Datasheet ncv8450 Datasheet

Page 1
NCV8450
Self-Protected High Side Driver with Temperature and Current Limit
Features
• Short Circuit Protection
• Thermal Shutdown with Automatic Restart
• Overvoltage Protection
• Integrated Clamp for Inductive Switching
• Loss of Ground Protection
• ESD Protection
• Slew Rate Control for Low EMI
• Very Low Standby Current
• AEC−Q100/101 qualified
• This is a Pb−Free Device
of 1.0 W and an internal current limit of 0.8 A
DS(on)
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MARKING DIAGRAM
SOT−223 (TO−261)
CASE 318E
A = Assembly Location Y = Year W = Work Week G = Pb−Free Package
(Note: Microdot may be in either location)
AYW
V8450G
G
1
Typical Applications
• Automotive
• Industrial
PRODUCT SUMMARY
Symbol Characteristics Value Unit
V
V
R
IN_CL
D(on)
on
Overvoltage Protection 54 V
Operation Voltage 4.5 − 45 V
On−State Resistance 1.0
ORDERING INFORMATION
See detailed ordering and shipping information in the package dimensions section on page 8 of this data sheet.
W
© Semiconductor Components Industries, LLC, 2010
February, 2010 − Rev. 2
1 Publication Order Number:
NCV8450/D
Page 2
(Pin 1)
NCV8450
V
(Pins 2, 4)
D
Regulated
Charge Pump
Output
Clamping
Control
Logic
IN
R_IN
Current
Limitation
Overtemperature
Detection
OUT (Pin 3)
PACKAGE PIN DESCRIPTION
Pin # Symbol Description
1 IN Control Input, Active Low
2 V
3 OUT Output
4 V
Figure 1. Block Diagram
D
D
Supply Voltage
Supply Voltage
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NCV8450
MAXIMUM RATINGS
Value
Rating Symbol
DC Supply Voltage (Note 1) V
Load Dump Protection (RI = 2 W, t
= 400 ms, VIN = 0, 10 V, IL = 150 mA, Vbb = 13.5 V)
d
Input Current I
Output Current (Note 1) I
Total Power Dissipation
@ TA = 25°C (Note 2)
V
Loaddump
in
out
P
D
D
@ TA = 25°C (Note 3)
Electrostatic Discharge (Note 4) (Human Body Model (HBM) 100 pF/1500 W) Input All other
Single Pulse Inductive Load Switching Energy (Note 4) (V
= 13.5 V, I = 465 mApk, L = 200 mH, T
DD
JStart
= 150°C)
Operating Junction Temperature T
Storage Temperature T
E
AS
J
storage
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
1. Reverse Output current has to be limited by the load to stay within absolute maximum ratings and thermal performance.
2. Minimum Pad.
3. 1 in square pad size, FR−4, 1 oz Cu.
4. Not subjected to production testing.
Min Max
Unit
−16 45 V
100 V
−15 15 mA
Internally Limited A
W
1.13
1.60
kV
1 5
29 mJ
−40 +150 °C
−55 +150 °C
THERMAL RESISTANCE RATINGS
Parameter Symbol Max Value Unit
Thermal Resistance (Note 5)
Junction−to−Ambient (Note 2) Junction−to−Ambient (Note 3)
5. Not subjected to production testing.
R
q
JA
R
q
JA
+−
I
D
V
D
I
IN
V
OUT
OUTIN
NCV8450
Figure 2. Applications Test Circuit
110
K/W
78.3
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Page 4
NCV8450
ELECTRICAL CHARACTERISTICS (6 v V
v 45 V; −40°C <TJ < 150°C unless otherwise specified)
D
Value
Rating
Symbol Conditions
Min Typ Max
OUTPUT CHARACTERISTICS
Operating Supply Voltage
On Resistance (Pin 1 Connected to GND)
Standby Current (Pin 1 Open) I
V
SUPPLY
R
ON
D
TJ = 25°C , I
T
= 150°C, I
J
TJ = 25°C , I
= 150 mA, VD = 7 V − 45 V
OUT
= 150 mA, VD = 7 V − 45 V
OUT
(Note 6)
= 150 mA, VD = 6 V
OUT
V
v 20 V
D
V
> 20 V
D
4.5 − 45 V
1.0
1.4
1.1
2 3
2.1
0.6 10 100
INPUT CHARACTERISTICS
Input Current – Off State
Input Current – On State (Pin 1 Grounded)
Input Resistance (Note 6) R
I
IN_OFF
I
IN_ON
IN
V
OUT
V
v 0.1 V, RL = 270 W, TJ = 25°C
OUT
v 0.1V, R
