
PHY0RxD0[PHY0Rx 0 D 0][PHY0Rx0D]
PHY0RxD1[PHY0Rx 0 D 1][PHY0Rx1D]
PHY0RxD2[PHY0Rx1 D 0]
PHY0RxD3[PHY0Rx1 D 1]
PHY0RxDV[PHY0CrS1DV]
PHY0RxErr[PHY0Rx 0Er]
PHY0TxClk[PHY0RefClk]
SDRAM Interface
MemAddr00:31
MemAddr12:00
BA1:0Bank Address support ing up to 4 internal b anksO3.3V LVTTL
RAS
CAS
DQM0:3
DQMCBDQM for ECC check bits.O3.3V LVTTL
Collision [receive error] signal from the PHY. This is an
asynchronous signal (MII 0).
or
Receive Error ([RMII 1]).
Carrier Sense signal from the PHY. This is an
asynchronous signal (MII 0).
or
Carrier sense data valid ([RMII 0]).
Receiver medium clock. This signal is generated by the
PHY (MII 0).
Received Data. This is a nibble wide bus from the PHY.
The data is synchronous with PHY0RxClk
(MII 0[RMII 0, 1][SMII 0, 1]).
Receive Data Valid. Data on the Data Bus is valid when
this signal is activated. Deassertion of this signal indicates
end of the frame reception (MII 0).
or
Carrier sense data valid ([RMII 1])
Receive Error. This signal comes from the PHY and is
synchronous with PHY0RxClk (MII 0 [RMII 0]).
Transmit medium clock. This signal is generated the PHY
([MII 0]).
or
Reference Clock [RMII and SMII].
Memory Data bus
Notes:
1. MemAddr00 is the most significant bit (msb).
2. MemData31 is the least significant bit (lsb).
Memory Address bus.
Notes:
1. MemAddr12 is the most significant bit (msb).
2. MemAddr00 is the least significant bit (lsb).
Row Address Strobe.O3.3V LVTTL
Column Address Strobe.O3.3V LVTTL
DQM for byte lane 0 (MemAddr00:7),
1 (MemAddr08:15),
2 (MemData16:23), and
3 (MemData24:31)
I/O3.3V LVTTL
5V tolerant
I
3.3V LVTTL
5V tolerant
I
3.3V LVTTL
5V tolerant
I
3.3V LVTTL
5V tolerant
I
3.3V LVTTL
5V tolerant
I
3.3V LVTTL
5V tolerant
I
3.3V LVTTL
5V tolerant
I
3.3V LVTTL
O3.3V LVTTL
O3.3V LVTTL
Notes
1, 5
1, 4
1, 4
1, 5
1, 5
1, 4
33
Page 36
Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
Signal Functional Description (Part 3 of 6)
Notes:
1. Receiver input has hy steresis.
2. Must pull up. See “Pull-up and Pull-down Resistors” on page 30 for recommen ded termination values.
3. Must pull down. See “Pull-up and Pull-down R esistors” on page 30 for recommended termination values.
4. If not used, must pull up.
5. If not used, must pull down.
6. Strapping input during reset; pull up or pull down as required.
7. Pull-up may be required. See “External Peripheral Bus Control Signals” on page 31.
Select up to four external SDRAM banks.O3.3V LVTTL
WE
1
]
:3
Write Enable.O3.3V LVTTL
Two copies of an SDRAM clock allows, in some cases,
glueless SDRAM attachment without requiring this signal
to be repowered by a PLL or zero-delay buffer.
External peripheral data bus .
Note: PerData00 is the most significant bit (msb) on this
bus.
Peripheral write-bte enable. Byte-enables which are valid
for an entire cycle or write-byte-enables which are valid for
each byte on each data transfer, allowing partial word
transactions. Used by either external bus controller or DMA
controller depending upon the type of transfer involved.
Peripheral write enable. Low when any of the two PerWBE
signals are low.
