Datasheet N74F175AN, N74F175N, N74F175D, N74F175AD Datasheet (Philips)

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74F175*, 74F175A Quad D flip-flop
Product specification IC15 Data Handbook
1996 Mar 12
INTEGRATED CIRCUITS
Page 2
Philips Semiconductors Product specification
74F175AQuad D flip-flop
2
1996 Mar 12 853–0047 16555
FEA TURES
•Four edge-triggered D-type flip-flops
•Buffered common clock
•Buffered asynchronous Master Reset
•True and complementary outputs
•Industrial temperature range available (–40°C to +85°C)
•PNP light loading inputs
DESCRIPTION
The 74F175A is a quad, edge-triggered D-type flip-flop with individual D inputs and both Q and Q
outputs. The common buffered
Clock (CP) and Master Reset (MR
) inputs load and reset (clear) all
flip-flops simultaneously. The register is fully edge-triggered. The state of each D input, one
setup time before the Low-to-High clock transition is transferred to the corresponding flip-flop’s Q output.
All Q outputs will be forced Low independently of clock or data inputs by a Low voltage level on the MR
input. The device is useful for applications where both true and complementary outputs are required, and the CP and MR
are common to all storage elements.
PIN CONFIGURATION
16 15 14 13 12 11 107
6
5
4
3
2
1
98
V
CC
SF00718
Q3 Q
3 D3 D2 Q
2 Q2 CP
MR
Q0 Q
0 D0 D1 Q
1 Q1
GND
TYPE TYPICAL f
max
TYPICAL SUPPL Y
CURRENT (TOTAL)
74F175A 160MHz 22mA
ORDERING INFORMATION
ORDER CODE
DESCRIPTION
COMMERCIAL RANGE
V
CC
= 5V ±10%,
T
amb
= 0°C to +70°C
PKG. DWG. #
16-pin plastic DIP 74F175AN SOT38-4
16-pin plastic SO 74F175AD SOT109-1
INPUT AND OUTPUT LOADING AND FAN OUT TABLE
PINS DESCRIPTION
74F (U.L.)
HIGH/LOW
LOAD VALUE
HIGH/LOW
D0 – D3 Data inputs 74F175A 1.0/0.033 20µA/20µA
MR Master reset input (active–Low) 74F175A 1.0/0.033 20µA/20µA
CP Clock input (active rising edge) 74F175A 1.0/0.033 20µA/20µA Q0–Q3 True outputs 50/33 1.0mA/20mA Q0–Q3 Complementary outputs 50/33 1.0mA/20mA
NOTE:
One (1.0) FAST unit load is defined as: 20µA in the High state and 0.6mA in the Low state.
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Philips Semiconductors Product specification
74F175AQuad D flip-flop
1996 Mar 12
3
LOGIC SYMBOL
VCC = Pin 16 GND = Pin 8
SF00719
4 5 12 13
D0 D1 D2 D3
CP MR
9 1
2 3 7 6 10 11 15 14
Q0 Q0 Q1 Q1 Q2 Q2 Q3 Q3
IEC/IEEE SYMBOL
R
C1
1D
SF00720
1 9
4
5
12
13
2 3 7
6
10
11 15 14
LOGIC DIAGRAM
DQ
RD
V
CC
= Pin 16
GND = Pin 8
CP
D0
4
DQ
RD
CP
D1
5
DQ
RD
CP
D2
12
DQ
RD
CP
D3
13
Q
SF00721
CP
MR
9
1
32 6 1110 14157
Q
0Q0 Q1Q1 Q2Q2 Q3Q3
FUNCTION TABLE
INPUTS OUTPUTS
OPERATING
MR CP Dn Q
n
Q
n
MODE
L X X L H Reset (clear) H ↑ h H L Load “1” H ↑ I L H Load “0”
H = High voltage level h = High state must be present one setup time before the
Low-to-High clock transition L = Low voltage level l = Low state must be present one setup time before the
Low-to-High clock transition X = Don’t care ↑ = Low-to-High clock transition
ABSOLUTE MAXIMUM RATINGS
(Operation beyond the limit set forth in this table may impair the useful life of the device. Unless otherwise noted these limits are over the operating free air temperature range.)
