Datasheet NM27C020V150, NM27C020T120, NM27C020Q150, NM27C020VE150, NM27C020VE120 Datasheet (Fairchild Semiconductor)

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NM27C020 2,097,152-Bit (256K x 8) UV Erasable CMOS EPROM
NM27C020 2,097,152-Bit (256K x 8) UV Erasable CMOS EPROM
General Description
The NM27C020 is a high speed 2 Megabit CMOS UV-EPROM manufactured on Fairchild’s advanced sub-micron technology. Utilizing the AMG architecture, this advanced CMOS process delivers high speeds while consuming low power.
The NM27C020 provides microprocessor-based systems exten­sive storage capacity for large portions of operating systems and application software. Its 100ns access time provides no-wait-state operation with high-performance CPUs.
The NM27C020 offers a single chip solution for the code storage requirements of 100% firmware-based equipment. Frequently­used software routines are quickly executed from EPROM stor­age, greatly enhancing system utility.
The NM27C020 is manufactured using Fairchild’s advanced CMOS AMG EPROM technology, and is one member of a high density Fairchild EPROM series family which range in densities up to 4Mb.
Block Diagram
July 1998
Features
■ High performance CMOS — 100 ns access time
■ Simplified upgrade path —VPP and PGM are “Don’t Care” during normal read operation
■ Manufacturers identification code
■ JEDEC Standard Pin Configuration
— 32-pin CERDIP package — 32-pin PLCC package — 32-pin PDIP package
© 1998 Fairchild Semiconductor Corporation
Output Enable,
Chip Enable, and
Program Logic
Y Decoder
X Decoder
. . . . . . . . .
Output Buffers
2,097,152-Bit
Cell Matrix
Data Outputs O0 - O
7
V
CC
GND
V
PP OE
PGM
CE
A0 - A
17
Address
Inputs
DS010835-1
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NM27C020 2,097,152-Bit (256K x 8) UV Erasable CMOS EPROM
Connection Diagrams
Commercial Temperature Range (0°C to +70°C) VCC = 5V ±10%
Parameter/Order Number Access Time (ns)
NM27C020 Q, V, N 100 100 NM27C020 Q, V, N 120 120 NM27C020 Q, V, N 150 150
All versions are guaranteed to function at slower speeds.
Extended Temperature Range (-40°C to +85°C) VCC = 5V ±10%
Parameter/Order Number Access Time (ns)
NM27C020 QE, VE, TE, NE 120 120 NM27C020 QE, VE, TE, NE 150 150
PLCC Pin Configuration
Top View
Pin Names
A0 –A17 Addresses CE Chip Enable OE Output Enable O0 –O7 Outputs PGM Program XX Don’t Care (During Read)
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17
XX/V
PP
A
16
A
15
A
12 A
7
A
6
A
5
A
4
A
3
A
2
A
1
A
0
O
0
O
1
O
2
GND
A
15
A
12
A
7
A
6
A
5
A
4
A
3
A
2
A
1
A
0
O
0
O
1
O
2
GND
27C512 27C256
V
PP
A
12
A
7
A
6
A
5
A
4
A
3
A
2
A
1
A
0
O
0
O
1
O
2
GND
27C256 27C512
V
CC
XX/PGM A
17
A
14
A
13
A
8
A
9
A
11
OE A
10
CE O
7
O
6
O
5
O
4
O
3
V
CC
A
14
A
13
A
8
A
9
A
11
OE
A
10
CE/PGM
O
7
O
6
O
5
O
4
O
3
V
CC
A
14
A
13
A
8
A
9
A
11
OE/V
PP
A
10
CE/PGM
O
7
O
6
O
5
O
4
O
3
XX/V
PP
A
16
A
15
A
12
A
7
A
6
A
5
A
4
A
3
A
2
A
1
A
0
O
0
O
1
O
2
GND
27C040
XX/V
PP
A
16
A
15
A
12
A
7
A
6
A
5
A
4
A
3
A
2
A
1
A
0
O
0
O
1
O
2
GND
27C010
A19 A
16
A
15
A
12
A
7
A
6
A
5
A
4
A
3
A
2
A
1
A
0
O
0
O
1
O
2
GND
27C080 27C040 27C080
V
CC
A
18
A
17
A
14
A
13
A
8
A
9
A
11
OE
A
10
CE O
7
O
6
O
5
O
4
O
3
V
CC
A
18
A
17
A
14
A
13
A
8
A
9
A
11
OE/V
PP
A
10
CE/PGM
O
7
O
6
O
5
O
4
O
3
27C010
V
CC
XX/PGM
XX
A
14
A
13
A
8
A
9
A
11
OE
A
10
CE/PGM
O
7
O
6
O
5
O
4
O
3
Note: Compatible EPROM pin configurations are shown in the blocks adjacent to the NM27C020 pins.