Peripheral Chip SelectsO
Peripheral output enable. Used by either the external bus
controller or the DMA controller depending upon the type
of transfer involved. When the NPe405L is the bus master,
it enables the peripherals to drive the bus.
Peripheral read/write. Used by either the external bus
controller or DMA controller depending upon the type of
transfer involved. High indicates a read from memory, low
indicates a write to memory.
O3.3V LVTTL
I/O
O
I/O
O
O
5V tolerant
3.3V LVTTL
5V tolerant
3.3V LVTTL
5V tolerant
3.3V LVTTL
5V tolerant
3.3V LVTTL
5V tolerant
3.3V LVTTL
5V tolerant
3.3V LVTTL
5V tolerant
3.3V LVTTL
5V tolerant
3.3V LVTTL
1
1
2, 7
7
7
34
PerReadyIndicates peripheral is ready to transfer data.I
PerBLast
PerClkPeripheral Clock. Used by synchronous peripherals.O
PerErrUsed to indicate errors from peripherals.I
Peripheral burst last. Used to indicate the last transfer of a
memory access.
O
5V tolerant
3.3V LVTTL
5V tolerant
3.3V LVTTL
5V tolerant
3.3V LVTTL
5V tolerant
3.3V LVTTL
1
7
1, 5
Page 37
PowerNP NPe405L Embedded Processor Data Sheet
Signal Functional Description (Part 4 of 6)
Notes:
1. Receiver input has hysteresis.
2. Must pull up. See “Pull-up and Pull-down Resistors” on page 30 for recommended termination values.
3. Must pull down. See “Pull-up and Pull-down R esistors” on page 30 for recommended termination values.
4. If not used, must pull up.
5. If not used, must pull down.
6. Strapping input during reset; pull up or pull down as required.
7. Pull-up may be required. See “External Peripheral Bus Control Signals” on page 31.
Preliminary
Signal NameDescriptionI/OType
[DMAReq0:3]
[DMAAck0:3
[EOT0:3
]
/TC0:3]
Internal Peripheral Interface
UARTSerClk
UART0_RxUART0 Receive data.I
UART0_TxUA RT0 Transmit data.O
[UART0_DCD
[UART0_DSR
[UART0_CTS
[UART0_DTR
[UART0_RTS
[UART0_RI
]UAR T 0 Data C arrier Detec t.I
]UART0 Data Set Ready.I
]UART0 Clear To Send.I
]UART0 Data Terminal Ready.O
]UART0 Request To Send.O
]UART0 Ring Indicator.I
DMA request. Used by peripherals to request a data
transfer. Following a system reset, the default mode of the
signals is active-low. They may be programmed to activehigh using the DMA0_POL register.
DMA acknowledge. Used to indicate to peripherals that
data transfer is complete. Following a system reset, the
default mode of the signals is active-low. They may be
programmed to active-high using the DMA0_POL register.
End Of Transfer/Terminal Count. Indication by peripherals
that all data has been transfered, or by DMA controller that
programmed amount of data has been transfered.
Following a system reset, the default mode of the signals is
active-low. They may be programmed to active-high using
the DMA0_POL register.
Serial Clock used to provide an alternative clock to the
internally generated serial clock. Used in cases where the
allowable internally generated baud rates are not
satisfactory. This input can be individually connected to
either or both UART0 and UART1.
I
O
I/O
I
5V tolerant
3.3V LVTTL
5V tolerant
3.3V LVTTL
5V tolerant
3.3V LVTTL
5V tolerant
3.3V LVTTL
5V tolerant
3.3V LVTTL
5V tolerant
3.3V LVTTL
5V tolerant
3.3V LVTTL
5V tolerant
3.3V LVTTL
5V tolerant
3.3V LVTTL
5V tolerant
3.3V LVTTL
5V tolerant
3.3V LVTTL
5V tolerant
3.3V LVTTL r
Notes
1
1
1
1
1
1
1
1
35
Page 38
Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
Signal Functional Description (Part 5 of 6)
Notes:
