Product specification
Supercedes data of 1990 Oct 23
IC15 Data Handbook
1996 Mar 12
Page 2
Philips SemiconductorsProduct specification
74F74Dual D-type flip-flop
FEA TURE
•Industrial temperature range available (–40°C to +85°C)
DESCRIPTION
The 74F74 is a dual positive edge-triggered D-type flip-flop featuring
individual data, clock, set, and reset inputs; also true and
complementary outputs. Set (SD) and reset (RD) are asynchronous
active low inputs and operate independently of the clock input. When
set and reset are inactive (high), data at the D input is transferred to
the Q and Q
must be stable just one setup time prior to the low-to-high transition of
outputs on the low-to-high transition of the clock. Data
PIN CONFIGURATION
1
D0
R
2
D0
CP0
3
S
D0
4
Q0
5
0
Q
6
GND
the clock for predictable operation. Clock triggering occurs at a
voltage level and is not directly related to the transition time of the
positive-going pulse. Following the hold time interval, data at the D
input may be changed without affecting the levels of the output.
TYPETYPICAL f
max
TYPICAL SUPPLY CURRENT (TOTAL)
74F74125MHz11.5mA
ORDERING INFORMATION
ORDER CODE
DESCRIPTION
COMMERCIAL RANGE
VCC = 5V ±10%,
T
= 0°C to +70°C
amb
14-pin plastic DIPN74F74NI74F74NSOT27-1
14-pin plastic SON74F74DI74F74DSOT108-1
INDUSTRIAL RANGE
VCC = 5V ±10%,
T
= –40°C to +85°C
amb
14
13
12
11
10
9
87
SF00045
V
CC
D1
R
D1
CP1
SD1
Q1
Q1
PKG. DWG. #
INPUT AND OUTPUT LOADING AND FAN OUT TABLE
PINSDESCRIPTION74F (U.L.) HIGH/LOWLOAD VALUE HIGH/LOW
H = High voltage level
h = High voltage level one setup time prior to low-to-high clock
transition
L = Low voltage level
l= Low voltage level one setup time prior to low-to-high clock
transition
NC= No change from the previous setup
X = Don’t care
↑ = Low-to-high clock transition
= Not low-to-high clock transition
↑
* = This setup is unstable and will change when either set or reset
return to the high level.
ABSOLUTE MAXIMUM RATINGS
(Operation beyond the limit set forth in this table may impair the useful life of the device.
Unless otherwise noted these limits are over the operating free air temperature range.)
SYMBOL
V
CC
V
IN
I
IN
V
OUT
I
OUT
amb
T
stg
Supply voltage–0.5 to +7.0V
Input voltage –0.5 to +7.0V
Input current–30 to +5mA
Voltage applied to output in high output state–0.5 to V
Current applied to output in low output state40mA
(Over recommended operating free-air temperature range unless otherwise noted.)
LIMITS
MINTYP2MAX
p
p
V
IK
I
I
I
IH
IL
I
OS
I
CC
Input clamp voltageVCC = MIN, II = I
Input current at maximum input
voltage
High-level input currentVCC = MAX, VI = 2.7V20µA
Low-level input
current
Short-circuit output current
Supply current (total)
Dn, CPnVCC = MAX, VI = 0.5V-0.6mA
SDn, RDn VCC = MAX, VI = 0.5V-1.8mA
3
4
CC
CC
=
=
=
IL
=
IL
IK
=
IH
=
IH
VCC = MAX, VI = 7.0V100µA
VCC = MAX-60-150mA
VCC = MAX11.516mA
OH
OL
=
=
±10%V
±5%V
±10%V
±5%V
NOTES:
1 For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions for the applicable type.
2 All typical values are at V
3 Not more than one output should be shorted at a time. For testing I
= 5V, T
CC
techniques are preferable in order to minimize internal heating and more accurately reflect operational values. Otherwise, prolonged shorting
amb
= 25°C.
, the use of high-speed test apparatus and/or sample-and-hold
OS
of a high output may raise the chip temperature well above normal and thereby cause invalid readings in other parameter tests. In any
sequence of parameter tests, I
4 Measure I
with the clock input grounded and all outputs open, then with Q and Q outputs high in turn.
CC
tests should be performed last.