A14 A13 A8 A9 A11 OE A10 CE O7
A7 A6 A5 A4 A3 A2 A1 A0
O0
A12
A15
A16
VPP
VCC
PGM
A17
O1
O2
GND
O3O4O5
O6
5 6 7 8 9 10 11 12 13
29 28 27 26 25 24 23 22 21
14 15 16 17 18 19 20
4 3 2 1 32 31 30
DS010835-10
DS010835-3
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NM27C020 2,097,152-Bit (256K x 8) UV Erasable CMOS EPROM
Access Time 100 = 100 ns 120 = 120 ns 150 = 150 ns
Operating Temp Blank = Commercial Temp. E = Extended Temp.
Packaging Q = Ceramic DIP V = PLCC N = PDIP
Memory Size 020 = 2 Mbit
Fairchild
Memory
EPROM
CMOS
Q 150ENM 27 C 020
Connection Diagrams (Continued)
Ordering Information
DS010835-9
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NM27C020 2,097,152-Bit (256K x 8) UV Erasable CMOS EPROM
Absolute Maximum Ratings (Note 1)
Storage Temperature -65°C to +125°C All Input Voltage Except A9 with
Respect to Ground (Note 13) -0.6V to +7V VPPand A9 with Respect to Ground -0.6V to +14V VCC Supply Voltage with
Respect to Ground -0.6V to +7V ESD Protection >2000V
All Output Voltages with
Respect to Ground (Note 13) VCC + 10V to GND -0.6V
Operating Range
Range Temperature VCCTolerance
Commercial 0°C to +70°C +5V ±10 Industrial -40°C to +85°C +5V ±10%
DC Read Characteristics Over Operating Range with V
PP
= V
CC
Symbol Parameter Test Conditions Min Max Units
V
IL
Input Low Level -0.5 0.8 V
V
IH
Input High Level 2.0 VCC +1 V
V
OL
Output Low Voltage IOL = 2.1 mA -0.4 V
V
OH
Output High Voltage IOH = -400 µA 3.5 V
I
SB1
(Note 4) VCC Standby Current (CMOS) CE = VCC ± 0.3V 100 µA
I
SB2
VCC Standby Current (TTL) CE = V
IH
1mA
I
CC
(Note 2) VCC Active Current CE, OE = V
IL
Commercial 30 I/O = 0 mA, f = 5 MHz Industrial 30 mA Inputs = VIH or V
IL
I
PP
VPP Supply Current VPP = V
CC
10 µA
VPP VPP Read Voltage VCC - 0.4 V
CC
V
I
LI
Input Load Current VIN = 5.5 or GND -1 1 µA
I
LO
Output Leakage Current V
OUT
= 5.5V or GND -10 10 µA
AC Read Characteristics Over Operating Range with V
PP
= V
CC
Symbol Parameter 100 120 150 Units
Min Max Min Max Min Max
t
ACC
Address to Output Delay 100 120 150 ns
t
CE
CE to Output Delay 100 120 150 ns
t
OE
OE to Output Delay 40 45 50 ns
tDF (Note 3) Output Disable to Output Float 40 45 50 ns
t
OH
Output Hold from Addresses, CE 0 0 0 ns or OE , Whichever Occurred First
Note 1: Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods of time may affect device reliability.
Note 2: The supply current is the sum of ICC and IPP. The maximum current value is with Outputs O0 to O7 unloaded. Note 3: This parameter is only sampled and is not 100% tested. Output Float is defined as the point where data is no longer driven-see timing diagram. Note 4: CMOS inputs: VIL = GND 10.3V, VIH = VCC 10.3V.
