Page 1
74ALS174
Hex D flip–flop
Product specification 1991 Feb 08
INTEGRATED CIRCUITS
IC05 Data Handbook
Page 2
Philips Semiconductors Product specification
74ALS174Hex D flip-flop
2
1991 Feb 08 853–1023 01670
FEA TURES
•Four edge-triggered D flip-flops
•Buffered common clock
•Buffered asynchronous master reset
DESCRIPTION
The 74ALS174 has six edge-triggered D-type flip-flops with
individual D inputs and Q outputs. The common buffered clock (CP)
and master reset (MR
) inputs load and reset (clear) all flip-flops
simultaneously .
The register is fully edge-triggered. The state of each D input, one
setup time before the Low-to-High clock transition is transferred to
the corresponding flip-flop’s Q output.
All Q outputs will be forced Low independent of clock or data inputs
by a Low voltage level on the MR
input. The device is useful for
applications where true outputs only are required, and the clock and
master reset are common to all storage elements.
TYPE
TYPICAL
f
MAX
TYPICAL
SUPPLY CURRENT
(TOTAL)
74ALS174 70MHz 7mA
PIN CONFIGURATION
16
15
14
13
12
11
107
6
5
4
3
2
1
Q2
V
CC
Q4
D3
Q3
D4
Q5
D5
MR
Q0
D2
D0
D1
Q1
98GND CP
SF00188
ORDERING INFORMA TION
ORDER CODE
DESCRIPTION COMMERCIAL RANGE
V
CC
= 5V ±10%,
T
amb
= 0°C to +70°C
DRAWING
NUMBER
16-pin plastic DIP 74ALS174N SOT38-4
16-pin plastic SO 74ALS174D SOT109-1
INPUT AND OUTPUT LOADING AND FAN-OUT TABLE
PINS DESCRIPTION
74ALS (U.L.)
HIGH/LOW
LOAD VALUE
HIGH/LOW
D0 – D3 Data inputs 1.0/1.0 20µA/0.1mA
CP Clock Pulse input (active rising edge) 1.0/1.0 20µA/0.1mA
MR Master Reset input (active-Low) 1.0/1.0 20µA/0.1mA
Q0 – Q5 Data outputs 20/80 0.4mA/8mA
NOTE: One (1.0) ALS unit load is defined as: 20µA in the High state and 0.1mA in the Low state.
LOGIC SYMBOL
Q2 Q3 Q4 Q5
7101215
346
V
CC
= Pin 16
GND = Pin 8
SF00189
Q1
5Q02
9
1
CP
MR
D0 D1 D2 D3 D4 D5
11 13 14
IEC/IEEE SYMBOL
SF00190
3
1D
9
C1
1
R
4
6
11
13
14
2
5
7
10
12
15
Page 3
Philips Semiconductors Product specification
74ALS174Hex D flip-flop
1991 Feb 08
3
LOGIC DIAGRAM
SF00192
CP
D
R
D
MR
1
CP
9
V
CC
= Pin 16
GND = Pin 8
Q
D0
3
Q0
2
CP
D
R
D
Q
D1
4
Q1
5
CP
D
R
D
Q
D2
6
Q2
7
CP
D
R
D
Q
D3
11
Q3
10
CP
D
R
D
Q
D4
13
Q4
12
CP
D
R
D
Q
D5
14
Q5
15
FUNCTION TABLE
INPUTS OUTPUTS
OPERATING
MR CP D Q
n
MODE
L X X L Reset (clear)
H ↑ h H Load “1”
H ↑ I L Load “0”
NOTES:
H = High-voltage level
h = High state must be present one setup time before the Low-to-High clock transition
L = Low-voltage level
l = Low state must be present one setup time before the Low-to-High clock transition
X = Don’t care
↑ = Low-to-High clock transition
ABSOLUTE MAXIMUM RATINGS
(Operation beyond the limit set forth in this table may impair the useful life of the device.
Unless otherwise noted these limits are over the operating free air temperature range.)
