Datasheet NM25C020LEM8X, NM25C020LEMT8, NM25C020LEMT8X, NM25C020LZM8, NM25C020LZM8X Datasheet (Fairchild Semiconductor)

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NM25C020 Rev. D.1
NM25C020 2K-Bit Serial CMOS EEPROM
(Serial Periphrial Interface (SPI) Synchronous Bus)
March 1999
© 1999 Fairchild Semiconductor Corporation
NM25C020 2K-Bit Serial CMOS EEPROM (Serial Peripheral Interface (SPI) Synchronous Bus)
General Description
The NM25C020 is a 2048-bit CMOS EEPROM with an SPI compatible serial interface. The NM25C020 is designed for data storage in applications requiring both non-volatile memory and in­system data updates. This EEPROM is well suited for applications using the 68HC11 series of microcontrollers that support the SPI interface for high speed communication with peripheral devices via a serial bus to reduce pin count. The NM25C020 is imple­mented in Fairchild Semiconductor’s floating gate CMOS process that provides superior endurance and data retention.
The serial data transmission of this device requires four signal lines to control the device operation: Chip Select (CS), Clock (SCK), Data In (SI), and Serial Data Out (SO). All programming cycles are completely self-timed and do not require an erase before WRITE.
BLOCK WRITE protection is provided by programming the STA­TUS REGISTER with one of four levels of write protection. Additionally, separate WRITE enable and WRITE disable instruc­tions are provided for data protection.
Hardware data protection is provided by the WP pin to protect against inadvertent programming. The HOLD pin allows the serial communication to be suspended without resetting the serial sequence.
Block Diagram
Features
2.1 MHz clock rate @ 2.7V to 5.5V
2048 bits organized as 256 x 8
Multiple chips on the same 3-wire bus with separate chip
select lines
Self-timed programming cycle
Simultaneous programming of 1 to 4 bytes at a time
Status register can be polled during programming to monitor
READY/BUSY
Write Protect (WP) pin and write disable instruction for both hardware and software write protection
Block write protect feature to protect against accidental writes
Endurance: 1,000,000 data changes
Data retention greater than 40 years
Packages available: 8-pin DIP, 8-pin SO, or 8-pin TSSOP
DS012400-1
Instruction
Decoder
Control Logic
and Clock
Generators
High Voltage
Generator
and
Program
Timer
Instruction
Register
Program Enable
Data In/Out Register
8 Bits
Data Out
Buffer
Non-Volatile
Status Register
Decoder 1 of 256
Address Counter/ Register
EEPROM Array
2048 Bits (256 x 8)
Read/Write Amps
CS
HOLD
SCK
V
CC
V
SS
V
PP
WP
SI
SO
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NM25C020 Rev. D.1
NM25C020 2K-Bit Serial CMOS EEPROM
(Serial Periphrial Interface (SPI) Synchronous Bus)
Connection Diagram
Dual-In-Line Package (N), SO Package (M8),
and TSSOP Package (MT8)
Top View
See Package Number N08E (N), M08A (M8), and MTC08 (MT8)
Pin Names
CS Chip Select Input
SO Serial Data Output WP Write Protect V
SS
Ground
SI Serial Data Input
SCK Serial Clock Input
HOLD Suspends Serial Data
V
CC
Power Supply
Ordering Information NM 25 C XX LZ E XX Letter Description
Package N 8-pin DIP
M8 8-pin SO MT8 8-pin TSSOP
Temp. Range None 0 to 70°C
V -40 to +125°C E -40 to +85°C
Voltage Operating Range Blank 4.5V to 5.5V
L 2.7V to 4.5V LZ 2.7V to 4.5V and
<1µA Standby Current
Density/Mode 020 2K, mode 0
C CMOS technology