1. Receiver input has hy steresis.
2. Must pull up. See “Pull-up and Pull-down Resistors” on page 30 for recommen ded termination values.
3. Must pull down. See “Pull-up and Pull-down R esistors” on page 30 for recommended termination values.
4. If not used, must pull up.
5. If not used, must pull down.
6. Strapping input during reset; pull up or pull down as required.
7. Pull-up may be required. See “External Peripheral Bus Control Signals” on page 31.
Signal NameDescriptionI/OTypeNotes
I
5V tolerant
3.3V LVTTL
5V tolerant
3.3V LVTTL
5V tolerant
3.3V LVTTL
5V tolerant
3.3V LVTTL
5V tolerant
3.3V LVTTL
5V tolerant
3.3V LVTTL
5V tolerant
3.3V LVTTL
5V tolerant
3.3V LVTTL
5V tolerant
3.3V LVTTL
5V tolerant
3.3V LVTTL
5V tolerant
3.3V LVTTL
5V tolerant
3.3V LVTTL
5V tolerant
3.3V LVTTL
5V tolerant
3.3V LVTTL
5V tolerant
3.3V LVTTL
5V tolerant
3.3V LVTTL
UART1_RxUART1 Receive data.I
UART1_TxUA RT1 Transmit data.O
[UART1_DCD
[UART1_DSR
[UART1_CTS
[UART1_DTR
[UART1_RTS
[UART1_RI
IICSCLIIC Serial Clock.I/O
IICSDAIIC Serial Data.I/O
Interrupts Interface
[IRQ0:6]Interrupt Requests.I
JTAG Interface
TDI Test Data In.I
TMSTest Mode Select.I
TDO Test Data Out.O
TCK Test Clock.I
TRST
]UAR T 1 Data C arrier D etec t.I
]UART1 Data Set Ready.I
]UART1 Clear To Send.I
]UART1 Data Terminal Ready.O
]UART1 Request To Send.O
]UART1 Ring Indicator.I
Test Reset. TRST must be low at power-on to reset the
JTAG boundary scan state machine.
1
6
1, 4
1, 4
1, 4
6
6
1, 4
1, 2
1, 2
1
1, 4
1, 4
1, 4
5
36
Page 39
PowerNP NPe405L Embedded Processor Data Sheet
Signal Functional Description (Part 6 of 6)
Notes:
1. Receiver input has hysteresis.
2. Must pull up. See “Pull-up and Pull-down Resistors” on page 30 for recommended termination values.
3. Must pull down. See “Pull-up and Pull-down R esistors” on page 30 for recommended termination values.
4. If not used, must pull up.
5. If not used, must pull down.
6. Strapping input during reset; pull up or pull down as required.
7. Pull-up may be required. See “External Peripheral Bus Control Signals” on page 31.
Preliminary
Signal NameDescriptionI/OType
System Interface
SysClk Main System Clock input.I
SysReset
SysErrSet to 1 when a Machine Check is generated.O
Halt
GPIO00:31
TestEn
TmrClk
Trace Interface
[TS1E]
[TS2E]
[TS1O]
[TS2O]
[TS3:6]
[TrcClk]
Power Pins
GND
V
OV
AV
Other Pins
ReservedDo not connect signals, voltage, or ground to these pins.n/an/a
DD
DD
DD
3.3V Analog
Wire w/ESD
Main System Reset.I/O
Halt from external debugger.I
General Purpose I/O. To access this function, software
must toggle a DCR bit.
Test Enable. Used only for manufacturing tests. Pull down
for normal operation.
This input must toggle at a rate of less than one half the
CPU core frequency (less than 100MHz in most cases). In
most cases this input toggles much slower (in the 1MHz to
10MHz range).
Even Trace execution status.To access this function,
software must toggle a DCR bit.
Odd Trace execution status. To access this function,
software must toggle a DCR bit.
Trace Status. To access this function, software must toggle
a DCR bit.