SYMBOL
PARAMETER RATING UNIT
V
CC
Supply voltage –0.5 to +7.0 V
V
IN
Input voltage –0.5 to +7.0 V
I
IN
Input current –30 to +5 mA
V
OUT
Voltage applied to output in High output state –0.5 to V
CC
V
I
OUT
Current applied to output in Low output state 16 mA
T
amb
Operating free-air temperature range 0 to +70 °C
T
stg
Storage temperature range –65 to +150 °C
RECOMMENDED OPERATING CONDITIONS
LIMITS
SYMBOL
PARAMETER
MIN NOM MAX
UNIT
V
CC
Supply voltage 4.5 5.0 5.5 V
V
IH
High-level input voltage 2.0 V
V
IL
Low-level input voltage 0.8 V
I
IK
Input clamp current –18 mA
I
OH
High-level output current –0.4 mA
I
OL
Low-level output current 8 mA
T
amb
Operating free-air temperature range 0 +70 °C
Page 4
Philips Semiconductors Product specification
74ALS174Hex D flip-flop
1991 Feb 08
4
DC ELECTRICAL CHARACTERISTICS
(Over recommended operating free-air temperature range unless otherwise noted.)
LIMITS
SYMBOL
PARAMETER
TEST CONDITIONS
1
MIN TYP
2
MAX
UNIT
V
OH
High-level output voltage VCC±10%, VIL = MAX, VIH = MIN, IOH = MAX V
CC
– 2 V
p
VCC = MIN, VIL = MAX,
I
OL
= 4mA 0.25 0.4 V
VOLLow-level output voltage
CC
,
IL
,
VIH = MIN
I
OL
= 8mA 0.35 0.50 V
V
IK
Input clamp voltage VCC = MIN, II = I
IK
–0.73 –1.5 V
I
I
Input current at maximum input voltage VCC = MAX, VI = 7.0V 100 µA
I
IH
High-level input current VCC = MAX, VI = 2.7V 20 µ A
I
IL
Low-level input current VCC = MAX, VI = 0.5V –0.1 mA
I
O
Output current
3
VCC = MAX, VO = 2.25V –30 –112 mA
I
CC
Supply current (total) VCC = MAX 7 14 mA
NOTES:
1. For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions for the applicable type.
2. All typical values are at V
CC
= 5V, T
amb
= 25°C.
3. The output conditions have been chosen to produce a current that closely approximates one half of the true short-circuit output current, I
OS
.
AC ELECTRICAL CHARACTERISTICS
LIMITS
SYMBOL PARAMETER TEST CONDITION
T
amb
= 0°C to +70°C
V
CC
= +5.0V ± 10%
C
L
= 50pF, RL = 500Ω
UNIT
MIN MAX
f
MAX
Maximum clock frequency Waveform 1 60 MHz
t
PLH
t
PHL
Propagation delay
CP to Qn
Waveform 1
5.0
5.0
15.0
15.0
ns
t
PHL
Propagation delay, MR to Qn Waveform 2 8.0 18.0 ns
AC SETUP REQUIREMENTS
LIMITS
SYMBOL PARAMETER TEST CONDITION
T
amb
= 0°C to +70°C
V
CC
= +5.0V ± 10%
C
L
= 50pF, RL = 500Ω
UNIT
MIN MAX
tsu(H)
t
su
(L)
Setup time, High or Low
Dn
to CP
Waveform 3
6.0
6.0
ns
th(H)
t
h
(L)
Hold time, High or Low
Dn
to CP
Waveform 3
0.0
0.0
ns
tw(H)
t
w
(L)
CP pulse width,
High or Low
Waveform 1
8.0
8.0
ns
tw(L) MR pulse width, Low Waveform 2 6.0 ns
t
REC
Recovery time, MR to CP Waveform 2 6.0 ns
Page 5
Philips Semiconductors Product specification
74ALS174Hex D flip-flop
1991 Feb 08
5
AC WAVEFORMS
For all waveforms, VM = 1.3V .