Interface 25 SPI
NM Fairchild Nonvolatile
Memory Prefix
CS
SO
WP V
SS
V
CC
HOLD SCK SI
8 7 6 5
1 2 3 4
NM25C020
DS012400-2
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NM25C020 Rev. D.1
NM25C020 2K-Bit Serial CMOS EEPROM
(Serial Periphrial Interface (SPI) Synchronous Bus)
Standard Voltage 4.5 VCC 5.5V Specifications Absolute Maximum Ratings (Note 1)
Ambient Storage Temperature -65°C to +150°C All Input or Output Voltage with
Respect to Ground +6.5V to -0.3V Lead Temp. (Soldering, 10 sec.) +300°C ESD Rating 2000V
Operating Conditions
Ambient Operating Temperature
NM25C020 0°C to +70°C NM25C020E -40°C to +85°C NM25C020V -40°C to +125°C
Power Supply (VCC) 4.5V to 5.5V
DC and AC Electrical Characteristics 4.5V V
CC
5.5V (unless otherwise specified)
Symbol Parameter Conditions Min Max Units
I
CC
Operating Current CS = V
IL
3mA
I
CCSB
Standby Current CS = V
CC
50 µA
I
IL
Input Leakage VIN = 0 to V
CC
-1 +1 µA
I
OL
Output Leakage V
OUT
= GND to V
CC
-1 +1 µA
V
IL
CMOS Input Low Voltage -0.3 VCC * 0.3 V
V
IH
CMOS Input High Voltage 0.7 * VCCVCC + 0.3 V
V
OL
Output Low Voltage IOL = 1.6 mA 0.4 V
V
OH
Output High Voltage IOH = -0.8 mA VCC - 0.8 V
f
OP
SCK Frequency 2.1 MHz
t
RI
Input Rise Time 2.0 µs
t
FI
Input Fall Time 2.0 µs
t
CLH
Clock High Time (Note 2) 190 ns
t
CLL
Clock Low Time (Note 2) 190 ns
t
CSH
Min CS High Time (Note 3) 240 ns
t
CSS
CS Setup Time 240 ns
t
DIS
Data Setup Time 100 ns
t
HDS
HOLD Setup Time 90 ns
t
CSN
CS Hold Time 240 ns
t
DIN
Data Hold Time 100 ns
t
HDN
HOLD Hold Time 90 ns
t
PD
Output Delay CL = 200 pF 240 ns
t
DH
Output Hold Time 0 ns
t
LZ
HOLD to Output Low Z 100 ns
t
DF
Output Disable Time CL = 200 pF 240 ns
t
HZ
HOLD to Output High Z 100 ns
t
WP
Write Cycle Time 1–4 Bytes 10 ms
Capacitance T
A
= 25°C, f = 2.1/1 MHz (Note 4)
Symbol Test Typ Max Units
C
OUT
Output Capacitance 3 8 pF
C
IN
Input Capacitance 2 6 pF
AC Test Conditions
Output Load CL = 200 pF Input Pulse Levels 0.1 * VCC – 0.9 * V
CC
Timing Measurement Reference Level 0.3 * VCC - .07 * V
CC
Note 1: Stress above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only, and functional operation of the device at these or any other conditions above those indicated in the operational sections of the specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Note 2: The fOP frequency specification specifies a minimum clock period of 1/fOP. Therefore, for every fOP clock cycle, t
CLH
+ t
CLL
must be equal to or greater than 1/fOP. For
example, if the 2.1MHz period = 476ns and t
CLH
= 190ns, t
CLL
must be 286ns.
Note 3: CS must be brought high for a minimum of t
CSH
between consecutive instruction cycles.
Note 4: This parameter is periodically sampled and not 100% tested.
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NM25C020 Rev. D.1
NM25C020 2K-Bit Serial CMOS EEPROM
(Serial Periphrial Interface (SPI) Synchronous Bus)
Low Voltage 2.7V VCC 4.5V Specifications Absolute Maximum Ratings (Note 5)
Ambient Storage Temperature -65°C to +150°C All Input or Output Voltage with
Respect to Ground +6.5V to -0.3V Lead Temp. (Soldering, 10 sec.) +300°C ESD Rating 2000V
Operating Conditions
Ambient Operating Temperature
NM25C020L/LZ 0°C to +70°C NM25C020LE/LZE -40°C to +85°C NM25C020LV -40°C to +125°C
Power Supply (VCC) 2.7V–4.5V
DC and AC Electrical Characteristics 2.7V V
CC
4.5V (unless otherwise specified)
25C020L/LE 25C020LV
25C020LZ/LZE
Symbol Parameter Part Conditions Min. Max. Min Max Units