Trace interface clock. A toggling signal that is always half
of the CPU core frequency. To access this function,
software must toggle a DCR bit.
and P09-P14 are also thermal balls.
Logic voltage—2.5VIHardwire
Output driver voltage—3.3VIHardwire
Filtered PLL voltage—2.5VI
I/O
5V tolerant
3.3V LVTTL
5V tolerant
3.3V LVTTL
5V tolerant
3.3V LVTTL
5V tolerant
3.3V LVTTL
3.3V LVTTL
I
Rcvr w/PD
5V tolerant
I
3.3V LVTTL
5V tolerant
O
3.3V LVTTL
5V tolerant
O
3.3V LVTTL
5V tolerant
O
3.3V LVTTL
5V tolerant
O
3.3V LVTTL
IHardwire
3.3V DC
Wire w/ESD
Notes
1, 2
1
1
1
1
37
Page 40
Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
Absolute Maximum Ratings
The absolute maximum ratings below are stress ratings only. Operation at or beyond these maximum ratings can cause
permanent damage to the device.
CharacteristicSymbolValueUnit
Supply Voltage (Internal Logic)
Supply Voltage (I/O Interface)
PLL Supply Voltage
Input Voltage (3.3V LVTTL receivers)
Input Voltage (5.0V LVTTL receivers)
Storage Temperature Range
Case temperature under bias
Notes:
1. All voltages are specified with respect to ground (GND).
2. AV
should be derived from VDD using the following circuit:
DD
2
V
OV
AV
T
V
V
STG
T
DD
DD
DD
IN
IN
C
0 to +2.7V
0 to +3.6V
0 to +2.7V
-0.6 to (OVDD + 0.6)
-0.6 to (OVDD + 2.4)
-55 to +150°C
-40 to +120°C
V
V
L1 – 2.2µH SMT inductor (equivalent to MuRata
V
DD
L1
C1
C2
C3
AV
DD
LQH3C2R2M34) or SMT chip ferrite bead (equivalent
to MuRata BLM31A700S)
C1 – 3.3
C2 –
C3 – 0.01
µF SMT tantalum
0.1µF SMT monolithic ceramic capacitor with X7R
dielectric or equivalent
µF SMT monolithic ceramic capacitor with X7R
dielectric or equivalent
Package Thermal Specifications
The NPe405L is designed to operate within a case temperature range of -40°C to 85°C. Thermal resistance values for the
E-PBGA packages in a convection environment are as follows:
Airflow
Package—Thermal Resistance
23mm, 324-balls—Junction-to-Case
23mm, 324-balls—Case-to-Ambient
Notes:
1. For a chip mounted on a JEDEC 2S2P card without a heat sink.
2. For a chip mounted on a card with at least one signal and two power planes, the following relationships exist:
a. Case temperature, T
b. T
= TC – P×θCA, where TA is ambient temperature and P is power consumption.
A
= T
c. T
CMax
– P×θJC, where T
JMax
, is measured at top center of case surface with device soldered to circuit board.
C
1
is maximum junction temperature and P is power consumption.
JMax
Symbol
θ
JC
θ
CA
0 (0)100 (0.51)200 (1.02)
222°C/W
171514°C/W
ft/min (m/sec)
Unit
38
Page 41
Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
Recommended DC Operating Conditions
Device operation beyond the conditions specified is not recommended. Extended operation beyond the recommended
conditions can affect device reliability.