OS
2.5V
CC
2.73.4V
CC
CC
CC
0.300.50V
0.300.50V
-0.73-1.2V
AC ELECTRICAL CHARACTERISTICS
SYMBOLPARAMETER
f
max
t
PLH
t
PHL
t
PLH
t
PHL
Maximum clock frequencyWaveform 110012510090MHz
Propagation delay
CPn to Qn or Qn
Propagation delay
SDn, RDn to Qn or Qn
TEST
CONDITION
Waveform 1
Waveform 2
AC SETUP REQUIREMENTS
SYMBOLPARAMETER
t
(H)
su
t
(L)
su
t
(H)
h
t
(L)
h
t
(H)
w
t
(L)
w
t
(L)
w
t
rec
Setup time, high or low
Dn to CPn
Hold time, high or low
Dn to CPn
CPn pulse width,
high or low
SDn, RDn pulse width,
low
Recovery time
SDn, RDn to CPn
TEST
CONDITION
Waveform 1
Waveform 1
Waveform 1
Waveform 24.04.04.0ns
Waveform 32.02.02.0ns
LIMITS
VCC = +5.0V
T
= +25°C
amb
C
= 50pF, RL = 500Ω
L
VCC = +5.0V ± 10%
T
= 0°C to +70°C
amb
C
= 50pF, RL = 500Ω
L
VCC = +5.0V ± 10%
T
= –40°C to +85°C
amb
C
= 50pF, RL = 500Ω
L
MINTYPMAXMINMAXMINMAX
3.8
5.3
4.4
3.2
3.5
6.2
4.6
7.0
6.8
8.0
6.1
9.0
3.8
4.4
3.2
3.5
7.8
9.2
7.1
10.5
3.8
4.4
3.2
2.5
8.5
9.2
7.5
10.5
LIMITS
VCC = +5.0V
T
= +25°C
amb
C
= 50pF, RL = 500Ω
L
VCC = +5.0V ± 10%
T
= 0°C to +70°C
amb
C
= 50pF, RL = 500Ω
L
VCC = +5.0V ± 10%
T
= –40°C to +85°C
amb
C
= 50pF, RL = 500Ω
L
MINTYPMAXMINMAXMINMAX
2.0
3.0
1.0
1.0
4.0
5.0
2.0
3.0
1.0
1.0
4.0
5.0
2.0
3.0
1.0
1.0
4.0
5.0
UNIT
ns
ns
UNIT
ns
ns
ns
1996 Mar 12
4
Page 5
Philips Semiconductors Product specification
74F74Dual D-type flip-flop
AC WAVEFORMS
For all waveforms, VM = 1.5V.
The shaded areas indicate when the input is permitted to
change for predictable output performance.
Dn
CPn
Qn
Qn
V
M
tsu(L) th(L)
V
M
V
M
t
PLH
t
PHL
tw(H)
V
tsu(H)th(H)
1/f
max
(L)
t
V
M
V
M
V
M
w
V
M
M
V
M
t
PHL
V
M
t
PLH
V
M
SF01276
Waveform 1. Propagation delay for data to output, data setup
time and hold times, and clock width, and maximum clock
frequency
SDn or RDn
CPn
V
M
t
rec
V
M
SF00051
Waveform 3. Recovery time for set or reset to clock
t
PLH
t
PHL
tw(L)
V
M
(L)
t
t
PHL
t
PLH
w
V
M
V
M
SF00050
V
M
V
M
V
M
SDn
RDn
Qn
Qn
V
M
Waveform 2. Propagation delay for set and reset to output,
set and reset pulse width
V
M
TEST CIRCUIT AND WAVEFORMS
V
CC
V
PULSE
GENERATOR
IN
R
T
Test Circuit for Totem-Pole Outputs
DEFINITIONS:
R
= Load resistor;
L
see AC ELECTRICAL CHARACTERISTICS for value.
C
= Load capacitance includes jig and probe capacitance;
SO14:plastic small outline package; 14 leads; body width 3.9 mmSOT108-1
1996 Mar 12
7
Page 8
Philips SemiconductorsProduct specification
74F74Dual D-type flip-flop
Data sheet status
Data sheet
status
Objective
specification
Preliminary
specification
Product
specification
Product
status
Development
Qualification
Production
Definition
This data sheet contains the design target or goal specifications for product development.
Specification may change in any manner without notice.
This data sheet contains preliminary data, and supplementary data will be published at a later date.
Philips Semiconductors reserves the right to make chages at any time without notice in order to
improve design and supply the best possible product.
This data sheet contains final specifications. Philips Semiconductors reserves the right to make
changes at any time without notice in order to improve design and supply the best possible product.
[1]
[1] Please consult the most recently issued datasheet before initiating or completing a design.
Definitions
Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or
at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended
periods may affect device reliability.
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips
Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or
modification.
Disclaimers
Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can
reasonably be expected to result in personal injury . Philips Semiconductors customers using or selling these products for use in such applications
do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard
cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless
otherwise specified.
Philips Semiconductors
811 East Arques Avenue
P.O. Box 3409
Sunnyvale, California 94088–3409
Telephone 800-234-7381
Copyright Philips Electronics North America Corporation 1998
All rights reserved. Printed in U.S.A.
print codeDate of release: 10-98
Document order number:9397-750-05066
yyyy mmm dd
8
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