Datasheet NCP1403SNT1G Datasheet

Page 1
NCP1403
15 V/50 mA PFM Step-Up DC-DC Converter
The NCP1403 is a monolithic PFM step-up DC-DC converter. This device is designed to boost a single Lithium or two cell AA/AAA battery voltage up to 15 V (with internal MOSFET) output for handheld applications. A pullup Chip Enable feature is built with this device to extend battery-operating life. Besides, the device can also be incorporated in step-down, and voltage-inverting configurations. This device is available in space-saving TSOP-5 package.
Features
82% Efficiency at V
78% Efficiency at V
Low Operating Current of 19 mA (No Switching)
Low Shutdown Current of 0.3 mA
Low Startup Voltage of 1.3 V Typical at 0 mA
Output Voltage up to 15 V with Built-in 16 V MOSFET Switch
PFM Switching Frequency up to 300 kHz
Chip Enable
Low Profile and Minimum External Parts
Micro Miniature TSOP-5 Package
Pb-Free Package is Available
= 15 V, I
OUT
= 15 V, I
OUT
= 50 mA, VIN = 5.0 V
OUT
= 30 mA, VIN = 3.6 V
OUT
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1
TSOP-5
SN SUFFIX
CASE 483
MARKING DIAGRAM AND
PIN CONNECTIONS
CE
FB
VDD
1
G
2
3
5
DCEAYWG
LX
GND
4
Typical Applications
LCD Bias
Personal Digital Assistants (PDA)
Digital Still Camera
Handheld Games
Hand-held Instrument
(Top View)
DCE =Specific Device Marking A = Assembly Location Y = Year W = Work Week G = Pb-Free Package (Note: Microdot may be in either location)
ORDERING INFORMATION
Device Package Shipping
NCP1403SNT1 TSOP-5 3000/Tape & Reel
NCP1403SNT1G TSOP-5
(Pb-Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
3000/Tape & Reel
© Semiconductor Components Industries, LLC, 2007
May, 2007 - Rev. 6
1 Publication Order Number:
NCP1403/D
Page 2
NCP1403
V
1.8 V to 5.5 V
V
IN
2.7 V to 5.5 V
C
4.7 mF 10 V
Enable
IN
Enable
1
C
1
10 mF
L
47 mH
+
CE
1
FB
2
VDD
3
NCP1403
LX
5
750 pF to
2000 pF
GND
4
Figure 1. Typical Step-Up Application Circuit 1
CE
1
FB
2
VDD
3
L
22 mH
NCP1403
LX
GND
D MBR0520LT1
5
4
D MBR0520LT1
C
C
R
FB1
R
FB2
C
2
2.2 mF 16 V
ZD
+
V
OUT
C
2
33 mF
+ 0.8
V
OUT
15 V
R
FB1
ǒ
) 1
R
FB2
White LED x 4
Ǔ
Figure 2. Typical Step-Up Application Circuit 2
LX VDD
VLx Limit
PFM ON/OFF Timing Control
Driver
Soft Start
Comparator
Figure 3. Representative Block Diagram
PFM
CE
UVLO
-
+
Vref
GND
FB
LED
+
0.8V R
S
I
R
S
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NCP1403
PIN FUNCTION DESCRIPTIONS
Pin Symbol Description
1 CE Chip Enable Pin
1. The chip is enabled if a voltage which is equal to or greater than 0.9 V is applied.
2. The chip is disabled if a voltage which is less than 0.3 V is applied.
3. The chip will be enabled if it is left floating.
2 FB PFM comparator inverting input, and is connected to off-chip resistor divider which sets output voltage.
3 VDD Power supply pin for internal circuit.
4 GND Ground pin.
5 LX External inductor connection pin.
MAXIMUM RATINGS
Rating Symbol Value Unit
Power Supply Voltage (Pin 3) V
DD
Input/Output Pin
LX (Pin 5) LX Peak Sink Current FB (Pin 2)
V
LX
I
LX
V
FB
CE (Pin 1)
Input Voltage Range Input Current Range
V
CE
I
CE
Power Dissipation and Thermal Characteristics
Maximum Power Dissipation @ TA = 25°C Thermal Resistance Junction-to-Air
Operating Ambient Temperature Range T
Operating Junction Temperature Range T
Storage Temperature Range T
P
D
R
q
JA
A
J
stg
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
1. This device series contains ESD protection and exceeds the following tests: Human Body Model (HBM) "2.0 kV per JEDEC standard: JESD22-A114 for all pins except LX pin. Human Body Model (HBM) "1.5 kV for LX pin. Machine Model (MM) "200 V per JEDEC standard: JESD22-A115 for all pins.
2. Latchup Current Maximum Rating: "150 mA per JEDEC standard: JESD78.
3. Moisture Sensitivity Level (MSL): 1 per IPC/JEDEC standard: J-STD-020A.
-0.3 to 6.0 V
-0.3 to 16.0 600
mA
-0.3 to 6.0
-0.3 to 6.0 150
500 250
mA
mW
°C/W
-40 to +85 °C
-40 to +150 °C
-55 to +150 °C
V
V
V
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NCP1403
ELECTRICAL CHARACTERISTICS (V
= 15 V, TA =25°C, for min/max values unless otherwise noted.)