ParameterSymbolMinimumTypicalMaximumUnitNotes
Logic Supply Voltage
I/O Supply Voltage
PLL Supply Voltage
Input Logic High (3.3V LVTTL
receivers)
Input Logic High (2.5V CMOS
receivers)
Input Logic High (5.0V LVTTL
receivers)
Input Logic Low
Output Logic High
Output Logic Low
3.3V I/O input current (no pull-up or
pull-down)
Input Current (with internal pulldown)
Input Current (with internal pull-up)
Input Max Allowable Overshoot
(2.5V CMOS receivers)
Input Max Allowable Overshoot
(3.3V LVTTL receivers)
Input Max Allowable Overshoot
(5.0V LVTTL receivers)
Input Max Allowable Undershoot
(3.3V or 5.0V receivers)
Output Max Allowable Overshoot
(3.3V or 5.0V receivers)
Output Max Allowable Undershoot
(3.3V and 5.0V receivers)
Case Temperature
V
OV
AV
V
V
V
V
V
V
I
I
I
V
IMAO25
V
IMAO3
V
IMAO5
V
IMAU
V
OMAO
V
OMAU3
T
DD
DD
DD
IH
IH
IH
IL
OH
OL
IL1
IL2
IL3
C
Notes:
1. See “5V-Tolerant I/O Input Current” on page 40
+2.3+2.5+2.7V
+3.0+3.3+3.6V
+2.3+2.5+2.7V
+2.0
+1.7
OV
V
DD
DD
V
V
+2.0+5.5V
0+0.8V
+2.4
OV
DD
V
0+0.4V
±10
±10 (@ 0V)400 (@ 3.6V)
-250 (@ 0V)±10 (@ 3.6V)
VDD + 0.6
OV
+ 0.6
DD
µA
µA
µA
V
V
+5.5V
− 0.6
− 0.6
− 40
OVDD + 0.3
+85
V
V
V
°C
39
Page 42
Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
5V-Tolerant I/O Input Current
100
0
-100
A)
-200
µ
-300
-400
Input Current (
-500
-600
-700
Input Capacitance
3.3V LVTTL I/O)
5 V tolerant LVTTL I/O
RX only pins
1.02.03.04.05.00.0
Input Voltage (V)
ParameterSymbolMaximumUnitNotes
C
IN1
C
IN2
C
IN4
2.5pF
3.5pF
0.75pF
40
Page 43
PowerNP NPe405L Embedded Processor Data Sheet
DC Electrical Characteristics
ParameterSymbolMinimumTypicalMaximumUnit
Active Operating Current for V
Active Operating Current for V
Active Operating Current for V
Active Operating Current for O V
Active Operating Current for O V
Active Operating Current for O V
Active Operating Current for AV
Active Operating Power @ 133MHz
Active Operating Power @ 200MHz
Active Operating Power @ 266MHz
Notes:
1. Maximum power is characterized at V
while running an application designed to maximize power consumption. The maximum power values are measured with the
following clock rate combinations:
a. CPU=133.33MHz, PLB=66.66MHz, OPB=66.66MHz, EBC=33.33MH z
b. CPU=200 MHz, PLB=100MHz, OPB=50MHz, EBC=50MHz
c. CPU=266.66MHz, PLB=66.66MHz, OPB=66.66MHz, EBC=33.33MHz
@ 133MHzI
DD
@ 200MHzI
DD
@ 266MHzI
DD
@ 133MHzI
DD
@ 200MHzI
DD
@ 266MHzI
DD
DD
=2.7V, OVDD=3.6V, TC=85°C, across the silicon process (worse case to best case),
DD
ODD
ODD
ODD
I
ADD
P
P
P
DD
DD
DD
DD
DD
DD
444497543mA
468565676mA
490590700mA
172336mA
243651mA
274461mA
5.566.5mA
1.11.3
1.41.7
1.51.8
1.6
2.1
1
1
2
1
Preliminary
W
W
W
Test Conditions
Clock timing and switching characteristics are specified in accordance
with operating conditions shown in the table “Recommended DC
Operating Conditions.” AC specifications are characterized at
= 3.00V and TJ = 85°C with the 50pF test load shown in the
OV
DD
figure at right.