= 270 W, TJ = 150°C (Note 6)
L
−50
−40
1.5 3 mA
1
SWITCHING CHARACTERISTICS
Turn−On Time (Note 7)
= V
IN
D
to 0 V) to 90% V
(V
Turn−Off Time (Note 7) (V
IN
= 0 V to V
) to 10% V
D
Slew Rate On (Note 7)
IN
OUT
= V
to 0V) 10% to 30%
D
(V V
Slew Rate Off (Note 7) (V
= 0 V to VD) 70% to 40%
IN
V
OUT
OUT
OUT
t
t
OFF
dV/dt
dV/dt
ON
ON
OFF
RL = 270 W (Note 6)
= 13.5 V, RL = 270 W, TJ = 25°C
V
D
RL = 270 W (Note 6)
= 13.5 V, RL = 270 W, TJ = 25°C
V
D
RL = 270 W (Note 6)
= 13.5 V, RL = 270 W, TJ = 25°C
V
D
RL = 270 W (Note 6)
= 13.5 V, RL = 270 W, TJ = 25°C
V
D
30
60
0.7
0.9
125 100
175 150
4 4
4 4
OUTPUT DIODE CHARACTERISTICS (Note 6)
Drain−Source Diode Voltage V
Continuous Reverse Drain Current
F
I
S
I
= −0.2 A 0.6 V
OUT
TJ = 25°C 0.2 A
PROTECTION FUNCTIONS (Note 8)
Temperature Shutdown (Note 6)
Temperature Shutdown Hysteresis (Note 6)
Output Current Limit I
Output Clamp Voltage (Inductive Load Switch Off) At V
= VD − V
OUT
CLAMP
Overvoltage Protection V
T
SD
T
SD_HYST
LIM
V
CLAMP
IN_CL
TJ = −40°C, VD = 13.5 V, tm = 100 ms (Note 6)
= 25 °C, VD = 13.5 V, tm = 100 ms
T
J
= 150 °C , VD = 13.5 V, tm = 100 ms (Note 6)
T
J
I
= 4 mA 45 52 V
OUT
I
= 4 mA 50 54 V
CLAMP
150 175 − °C
5 °C
1.5 A
0.8
0.5
6. Not subjected to production testing
7. Only valid with high input slew rates
8. Protection functions are not designed for continuous repetitive operation and are considered outside normal operating range
Unit
W
mA
mA
kW
ms
ms
V/ms
V/ms
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NCV8450
TYPICAL CHARACTERISTIC CURVES
2.0 I
= 150 mA
out
1.8
1.6
1.4
1.2
(W)
1.0
DS(on)
0.8
R
0.6
0.4
0.2
0
−40 −20 0 20 40 60 80 100 120 140
Figure 3. R
5.0
4.5
4.0
3.5
3.0
(W)
2.5
DS(on)
2.0
R
1.5
1.0
0.5
0
01020304050
VD = 6 V
VD = 15 V
TEMPERATURE (°C)
vs. Temperature
DS(on)
125°C
150°C
V
(V)
D
Figure 5. R
DS(on)
25°C
vs. V
−40°C
D
1.0
0.95
0.9
0.85
(W)
0.8
DS(on)
0.75
R
0.7
0.65
0.6 0 0.1 0.2 0.3 0.4 0.5
80
R
LOAD
70
60
50
40
30
TURN ON TIME (ms)
20
10
0
−40 −20 0 20 40 60 80 100 120 140
VD = 6 V
VD = 9 V
OUTPUT LOAD (A)
Figure 4. R
= 270 W
TEMPERATURE (°C)
vs. Output Load
DS(on)
VD = 42 V
VD = 13.5 V
VD = 9 V
TA = 25°C
Figure 6. Turn On Time vs. Temperature
140
R
= 270 W
LOAD
120
100
80
60
40
TURN OFF TIME (ms)
20
0
−40 −20 0 20 40 60 80 100 120 140
TEMPERATURE (°C)
VD = 42 V
VD = 13.5 V
VD = 9 V
Figure 7. Turn Off Time vs. Temperature
1.2
1.0
0.8
0.6
0.4
SLEW RATE (ON) (V/ms)
0.2
0
−40 −20 0 20 40 60 80 100 120 140
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5
R
= 270 W
LOAD
VD = 42 V
VD = 13.5 V
VD = 9 V
TEMPERATURE (°C)
Figure 8. Slew Rate (ON) vs. Temperature
Page 6
NCV8450
TYPICAL CHARACTERISTIC CURVES
1.2
VD = 13.5 V
1
0.8
0.6
0.4
SLEW RATE (OFF) (V/ms)
0.2
R
LOAD
0
−40 −20 0 20 40 60 80 100 120 140
VD = 9 V
= 270 W
TEMPERATURE (°C)
VD = 42 V
Figure 9. Slew Rate (OFF) vs. Temperature
1.4
1.2
1.0
0.8
TA = −40°C
25°C
1.4
1.2
1
0.8
0.6
0.4
CURRENT LIMIT (A)
0.2
0
−40 −20 0 20 40 60 80 100 120 140
TEMPERATURE (°C)
VD = 13.5 V
Figure 10. Current Limit vs. Temperature
70
60
50
40
VD = 45 V
0.6
0.4
PEAK SC CURRENT (A)
0.2
0
02040
150°C
10 30 50
VD, VOLTAGE (V)
Figure 11. Peak Short Circuit Current vs. V
125°C
D
Voltage
70
60
50
40
30
20
, LEAKAGE CURRENT (mA)
D
10
V
0
0 5 10 15 20 25 30 35 40 45
−40°C
25°C
VD, VOLTAGE (V)
125°C
150°C
Figure 13. VD Leakage Current vs. VD Voltage
Off−State
30
20
, LEAKAGE CURRENT (mA)
D
V
10
0
−40 −20 0 20 40 60 80 100 120 140 TEMPERATURE (°C)
VD = 25 V
VD = 15 V
Figure 12. VD Leakage Current vs.