OUT
Characteristic Symbol Min Typ Max Unit
ON/OFF TIMING CONTROL
Minimum Off Time (V
= 3.0 V, VFB = 0 V) t
DD
Maximum On Time (Current not asserted) t
Maximum Duty Cycle D
Minimum Startup Voltage (I
= 0 mA) V
OUT
Minimum Startup Voltage Temperature Coefficient (TA = -40 to +85°C) DV
Minimum Supply Voltage (I
= 0 mA) V
OUT
Soft-Start Time t
LX (PIN 5)
Internal Switch Voltage (Note 4) V
LX Pin On-State Sink Current (VLX = 0.4 V, V
Voltage Limit (When VLX reaches V switch protection circuit)
LXLIM
= 3.0 V) I
DD
, the LX switch is turned off by the LX
Off-State Leakage Current (VLX = 16 V) I
CE (PIN 1)
CE Input Voltage (V
= 3.0 V, VFB = 0 V)
DD
High State, Device Enabled Low State, Device Enabled
CE Input Current High State, Device Enabled (V Low State, Device Enabled (VDD = 5.5 V, VCE = V
= VCE = 5.5 V)
DD
FB
= 0 V)
TOTAL DEVICE
Supply Voltage V
Feedback Voltage V
Feedback Pin Bias Current (VFB = 0.8 V) I
Operating Current 1 (V
FB
Operating Current 2 (VDD = V
Off-state Current (V
= 5.0 V, VCE = 0 V, internal 100 nA pullup current source) I
DD
4. Recommend maximum V
= 0 V, V
OUT
= V
DD
= V
CE
FB
up to 15 V.
= 3.0 V) I
CE
= 3.0 V, Not switching) I
off
on
MAX
start
hold
SS
LX
V
LXLIM
LKG
V
CE(high)
V
CE(low)
I
CE(high)
I
CE(low)
DD
FB
DD1
DD2
OFF
start
LX
FB
0.8 1.3 1.5
4.0 6.0 8.4
75 83 91 %
- 1.3 1.8 V
- 1.6 - mV/°C
- 1.2 1.7 V
0.5 10 - ms
0.5 - 16 V
100 130 - mA
0.55 0.75 1.0 V
- 0.1 1.0
0.9
-
-0.5
-0.5
-
-
0
-0.1
-
0.3
0.5
0.5
1.2 - 5.5 V
0.76 0.8 0.84 V
- 15 30 nA
- 130 200
- 19 25
- 0.3 0.8
ms
ms
mA
V V
mA mA
mA
mA
mA
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NCP1403
TYPICAL CHARACTERISTICS
17.0
16.5
16.0
15.5
15.0
14.5
, OUTPUT VOLTAGE (V)
14.0
OUT
V
13.5
13.0
14.0
13.5
13.0
12.5
12.0
11.5
, OUTPUT VOLTAGE (V)
11.0
OUT
V
10.5
10.0
15.4
L = 47 mH V
= 15 V
OUT
C
= 33 mF
OUT
TA = 25°C Figure 1
1.8 V
2.4 V
3.6 V
4.0 V
3.0 V
I
, OUTPUT CURRENT (mA) I
OUT
Figure 4. Output Voltage versus Output
L = 47 mH V
OUT
C
OUT
TA = 25°C Figure 1
1.8 V
= 12 V = 33 mF
2.4 V
I
OUT
Current (V
, OUTPUT CURRENT (mA)
OUT
3.0 V
= 15 V)
3.6 V
Figure 6. Output Voltage versus Output
Current (V
OUT
= 12 V)
VIN = 5.5
V
5.0 V
706050403020100
VIN = 5.5
V
5.0 V
4.0 V
706050403020100
100
Vin = 5.5 V
80
2.4 V
60
1.8 V
40
EFFICIENCY (%)
20
3.0 V
3.6 V
4.0 V
L = 47 mH V
OUT
C
OUT
TA = 25°C Figure 1
5.0 V
= 15 V
= 33 mF
0
80 80
, OUTPUT CURRENT (mA)
OUT
706050403020100
Figure 5. Efficiency versus Output Current
(V
= 15 V)
OUT
100
VIN = 5.5
V
80
60
1.8 V
2.4 V
3.0 V
3.6 V
4.0 V
5.0 V
L = 47 mH V
= 12 V
EFFICIENCY (%)
40
C
OUT
OUT
= 33 mF TA = 25°C Figure 1
20
80
I
, OUTPUT CURRENT (mA)
OUT
706050403020100
Figure 7. Efficiency versus Output Current
(V
= 12 V)
OUT
12.4
80
15.2
I
= 5 mA
15.0
14.8
, OUTPUT VOLTAGE (V)
14.6
OUT
V
OUT
I
OUT
= 0 mA
L = 47 mH V C TA = 25°C Figure 1
14.4
Vin, INPUT VOLTAGE (V)
Figure 8. Output Voltage versus Input Voltage
(V
= 15 V)
OUT
OUT
OUT
= 15 V
= 33 mF
5.04.54.0
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12.2
I
= 5 mA
I
OUT
OUT
= 0 mA
L = 47 mH V
= 12 V
OUT
C
= 33 mF
OUT
TA = 25°C Figure 1
12.0
11.8
, OUTPUT VOLTAGE (V)
11.6
OUT
V
11.4
6.05.53.53.02.52.0
5.04.54.0
6.05.53.53.02.52.0
Vin, INPUT VOLTAGE (V)
Figure 9. Output Voltage versus Input Voltage
(V
= 12 V)
OUT
5
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NCP1403
TYPICAL CHARACTERISTICS
1000
V
900
800
700
600
500
OUT
L = 47 mH D = MBR0520LT1 C
IN
C
OUT
I
OUT
TA = 25°C Figure 1
400
300
200
, NO LOAD INPUT CURRENT (mA)
100
IN
I
0
