Philips Semiconductors Product specification
NE/SA568A150MHz phase-locked loop
1996 Feb 1
4
C
9
1
2 (50) (fO)
F
At 70MHz, the calculated value is 45pF. Empirical results with the
test and application board were improved when a 47pF capacitor
was used.
The natural frequency for the loop filter is set by C
10
and R1. If the
center frequency of the loop is 70MHz and the full demodulated
bandwidth is desired, i.e., f
BW
= fO/7 = 10MHz, and a value for R1 is
chosen, the value of C
10
can be calculated.
C
10
1
2 R1f
BW
F
Also,
C
11
1
2350f
BW(Hz)
This capacitance determines the signal bandwidth of the output
buffer amplifier. (For further inofrmation see Philips application note
AN1881 “The NE568A Phase Locked Loop as a Wideband Video
Demodulator”.
Parts List and Layout 40MHz Application NE568AD
C
1
100nF ±10% Ceramic chip 1206
C
2
1
18pF ±2% Ceramic chip 0805
C
2
2
16pF ±2% Ceramic ORChip
C
3
100nF ±10% Ceramic chip 1206
C
4
100nF ±10% Ceramic chip 1206
C
5
6.8µF ±10% Tantalum 35V
C
6
100nF ±10% Ceramic chip 1206
C
7
100nF ±10% Ceramic chip 1206
C
8
100nF ±10% Ceramic chip 1206
C
9
47pF ±2% Ceramic chip 0805 or 1206
C
10
560pF ±2% Ceramic chip 0805 or 1206
C
11
47pF ±2% Ceramic chip 0805 or 1206
C
12
100nF ±10% Ceramic chip 1206
C
13
100nF ±10% Ceramic chip 1206
R
1
27Ω ±10% Chip CR32 1/4W
R
2
1.2kΩ Trim pot
R
3
3
43Ω ±10% Chip CR32 1/4W
R
4
4
3.9kΩ ±10% Chip CR32 1/4W
R
5
3
50Ω ±10% Chip CR32 1/4W
RFC
1
5
10µH ±10% Surface mount
RFC
2
5
10µH ±10% Surface mount
NOTES:
1. 18pF with Pin 12 ground and Pin 13 no connect (open).
2. C
2
+ C
STRAY
= 16pF for temperature-compensated configuration
with R
4
= 3.9kΩ.
3. For 50Ω setup. R1 = 62Ω, R3 = 75Ω for 75Ω application.
4. For test configuration R
4
= 0Ω (GND) and C2 = 18pF.
5. 0Ω chip resistors (jumpers) may be substituted with minor degra-
dation of performance.
Parts List and Layout 70MHz Application NE568AN
C
1
100nF ±10% Ceramic chip 50V
C
2
1
18pF ±2% Ceramic chip 50V
C
2
2
16pF ±2% Ceramic chip 0805
C
3
100nF ±10% Ceramic chip 50V
C
4
100nF ±10% Ceramic chip 50V
C
5
6.8µF ±10% Tantalum 35V
C
6
100nF ±10% Ceramic chip 50V
C
7
100nF ±10% Ceramic chip 50V
C
8
100nF ±10% Ceramic chip 50V
C
9
47pF ±2% Ceramic chip 50V
C
10
560pF ±2% Ceramic chip 50V
C
11
47pF ±2% Ceramic chip 50V
C
12
100nF ±10% Ceramic chip 50V
C
13
100nF ±10% Ceramic chip 50V
R
1
27Ω ±10% Ceramic chip
CR32
1/4W
R
2
1.2kΩ Trim pot
R
3
3
43Ω ±10% Ceramic chip
CR32
1/4W
R
4
4
3.9kΩ ±10% Ceramic chip
CR32
1/4W
R
5
3
50Ω ±10% Ceramic chip
CR32
1/4W
RFC
1
10µH ±10% Surface mount
RFC
2
10µH ±10% Surface mount
NOTES:
1. 18pF with Pin 12 ground and Pin 13 no connect (open).
2. C
2
+ C
STRAY
= 16pF for temperature-compensated configuration
with R
4
= 3.9kΩ.
3. For 50Ω setup. R1 = 62Ω, R3 = 75Ω for 75Ω application.
4. For test configuration R
4
= 0Ω (GND) and C2 = 18pF.