I
CC
Operating Current CS = V
IL
33mA
I
CCSB
Standby Current L CS = V
CC
10 10 µA
LZ 1 N/A µA
I
IL
Input Leakage VIN = 0 to V
CC
-1 1 -1 1 µA
I
OL
Output Leakage V
OUT
= GND to V
CC
-1 1 -1 1 µA
V
IL
Input Low Voltage -0.3 VCC * 0.3 -0.3 VCC * 0.3 V
V
IH
Input High Voltage 0.7 * VCCVCC + 0.3 0.7 * VCCVCC + 0.3 V
V
OL
Output Low Voltage I
OL
= 0.8 mA 0.4 0.4 V
V
OH
Output High Voltage I
OH
= –0.8 mA VCC - 0.8 VCC - 0.8 V
f
OP
SCK Frequency 1.0 1.0 MHz
t
RI
Input Rise Time 2.0 2.0 µs
t
FI
Input Fall Time 2.0 2.0 µs
t
CLH
Clock High Time (Note 6) 410 410 ns
t
CLL
Clock Low Time (Note 6) 410 410 ns
t
CSH
Min. CS High Time (Note 7) 500 500 ns
t
CSS
CS Setup Time 500 500 ns
t
DIS
Data Setup Time 100 100 ns
t
HDS
HOLD Setup Time 240 240 ns
t
CSN
CS Hold Time 500 500 ns
t
DIN
Data Hold Time 100 100 ns
t
HDN
HOLD Hold Time 240 240 ns
t
PD
Output Delay CL = 200 pF 500 500 ns
t
DH
Output Hold Time 0 0 ns
t
LZ
HOLD Output Low Z 240 240 ns
t
DF
Output Disable Time CL = 200 pF 500 500 ns
t
HZ
HOLD to Output Hi Z 240 240 ns
t
WP
Write Cycle Time 1-4 Bytes 15 15 ms
Capacitance T
A
= 25°C, f = 2.1/1 MHz (Note 8)
Symbol Test Typ Max Units
C
OUT
Output Capacitance 3 8 pF
C
IN
Input Capacitance 2 6 pF
AC Test Conditions
Output Load IOL = 10 µA, IOH = 10 µA Input Pulse Levels 0.3V to 3.5V Timing Measurement Reference Level
Input 0.4V and 1.6V Output 0.8V and 1.6V
Note 5: Stress above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only, and functional operation of the device at these or any other conditions above those indicated in the operational sections of the specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Note 6: The fOP frequency specification specifies a minimum clock period of 1/fOP. Therefore, for every fOP clock cycle, t
CLH
+ t
CLL
must be equal to or greater than 1/fOP. For
example, if the 2.1MHz period = 476ns and t
CLH
= 190ns, t
CLL
must be 286ns.
Note 7: CS must be brought high for a minimum of t
CSH
between consecutive instruction cycles.
Note 8: This parameter is periodically sampled and not 100% tested.
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NM25C020 Rev. D.1
NM25C020 2K-Bit Serial CMOS EEPROM
(Serial Periphrial Interface (SPI) Synchronous Bus)
AC Test Conditions (Continued)
FIGURE 1. Synchronous Data Timing Diagram
FIGURE 3. SPI Serial Interface
CS
SCK
SI
SO
V
IH
V
IL
V
IH
V
IL
V
IH
V
IL
V
OH
V
OL
t
CSS
t
CSH
t
CSN
t
DIS
t
PD
t
DH
t
DF
t
DIN
t
CLH
t
CLL
SI SO SCK CS
DATA OUT (MOSI)
DATA IN (MISO)
SERIAL CLOCK (CLK)
SS0 SS1 SS2 SS3
SI SO SCK CS
SI SO SCK CS
SI SO SCK CS
SPI CHIP SELECTION
MASTER MCU
NM25C020
DS012400-3
DS012400-4
SCK
HOLD
SO
t
HZ
t
HDN
t
HDS
t
HDN
t
HDS
t
LZ
DS012400-6
FIGURE 2. HOLD Timing
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NM25C020 Rev. D.1
NM25C020 2K-Bit Serial CMOS EEPROM
(Serial Periphrial Interface (SPI) Synchronous Bus)
Functional Description
TABLE 1. Instruction Set
Instruction Instruction Operation
Name Opcode
WREN 00000110 Set Write Enable Latch
WRDI 00000100 Reset Write Enable Latch
RDSR 00000101 Read Status Register
WRSR 00000001 Write Status Register
READ 00000011 Read Data from Memory
Array
WRITE 00000010 Write Data to Memory Array
MASTER: The device that generates the serial clock is desig­nated as the master. The NM25C020 can never function as a master.
SLAVE: The NM25C020 always operates as a slave as the serial clock pin is always an input.
