•Industrial temperature range available (–40°C to +85°C)
TYPE
74F023.4ns4.4mA
TYPICAL
PROPAGATION
DELAY
TYPICAL SUPPL Y
CURRENT
(TOTAL)
PIN CONFIGURATION
1
0
Q
2
D0a
3
D0b
4
1
Q
D1a
5
D1b
6
GND
14
V
Q
13
12
D3b
D3a
11
Q2
10
9
D2a
87
D2b
SF00007
CC
3
ORDERING INFORMA TION
ORDER CODE
DESCRIPTION
COMMERCIAL RANGE
VCC = 5V ±10%, T
= 0°C to +70°C
amb
VCC = 5V ±10%, T
INDUSTRIAL RANGE
= –40°C to +85°C
amb
PKG DWG #
14-pin plastic DIPN74F02NI74F02NSOT27-1
14-pin plastic SON74F02DI74F02DSOT108-1
INPUT AND OUTPUT LOADING AND FAN-OUT TABLE
PINSDESCRIPTION74F (U.L.) HIGH/LOWLOAD VALUE HIGH/LOW
Dna, DnbData inputs1.0/1.020µA/0.6mA
QnData output50/331.0mA/20mA
NOTE:
One (1.0) FAST unit load is defined as: 20µA in the high state and 0.6mA in the low state.
LOGIC DIAGRAM
VCC = Pin 14
GND = Pin 7
LOGIC SYMBOL
VCC = Pin 14
GND = Pin 7
2
D0a
3
D0b
5
D1a
6
D1b
8
D2a
9
D2b
11
D3a
12
D3b
2356891112
D0a D0bD1aD2a D2b D3a D3bD1b
Q0 Q1 Q2 Q3
1 4 10 13
1
4
10
13
SF00008
SF00009
FUNCTION TABLE
Q
0
Q1
INPUTSOUTPUT
DnaDnbQn
LL H
LHL
Q2
Q
3
HLL
HHL
NOTES:
1 H = High voltage level
2 L = Low voltage level
IEC/IEEE SYMBOL
2
3
5
6
8
9
11
12
1
1
4
10
13
SF00010
1990 Oct 04853-0326 00622
2
Page 3
Philips Semiconductors Product specification
74F02Quad 2-input NOR gate
ABSOLUTE MAXIMUM RATINGS
(Operation beyond the limit set forth in this table may impair the useful life of the device.
Unless otherwise noted these limits are over the operating free air temperature range.)
SYMBOL
V
V
I
IN
V
I
OUT
T
T
CC
IN
OUT
amb
stg
Supply voltage–0.5 to +7.0V
Input voltage –0.5 to +7.0V
Input current–30 to +5mA
Voltage applied to output in high output state–0.5 to V
Current applied to output in low output state40mA
Operating free air temperature rangeCommercial range0 to +70°C
(Over recommended operating free-air temperature range unless otherwise noted.)
SYMBOL
V
OH
High-level output voltageVCC = MIN, VIL = MAX±10%V
PARAMETERTEST CONDITIONS
VIH = MIN, IOH = MAX±5%V
V
OL
V
IK
I
I
I
IH
I
IL
I
OS
I
CC
Low-level output voltageVCC = MIN, VIL = MAX±10%V
VIH = MIN, I
Input clamp voltageVCC = MIN, II = I
Input current at maximum input
VCC = MAX, VI = 7.0V100µA
= MAX±5%V
Ol
IK
voltage
High-level input currentVCC = MAX, VI = 2.7V20µA
Low-level input currentVCC = MAX, VI = 0.5V-0.6mA
4
3
VCC = MAX-60-150mA
I
CCHVCC
I
CCLVCC
= MAX3.05.6mA
= MAX7.013.0mA
Short-circuit output current
Supply current (total)
NOTES:
1 For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions for the applicable type.
2 All typical values are at V
3 Not more than one output should be shorted at a time. For testing I
= 5V, T
CC
techniques are preferable in order to minimize internal heating and more accurately reflect operational values. Otherwise, prolonged shorting
amb
= 25°C.
OS
of a high output may raise the chip temperature well above normal and thereby cause invalid readings in other parameter tests. In any
sequence of parameter tests, I
is measured with outputs open.
4I
CC
tests should be performed last.
OS
1
MINTYP
CC
CC
CC
CC
2.5V
2.73.4V
LIMITSUNIT
2
MAX
0.300.50V
0.300.50V
-0.73-1.2V
, the use of high-speed test apparatus and/or sample-and-hold
SO14: plastic small outline package; 14 leads; body width 3.9 mmSOT108-1
74F02
1990 Oct 04
9
Page 10
Philips SemiconductorsProduct specification
Quad 2-input NOR gate
74F02
NOTES
1990 Oct 04
10
Page 11
Philips SemiconductorsProduct specification
Quad 2-input NOR gate
74F02
DEFINITIONS
Data Sheet IdentificationProduct StatusDefinition
Objective Specification
Preliminary Specification
Product Specification
Formative or in Design
Preproduction Product
Full Production
This data sheet contains the design target or goal specifications for product development. Specifications
may change in any manner without notice.
This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips
Semiconductors reserves the right to make changes at any time without notice in order to improve design
and supply the best possible product.
This data sheet contains Final Specifications. Philips Semiconductors reserves the right to make changes
at any time without notice, in order to improve design and supply the best possible product.
Philips Semiconductors and Philips Electronics North America Corporation reserve the right to make changes, without notice, in the products,
including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright,
or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified. Applications that are described herein for any of these products are for illustrative purposes
only. Philips Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing
or modification.
LIFE SUPPORT APPLICA TIONS
Philips Semiconductors and Philips Electronics North America Corporation Products are not designed for use in life support appliances, devices,
or systems where malfunction of a Philips Semiconductors and Philips Electronics North America Corporation Product can reasonably be expected
to result in a personal injury. Philips Semiconductors and Philips Electronics North America Corporation customers using or selling Philips
Semiconductors and Philips Electronics North America Corporation Products for use in such applications do so at their own risk and agree to fully
indemnify Philips Semiconductors and Philips Electronics North America Corporation for any damages resulting from such improper use or sale.
Philips Semiconductors
811 East Arques Avenue
Copyright Philips Electronics North America Corporation 1997
All rights reserved. Printed in U.S.A.
P.O. Box 3409
Sunnyvale, California 94088–3409
Telephone 800-234-7381
1990 Oct 04
11
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