Page 1
INTEGRATED CIRCUITS
74F10 Triple 3-input NAND gate
74F11 Triple 3-input AND gate
Product specification
IC15 Data Handbook
1989 Sep 20
Page 2
Philips Semiconductors Product specification
74F10, 74F11Gates
74F10 Triple 3-input NAND gate
74F11 Triple 3-input AND gate
ORDERING INFORMATION
COMMERCIAL RANGE
DESCRIPTION
14-pin plastic DIP N74F10N, N74F11N SOT27-1
VCC = 5V ±10%,
T
= 0°C to +70°C
amb
TYPE
TYPICAL
PROPAGATION
DELA Y
TYPICAL
SUPPLY CURRENT
(TOTAL)
74F10 3.5ns 3.3mA
74F11 4.2ns 5.3mA
14-pin plastic SO N74F10D, N74F11D SOT108-1
INPUT AND OUTPUT LOADING AND FAN OUT TABLE
PINS DESCRIPTION 74F (U.L.) HIGH/LOW LOAD VALUE HIGH/LOW
Dna, Dnb, Dnc Data inputs 1.0/1.0 20µA/0.6mA
Qn Data output (74F10) 50/33 1.0mA/20mA
Qn Data output (74F11) 50/33 1.0mA/20mA
NOTE: One (1.0) FAST unit load is defined as: 20µA in the High state and 0.6mA in the Low state.
PIN CONFIGURATIONS
D0a
D0b
D1a
D1b
D1c
GND
74F10
1
2
3
4
5
1
Q
6
14
V
D0c
13
Q
12
D2c
11
D2b
10
D2a
9
Q2
87
SF00055
CC
0
D0a
D0b
D1a
D1b
D1c
Q1
GND
74F11
1
2
3
4
5
6
14
13
12
11
10
9
87
SF00056
V
D0c
Q0
D2c
D2b
D2a
Q2
PKG DWG #
CC
LOGIC SYMBOLS
1 2 13 3 4 5 9 10
D0a D0b D0c D1b D1c D2a D2bD1a
VCC = Pin 14
GND = Pin 7
74F10
Q0 Q1 Q2
12 6 8
11
D2c
SF00057
= Pin 14
V
CC
GND = Pin 7
74F11
1 2 13 3 4 5 9 10
D0a D0b D0c D1b D1c D2a D2bD1a
Q0 Q1 Q2
12 6 8
11
D2c
SF00058
September 20, 1989 853–0329 97683
2
Page 3
Philips Semiconductors Product specification
INPUTS
74F10, 74F11Gates
IEC/IEEE SYMBOLS
74F10
1
2
13
3
4
5
9
10
11
&
12
6
8
1
2
13
3
4
5
9
10
11
74F11
&
12
6
8
SF00059
LOGIC DIAGRAMS
74F10
1
VCC = Pin 14
GND = Pin 7
D0a
D0b
D0c
D1a
D1b
D1c
D2a
D2b
D2c
2
13
3
4
5
9
10
11
12
Q0
6
Q1
8
Q2
SF00061
FUNCTION TABLE
OUTPUTS
74F10 74F11
Dna Dnb Dnc Qn Qn
L L L H L
L L H H L
L H L H L
L H H H L
H L L H L
H L H H L
H H L H L
H H H L H
NOTES:
1. H = High voltage level
2. L = Low voltage level
VCC = Pin 14
GND = Pin 7
D0a
D0b
D0c
D1a
D1b
D1c
D2a
D2b
D2c
1
2
13
3
4
5
9
10
11
74F11
SF00060
12
6
8
SF00062
Q0
Q1
Q2
September 20, 1989
3
Page 4
Philips Semiconductors Product specification
SYMBOL
PARAMETER
UNIT
SYMBOL
PARAMETER
TEST CONDITIONS
1
UNIT
VOHHigh-level output voltage
V
VOLLow-level output voltage
V
74F10
V
MAX
mA
ICCSupply current (total)
74F11
V
MAX
mA
74F10, 74F11Gates
ABSOLUTE MAXIMUM RATINGS
(Operation beyond the limit set forth in this table may impair the useful life of the device.
Unless otherwise noted these limits are over the operating free-air temperature range.)
SYMBOL
V
V
I
IN
V
I
OUT
T
T
CC
IN
OUT
amb
stg
Supply voltage –0.5 to +7.0 V
Input voltage –0.5 to +7.0 V
Input current –30 to +5 mA
Voltage applied to output in High output state –0.5 to V
Current applied to output in Low output state 40 mA
Operating free-air temperature range 0 to +70 °C
Storage temperature range –65 to +150 °C
RECOMMENDED OPERATING CONDITIONS
V
V
V
I
I
I
T
CC
IH
IL
IK
OH
OL
amb
Supply voltage 4.5 5.0 5.5 V
High-level input voltage 2.0 V
Low-level input voltage 0.8 V
Input clamp current –18 mA
High-level output current –1 mA
Low-level output current 20 mA
Operating free air temperature range 0 +70 °C
PARAMETER RATING UNIT
CC
V
LIMITS
MIN NOM MAX
DC ELECTRICAL CHARACTERISTICS
(Over recommended operating free-air temperature range unless otherwise noted.)