VIN, INPUT VOLTAGE (V) VIN, INPUT VOLTAGE (V)
Figure 10. No Load Input Current versus
Input Voltage
6
5
4
3
2
, SWITCH-ON RESISTANCE (W)
DS(on)
1
R
VIN, INPUT VOLTAGE (V) I
Figure 12. Switch-On Resistance versus Input
Voltage
= 15 V
= 10 mF
= 33 mF
= 0 mA
V
= 15 V
OUT
TA = 25°C
600
500
400
300
200
, CURRENT LIMIT (mA)
LIM
I
100
0
654321
5.0
4.5
4.0
3.5
3.0
2.5
2.0
, STARTUP/HOLD VOLTAGE (V)
1.5
HOLD
1.0
/V
0.5
START
654321
V
Figure 13. Startup/Hold Voltage versus Output
TA = 25°C
Figure 11. Current Limit versus Input Voltage
V
= 15 V
OUT
L = 47 mH C
= 33 mF
OUT
TA = 25°C Figure 1
V
START
V
HOLD
16141210 2018 28262422
, OUTPUT CURRENT (mA)
OUT
Current
654321
3086420
0.84
0.82
0.80
0.78
, FEEDBACK VOLTAGE (V)
0.76
FB
V
0.74
TA, AMBIENT TEMPERATURE(°C) TA, AMBIENT TEMPERATURE (°C)
Figure 14. Feedback Voltage versus Ambient
Temperature
100
90
80
70
60
, MAXIMUM DUTY CYCLE (%)
MAX
D
50
1007550250-25-50
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1007550250-25-50
Figure 15. Maximum Duty Cycle versus
Ambient Temperature
Page 7
NCP1403
TYPICAL CHARACTERISTICS
9
8
7
6
5
, MAXIMUM SWITCH ON TIME (ms)
on
t
4
TA, AMBIENT TEMPERATURE (°C) TA, AMBIENT TEMPERATURE (°C)
1007550250-25-50
5
4
3
2
1
, MINIMUM SWITCH OFF TIME (ms)
off
t
0
1007550250-25-50
Figure 16. Maximum Switch On Time Figure 17. Minimum Switch Off Time
170
150
130
25
23
21
, OPERATING CURRENT 1 (mA)
DD1
I
OFF-STATE CURRENT (mA)
off,
I
110
0.8
0.6
0.4
0.2
90
70
TA, AMBIENT TEMPERATURE (°C) TA, AMBIENT TEMPERATURE (°C)
Figure 18. Operating Current 1 versus
Ambient Temperature
1
0
TA, AMBIENT TEMPERATURE (°C) TA, AMBIENT TEMPERATURE (°C)
VDD = VCE = 3.0 V
VFB = 0 V
VDD = 5.0 V
VCE = 0 V
19
VDD = VCE = 3.0 V
17
, OPERATING CURRENT 2 (mA)
DD2
I
1007550250-25-50
15
VFB = 3.0 V NOT SWITCHING
1007550250-25-50
Figure 19. Operating Current 2 versus
Ambient Temperature
25
15
5
-5
-15
, CE HIGH INPUT CURRENT (nA)
-25
CE(high)
1007550250-25-50
I
VDD = 5.5 V
VCE = 5.5 V
1007550250-25-50
Figure 20. Off-State Current versus Ambient
Temperature
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Figure 21. CE High Input Current versus
Ambient Temperature
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NCP1403
TYPICAL CHARACTERISTICS
L = 47 mH, CIN = 10 mF, C
1. V
= 15 V, 10 V/div
OUT
OUT
= 33 mF, I
2. VLX, 10 V/div
3. VIN = 0 V to 3.6 V, 5 V/div
Figure 22. Startup Waveforms Figure 23. Chip Enable Waveforms
L = 47 mH, CIN = 10 mF, C
1. V
= 15 V (AC Coupled), 100 mV/div
OUT
2. VIN = 3.6 V to 5.5 V, 2.0 V/div
OUT
Figure 24. Line Transient Response Figure 25. Load Transient Response
= 33 mF, I
OUT
OUT
= 20 mA
= 10 mA
L = 47 mH, CIN = 10 mF, C
OUT
mA
1. V
= 15 V, 10 V/div
OUT
2. VLX, 10 V/div
3. VCE = 0 V to 3.3 V, 5 V/div
L = 47 mH, CIN = 10 mF, C
1. V
= 15 V (AC Coupled), 50 mV/div
OUT
2. I
= 1.0 mA to 15 mA, 10 mA/div
OUT
= 33 mF, VIN = 3.6 V, I
= 33 mF, VIN = 3.6 V
OUT
OUT
= 20
L = 47 mH, CIN = 10 mF, C V, I
= 10 mA
OUT
1. VLX, 5.0 V/div
2. IL, 200 mA/div
3. V
, 50 mV/div
ripple
= 33 mF, VIN = 3.6 V, V
OUT
OUT
= 15
L = 47 mH, CIN = 10 mF, C V, I
= 30 mA
OUT
1. VLX, 5.0 V/div
2. IL, 200 mA/div
3. V
, 50 mV/div
ripple
= 33 mF, VIN = 3.6 V, V
OUT
OUT
= 15
Figure 26. Operating Waveforms (Medium Load) Figure 27. Operating Waveforms (Heavy Load)
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NCP1403
DETAILED OPERATING DESCRIPTION
Operation
The NCP1403 is monolithic DC-DC switching converter optimized for single Lithium or two cells AA/AAA size batteries powered portable products.