SYMBOL PARAMETER RATING UNIT
V
CC
Supply voltage –0.5 to +7.0 V
V
IN
Input voltage –0.5 to +7.0 V
I
IN
Input current –30 to +5 mA
V
OUT
Voltage applied to output in High output state –0.5 to V
CC
V
I
OUT
Current applied to output in Low output state
40 mA
p
p
Commercial range 0 to +70
°C
T
amb
O erating free air tem erature range
Industrial range –40 to +85
°C
T
stg
Storage temperature range –65 to +150
°C
Page 4
Philips Semiconductors Product specification
74F175AQuad D flip-flop
1996 Mar 12
4
RECOMMENDED OPERATING CONDITIONS
SYMBOL PARAMETER LIMITS UNIT
MIN NOM MAX
V
CC
Supply voltage 4.5 5.0 5.5 V
V
IH
High-level input voltage 2.0 V
V
IL
Low-level input voltage 0.8 V
I
IK
Input clamp current –18 mA
I
OH
High-level output current –1 mA
I
OL
Low-level output current
20 mA
Commercial range 0 +70
°C
T
amb
O
perating free air temperature range
Industrial range –40 +85
°C
DC ELECTRICAL CHARACTERISTICS
(Over recommended operating free-air temperature range unless otherwise noted.)
SYMBOL
PARAMETER TEST LIMITS UNIT
CONDITIONS
1
MIN TYP2MAX
p
VCC= MIN, VIL = MAX,
10%V
CC
2.5
V
OH
High-level out ut voltage
CC IL
VIH = MIN, IOH = MAX
5%V
CC
2.7 3.4
V
V
OL
Low-level output voltage
VCC = MIN, VIL = MAX,
10%V
CC
0.30 0.5
CC IL
VIH = MIN, IOL = MAX
5%V
CC
0.30 0.5
V
V
IK
Input clamp voltage VCC = MIN, II = I
IK
–0.73 –1.2 V
I
I
Input current at maximum input voltage VCC = 0.0V, VI = 7.0V 100 µA
I
IH
High-level input current VCC = MAX, VI = 2.7V 20 µA
I
IL
Low-level input current VCC = MAX, VI = 0.5V 74F175A –20 µA
I
OS
Short-circuit output current
3
VCC = MAX –60 –150 mA
I
CC
Supply current (total) VCC = MAX 74F175A 22 31 mA
Notes to DC electrical characteristics
1. For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions for the applicable type.
2. All typical values are at V
CC
= 5V, T
amb
= 25°C.
3. Not more than one output should be shorted at a time. For testing IOS, the use of high-speed test apparatus and/or sample-and-hold techniques are preferable in order to minimize internal heating and more accurately reflect operational values. Otherwise, prolonged shorting of a high output may raise the chip temperature well above normal and thereby cause invalid readings in other parameter tests. In any sequence of parameter tests, I
OS
tests should be performed last.
AC ELECTRICAL CHARACTERISTICS FOR 74F175A
LIMITS
T
amb
= 25°C T
amb
= 0°C to +70°C T
amb
= 40°C to +85°C
SYMBOL PARAMETER TEST VCC = +5V
VCC = +5.0V ± 10% VCC = +5.0V ± 10%
UNIT
CONDITION CL = 50pF,
R
L
= 500Ω
CL = 50pF,
R
L
= 500Ω
CL = 50pF,
R
L
= 500Ω
MIN TYP MAX MIN MAX MIN MAX
f
max
Maximum clock frequency
Waveform 1 140 160 125 110 MHz
t
PLH
t
PHL
Propagation delay CP to Qn or Q
n
Waveform 1
3.0
4.5
4.0
6.0
6.5
8.5
2.5
4.0
7.5
9.0
2.5
4.0
8.0
10.0
ns
t
PLH
t
PHL
Propagation delay MR
to Qn
Waveform 3 4.5 6.5 9.0 4.5 10.0 4.5 11.0 ns
t
PHL
t
PHL
Propagation delay MR
to Qn
Waveform 3 4.5 6.0 8.0 4.0 9.0 4.0 10.0 ns
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Philips Semiconductors Product specification
74F175AQuad D flip-flop
1996 Mar 12
5
AC SETUP REQUIREMENTS FOR 74F175A
LIMITS
T
amb
= 25°C T
amb
= 0°C to +70°C T
amb
= 40°C to +85°C
SYMBOL PARAMETER TEST VCC = +5V
VCC = +5.0V ± 10% VCC = +5.0V ± 10%
UNIT
CONDITION CL = 50pF,
R
L
= 500Ω
CL = 50pF,
R
L
= 500Ω
CL = 50pF,
R
L
= 500Ω
MIN TYP MAX MIN MAX MIN MAX
ts(H)
t
s
(L)
Setup time, High or Low Dn to CP
Waveform 2
3.0
3.0
3.5
3.5
4.0
4.0
ns
th(H) t
h
(L)
Hold time, High or Low Dn to CP
Waveform 2
0.0
0.0
0.0
0.0
0.0
0.0
ns
tw(H)
t
w
(L)
CP Pulse width High or Low
Waveform 1
3.0
4.0
3.5
5.0
4.0
5.5
ns
tw(L)
MR Pulse width Low
Waveform 3 3.5 3.5 4.0 ns
t
REC
Recovery time MR
to CP
Waveform 3 4.0 4.5 5.0 ns
AC WAVEFORMS
For all waveforms, VM = 1.3V .