Output
Pin
50pF
41
Page 44
Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
Clocking Specifications
SymbolParameterMinMaxUnits
SysClk Input
F
C
T
C
T
CS
T
CH
T
CL
Note: Input slew rate > 2V/ns
MemClkOut Output
F
C
T
C
F
C
T
C
F
C
T
C
T
CH
T
CL
Other Clocks
F
C
F
C
F
C
F
C
F
C
F
C
F
C
Notes:
1. If HDLCEX is not used, the maximum OPB frequency is 66.66MHz.
SysClk clock input frequency2566.66MHz
SysClk clock period1540ns
Clock edge stability (phase jitter, cycle to cycle)0.15ns
Clock input high time40% of nominal period 60% of nominal periodns
Clock input low time40% of nominal period 60% of nominal periodns
MemClkOut clock output frequency–133MHz66.66MHz
MemClkOut clock period–133MHz15ns
MemClkOut clock output frequency–200MHz100MHz
MemClkOut clock period–200MHz10ns
MemClkOut clock output frequency–266MHz133.33MHz
MemClkOut clock period–266MHz7.5ns
Clock output high time45% of nominal period 55% of nominal periodns
Clock output low time45% of nominal period 55% of nominal periodns
Care must be taken when using a spread spectrum clock generator (SSCG) with the NPe405L. This
controller uses a PLL for clock generation inside the chip. The accuracy with which the PLL follows the SSCG
is referred to as tracking skew. The PLL bandwidth and phase angle determine how much tracking skew
there is between the SSCG and the PLL for a given frequency deviation and modulation frequency. When
using an SSCG with the NPe405L the following conditions must be met:
• The frequency deviation must not violate the minimum clock cycle time. Therefore, when operating the
NPe405L with one or more internal clocks at their maximum supported frequency, the SSCG can only
lower the frequency.
• The maximum frequency deviation cannot exceed
40kHz. In some cases, on-board NPe405L peripherals impose more stringent requirements (see Note 1).
• Use the peripheral bus clock (PerClk) for logic that is synchronous to the peripheral bus since this clock
tracks the modulation.
• Use the SDRAM MemClkOut since it also tracks the modulation.
Please refer to the application note Using a Spread Spectrum Clock Generator with the PowerPC 405GP for
additional details. This application note is available on the IBM Microelectronics web site at
http://www.chips.ibm.com.
Notes:
1. The serial port baud rates are synchronous to the modulated clock. The serial port has a tolerance of
approximately 1.5% on baud rate before framing errors begin to occur. The 1.5% tolerance assumes that
the connected device is running at precise baud rates. If an external serial clock is used the baud rate is
unaffected by the modulation
2. Ethernet operation is unaffected.
3. IIC operation is unaffected.
Caution: It is up to the system designer to ensure that any SSCG used with the NPe405L meets the above
requirements and does not adversely affect other aspects of the system.
−3%, and the modulation frequency cannot exceed
43
Page 46
Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
Peripheral Interface Clock Timings
ParameterMinMaxUnits
EMC0MDClk output frequency–2.5MHz
EMC0MDClk period400–ns
EMC0MDClk output high time160–ns
EMC0MDClk output low time160–ns
PHY0TxClk input frequency2.525MHz
PHY0TxClk period40400ns
PHY0TxClk input high time35% of nominal period–ns
PHY0TxClk input low time3 5% of no minal period–ns
PHY0RxClk input frequency2.525MHz
PHY0RxClk period40400ns
PHY0RxClk input high time35% of nominal period–ns
PHY0RxClk input low time35% of nominal period–ns
PerClk output frequency–133MHz–33.33MHz
PerClk period–133MHz30–ns
PerClk output frequency–200MHz–50MHz
PerClk period–200MHz20–ns
PerClk output frequency–266MHz)–66.66MHz
PerClk period–266MHz15–ns
PerClk output high time45% of nominal period55% of nominal periodns
PerClk output low time45% of nominal period55% of nominal periodns
UARTSerClk input frequency
UARTSerClk period
UARTSerClk input high time
UARTSerClk input low time
TmrClk input frequency–133MHz–33.33MHz
TmrClk period–133MHz30–ns
TmrClk input frequency–200MHz–50MHz
TmrClk period–200MHz20–ns
TmrClk input frequency–266MHz–66.66MHz
TmrClk period–266MHz15–ns
TmrClk input high time40% of nominal period60% of nominal periodns
TmrClk input low time40% of nominal period60% of nominal periodns
HDLCEXTxClk, HDLCEXRxClk08.192MHz
Notes:
1. T
is the period in ns of the OPB clock. The maximum OPB clock frequency is 33.33 MHz for 133MHz parts, 50 MHz for