The NCP1403 device consists of startup circuit, chip enable circuit, PFM comparator, voltage reference, PFM on/off timing control circuit, driver, current limit circuit, and open-drain MOSFET switch. The device operating current is typically 130 mA, and can be further reduced to about 0.3 mA when the chip is disabled (VCE < 0.3 V).
The operation of NCP1403 can be best understood by referring to the block diagram and typical application circuit 1 in Figures 3 and 1. The PFM comparator monitors the output voltage via the external feedback resistor divider by comparing the feedback voltage with the reference voltage. When the feedback voltage is lower than the reference voltage, the PFM control and driver circuit turns on the N-Channel MOSFET switch and the current ramps up in the inductor. The switch will remain on for the maximum on-time, 6.0 ms, or until the current limit is reached, whichever occurs first. The MOSFET switch is then turned off and energy stored in the inductor will be discharged to the output capacitor and load through the Schottky diode. The MOSFET switch will be turned off for at least the minimum off-time, 1.3 ms, and will remain off if the feedback voltage is higher than the reference voltage and output capacitor will be discharged to sustain the output current, until the feedback voltage is again lower than reference voltage. This switching cycle is then repeated to attain voltage regulation.
Soft Start
There is a soft start circuit in NCP1403. When power is applied to the device, the soft start circuit pumps up the output voltage to approximately 1.5 V at a fixed duty cycle, the level at which the converter can operate normally. With the soft start circuit, the output voltage overshoot is minimized and the startup capability with heavy loads is also improved.
ON/OFF Timing Control
The maximum on-time is typically 6.0 ms, whereas, the minimum off-time is typically 1.3 ms. Owing to the current limit circuit, the on-time can be shorter. The switching frequency can be up to 300 kHz.
Voltage Reference and Output Voltage
The internal voltage reference is trimmed to 0.8 V at an accuracy of ±5.0%. The voltage reference is connected to the non-inverting input of the PFM comparator and the inverting input of the PFM comparator is connected to the FB pin. The output voltage can be set by connected an external resistor voltage divider from the V
OUT
to the FB pin. With the internal 16 V MOSFET switch, the output voltage can be set between VIN to 15 V.
LX Limit
The LX Limit is a current limit feature which is achieved by monitoring the voltage at the LX pin during the MOSFET switch turn-on period. When the switch is turned on, current ramps up in the inductor, and the voltage at the LX pin will increase according to the Ohm's Law due to the On-state resistance of the MOSFET. When the VLX is greater than
0.75 V, the switch will be turned off. With the current limit circuit, saturation of inductor is prevented and output voltage overshoot during startup can also be minimized.
N-Channel MOSFET Switch
The NCP1403 is built-in with a 16 V open drain N-Channel MOSFET switch which allows high output voltage up to 15 V to be generated from simple step-up topology.
Enable / Disable Operation
The NCP1403 offers IC shut-down mode by the chip enable pin (CE pin) to reduce current consumption. An internal 100 nA pullup current source tied the CE pin to OUT pin by default i.e. user can float the pin CE for permanent “ON”. When voltage at pin CE is equal to or greater than 0.9 V, the chip will be enabled, which means the device is in normal operation. When voltage at pin CE is less than 0.3 V, the chip is disabled, which means IC is shutdown. During shutdown, the IC supply current reduces to 0.3 mA and LX pin enters high impedance state. However, the input remains connected to the output through the inductor and the Schottky diode, keeping the output voltage to one diode forward voltage drop below the input voltage.