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NM27C020 2,097,152-Bit (256K x 8) UV Erasable CMOS EPROM
40
30
20
10
0
012345678
31
30
29
28
27
26
-60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110 120 130 140
AC Read Characteristics (Continued)
ICC vs. Frequency
Frequency (MHz)
ICC vs. Temperature
Temperature (IC)
DS010835-7
DS010835-8
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NM27C020 2,097,152-Bit (256K x 8) UV Erasable CMOS EPROM
Capacitance T
A
= +25°C, f = 1 MHz (Note 5)
Symbol Parameter Conditions Typ Max Units
C
IN
Input Capacitance VIN = 0V 9 15 pF
C
OUT
Output Capacitance V
OUT
= 0V 12 15 pF
AC Test Conditions
Output Load 1 TTL Gate and CL = 100 pF (Note 11) Input Rise and Fall Times ≤5 ns Input Pulse Levels 0.45V to 2.4V Timing Measurement Reference Level (Note 13)
Inputs 0.8V and 2V Outputs 0.8V and 2V
AC Waveforms (Notes 9, 10, 12)
Note 5: This parameter is only sampled and is not 100% tested. Note 6: OE may be delayed up to t
ACC
- tOE after the falling edge of CE without impacting t
ACC
.
Note 7: The tDF and tCF compare level is determined as follows: High to TRI-STATE®, the measured V
OH1
(DC) - 0.10V;
Low to TRI-STATE, the measured V
OL1
(DC) + 0.10V.
Note 8: TRI-STATE may be attained using OE or CE . Note 9: The power switching characteristics of EPROMs require careful device decoupling. It is recommended that at least a 0.1 MF ceramic capacitor be used on every
device between VCC and GND.
Note 10:The outputs must be restricted to VCC + 1.0V to avoid latch-up and device damage. Note 11:1 TTL Gate: IOL = 1.6 mA, IOH = -400 µA.
CL: 100 pF includes fixture capacitance.
Note 12:VPP may be connected to VCC except during programming. Note 13:Inputs and outputs can undershoot to -2.0V for 20 ns Max.
Address Valid
Valid Output
Hi-Z
2V
0.8V
2V
0.8V
2V
0.8V
ADDRESS
OUTPUT
CE
OE
t
CE
2V
0.8V
(Note 6)
(Note 6)
t
DF
(Note 7, 8)
(Note 7, 8)
t
OH
Hi-Z
t
OE
ACC
t
CF
t
DS010835-4
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NM27C020 2,097,152-Bit (256K x 8) UV Erasable CMOS EPROM
Programming Characteristics (Notes 14, 15, 16, 17)
Symbol Parameter Condition Min Typ Max Units
t
AS
Address Setup Time 1 µs
t
OES
OE Setup Time 1 µs
t
CES
CE Setup Time OE = V
IH
1 µs
t
DS
Data Setup Time 1 µs
t
VPS
VPP Setup Time 1 µs
t
VCS
VCC Setup Time 1 µs
t
AH
Address Hold Time 0 µs
t
DH
Data Hold Time 1 µs
t
DF
Output Enable to Output CE = V
IL
060ns
Float Delay
t
PW
Program Pulse Width 45 50 105 µs
t
OE
Data Valid from OE CE = V
IL
100 ns
I
PP
VPP Supply Current during CE = V
IL
15 mA
Programming Pulse PGM = V
IL
I
CC
VCC Supply Current 20 mA
T
A
Temperature Ambient 20 25 30 °C
V
CC
Power Supply Voltage 6.25 6.5 6.75 V
V
PP
Programming Supply Voltage 12.5 12.75 13.0 V
t
FR
Input Rise, Fall Time 5 ns
V
IL
Input Low Voltage 0.0 0.45 V
V
IH
Input High Voltage 2.4 4.0 V
t
IN
Input Timing Reference Voltage 0.8 2.0 V
t
OUT
Output Timing Reference Voltage 0.8 2.0 V
Note 14:Fairchild’s standard product warranty applies only to devices programmed to specifications described herein. Note 15:VCC must be applied simultaneously or before VPP and removed simultaneously or after VPP. The EPROM must not be inserted into or removed from a board with
voltage applied to VPP or VCC. Note 16:The maximum absolute allowable voltage which may be applied to the VPP pin during programming is 14V. Care must be taken when switching the VPP supply to
prevent any overshoot from exceeding this 14V maximum specification. At least a 0.1 µF capacitor is required across VPP, VCC to GND to suppress spurious voltage transients which may damage the device.
Note 17: During power up the PGM pin must be brought high (≥V IH ) either coincident with or before power is applied to V PP .