The shaded areas indicate when the input is permitted to change for predictable output performance.
CP
V
M
V
M
V
M
tw(H)
1/f
max
V
M
V
M
t
PLH
tw(L)t
PHL
Qn
SF00294
Waveform 1. Propagation Delay for Clock Input to Output,
Clock Pulse Width,
and Maximum Clock Frequency
V
M
SC00065
MR
Qn
V
M
tw(L)
t
PHL
V
M
t
REC
CP
V
M
Waveform 2. Master Reset Pulse Width,
Master Reset to Output Delay,
and Master Reset to Clock Recovery Time
th(H)tsu(H)
CP
SC00064
V
M
V
M
V
M
V
M
V
M
V
M
th(L)tsu(L)
Dn
Waveform 3. Data Setup and Hold Times
TEST CIRCUIT AND WAVEFORMS
t
w
90%
V
M
10%
90%
V
M
10%
90%
V
M
10%
90%
V
M
10%
NEGATIVE
PULSE
POSITIVE
PULSE
t
w
AMP (V)
0.3V
0.3V
t
THL (tf
f
)
INPUT PULSE REQUIREMENTS
Rep.Rate
t
w
t
TLHtTHL
1MHz
500ns
2.0ns 2.0ns
Input Pulse Definition
V
CC
Family
74ALS
D.U.T.
PULSE
GENERATOR
R
L
C
L
R
T
V
IN
V
OUT
Test Circuit for Totem-pole Outputs
DEFINITIONS:
R
L
= Load resistor;
see AC electrical characteristics for value.
CL= Load capacitance includes jig and probe capacitance;
see AC electrical characteristics for value.
R
T
= T ermination resistance should be equal to Z
OUT
of
pulse generators.
t
THL (tf
)
t
TLH (tr
)
t
TLH (tr
)
AMP (V)
Amplitude
3.5V
1.3V
V
M
SC00005
Page 6
Philips Semiconductors Product specification
74ALS174Hex D flip–flop
1991 Feb 08
6
DIP16: plastic dual in-line package; 16 leads (300 mil) SOT38-4
Page 7
Philips Semiconductors Product specification
74ALS174Hex D flip–flop
1991 Feb 08
7
SO16: plastic small outline package; 16 leads; body width 3.9 mm SOT109-1
Page 8
Philips Semiconductors Product specification
74ALS174Hex D flip–flop
1991 Feb 08
8
Philips Semiconductors and Philips Electronics North America Corporation reserve the right to make changes, without notice, in the products,
including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright,
or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified. Applications that are described herein for any of these products are for illustrative purposes
only. Philips Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing
or modification.
LIFE SUPPORT APPLICA TIONS
Philips Semiconductors and Philips Electronics North America Corporation Products are not designed for use in life support appliances, devices,
or systems where malfunction of a Philips Semiconductors and Philips Electronics North America Corporation Product can reasonably be expected
to result in a personal injury. Philips Semiconductors and Philips Electronics North America Corporation customers using or selling Philips
Semiconductors and Philips Electronics North America Corporation Products for use in such applications do so at their own risk and agree to fully
indemnify Philips Semiconductors and Philips Electronics North America Corporation for any damages resulting from such improper use or sale.
This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips
Semiconductors reserves the right to make changes at any time without notice in order to improve design
and supply the best possible product.
Philips Semiconductors
811 East Arques Avenue
P.O. Box 3409
Sunnyvale, California 94088–3409
Telephone 800-234-7381
DEFINITIONS
Data Sheet Identification Product Status Definition
Objective Specification
Preliminary Specification
Product Specification
Formative or in Design
Preproduction Product
Full Production
This data sheet contains the design target or goal specifications for product development. Specifications
may change in any manner without notice.
This data sheet contains Final Specifications. Philips Semiconductors reserves the right to make changes
at any time without notice, in order to improve design and supply the best possible product.
Copyright Philips Electronics North America Corporation 1997
All rights reserved. Printed in U.S.A.
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