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NCP1403
APPLICATIONS CIRCUIT INFORMATION
External Component Selection
Inductor
The NCP1403 is designed to work well with a range of inductance values, the actual inductance value depends on the specific application, output current, efficiency, and output ripple voltage. For step up conversion, the device works well with inductance ranging from 22 mH to 47 mH. Inductor with small DCR, usually less than 1.0 W, should be used to minimize loss. It is necessary to choose an inductor with saturation current greater than the peak switching current in the application.
If 22 mH inductance is used, lower profile surface mount inductor can be selected for the same current rating. Moreover, it permits the converter to switch at higher frequency up to 300 kHz since the inductor current will ramp up faster and hit the current limit at a shorter time for smaller inductance value. However, current output are slightly lower because the off-time is limited by the minimum off-time. If 47 mH inductance is selected, higher efficiency and output current capability are achieved, but the converter will switch at a lower frequency and the inductor size will be slightly larger for the same current rating.
For lower inductance value, the inductor current ramp-down time will be shorter than the minimum off-time. Consequently, the converter can only operate in discontinuous conduction mode and lower output current can be generated. For higher inductance value, if the inductance is sufficiently large, the maximum on-time will expire before the current limit is reached. As a result, the available output power and output current are reduced. Besides, instability may occur when operation enters CCM.
To ensure the current limit is reached before the maximum on-time expires, L can be selected according to the inequality below:
(V
IN *VS
L v
where VS = 0.75 V which is the MOSFET saturation voltage, and I Figure 11, and t
is the current limit which can be referred to in
LIM
on(MAX)
If the above condition is satisfied, IPK = I is the peak inductor current. Then, step-up converter with inductor satisfy the following condition will operate in DCM only,
I
LIM @ L
(V
If the IPK = I
) VD* V
OUT
, step-up converter with inductor satisfy
LIM
the following condition will operate in CCM at maximum output current,
I
LIM @ L
(V
OUT
) VD* V
where VD is the Schottky diode forward voltage drop, t
off(MIN)
= 1.3 ms.
I
LIM
= 6.0 ms.
)
@ t
IN)
IN)
on(MAX)
v t
off(MIN)
u t
off(MIN)
LIM
; where I
PK
For step-up converter operates in DCM only, the maximum output current can be calculated from the equation below:
2
(I
)
L
I
OUT(MAX)
+
2(V
) VD* VIN)
OUT
LIM
ǒ
ǒ
I
LIM
VIN*V
L
S
Ǔ
) t
off(MIN)
For step-up converter operates in CCM, the maximum output current can be calculated from the equation below:
I
OUT(MAX)
Diode
+ǒI
LIM
*
) VD* VIN) t
OUT
off(MIN)
2L
(V
IN *VS)
Ǔ
@
(V
) VD* VS)
OUT
(V
The diode is the main source of loss in DC-DC converters. The most importance parameters which affect their efficiency are the forward voltage drop, VF, and the reverse recovery time, trr. The forward voltage drop creates a loss just by having a voltage across the device while a current flowing through it. The reverse recovery time generates a loss when the diode is reverse biased, and the current appears to actually flow backwards through the diode due to the minority carriers being swept from the P-N junction. A Schottky diode with the following characteristics is recommended:
1. Small forward voltage, VF < 0.3 V
2. Small reverse leakage current
3. Fast reverse recovery time / switching speed
4. Rated current larger than peak inductor current, I
> I
rated
PK
5. Reverse voltage larger than output voltage, V
Input Capacitor
reverse
> V
OUT
The input capacitor can stabilize the input voltage and minimize peak current ripple from the source. The value of the capacitor depends on the impedance of the input source used. Small ESR (Equivalent Series Resistance) Tantalum or ceramic capacitor with value of 10 mF should be suitable.
Output Capacitor
The output capacitor is used for sustaining the output voltage when no current is delivering from the input, and smoothing the ripple voltage. Low ESR Tantalum capacitor should be used to reduce output ripple voltage since the output ripple voltage is dominated by the ESR value of the Tantalum capacitor. In general, a 22 mF to 47ĂmF low ESR (0.2 W to 0.4 W) Tantalum capacitor should be appropriate. The output ripple voltage can be approximately given by the following equation:
V
Feedback Resistors
ripple
[ (IPK* I
OUT
) @ ESR
Choose the RFB2 value from the range 10 kW to 200 kW for positive output voltage. The value of R
can then be
FB1
calculated from the equation below:
V
OUT
R
FB1
+ R
FB2
ǒ
0.8
1% tolerance resistors should be used for both R R
for better V
FB2
OUT
accuracy.
* 1
Ǔ
and
FB1
Ǔ
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NCP1403
Output Voltage Higher than 15 V
NCP1403 can be used to generate output voltage higher than 15 V by adding an external high voltage N-Channel MOSFET in series with the internal MOSFET switch as shown in Figure 33. The drain-to-source breakdown voltage of the external MOSFET must be at least 1V higher than the output voltage. The diode D1 helps the external MOSFET to turn off and ensures that most of the voltage across the external MOSFET during the switch-off period. Since the high voltage external MOSFET is in series with the internal MOSFET, higher break down voltage is achieved but the current capability is not increased.
