Page 1
INTEGRATED CIRCUITS
74F804, 74F1804
Hex 2-input NAND drivers
Product specification
IC15 Data Handbook
1990 Sep 14
Page 2
Philips Semiconductors Product specification
74F804/1804Hex 2-input NAND drivers
FEA TURES
•High capacitive drive capability
•Choice of configuration
Corner V
Center V
and GND – 74F804
CC
and GND – 74F1804
CC
•Typical propagation delay of 2.5ns
TYPE
74F804 2.5ns 9mA
74F1804 2.5ns 9mA
ORDERING INFORMATION
DESCRIPTION COMMERCIAL RANGE
20–pin plastic DIP N74F804N, N74F1804N SOT146-1
20–pin plastic SOL N74F804D, N74F1804D SOT163-1
PIN CONFIGURATION
TYPICAL
PROPAGATION
DELA Y
74F804
D0a
1
D0b
2
3
0
Q
4
D1a
5
D1b
6
Q
1
7
D2a
8
D2b
9
2
Q
10 11
GND
20
19
18
17
16
15
14
13
12
SF00448
TYPICAL SUPPL Y
CURRENT
( TOTAL)
= 5V ±10%, T
V
CC
V
CC
D5b
D5a
Q
5
D4b
D4a
4
Q
D3b
D3a
3
Q
INPUT AND OUTPUT
LOADING AND FAN OUT TABLE
NOTE: One (1.0) FAST unit load is defined as: 20µA in the high
state and 0.6mA in the low state.
ORDER CODE
= 0°C to +70°C
amb
IEC/IEEE SYMBOL
PINS DESCRIPTION 74F (U.L.)
HIGH/LOW
LOAD VALUE
HIGH/LOW
Dna – Dnb Data inputs 1.0/0.033 20µA/20µA
Q0 – Q5 Data outputs 2400/80 48mA/48mA
PKG DWG #
1
2
4
5
7
8
12
13
15
16
18
19
74F804
&
3
6
9
11
14
17
SF00450
LOGIC SYMBOL
74F804
1245781213
D0a D0bD1a D2a D2b D3aD3bD1b
Q0 Q1 Q2 Q3
36 911
V
= Pin 20
CC
GND = Pin 10
September 14, 1990 853-1313 00423
15 16 18 19
D4aD4bD5aD5b
Q4 Q5
14 17
SF00449
PIN CONFIGURA TION
2
74F1804
1
D4b
5
2
Q
D5a
3
D5b
4
V
5
CC
6
D0a
7
D0b
8
Q
0
9
D1a
10 11
D1b
20
19
18
17
16
15
14
13
12
SF00451
D4a
4
Q
D3b
D3a
Q
3
GND
Q
2
D2b
D2a
Q
1
Page 3
Philips Semiconductors Product specification
74F804/1804Hex 2-input NAND drivers
LOGIC SYMBOL
6791012131718
D0a D0bD1a D2a D2b D3a D3bD1b
V
= Pin 5
CC
GND = Pin 15
IEC/IEEE SYMBOL
6
7
9
10
12
13
17
18
20
1
3
4
74F1804
Q0 Q1 Q2 Q3
8111416
74F1804
&
20 1 3 4
D4a D4bD5a D5b
Q4 Q5
2
19
SF00453
SF00452
8
11
14
16
19
2
LOGIC DIAGRAM
74F804
1
D0a
2
Dob
4
D1a
5
D1b
7
D2a
8
D2b
12
D3a
13
D3b
15
D4a
16
D4b
18
D5a
19
D5b
VCC = Pin 20
GND = Pin 10
3
6
9
11
14
17
FUNCTION TABLE
INPUTS OUTPUT
Da Db Q
H H L
L X H
X L H
NOTES:
H = High voltage level
L = Low voltage level
X = Don’t care
74F1804
6
D0a
Q
O
1
Q
Q
2
3
Q
Q
4
Q
5
7
Dob
9
D1a
10
D1b
12
D2a
13
D2b
17
D3a
18
D3b
20
D4a
1
D4b
3
D5a
4
D5b
= Pin 5
V
CC
GND = Pin 15
8
11
14
16
19
2
SF00454
Q
O
1
Q
Q
2
3
Q
Q
4
Q
5
ABSOLUTE MAXIMUM RATINGS
(Operation beyond the limit set forth in this table may impair the useful life of the device. Unless otherwise noted these limits are over the
operating free air temperature range.)
SYMBOL
V
V
I
IN
V
I
OUT
T
T
CC
IN
OUT
amb
stg
Supply voltage –0.5 to +7.0 V
Input voltage –0.5 to +7.0 V
Input current –30 to +5 mA
Voltage applied to output in high output state –0.5 to V
Current applied to output in low output state 96 mA
Operating free–air temperature range 0 to +70
Storage temperature range –65 to +150
September 14, 1990
PARAMETER RATING UNIT
CC
3
V
°C
°C
Page 4
Philips Semiconductors Product specification
74F804/1804Hex 2-input NAND drivers
RECOMMENDED OPERATING CONDITIONS
SYMBOL PARAMETER LIMITS T
UNIT MIN NOM MAX
V
V
V
I
I
I
T
CC
IH
IL
Ik
OH
OL
amb
Supply voltage 4.5 5.0 5.5 V
High–level input voltage 2.0 V
Low–level input voltage 0.8 V
Input clamp current –18 mA
High–level output current –48 mA
Low–level output current 48 mA
Operating free air temperature range 0 +70
DC ELECTRICAL CHARACTERISTICS
(Over recommended operating free-air temperature range unless otherwise noted.)