TRANSMITTER/RECEIVER: The NM25C020 has separate pins for data transmission (SO) and reception (SI).
MSB: The Most Significant Bit is the first bit transmitted and received.
CHIP SELECT: The chip is selected when pin CS is low. When the chip is
not
selected, data will not be accepted from pin SI, and the
output pin SO is in high impedance. SERIAL OP-CODE: The first byte transmitted after the chip is
selected with CS going low contains the op-code that defines the operation to be performed.
PROTOCOL: When connected to the SPI port of a 68HC11 microcontroller, the NM25C020 accepts a clock phase of 0 and a clock polarity of 0. The SPI protocol for this device defines the byte transmitted on the SI and SO data lines for proper chip operation. See Figure 4.
CS
SI
SO
INVALID CODE
DS012400-7
CS
SCK
SI
SO
Bit 7 Bit 6 Bit 0
Bit 1Bit 7 Bit 0
DS012400-5
FIGURE 4. SPI Protocol
Data is clocked in on the positive SCK edge and out on the negative SCK edge.
HOLD: The HOLD pin is used in conjunction with the CS to select the device. Once the device is selected and a serial sequence is underway, HOLD may be forced low to suspend further serial communication with the device without resetting the serial se­quence. Note that HOLD must be brought low while the SCK pin is low. The device must remain selected during this sequence. To resume serial communication HOLD is brought high while the SCK pin is low. The SO pin is at a high impedance state during HOLD.
INVALID OP-CODE: After an invalid code is received, no data is shifted into the NM25C020, and the SO data output pin remains high impedance until a new CS falling edge reinitializes the serial communication. See Figure 5.
FIGURE 5. Invalid Op-Code
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NM25C020 Rev. D.1
NM25C020 2K-Bit Serial CMOS EEPROM
(Serial Periphrial Interface (SPI) Synchronous Bus)
Functional Description (Continued)
READ SEQUENCE: Reading the memory via the serial SPI link
requires the following sequence. The CS line is pulled low to select the device. The READ op-code is transmitted on the SI line followed by the byte address (A7–A0) to be read. After this is done, data on the SI line becomes don’t care. The data (D7–D0) at the address specified is then shifted out on the SO line. If only one byte is to be read, the CS line can be pulled back to the high level. It is possible to continue the READ sequence as the byte adress is automatically incremented and data will continue to be shifted out as clock pulses are continuously applied. When the highest address is reached (FF), the address counter rolls over to lowest address (000) allowing the entire memory to be read in one continuous READ cycle. See Figure 6.
Level Status Register Bits Array
Address
BP1 BP0 Protected
0 0 0 None 1 0 1 C0-FF 2 1 0 80-FF 3 1 1 00-FF
WRITE ENABLE (WREN): When VCC is applied to the chip, it “powers up” in the write disable state. Therefore, all programming modes must be preceded by a WRITE ENABLE (WREN) instruc­tion. At the completion of a WRITE or WRSR cycle the device is automatically returned to the write disable state. Note that a WRITE DISABLE (WRDI) instruction will also return the device to the write disable state. See Figure 8.
FIGURE 8. Write Enable
CS
SI
SO
WREN Op-Code
DS012400-10
WRITE DISABLE (WRDI): To protect against accidental data disturbance the WRITE DISABLE (WRDI) instruction disables all programming modes. See Figure 9.
FIGURE 9. Write Disable
CS
SI
SO
WRDI Op-Code
DS012400-11
TABLE 3. Block Write Protection Levels
FIGURE 6. Read Sequence
FIGURE 7. Read Status
CS
SI
SO
Read
Op-Code
Byte
Addr.
DatanData
n+1
Data
n+2
Data
n+3
CS
SI
SO
RDSR
Op-Code
SR Data
MSB…LSB
DS012400-8
DS012400-9
READ STATUS REGISTER (RDSR) : The Read Status Register (RDSR) instruction provides access to the status register and is used to interrogate the READY/BUSY and WRITE ENABLE status of the chip. (Two non-volatile status register bits are used to select one of four levels of BLOCK WRITE PROTECTION.) The status register format is shown in Table 2.