1. Ethernet interface meets timing requirements as defined by IEEE 802.3 standard.
2. The SDRAM command interface is configurable through SDRAM0_TR[LDF] to provide a 2 to 4 cycle delay before the
command is used by SDRAM. Output times in table a re in cycle 1.
3. SDRAM I/O timings are specified relative to a SysClk terminated in a lumped 10pF load.
4. SDRAM interface hol d times are guaranteed at the NPe405L package pin. System designers must use the NPe405L
IBIS model (available from www.chips.ibm.com) to ensure their clock distribution topology minimizes loading and
reflections, and that the relative delays on clock wiring do not exceed the delays on other SDRAM signal wiring.
5. PerClk rising edge at package pin with a 10pF load trails the internal PLB clock by approximately 0.8ns.
1. Ethernet interface meets timing requirements as defined by IEEE 802.3 standard.
2. The SDRAM command interface is configurable through SDRAM0_TR[LDF] to provide a 2 to 4 cycle delay before the
command is used by SDRAM. Output times in table a re in cycle 1.
3. SDRAM I/O timings are specified relative to a SysClk terminated in a lumped 10pF load.
4. SDRAM interface hol d times are guaranteed at the NPe405L package pin. System designers must use the NPe405L
IBIS model (available from www.chips.ibm.com) to ensure their clock distribution topology minimizes loading and
reflections, and that the relative delays on clock wiring do not exceed the delays on other SDRAM signal wiring.
5. PerClk rising edge at package pin with a 10pF load trails the internal PLB clock by approximately 0.8ns.
Input (ns)Output (ns)Output Current (mA)
Signal
Setup Time
(T
min)
IS
Hold Time
TIH min)
Valid Delay
(TOV max)
Hold Time
(TOH min)
I/O H
(maximum)
I/O L
(minimum)
SDRAM Interface
BA1:0n/an/a7.21.51 912Sys Clk2, 3
BankSel3:0
CAS
ClkEn0:1n/an/a4.91.04025SysClk3
DQM0:3n/an/a5.91.01912SysClk3
DQMCBn/an/a5.91.01912SysClk3
ECC0:72.00.35.71.01912SysClk3
MemAddr12:00n/an/a7.21.41912SysClk2, 3
MemClkOut0:1n/an/a0.4-1.21912SysClk3, 4
MemData00:312.00.35.61.01912SysClk3
RAS
WE
1. Ethernet interface meets timing requirements as defined by IEEE 802.3 standard.
2. The SDRAM command interface is configurable through SDRAM0_TR[LDF] to provide a 2 to 4 cycle delay before the
command is used by SDRAM. Output times in table a re in cycle 1.
3. SDRAM I/O timings are specified relative to a SysClk terminated in a lumped 10pF load.
4. SDRAM interface hol d times are guaranteed at the NPe405L package pin. System designers must use the NPe405L
IBIS model (available from www.chips.ibm.com) to ensure their clock distribution topology minimizes loading and
reflections, and that the relative delays on clock wiring do not exceed the delays on other SDRAM signal wiring.
