NOTE: One (1.0) FAST unit load is defined as: 20µA in the high state and 0.6mA in the low state.
LOGIC DIAGRAM
1A
2A
3A
4A
5A
VCC = Pin 14
GND = Pin 7
6A
LOGIC SYMBOL
VCC = Pin 14
GND = Pin 7
1
3
5
9
11
13
13591113
1A 2A 3A 4A 5A 6A
1A 2A 3A 4A 5A 6A
46810
2
2
4
6
8
10
12
SF00012
12
SF00013
FUNCTION TABLE
1Y
INPUTSOUTPUT
AY
2Y
3Y
4Y
5Y
6Y
NOTES:
H = High voltage level
L = Low voltage level
L H
HL
IEC/IEEE SYMBOL
1
3
5
9
11
13
1
2
4
6
8
10
12
SF00014
October 4, 1990853-0327 00621
2
Page 3
Philips Semiconductors Product specification
74F04Hex inverter
ABSOLUTE MAXIMUM RATINGS
(Operation beyond the limit set forth in this table may impair the useful life of the device.
Unless otherwise noted these limits are over the operating free air temperature range.)
SYMBOL
V
V
I
IN
V
I
OUT
T
T
CC
IN
OUT
amb
stg
Supply voltage–0.5 to +7.0V
Input voltage –0.5 to +7.0V
Input current–30 to +5mA
Voltage applied to output in high output state–0.5 to V
Current applied to output in low output state40mA
Operating free air temperature rangeCommercial range0 to +70°C
(Over recommended operating free-air temperature range unless otherwise noted.)
SYMBOL
V
OH
High-level output voltageVCC = MIN, VIL = MAX±10%V
PARAMETERTEST CONDITIONS
VIH = MIN, IOH = MAX±5%V
V
OL
V
IK
I
I
I
IH
I
IL
I
OS
I
CC
Low-level output voltageVCC = MIN, VIL = MAX±10%V
VIH = MIN, I
Input clamp voltageVCC = MIN, II = I
Input current at maximum input
VCC = MAX, VI = 7.0V100µA
= MAX±5%V
Ol
IK
voltage
High-level input currentVCC = MAX, VI = 2.7V20µA
Low-level input currentVCC = MAX, VI = 0.5V-0.6mA
Short-circuit output current
Supply current (total)I
3
VCC = MAX-60-150mA
CCHVCC
I
CCLVCC
= MAXVIN = GND2.84.2mA
= MAXVIN = 4.5V10.215.3mA
NOTES:
1. For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions for the applicable type.
2. All typical values are at V
3. Not more than one output should be shorted at a time. For testing I
= 5V, T
CC
techniques are preferable in order to minimize internal heating and more accurately reflect operational values. Otherwise, prolonged shorting
amb
= 25°C.
OS
of a high output may raise the chip temperature well above normal and thereby cause invalid readings in other parameter tests. In any
sequence of parameter tests, I
tests should be performed last.
OS
1
MINTYP
CC
CC
CC
CC
2.5V
2.73.4V
LIMITSUNIT
2
MAX
0.300.50V
0.300.50V
-0.73-1.2V
, the use of high-speed test apparatus and/or sample-and-hold
SO14: plastic small outline package; 14 leads; body width 3.9 mmSOT108-1
1990 Oct 04
6
Page 7
Philips SemiconductorsProduct specification
74F04Hex inverter
NOTES
1990 Oct 04
7
Page 8
Philips SemiconductorsProduct specification
74F04Hex inverter
Data sheet status
Data sheet
status
Objective
specification
Preliminary
specification
Product
specification
Product
status
Development
Qualification
Production
Definition
This data sheet contains the design target or goal specifications for product development.
Specification may change in any manner without notice.
This data sheet contains preliminary data, and supplementary data will be published at a later date.
Philips Semiconductors reserves the right to make chages at any time without notice in order to
improve design and supply the best possible product.
This data sheet contains final specifications. Philips Semiconductors reserves the right to make
changes at any time without notice in order to improve design and supply the best possible product.
[1]
[1] Please consult the most recently issued datasheet before initiating or completing a design.
Definitions
Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or
at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended
periods may affect device reliability.
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips
Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or
modification.
Disclaimers
Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can
reasonably be expected to result in personal injury . Philips Semiconductors customers using or selling these products for use in such applications
do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard
cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless
otherwise specified.
Philips Semiconductors
811 East Arques Avenue
P.O. Box 3409
Sunnyvale, California 94088–3409
Telephone 800-234-7381
Copyright Philips Electronics North America Corporation 1998
All rights reserved. Printed in U.S.A.
print codeDate of release: 10-98
Document order number:9397-750-05053
yyyy mmm dd
8
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