LIMITS
MIN TYP
p
p
V
IK
I
I
I
IH
I
IL
I
OS
Input clamp voltage VCC = MIN, II = I
Input current at maximum input voltage VCC = MAX, VI = 7.0V 100 µA
High-level input current VCC = MAX, VI = 2.7V 20 µA
Low-level input current VCC = MAX, VI = 0.5V –0.6 mA
Short-circuit output current
3
pp
VCC = MIN, VIL = MAX ±10%V
VIH = MIN, IOH = MAX ±5%V
CC
VCC = MIN, VIL = MAX ±10%V
VIH = MIN, I
= MAX ±5%V
Ol
IK
CC
VCC = MAX –60 –150 mA
I
CCH
I
CCL
I
CCH
I
CCL
CC
CC
=
=
VIN = GND 1.8 2.1
VIN = 4.5V 6.0 7.7
VIN = 4.5V 4.7 6.2
VIN = GND 7.2 9.7
CC
CC
2.5
2.7 3.4
NOTES:
1. For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions for the applicable type.
2. All typical values are at V
3. Not more than one output should be shorted at a time. For testing I
= 5V, T
CC
techniques are preferable in order to minimize internal heating and more accurately reflect operational values. Otherwise, prolonged shorting
amb
= 25°C.
, the use of high-speed test apparatus and/or sample-and-hold
OS
of a High output may raise the chip temperature well above normal and thereby cause invalid readings in other parameter tests. In any
sequence of parameter tests, I
tests should be performed last.
OS
2
MAX
0.35 0.50
0.35 0.50
–0.73 –1.2 V
September 20, 1989
4
Page 5
Philips Semiconductors Product specification
TEST
CONDITION
74F10, 74F11Gates
AC ELECTRICAL CHARACTERISTICS
LIMITS
VCC = +5.0V VCC = +5.0V ± 10%
SYMBOL PARAMETER
t
PLH
t
PHL
t
PLH
t
PHL
Propagation delay
Dna, Dnb, Dnc to Qn
Propagation delay
Dna, Dnb, Dnc to Qn
AC WAVEFORMS
For all waveforms, VM = 1.5V.
74F10 Waveform 1
74F11 Waveform 2
T
= +25°C T
amb
= 0°C to +70°C UNIT
amb
CL = 50pF, RL = 500Ω CL = 50pF, RL = 500Ω
MIN TYP MAX MIN MAX
2.4
1.5
3.0
2.5
3.7
3.2
4.2
4.1
5.0
4.3
5.6
5.5
2.4
1.5
3.0
2.5
6.0
5.3
6.6
6.5
ns
ns
Dna, Dnb, Dnc
Qn
V
M
t
PHL
V
M
t
PLH
V
M
V
M
Waveform 1. Propagation Delay for Inverting Outputs
(74F10)
TEST CIRCUIT AND WAVEFORM
V
CC
V
PULSE
GENERATOR
IN
R
T
Test Circuit for Totem-Pole Outputs
DEFINITIONS:
= Load resistor;
R
L
see AC ELECTRICAL CHARACTERISTICS for value.
C
= Load capacitance includes jig and probe capacitance;
L
see AC ELECTRICAL CHARACTERISTICS for value.
R
= Termination resistance should be equal to Z
T
pulse generators.
D.U.T.
V
OUT
C
L
R
L
SF00064
OUT
of
NEGATIVE
PULSE
POSITIVE
PULSE
Dna, Dnb, Dnc
Qn
V
M
t
PLH
V
M
t
PHL
V
M
V
M
Waveform 2. Propagation Delay for Non-Inverting Outputs
(74F11)
90%
10%
w
TLH (tr
t
THL (tf
V
10%
)
)
90%
V
M
10%
)
t
THL (tf
)
t
TLH (tr
90%
V
M
t
t
w
90%
M
V
M
10%
t
Input Pulse Definition
family
74F
INPUT PULSE REQUIREMENTS
V
amplitude
3.0V 1.5V
rep. rate
M
1MHz 500ns
t
w
t
TLHtTHL
2.5ns 2.5ns
SF00063
AMP (V)
0V
AMP (V)
0V
September 20, 1989
SF00006
5
Page 6
Philips Semiconductors Product specification
74F10, 74F11Gates
DIP14: plastic dual in-line package; 14 leads (300 mil) SOT27-1
1989 Sep 20
6
Page 7
Philips Semiconductors Product specification
74F10, 74F11Gates
SO14: plastic small outline package; 14 leads; body width 3.9 mm SOT108-1
1989 Sep 20
7
Page 8
Philips Semiconductors Product specification
74F10, 74F11Gates
Data sheet status
Data sheet
status
Objective
specification
Preliminary
specification
Product
specification
Product
status
Development
Qualification
Production
Definition
This data sheet contains the design target or goal specifications for product development.
Specification may change in any manner without notice.
This data sheet contains preliminary data, and supplementary data will be published at a later date.
Philips Semiconductors reserves the right to make chages at any time without notice in order to
improve design and supply the best possible product.
This data sheet contains final specifications. Philips Semiconductors reserves the right to make
changes at any time without notice in order to improve design and supply the best possible product.
[1]
[1] Please consult the most recently issued datasheet before initiating or completing a design.
Definitions
Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or
at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended
periods may affect device reliability.
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips
Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or
modification.
Disclaimers
Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can
reasonably be expected to result in personal injury . Philips Semiconductors customers using or selling these products for use in such applications
do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard
cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless
otherwise specified.
Philips Semiconductors
811 East Arques Avenue
P.O. Box 3409
Sunnyvale, California 94088–3409
Telephone 800-234-7381
Copyright Philips Electronics North America Corporation 1998
All rights reserved. Printed in U.S.A.
print code Date of release: 10-98
Document order number: 9397-750-05056
yyyy mmm dd
8
Loading...