TABLE 2. Status Register Format
Bit Bit Bit Bit Bit Bit Bit Bit
76543210
X X X X BP1 BP0 WEN RDY
X = Don't Care
Status register Bit 0 = 0 (RDY) indicates that the device is READY; Bit 0 = 1 indicates that a program cycle is in progress. Bit 1 = 0 (WEN) indicates that the device is not WRITE ENABLED; Bit 1 = 1 indicates that the device is WRITE ENABLED. Non-volatile status register Bits 2 and 3 (BP0 and BP1) indicate the level of BLOCK WRITE PROTECTION selected. The block write protec­tion levels and corresponding status register control bits are shown in Table 3. Note that if a RDSR instruction is executed during a programming cycle only the RDY bit is valid. All other bits are 1s. See Figure 7.
WRITE SEQUENCE: To program the device, the WRITE PRO­TECT (WP) pin must be held high and two separate instructions
must be executed. The chip must first be write enabled via the WRITE ENABLE instruction and then a WRITE instruction must be executed. Moreover, the address of the memory location(s) to be programmed must be outside the protected address field selected by the Block Write Protection Level. See Table 3.
A WRITE command requires the following sequence. The CS line is pulled low to select the device, then the WRITE op-code is transmitted on the SI line followed by the byte address(A7–A0) and the corresponding data (D7-D0) to be written. Programming will start after the CS pin is forced back to a high level. Note that the LOW to HIGH transition of the CS pin must occur during the SCK low time immediately after clocking in the D0 data bit. See Figure
10.
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NM25C020 Rev. D.1
NM25C020 2K-Bit Serial CMOS EEPROM
(Serial Periphrial Interface (SPI) Synchronous Bus)
Functional Description (Continued)
SCK
SI
SO
CS
D0D1D2
CS
SI
SO
Write
Op-Code
Byte
Addr (n)
Data
(n)
Data
(n + 1)
Data
(n + 2)
Data
(n + 3)
DS012400-12
DS012400-13
FIGURE 11. 4 Byte Page Write
FIGURE 10. Write Sequence
The READY/BUSY status of the device can be determined by executing a READ STATUS REGISTER (RDSR) instruction. Bit 0 = 1 indicates that the WRITE cycle is still in progress and Bit 0 = 0 indicates that the WRITE cycle has ended. During the WRITE programming cycle (Bit 0 = 1) only the READ STATUS REGIS­TER instruction is enabled.
The NM25C020 is capable of a 4 byte PAGE WRITE operation. After receipt of each byte of data the two low order address bits are internally incremented by one. The seven high order bits of the address will remain constant. If the master should transmit more than 4 bytes of data, the address counter will “roll over,” and the previously loaded data will be reloaded. See Figure 11.
At the completion of a WRITE cycle the device is automati­cally returned to the write disable state.
If the device is not WRITE enabled, the device will ignore the WRITE instruction and return to the standby state when CS is forced high. A new CS falling edge is required to re-initialize the serial communication.
WRITE STATUS REGISTER (WRSR): The WRITE STATUS REGISTER (WRSR) instruction is used to program the non­volatile status register Bits 2 and 3 (BP0 and BP1). The WRITE PROTECT (WP) pin must be held high and two separate instruc­tions must be executed. The chip must first be write enabled via the WRITE ENABLE instruction and then a WRSR instruction must be executed.
CS
SI
SO
WRSR
Op-Code
SR Data
xxxxBP1BP0xx
DS012400-14
FIGURE 12. Write Status Register
BP0
SCK
SI
SO
CS
DS012400-15
FIGURE 13. Start WRSR Condition
The WRSR command requires the following sequence. The CS line is pulled low to select the device and then the WRSR op-code is transmitted on the SI line followed by the data to be pro­grammed. See Figure 12.
Note that the first four bits are don’t care bits followed by BP1 and BP0 then two additional don’t care bits. Programming will start after the CS pin is forced back to a high level. As in the WRITE instruction the LOW to HIGH transition of the CS pin must occur during the SCK low time immediately after clocking in the last don’t care bit. See Figure 13.
The READY/BUSY status of the device can be determined by executing a READ STATUS REGISTER (RDSR) instruction. Bit 0 = 1 indicates that the WRSR cycle is still in progress and Bit 0 = 0 indicates that the WRSR cycle has ended.
At the completion of a WRITE cycle the device is automatically returned to the write disable state.