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NM27C020 2,097,152-Bit (256K x 8) UV Erasable CMOS EPROM
t
AS
t
AH
Program
Program
Verify
Address N
t
DF
Data Out Valid
ADD N
Data In Stable
ADD N
Hi-Z
t
DS
t
DH
t
VCS
t
VPS
t
CES
t
PW
t
OES
t
OE
2V
0.8V
2V
0.8V
6.25V
12.75V
0.8V
2V
0.8V
2V
0.8V
ADDRESS
DATA
V
CC
CE
PGM
OE
V
PP
Programming Waveforms (Note 16)
DS010835-5
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NM27C020 2,097,152-Bit (256K x 8) UV Erasable CMOS EPROM
Turbo Programming Algorithm Flow Chart
VCC = 6.5V VPP = 12.75V
n = 0
ADDRESS = FIRST LOCATION
CHECK ALL BYTES
1ST: V
CC
= VPP = 6.0V
2ND: V
CC
= VPP = 4.3V
PROGRAM ONE 50µs PULSE
INCREMENT n
ADDRESS = FIRST LOCATION
VERIFY
BYTE
n = 10?
DEVICE
FAILED
LAST
ADDRESS
?
INCREMENT
ADDRESS
n = 0
PROGRAM ONE
50 µs
PULSE
INCREMENT
ADDRESS
VERIFY
BYTE
LAST
ADDRESS
?
PASS
NO
FAIL
YES
YES
PASS
NO
FAIL
NO
YES
DS010835-6
FIGURE 1.
Note: The standard National Semiconductor Algorithm may also be used but it will have longer programming time.
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NM27C020 2,097,152-Bit (256K x 8) UV Erasable CMOS EPROM
Functional Description
DEVICE OPERATION
The six modes of operation of the device are listed in Table 1. It should be noted that all inputs for the six modes are at TTL levels. The power supplies required are VCC and VPP. The VPP power supply must be at 12.75V during the three programming modes, and must be at 5V in the other three modes. The VCC power supply must be at 6.5V during the three programming modes, and at 5V in the other three modes.
Read Mode
The part has two control functions, both of which must be logically active in order to obtain data at the outputs. Chip Enable (CE) is the power control and should be used for device selection. Output Enable (OE) is the output control and should be used to gate data to the output pins, independent of device selection. Assuming that the addresses are stable, address access time (t
ACC
) is equal to the delay from CE to output (tCE). Data is available at the outputs tOE after the falling edge of OE, assuming that CE has been low and addresses have been stable for at least t
ACC
–tOE.
Standby Mode
The EPROM has a standby mode which reduces the active power dissipation by over 99%, from 220 mW to 0.55 mW. The EPROM is placed in the standby mode by applying a CMOS high signal to the CE input. When in standby mode, the outputs are in a high impedance state, independent of the OE input.
Output OR-Tying
1. the lowest possible memory power dissipation, and
2. complete assurance that output bus contention will not
occur.
To most efficiently use these two control lines, it is recommended that CE be decoded and used as the primary device selecting function, while OE be made a common connection to all devices in the array and connected to the READ line from the system control bus. This assures that all selected memory devices are in their low power standby modes and that the output pins are active only when data is desired from a particular memory device.
Programming
CAUTION: Exceeding 14V on pin 1 (VPP) will damage the device. Initially, and after each erasure, all bits of the device are in the “1’s”
state. Data is introduced by selectively programming “0’s” into the desired bit locations. Although only “0’s” will be programmed, both “1’s” and “0’s” can be presented in the data word. The only way to change a “0” to a “1” is by ultraviolet light erasure.
The part is in the programming mode when the VPP power supply is at 12.75V and OE is at VIH. It is required that at least a 0.1 µF capacitor be placed across VPP, VCC to ground to suppress spurious voltage transients which may damage the device. The data to be programmed is applied 8 bits in parallel to the data output pins. The levels required for the address and data inputs are TTL.
When the address and data are stable, an active low, TTL program pulse is applied to the PGM input. A program pulse must be applied at each address location to be programmed. The EPROM is programmed with the Turbo Programming Algorithm shown in Figure 1. Each Address is programmed with a series of 50 µs pulses until it verifies good, up to a maximum of 10 pulses. Most memory cells will program with a single 50 µs pulse. (The standard National Semiconductor Algorithm may also be used but it will have longer programming time.) The EPROM must not be pro­grammed with a DC signal applied to the PGM input. Program­ming multiple EPROM in parallel with the same data can be easily accomplished due to the simplicity of the programming require­ments. Like inputs of the parallel EPROM may be connected together when they are programmed with the same data. A low level TTL pulse applied to the PGM input programs the paralleled EPROM.
MODE SELECTION
The modes of operation of the NM27C020 are listed in Table 1. A single 5V power supply is required in the read mode. All inputs are TTL levels except for VPP and A9 for device signature.