There is an alternative application circuit shown in Figure 35 which can output voltage up to 30 V. For this circuit, a diode-capacitor charge-pump voltage doubler constructed by D2, D3 and C1 is added. During the internal MOSFET switch-on time, the LX pin is shorted to ground and D2 will charge up C1 to the stepped up voltage at the cathode of D1. During the MOSFET switch-off time, the voltage at V
OUT
will be almost equal to the double of the voltage at the cathode of D1. The V
is monitored by the FB pin via the
OUT
resistor divider and can be set by the resistor values. Since the maximum voltage at the cathode of D1 is 15V, the maximum V
is 30 V. The value of C1 can be in the range
OUT
of 0.47 mF to 2.2 mF.
Negative Voltage Generation
The NCP1403 can be used to produce a negative voltage output by adding a diode-capacitor charge-pump circuit (D2, D3, and C1) to the LX pin as shown in Figure 32. The feedback voltage resistor divider is still connected to the positive output to monitor the positive output voltage and a small value capacitor is used at C2. When the internal MOSFET switches off, the voltage at the LX pin charges up the capacitor through diode D2. When the MOSFET switches on, the capacitor C1 is effectively connected like a reversed battery and C1 discharges the stored charges through the R charge up C
OUT
of the internal MOSFET and D3 to
ds(on)
and builds up a negative voltage at V
OUT
Since the negative voltage output is not directly monitored by the NCP1403, the output load regulation of the negative output is not as good as the standard positive output circuit. The resistance values of the resistors of the voltage divider can be one-tenth of those used in the positive output circuit in order to improve the regulation at light load.
For the application circuit in Figure 36, it is actually the combination of the application circuits in Figures 32 and 33.
Step-Down Converter
NCP1403 can be configured as a simple step-down converter by using the open-drain LX pin to drive an external P-Channel MOSFET as shown in Figure 34. The resistor RGS is used to switch off the P-Channel MOSFET during the switch-off period. Too small resistance value should not be used for RGS, otherwise, the efficiency will be reduced.
White LED Driver
The NCP1403 can be used as a constant current LED driver which can drive up to 4 white LEDs in series as shown in Figure 2. The LED current can be set by the resistance value of RS. The desired LED current can be calculated by the equation below:
+
0.8 R
S
I
LED
Moreover, the brightness of the LEDs can be adjusted by a DC voltage or a PWM signal with an additional circuit illustrated below:
To FB Pin To LED
DC/PWM Signal
GND
R2
C1
0.1 mF
D2
R1
100 k
C2
820 pF
With this additional circuit, the maximum LED current is set by the above equation. The value of R2 can be obtained by the following equation:
V
* VD* 0.8
R2 +
V
is the maximum voltage of the control signal, V
MAX
is the diode forward voltage, I LED current and I
MAX
(I
LED(MAX)*ILED(MIN)
ǒ
LED(MIN)
)R
S
R1
LED(MAX)
Ǔ
is the maximum
is the minimum LED current. If a PWM control signal is used, the signal frequency from 4 kHz to 40 kHz can be applied.
In case the LEDs fail, the feedback voltage will become zero. The NCP1403 will then switch at maximum duty cycle and result in a high output voltage which will cause the LX pin voltage to exceed its maximum rating. A Zener diode can be added across the output and FB pin to limit the voltage at the LX pin. The Zener voltage should be higher than the total forward voltage of the LED string.
.
PCB Layout Hints
The schematic, PCB trace layout, and component placement of the step-up DC-DC converter demonstration board are shown in Figure 28 to Figure 31 for PCB layout design reference.
Grounding
One point grounding should be used for the output power return ground, the input power return ground, and the device switch ground to reduce noise. The input ground and output ground traces must be thick and short enough for current to flow through. A ground plane should be used to reduce ground bounce.
R
S
D
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NCP1403
Power Signal Traces
Low resistance conducting paths should be used for the power carrying traces to reduce power loss so as to improve efficiency (short and thick traces for connecting the inductor L can also reduce stray inductance). Besides, the length and area of all the traces with connection to the LX pin should be minimized. e.g., short and thick traces listed below should be used in the PCB:
1. Trace from VIN to L
2. Trace from L to LX pin of the IC
3. Trace from L to anode pin of Schottky diode
4. Trace from cathode pin of Schottky diode to V
.
OUT
TP1
V
IN
1.8 V to 5.0 V
+
C1
10 mF
C3
R1
CE
1
FB
2
External Feedback Resistors
Feedback resistors should be located as close to the FB pin as possible to minimize noise picked up by the FB pin. The ground connection of the feedback resistor divider should be connected directly to the GND pin.
Input Capacitor
The input capacitor should be located close to both the V to the inductor and the VDD pin of the IC.
Output Capacitor
The output capacitor should be placed close to the output terminals to obtain better smoothing effect on output ripple voltage.