CP
V
M
V
M
V
M
tw(H)
1/f
max
V
M
V
M
t
PLH
tw(L)
t
PHL
Q
n
V
M
V
M
Q
n
t
PLH
t
PHL
SF00722
Waveform 1. Propagation delay for clock input to output, clock
pulse width, and maximum clock frequency
th(H)ts(H)
CP
SF00191
V
M
V
M
V
M
V
M
V
M
V
M
th(L)ts(L)
Dn
Waveform 2. Data setup time and hold times
CP
V
M
V
M
V
M
V
M
t
PHL
t
REC
MR
Q
n
tw(L)
V
M
Q
n
t
PLH
SF00723
Waveform 3. Master Reset pulse width, Master Reset to output
delay and Master Reset to Clock recovery time
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Philips Semiconductors Product specification
74F175AQuad D flip-flop
1996 Mar 12
6
TEST CIRCUIT AND WAVEFORMS
t
w
90%
V
M
10%
90%
V
M
10%
90%
V
M
10%
90%
V
M
10%
NEGATIVE PULSE
POSITIVE PULSE
t
w
AMP (V)
0V
0V
t
THL (tf
)
INPUT PULSE REQUIREMENTS
rep. rate
t
w
t
TLHtTHL
1MHz 500ns
2.5ns 2.5ns
Input Pulse Definition
V
CC
family
74F
D.U.T.
PULSE
GENERATOR
R
L
C
L
R
T
V
IN
V
OUT
Test Circuit for Totem-Pole Outputs
DEFINITIONS:
R
L
= Load resistor;
see AC ELECTRICAL CHARACTERISTICS for value.
C
L
= Load capacitance includes jig and probe capacitance;
see AC ELECTRICAL CHARACTERISTICS for value.
R
T
= Termination resistance should be equal to Z
OUT
of
pulse generators.
t
THL (tf
)
t
TLH (tr
)
t
TLH (tr
)
AMP (V)
amplitude
3.0V 1.5V
V
M
SF00006
Page 7
Philips Semiconductors Product specification
74F175*, 74F175AQuad D flip-flop
1996 Mar 12
7
* Discontinued part. Please see the Discontinued Product List.
DIP16: plastic dual in-line package; 16 leads (300 mil) SOT38-4
Page 8
Philips Semiconductors Product specification
74F175*, 74F175AQuad D flip-flop
1996 Mar 12
8
* Discontinued part. Please see the Discontinued Product List.
SO16: plastic small outline package; 16 leads; body width 3.9 mm SOT109-1
Page 9
Philips Semiconductors Product specification
74F175*, 74F175AQuad D flip-flop
1996 Mar 12
9
* Discontinued part. Please see the Discontinued Product List.
NOTES
Page 10
Philips Semiconductors Product specification
74F175*, 74F175AQuad D flip-flop
yyyy mmm dd
10
Definitions
Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook. Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification.
Disclaimers
Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can
reasonably be expected to result in personal injury . Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
Philips Semiconductors 811 East Arques Avenue P.O. Box 3409 Sunnyvale, California 94088–3409 Telephone 800-234-7381
Copyright Philips Electronics North America Corporation 1998
All rights reserved. Printed in U.S.A.
print code Date of release: 10-98 Document order number: 9397-750-05091
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Data sheet status
Objective specification
Preliminary specification
Product specification
Product status
Development
Qualification
Production
Definition
[1]
This data sheet contains the design target or goal specifications for product development. Specification may change in any manner without notice.
This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips Semiconductors reserves the right to make chages at any time without notice in order to improve design and supply the best possible product.
This data sheet contains final specifications. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product.
Data sheet status
[1] Please consult the most recently issued datasheet before initiating or completing a design.
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