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NM25C020 Rev. D.1
NM25C020 2K-Bit Serial CMOS EEPROM
(Serial Periphrial Interface (SPI) Synchronous Bus)
Molded Small Out-Line Package (M8)
Package Number M08A
Molded Dual-In-Line Package (N)
Package Number N08E
Physical Dimensions inches (millimeters) unless otherwise noted
0.373 - 0.400
(9.474 - 10.16)
0.092
(2.337)
DIA
+
1234
8765
0.250 - 0.005
(6.35 ± 0.127)
87
0.032 ± 0.005
(0.813 ± 0.127)
Pin #1
Option 2
RAD
1
0.145 - 0.200
(3.683 - 5.080)
0.130 ± 0.005
(3.302 ± 0.127)
0.125 - 0.140
(3.175 - 3.556)
0.020
(0.508)
Min
0.018 ± 0.003
(0.457 ± 0.076)
90° ± 4°
Typ
0.100 ± 0.010
(2.540 ± 0.254)
0.040
(1.016)
0.039
(0.991)
Typ.
20° ± 1°
0.065
(1.651)
0.050
(1.270)
0.060
(1.524)
Pin #1 IDENT
Option 1
0.280
MIN
0.300 - 0.320 (7.62 - 8.128)
0.030
(0.762)
MAX
0.125
(3.175)
DIA
NOM
0.009 - 0.015
(0.229 - 0.381)
0.045 ± 0.015
(1.143 ± 0.381)
0.325
+0.040
-0.015
8.255
+1.016
-0.381
95° ± 5°
0.090
(2.286)
(7.112)
IDENT
1234
8765
0.189 - 0.197
(4.800 - 5.004)
0.228 - 0.244
(5.791 - 6.198)
Lead #1
IDENT
Seating
Plane
0.004 - 0.010
(0.102 - 0.254)
0.014 - 0.020
(0.356 - 0.508)
0.014
(0.356)
Typ.
0.053 - 0.069
(1.346 - 1.753)
0.050
(1.270)
Typ
0.016 - 0.050 (0.406 - 1.270) Typ. All Leads
8° Max, Typ.
All leads
0.150 - 0.157
(3.810 - 3.988)
0.0075 - 0.0098 (0.190 - 0.249) Typ. All Leads
0.04
(0.102)
All lead tips
0.010 - 0.020
(0.254 - 0.508)
x 45°
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NM25C020 Rev. D.1
NM25C020 2K-Bit Serial CMOS EEPROM
(Serial Periphrial Interface (SPI) Synchronous Bus)
8-Pin Molded TSSOP, JEDEC (MT8)
Package Number MTC08
Physical Dimensions inches (millimeters) unless otherwise noted
Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications.
Life Support Policy
Fairchild's products are not authorized for use as critical components in life support devices or systems without the express written approval of the President of Fairchild Semiconductor Corporation. As used herein:
1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user.
2. A critical component is any component of a life support device or system whose failure to perform can be reasonably ex­pected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
Fairchild Semiconductor Fairchild Semiconductor Fairchild Semiconductor Fairchild Semiconductor Americas Europe Hong Kong Japan Ltd. Customer Response Center Fax: +44 (0) 1793-856858 8/F, Room 808, Empire Centre 4F, Natsume Bldg.
Tel. 1-888-522-5372 Deutsch Tel: +49 (0) 8141-6102-0 68 Mody Road, Tsimshatsui East 2-18-6, Yushima, Bunkyo-ku
English Tel: +44 (0) 1793-856856 Kowloon. Hong Kong Tokyo, 113-0034 Japan Français Tel: +33 (0) 1-6930-3696 Tel; +852-2722-8338 Tel: 81-3-3818-8840 Italiano Tel: +39 (0) 2-249111-1 Fax: +852-2722-8383 Fax: 81-3-3818-8841
0.114 - 0.122 (2.90 - 3.10)
0.123 - 0.128 (3.13 - 3.30)
0.246 - 0.256 (6.25 - 6.5)
14
85
0.169 - 0.177 (4.30 - 4.50)
(7.72) Typ
(4.16) Typ
(1.78) Typ
(0.42) Typ
(0.65) Typ
0.002 - 0.006 (0.05 - 0.15)
0.0256 (0.65) Typ.
0.0433 (1.1)
Max
0.0075 - 0.0098 (0.19 - 0.30)
Pin #1 IDENT
0.0035 - 0.0079
0°-8°
0.020 - 0.028 (0.50 - 0.70)
0.0075 - 0.0098 (0.19 - 0.25)
Seating
plane
Gage plane
See detail A
Notes: Unless otherwise specified
1. Reference JEDEC registration MO153. Variation AA. Dated 7/93
Land pattern recommendation
DETAIL A
Typ. Scale: 40X
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