L1
47 mH
LX
5
NCP1403
D1
MBR0520LT1
+
C2
33 mF
TP3 V
OUT
15 V
IN
TP2
GND
Enable
R2
VDD
3
GND
4
Figure 28. Step-Up Converter Demonstration Board Schematic
TP4 GND
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NCP1403
Figure 29. Step-Up Converter Demonstration Board Top Layer Copper
Figure 30. Step-Up Converter Demonstration Board Bottom Layer Copper
Figure 31. Step-Up Converter Demonstration Board Top Layer Component Silkscreen
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NCP1403
Components Supplier
Parts Supplier Part Number Description Phone
L1 Sumida Electric Co. Ltd. CD43-470KC
D1 ON Semiconductor MBR0520LT1 Schottky Power Rectifier (852) 2689-0088
C1 Kemet Electronics Corp. T494A106K010AS
C2 Kemet Electronics Corp. T494C336K016AS
Low ESR Tantalum Capacitor 10 mF/10 V
Low ESR Tantalum Capacitor 33 mF/16 V
Inductor 47 mH
OTHER APPLICATIONS
L
V
IN
2.0 V to 5.5 V
C1
10 mF
L: CD43-470KC, Sumida C1: T494A106K010AS, Kemet C2: EMK107BJ104MA, Taiyo Yuden C3: GMK316F225ZG, Taiyo Yuden C4: T494D336K025AS, Kemet D1, D2, D3: MBR0520LT1, ON Semiconductor
+
CE
VDD
1
FB
2
3
47 mH
NCP1403
LX
5
GND
6
D1
MBR0520LT1
C
C
3000 pF
C3
2.2 mF
MBR0520LT1 x 2
D3
D2
C2
0.1 mF
R
FB1
R
FB2
V
OUT
+
C4
33 mF
25 V
[*0.8
(852) 2880-6688
(852) 2305-1168
(852) 2305-1168
V
OUT
-15 V 6 mA at VIN = 2.0 V 40 mA at VIN = 5.5 V
R
FB1
ǒ
) 1Ǔ) 1
R
FB2
Figure 32. Positive-to-Negative Output Converter for Negative LCD Bias
V
IN
3.0 V to 5.5 V
C1
10 mF
10 V
L: CD43-470KC, Sumida C1: T494A106K010AS, Kemet C2: T494D226K035AS, Kemet Q1: MGSF1N03T1, ON Semiconductor
NTHS5402T1, ON Semiconductor D1: MBR0530T1, ON Semiconductor D2: MMSD914T1, ON Semiconductor
+
CE
1
FB
2
VDD
3
L
47 mH
NCP1403
MGSF1N03T1
/
NTHS5402T1
LX
5
D2 MMSD914T1
GND
6
D1
Q1
750 pF to
2000 pF
MBR0530T1
C
C
R
R
V
FB1
FB2
OUT
V
OUT
Up to 29 V
+
6 mA at VIN = 3.0 V
C2
35 mA at VIN = 5.5 V
22 mF
35 V
R
FB1
ǒ
+ 0.8
R
FB2
) 1
Ǔ
Figure 33. Step-Up DC-DC Converter with 29 V Output Voltage
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NCP1403
V
IN
2.2 V to 4.2 V
C1
22 mF
10 V
L: CD43-101KC, Sumida C1: T494C226K010AS, Kemet C2: T494D686K006AS, Kemet Q1: MGSF1P02ELT1, ON Semiconductor D1: MBR0520LT1, ON Semiconductor
+
CE
FB
VDD
Figure 34. Step-down DC-DC Converter with 1.6 V Output Voltage for DSP Circuit
1
2
3
NCP1403
LX
5
GND
6
Q1
R
820
GS
MBR0520LT1
MGSF1P02LT1
D1
L 100
mH
C
C
750 pF to
2000 pF
V
68 mF
R
FB1
R
FB2
OUT
6 V
+ 0.8
+
C2
ǒ
R R
V
OUT
1.6 V 200 mA at VIN =
2.2 V
FB1
) 1
FB2
Ǔ
V
IN
1.8 V to 5.5 V
+
C1
10 mF
10 V
R
C
FB1
C
750 pF to
2000 pF
R
FB2
L: CD43-470KC, Sumida C1: T494A106K010AS, Kemet C2, C4: T494D106K020AS, Kemet C3: GMK316F225ZG, Taiyo Yuden D1, D2, D3: MBR0520LT1, ON Semiconductor
CE
1
FB
2
VDD
3
Figure 35. Step-Up DC-DC Converter with 30 V Output Voltage
L
47 mH
U1
NCP1403
LX
5
GND
6
C3
D1
2.2 mF
D3
D2 MBR0520LT1
MBR0520LT1
MBR0520LT1
V
OUT
30 V
+
2 mA at VIN = 1.8 V
C4
35 mA at VIN = 5.5 V
10 mF
20 V
+
C2
10 mF
20 V
V
+ 0.8
OUT
R
FB1
ǒ
R
FB2
) 1
Ǔ
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V
IN
3.5 V to 5.0 V
+
C1
10 mF
10 V
R
C
FB1
C
750 pF to