TABLE 1. Modes Selection
Pins CE OE PGM V
PP
V
CC
Outputs
Mode
Read V
IL
V
IL
X X 5.0V D
OUT
(Note 18)
Output Disable X V
IH
X X 5.0V H igh Z
Standby V
IH
X X X 5.0V High Z
Programming V
IL
V
IH
V
IL
12.75V 6.25V D
IN
Program Verify V
IL
V
IL
V
IH
12.75V 6.25V D
OUT
Program Inhibit V
IH
X X 12.75V 6.25V High Z
Note 18:X can be VIL or VIH.
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NM27C020 2,097,152-Bit (256K x 8) UV Erasable CMOS EPROM
Functional Description (Continued)
Program Inhibit
Programming multiple EPROM’s in parallel with different data is also easily accomplished. Except for CE all like inputs (including OE) of the parallel EPROM may be common. A TTL low level program pulse applied to an EPROM’s CE with VPP at 12.75V will program that EPROM. A TTL high level CE input inhibits the other EPROM’s from being programmed.
Program Verify
A verify should be performed on the programmed bits to determine whether they were correctly programmed. The verify may be performed with VPP at 12.75V. VPP must be at VCC, except during programming and program verify.
MANUFACTURER’S IDENTIFICATION CODE
The part has a manufacturer’s indentification code to aid in programming. When the device is inserted in an EPROM pro­grammer socket, the programmer reads the code and then automatically calls up the specific programming algorithm for the part. This automatic programming control is only possible with programmers which have the capability of reading the code.
The Manufacturer’s Identification code, shown in Table 2, specifi­cally identifies the manufacturer and device type. The code for the NM27C020 is “8F8E,” where “8F” designates that it is made by Fairchild Semiconductor, and “8E” designates a 2 Megabit byte­wide part.
The code is accessed by applying 12V ±0.5V to address pin A9. Addresses and control pins are held at VIL, except A0. Address pin A0 is held at VIL for the manufacturer’s code, and held at VIH for the device code. The code is read on the eight data pins, O0 –07 . Proper code access is only guaranteed at 25°C ± 5°C.
ERASURE CHARACTERISTICS
The erasure characteristics of the device are such that erasure begins to occur when exposed to light with wavelengths shorter than approximately 4000 Angstroms (Å). It should be noted that sunlight and certain types of fluorescent lamps have wavelengths
in the 3000Å – 4000Å range. After programming, opaque labels should be placed over the EPROM window to prevent uninten­tional erasure. Covering the window will also prevent temporary functional failure due to the generation of photo currents.
The recommended erasure procedure for the EPROM is expo­sure to short wave ultraviolet light which has a wavelength of 2537Å. The integrated dose (i.e., UV intensity X exposure time) for erasure should be a minimum of 15W-sec/cm2. The device should be placed within 1 inch of the lamp tubes during erasure. The device should be placed within 1 inch of the lamp tubes during erasure.
An erasure system should be calibrated periodically. The distance from lamp to device should be maintained at one inch. The erasure time increases as the square of the distance from the lamp. (if distance is doubled the erasure time increases by factor of 4). Lamps lose intensity as they age. When a lamp is changed, the distance has changed, or the lamp has aged, the system should be checked to make certain full erasure is occurring. Incomplete erasure will cause symptoms that can be misleading. Program­mers, components and even system designs have been errone­ously suspected when incomplete erasure was the problem.
SYSTEM CONSIDERATION
The power switching characteristics of EPROMs require careful decoupling of the devices. The supply current, ICC, has three segments that are of interest to the system designer: the standby current level, the active current level, and the transient current peaks that are produced by voltage transitions on input pins. The magnitude of these transient current peaks is dependent on the output capacitance loading of the device. The associated V
CC
transient voltage peaks can be suppressed by properly selected decoupling capacitors. It is recommended that at least a 0.1 µF ceramic capacitor be used on every device between VCC and GND. This should be a high frequency capacitor of low inherent inductance. In addition, at least a 4.7 µF bulk electrolytic capacitor should be used between VCC and GND for each eight devices. The bulk capacitor should be located near where the power supply is connected to the array. The purpose of the bulk capacitor is to overcome the voltage drop caused by the inductive effects of the PC board traces.