5. PerClk rising edge at package pin with a 10pF load trails the internal PLB clock by approximately 0.8ns.
HDLCEXRxClkn/an/an/an/an/an/a
HDLCEXRxDataA:B23.91.6n/an/an/an/a
HDLCEXRxFS24.20.8n/an/an/an/a
HDLCEXTxClkn/an/an/an/an/an/a
HDLCEXTxDataA:Bn/an/a7.63.3128
HDLCEXTxFS24.20.8n/an/an/an / a
[HDLCEXTxEnA]n/an/a[8.5][3.5]128
[HDLCEXTxEnB]n/an/a[8.9][3.8]128
ClockNotes
49
Page 52
Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
I/O Specifications—266MHz (Part 2 of 2)
Notes:
1. Ethernet interface meets timing requirements as defined by IEEE 802.3 standard.
2. The SDRAM command interface is configurable through SDRAM0_TR[LDF] to provide a 2 to 4 cycle delay before the
command is used by SDRAM. Output times in table a re in cycle 1.
3. SDRAM I/O timings are specified relative to a SysClk terminated in a lumped 10pF load.
4. SDRAM interface hol d times are guaranteed at the NPe405L package pin. System designers must use the NPe405L
IBIS model (available from www.chips.ibm.com) to ensure their clock distribution topology minimizes loading and
reflections, and that the relative delays on clock wiring do not exceed the delays on other SDRAM signal wiring.
5. PerClk rising edge at package pin with a 10pF load trails the internal PLB clock by approximately 0.8ns.
The following describes the method by which initial chip settings are established when a system reset occurs.
Strapping
While the SysReset
input pin is low (system reset), the state of certain I/O pins is read to enable default initial
conditions prior to NPe405L start-up. The actual capture instant is the nearest SysClk edge before the
deassertion of reset. These pins must be strapped using external pull-up (logical 1) or pull-down (logical 0)
resistors to select the desired default conditions. The recommended pull-up is 3k
the recommended pull-down is 1k
Ω to GND.These pins are used for strap functions only during reset. They
Ω to +3.3V or 10kΩ to +5V,
are used for other signals during normal operation. The following table lists the strapping pins along with their
functions and strapping options.
Strapping Pin Assignments
FunctionOptionBall Strapping
EXT_BootW
Width of boot device on EBC data bus
8 bits0
16 bits1
ZMII_Mode
Ethernet ZMII mode
MII mode00
SMII mode01
RMII 10 Mbps mode10
RMII 100 Mbps mode11
Y21
(UART1_Tx)
V21
(UART1_RTS
U20
)
(UART1_DTR)
51
Page 54
Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
(c) Copyright International Business Machines Corporation 1999, 2002
All Rights Reserved
Printed in the United States of America, October 2, 2002
The following are trademarks of International Business Machines Corporation in
the United States, or other countries, or both:
Blue LogicIBMPowerPC
CodePackIBM Logo
CoreConnectPowerNP
Other company, product, and service names may be trademarks or service marks
of others.
Preliminary Edition (October 2, 2002)
This document contains information on a new product under development by IBM.
IBM reserves the right to change or discontinue this product without notice.
This document is a preliminary edition of the PowerNP NPe405L data sheet. Make
sure you are using the correct edition for the level of the product.
While the information contained herein is believed to be accurate, such
information is preliminary, and should not be relied upon for accuracy or
completeness, and no representations or warranties of accuracy or completeness
are made.
All information contained in this document is subject to change without notice. The
products described in this document are NOT intended for use in applications
such as implantation, life support, or other hazardous uses where malfunction
could result in death, bodily injury, or catastrophic property damage. The
information contained in this document does not affect or change IBM product
specifications or warranties. Nothing in this document shall operate as an express
or implied license or indemnity under the intellectual property rights of IBM or third
parties. All information contained in this document was obtained in specific
environments, and is presented as an illustration. The results obtained in other
operating environments may vary.
THE INFORMATION CONTAINED IN THIS DOCUMENT IS PROVIDED ON AN
"AS IS" BASIS. In no event will IBM be liable for damages arising directly or
indirectly from any use of the information contained in this document.
IBM Microelectronics Division
1580 Route 52
Hopewell Junction, NY 12533-6351
The IBM home page is www. ibm.com.
52
The IBM Microelectronics Division home is www.chips.ibm.com.
SA14-2558-10
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