SYMBOL
V
OH
High-level output voltage VCC = MIN, VIL = MAX
PARAMETER TEST CONDITIONS
VIH = MIN, IOH = MAX
V
OL
V
IK
I
I
I
IH
I
IL
I
O
I
CC
Low-level output voltage VCC = MIN, VIL = MAX
VIH = MIN, I
Input clamp voltage VCC = MIN, II = I
OL
= MAX
IK
Input current at maximum input voltage VCC = MAX, VI = 7.0V 100 µA
High–level input current VCC = MAX, VI = 2.7V 20 µA
Low–level input current VCC = MAX, VI = 0.5V -20 µA
Output current
Supply current (total) I
3
VCC = MAX -60 -160 mA
CCHVCC
I
CCLVCC
= MAX VIN = GND 2.0 3.0 mA
= MAX VIN = 4.5V 15 20 mA
NOTES:
1. For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions for the applicable type.
2. All typical values are at V
3. The output conditions have been chosen to produce a current that closely approximates one half of the true short–circuit output current, I
= 5V, T
CC
amb
= 25°C.
1
±10%V
±10%V
±5%V
±5%V
CC
CC
CC
CC
LIMITS UNIT
MIN TYP
2
MAX
2.0 V
2.0 V
0.38 0.55 V
0.38 0.55 V
-0.73 -1.2 V
=
A
–40 to
°C
+85
°C
OS
.
AC ELECTRICAL CHARACTERISTICS
T
= +25°C T
amb
SYMBOL PARAMETER TEST VCC = +5.0V
CONDITION CL = 50pF,
= 500Ω
R
L
MIN TYP MAX MIN MAX
t
PLH
t
PHL
t
sk(o)
NOTES:
1. [t
PN
2. Skew times are valid only under same test conditions (temperature, V
September 14, 1990
Propagation delay
Dna, Dnb to Qn
Output skew
1,2
Waveform 1
Waveform 2 1.5 1.5 ns
1.0
1.0
2.0
3.0
actual – tPM actual] for any output compared to any other output where N and M are either LH or HL.
, loading, etc.,).
CC
4
4.0
4.5
LIMITS
amb
VCC = +5.0V ± 10%
1.0
1.0
= 0°C to +70°C
CL = 50pF,
= 500Ω
R
L
4.0
5.0
UNIT
ns
Page 5
Philips Semiconductors Product specification
74F804/1804Hex 2-input NAND drivers
AC WAVEFORMS
Dna, Dnb
Qn
V
M
t
PHL
V
M
t
PLH
V
M
Waveform 1. Propagation delay for inverting outputs
NOTE: For all waveforms, V
= 1.5V.
M
TEST CIRCUIT AND WAVEFORMS
V
CC
V
PULSE
GENERATOR
IN
R
T
Test Circuit for Totem-Pole Outputs
DEFINITIONS:
= Load resistor;
R
L
see AC ELECTRICAL CHARACTERISTICS for value.
= Load capacitance includes jig and probe capacitance;
C
L
see AC ELECTRICAL CHARACTERISTICS for value.
R
= Termination resistance should be equal to Z
T
pulse generators.
D.U.T.
V
OUT
C
Qn
V
M
SF00005
Qn
V
M
t
sk(0)
V
M
SF00455
Waveform 2. Output skew
t
NEGATIVE
PULSE
R
L
L
POSITIVE
PULSE
90%
10%
V
M
10%
t
THL (tf
t
TLH (tr
90%
V
M
w
V
M
10%
)
)
t
w
t
TLH (tr
t
THL (tf
)
)
90%
V
M
90%
10%
AMP (V)
0V
AMP (V)
0V
Input Pulse Definition
INPUT PULSE REQUIREMENTS
V
amplitude
3.0V 1.5V
rep. rate
M
1MHz 500ns
t
w
t
TLHtTHL
2.5ns 2.5ns
OUT
of
family
74F
September 14, 1990
SF00006
5
Page 6
Philips Semiconductors Product specification
74F804, 74F1804Hex 2-input NAND drivers
DIP20: plastic dual in-line package; 20 leads (300 mil) SOT146-1
1990 Sep 14
6
Page 7
Philips Semiconductors Product specification
74F804, 74F1804Hex 2-input NAND drivers
SO20: plastic small outline package; 20 leads; body width 7.5 mm SOT163-1
1990 Sep 14
7
Page 8
Philips Semiconductors Product specification
74F804, 74F1804Hex 2-input NAND drivers
Data sheet status
Data sheet
status
Objective
specification
Preliminary
specification
Product
specification
Product
status
Development
Qualification
Production
Definition
This data sheet contains the design target or goal specifications for product development.
Specification may change in any manner without notice.
This data sheet contains preliminary data, and supplementary data will be published at a later date.
Philips Semiconductors reserves the right to make chages at any time without notice in order to
improve design and supply the best possible product.
This data sheet contains final specifications. Philips Semiconductors reserves the right to make
changes at any time without notice in order to improve design and supply the best possible product.
[1]
[1] Please consult the most recently issued datasheet before initiating or completing a design.
Definitions
Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or
at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended
periods may affect device reliability.
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips
Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or
modification.
Disclaimers
Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can
reasonably be expected to result in personal injury . Philips Semiconductors customers using or selling these products for use in such applications
do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard
cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless
otherwise specified.
Philips Semiconductors
811 East Arques Avenue
P.O. Box 3409
Sunnyvale, California 94088–3409
Telephone 800-234-7381
Copyright Philips Electronics North America Corporation 1998
All rights reserved. Printed in U.S.A.
print code Date of release: 10-98
Document order number: 9397-750-05182
yyyy mmm dd
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