Temperature Off−State
2.5
2.0
1.5
1.0
INPUT CURRENT (mA)
0.5
0
−40 −20 0 20 40 60 80 100 120 140
VD = 45 V
VD = 28 V
VD = 15 V
VD = 6 V
TEMPERATURE (°C)
Figure 14. On−State Input Current vs.
Temperature
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NCV8450
TYPICAL CHARACTERISTIC CURVES
80
R
= 100 W
70
60
50
40
30
20
INPUT CURRENT (mA)
10
out
150°C
125°C
25°C
−40°C
0
02040
, VOLTAGE (V)
V
D
Figure 18. Input Current vs. VD Voltage
Off−State
8
7
6
5
4
3
2
INPUT CURRENT (mA)
1
0
0 5 10 15 20 25 30 35 40 45 50 55 60 65
25°C
VD, VOLTAGE (V)
−40°C
150°C
125°C
Figure 16. Input Current vs. VD Voltage
On−State
12
10
8.0
6.0
4.0
OUTPUT VOLTAGE (V)
2.0
0
012345678910
, VOLTAGE (V)
V
D
R
OUT
= 100 kW
V
= 0 V
IN
Figure 15. Output Voltage vs. VD Voltage
900
800
700
600
500
400
300
CURRENT (mA)
200
100
0
50 100 150
LOAD INDUCTANCE (mH)
TA = 150°C
V
= 20 V
D
Figure 17. Single Pulse Maximum Switch−off
Current vs. Load Inductance
1000
VD = 13.5 V
100
10
SHUTDOWN TIME (ms)
1
−40 40 80 140
VD = 24 V
VD = 42 V
0−20 20 60 100 120
TEMPERATURE (°C)
Figure 19. Initial Short−Circuit Shutdown Time
vs. Temperature
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NCV8450
TYPICAL CHARACTERISTIC CURVES
140
120
1000
100
10
1
0.1
Duty Cycle = 0.5
0.2
0.1
0.05
0.02
0.01
Single Pulse
100
80
(°C/W)
JA
60
q
R
40
20
0
0 100 200
PCB Cu thickness, 1.0 oz
PCB Cu thickness, 2.0 oz
300 400 500 600 700
COPPER HEAT SPREADER AREA (mm2)
Figure 20. R
vs. Copper Area
q
JA
0.01
0.001
R(t), EFFECTIVE TRANSIENT THERMAL RESPONSE
Psi TSP−A(t)
1E−021E−031E−041E−051E−06
PULSE TIME (s)
1E−01 1E+00 1E+01 1E+02 1E+03
Figure 21. Transient Thermal Response
ISO PULSE TEST RESULTS
Test Pulse Test Level Test Results Pulse Cycle Time and Generator Impedance
1 200 V C
2 150 V C
3a 200 V C
3b 200 V C
5 175 V E(100 V)
500 ms, 10 W
500 ms, 10 W
100 ms, 50 W
100 ms, 50 W
400 ms, 2 W
ORDERING INFORMATION
Device Package Shipping
NCV8450STT3G SOT−223
(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
4000 / Tape & Reel
†
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NCV8450
PACKAGE DIMENSIONS
SOT−223 (TO−261)
CASE 318E−04
ISSUE M
0.08 (0003)
e1
H
E
A1
D
b1
4
123
e
E
b
q
A
SOLDERING FOOTPRINT*
3.8
0.15
2.0
0.079
L1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
DIMAMIN NOM MAX MIN
A1 0.02 0.06 0.10 0.001
b 0.60 0.75 0.89 0.024
b1 2.90 3.06 3.20 0.115
c 0.24 0.29 0.35 0.009
D 6.30 6.50 6.70 0.249
E 3.30 3.50 3.70 0.130
e 2.20 2.30 2.40 0.087 e1 L1 1.50 1.75 2.00 0.060
H
C
E
q
MILLIMETERS
1.50 1.63 1.75 0.060
0.85 0.94 1.05 0.033
6.70 7.00 7.30 0.264 0° 10° 0° 10°
− −
INCHES
NOM MAX
0.064 0.068
0.002 0.004
0.030 0.035
0.121 0.126
0.012 0.014
0.256 0.263
0.138 0.145
0.091 0.094
0.037 0.041
0.069 0.078
0.276 0.287
2.3
0.091
2.3
0.091
6.3
0.248
2.0
0.079
1.5
0.059
SCALE 6:1
ǒ
inches
mm
Ǔ
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
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NCV8450/D
9
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