2000 pF
R
FB2
L: CD43-470KC, Sumida C1: T494A106K010AS, Kemet C2: UMK212F105ZG, Taiyo Yuden C3: GMK316F225ZG, Taiyo Yuden C4: T494D226K035AS, Kemet Q1: MGSF1N03T1, ON Semiconductor/
NTHS5402T1, ON Semiconductor D1, D2: MMSD914T1, ON Semiconductor D3, D4: MBR0530T1, ON Semiconductor
CE
1
FB
2
VDD
3
Figure 36. Voltage Inverting DC-DC Converter with -28 V Output Voltage
L
47 mH
U1
NCP1403
NCP1403
D3
C3
2.2 mF / 50 V
LX
5
MMSD914T1
D1
GND
6
MBR0530T1 x 2
D4
D2
MMSD914T1
Q1 MGSF1N03T1 / NTHS5402T1
V
[*0.8
OUT
ǒ
R R
+
+
FB1 FB2
C4
22 mF
35 V
C2
1 mF 50 V
) 1Ǔ) 1
V
OUT
-28 V
9 mA at VIN = 3.3 V 20 mA at VIN = 5.0 V
VIN 1.8 V to 5.5 V
C1
10 mF
L1: CD43-470KC, Sumida C1: T494A106K010AS, Kemet C2, C5: T494C226K020AS, Kemet C3: UMK107B102KZ, Taiyo Yuden C4: TMK316BJ225ML, Taiyo Yuden D1, D2, D3: MBR0520LT1, ON Semiconductor R1: 390 kW R2: 22 kW
10 V
ON
JPI
OFF
750 pF to
2000 pF
C3
CE
1
R1
FB
2
R2
VDD
3
Figure 37. +15 V, -15 V Outputs Converter for LCD Bias Supply
L1
47 mH
U1
NCP1403
LX
5
GND
6
MBR0520LT1
D2
C4
2.2 mF
V
+ 0.8
OUT1
V
[*V
OUT2
MBR0520LT1
D3
D1 MBR0520LT1
R
FB1
ǒ
R
FB2
OUT1
) 1
) 0.3
V
OUT2
-15 V
C5
+
22 mF
C2
+
22 mF 20 V
2 mA at VIN = 1.8 V 5 mA at VIN = 2.4 V
20 V
10 mA at VIN = 3.0 V
V
OUT1
15 V
2 mA at VIN = 1.8 V 5 mA at VIN = 2.4 V 10 mA at VIN = 3.0 V
Ǔ
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NCP1403
L1
VIN 1.8 V to 5.5 V
C1
+
10 mF
L1: CD43-470KC, Sumida C1, C2: T494A106K010AS, Kemet C3: UMK107B102KZ, Taiyo Yuden C4, C5: TMK316BJ225ML, Taiyo Yuden C6, C7: T494C226K020AS, Kemet D1, D2, D3, D4, D5: MBR0520LT1, ON Semiconductor R1: 390 kW R2: 22 kW
10 V
ON
JPI
OFF
750 pF to
2000 pF
C3
CE
1
R1
FB
2
R2
VDD
3
Figure 38. +15 V, -7.5 V Outputs Converter for CCD Supply Circuit
47 mH
U1
NCP1403
LX
5
GND
6
MBR0520LT1
D3
C5
2.2 mF
MBR0520LT1
D1
MBR0520LT1
V
+ 0.8
OUT1
V
[*
OUT2
D4
MBR0520LT1
C4
2.2 mF
D2
R
FB1
ǒ
R
FB2
V
OUT1
2
MBR0520LT1
D5
+
C2
10 mF 10 V
Ǔ
) 1
V
OUT2
-7.5 V
C7
+
22 mF
C6
+
22 mF 20 V
5 mA at V
20 V
V
OUT1
15 V 20 mA at VIN = 3.0 V
= 3.0 V
IN
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NCP1403
PACKAGE DIMENSIONS
TSOP-5
SN SUFFIX
CASE 483-02
ISSUE G
NOTES:
1. DIMENSIONING AND TOLERANCING PER
NOTE 5
2X
2X
T0.10
T0.20
54
123
L
G
D
0.205XC AB
M
S
B
K
DETAIL Z
A
J
DETAIL Z
C
0.05
H
SEATING PLANE
T
SOLDERING FOOTPRINT*
1.9
0.95
0.037
0.074
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS.
5. OPTIONAL CONSTRUCTION: AN ADDITIONAL TRIMMED LEAD IS ALLOWED IN THIS LOCATION. TRIMMED LEAD NOT TO EXTEND MORE THAN 0.2 FROM BODY.
MILLIMETERS
DIM MIN MAX
A 3.00 BSC B 1.50 BSC C 0.90 1.10 D 0.25 0.50 G 0.95 BSC H 0.01 0.10
J 0.10 0.26 K 0.20 0.60 L 1.25 1.55 M 0 10
__
S 2.50 3.00
2.4
0.094
1.0
0.039
0.7
0.028
SCALE 10:1
ǒ
inches
mm
Ǔ
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
The product described herein (NCP1403), may be covered by the following U.S. patents: 6,518,834. There may be other patents pending.
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
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NCP1403/D
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