TABLE 2. Manufacturer’s Identification Code
Pins A0 A9 O7 O6 O5 O4 O3 O2 O1 O0 Hex
(12) (26) (21) (19) (18) (17) (16) (15) (14) (13) Data
Manufacturer Code
V
IL
12V100011118F
Device Code V
IH
12V0000011107
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NM27C020 2,097,152-Bit (256K x 8) UV Erasable CMOS EPROM
32-Lead EPROM Ceramic Dual-In-Line Package (Q)
Order Number NM27C020Q
Package Number J32AQ
Physical Dimensions inches (millimeters) unless otherwise noted
1.660 MAX
32
1
17
16
R 0.025
R 0.030-0.055
TYP
UV WINDOW SIZE AND CONFIGURATION DETERMINED BY DEVICE SIZE
0.590-0.620
0.175 MAX
0.060-0.100 TYP
0.050-0.060 TYP
0.015-0.021 TYP
86°-94°
TYP
0.150 MIN TYP
0.015 -0.060 TYP
0.10
MAX
0.090-0.110 TYP
0.005 MIN TYP
0.225 MAX TYP
0.125 MIN TYP
90° - 100°
TYP
0.685
+0.025
-0.060
0.008-0.012 TYP
0.585 MAX
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NM27C020 2,097,152-Bit (256K x 8) UV Erasable CMOS EPROM
32-Lead PDIP Package
Order Number NM27C020N
Physical Dimensions inches (millimeters) unless otherwise noted
1.64 – 1.66
(41.66 – 42.164)
32
1
17
16
0.062
(1.575)
RAD
Pin No. 1 IDENT
0.580
(14.73)
MIN
0.600 – 0.620
(15.240 – 15.748)
0.145 – 0.210
(3.683 – 5.334)
0.040 - 0.090
(1.016 – 2.286)
0.050
(1.270)
TYP
TYP
0.125 – 0.165
(3.175 – 4.191)
0.018 ±0.003
(0.457 ±0.078)
0.035 – 0.07
(0.889 – 1.778)
86°- 94°
TYP
0.120 – 0.150 (3.048 – 3.81)
0.015
(0.381)
0.100 ±0.010
(2.540 ±0.254)
90°–105°
0.008 - 0.015
(0.203 – 0.381)
0.490 – 0.550
(12.446 – 13.97)
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NM27C020 2,097,152-Bit (256K x 8) UV Erasable CMOS EPROM
Physical Dimensions inches (millimeters) unless otherwise noted
32-Lead PLCC Package
Order Number NM27C020V
Package Number VA32A
0.007[0.18]
A
S
S
F-G
0.007[0.18]
B
S
D-E
0.449-0.453
[11.40-11.51]
S
0.045 [1.143]
0.000-0.010 [0.00-0.25]
Polished Optional
0.585-0.595
[14.86-15.11]
0.549-0.553
[13.94-14.05]
-B-
-F-
-E-
-G-
0.050
21
29
30
1
4
2014
13
5
-D-
0.007[0.18]
B
S
D-E
S
0.002[0.05]
B
S
-A-
0.485-0.495
[12.32-12.57]
0.007[0.18]
A
S
S
F-G
A
0.002[0.05]
S
S
0.007[0.18]
C
M
S
D-E, F-G
0.015[0.38]
C D-E, F-G
0.490-0530
[12.45-13.46]
0.078-0.095 [1.98-2.41]
0.013-0.021 [0.33-0.53]
0.004[0.10]
0.123-0.140 [3.12-3.56]
See detail A
-J-
-C-
0.400
[10.16]
( )
TYP
0.541-0.545
[13.74-13-84]
0.023-0.029 [0.58-0.74]
0.106-0.112 [2.69-2.84]
60°
0.015 [0.38]
Base Plane
-H-
Min Typ
S
0.027-0.033 [0.69-0.84]
0.025
[0.64]
Min
0.025 [0.64]
Min
0.031-0.037 [0.79-0.94]
0.053-0.059 [1.65-1.80]
0.006-0.012 [0.15-0.30]
0.019-0.025 [0.48-0.64]
0.065-0.071 [1.65-1.80]
0.021-0.027 [0.53-0.69]
Section B-B
Typical
0.007[0.18]
H
S
S
D-E, F-G
0.010[0.25]
B A
S
D-E, F-G
0.118-0.129 [3.00-3.28]
L
B
B
45°X
0.042-0.048 [1.07-1.22]
0.026-0.032 [0.66-0.81]
Typ
0.0100 [0.254]
0.030-0.040 [0.76-1.02]
R
0.005 [0.13]
Max
0.020 [0.51]
0.045 [1.14]
Detail A
Typical
Rotated 90°
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