Page 1
FEATURES
PRELIMINARY
MX29F1615
16M-BIT [2M x8/1M x16] CMOS
SINGLE VOLTAGE FLASH EEPROM
• 5V ± 10% write and erase
• JEDEC-standard EEPROM commands
• Endurance:100 cycles
• Fast access time: 90/100/120ns
• Auto Erase and Auto Program Algorithms
- Automatically erases the whole chip
- Automatically programs and verifies data at
specified addresses
• Status Register feature for detection of
program or erase cycle completion
• Low VCC write inhibit is equal to or less than 3.2V
GENERAL DESCRIPTION
The MX29F1615 is a 16-mega bit Flash memory organized
as either 1M wordx16 or 2M bytex8. MXIC's Flash
memories offer the most cost-effective and reliable read/
write non-volatile random access memory. The
MX29F1615 is packaged in 42-pin PDIP. It is designed
to be reprogrammed and in standard EPROM
programmers.
The standard MX29F1615 offers access times as fast as
90ns,allowing operation of high-speed microprocessors
without wait. To eliminate bus contention, the MX29F1615
has separate chip enables(CE) and output enable (OE)
control.
• Software and hardware data protection
• Page program operation
- Internal address and data latches for 64 words per
page
- Page programming time: 0.9ms typical
• Low power dissipation
- 30mA typical active current
- 1uA typical standby current
• CMOS and TTL compatible inputs and outputs
• Package Type:
- 42 lead PDIP
To allow for simple in-system reprogrammability, the
MX29F1615 requires high input voltages (10V) on BYTE/
VPP pin for programming. Reading data out of the device
is similar to reading from an EPROM.
MXIC Flash technology reliably stores memory contents
even after 100 cycles. The MXIC's cell is designed to
optimize the erase and programming mechanisms. In
addition, the combination of advanced tunnel oxide
processing and low internal electric fields for erase and
programming operations produces reliable cycling. The
MX29F1615 uses a 5V ± 10% VCC supply to perform the
Auto Erase and Auto Program algorithms.
MXIC's Flash memories augment EPROM functionality
with electrical erasure and programming. The MX29F1615
uses a command register to manage this functionality.
The command register allows for 100% TTL level control
inputs and fixed power supply levels during erase and
programming, while maintaining maximum EPROM
compatibility.
P/N: PM0615
The highest degree of latch-up protection is achieved
with MXIC's proprietary non-epi process. Latch-up
protection is proved for stresses up to 100 milliamps on
address and data pin from -1V to VCC +1V.
1
REV.1.1, JUN. 15, 2001
Page 2
MX29F1615
PIN CONFIGURATIONS
42 PDIP(600mil)
A18
1
A17
2
A7
3
A6
4
A5
5
A4
6
A3
7
A2
8
A1
9
A0
10
CE
11
GND
12
OE
13
14
15
16
17
18
19
20
21
MX29F1615
Q0
Q8
Q1
Q9
Q2
Q10
Q3
Q11
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
A19
A8
A9
A10
A11
A12
A13
A14
A15
A16
BYTE/VPP
GND
Q15/A-1
Q7
Q14
Q6
Q13
Q5
Q12
Q4
VCC
PIN DESCRIPTION
SYMBOL PIN NAME
A0 - A19 Address Input
Q0 - Q14 Data Input/Output
Q15/A - 1 Q15(Word mode)/LSB addr.(Byte mode)
CE Chip Enable Input
OE Output Enable Input
BYTE/VPP Word/Byte Selection Input/Write Enable
Input
VCC Power Supply
GND Ground Pin
P/N: PM0615
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REV. 1.1, JUN. 15, 2001
Page 3
BLOCK DIAGRAM
MX29F1615
CE
OE
BYTE/VPP
Q15/A-1
A0-A19
CONTROL
INPUT
LOGIC
ADDRESS
LATCH
AND
BUFFER
PROGRAM/ERASE
HIGH VOLT A GE
X-DECODER
MX29F1615
FLASH
ARRAY
Y-DECODER
Y-PASS GATE
SENSE
AMPLIFIER
PGM
DATA
HV
ARRAY
SOURCE
HV
WRITE
STATE
MACHINE
(WSM)
COMMAND INTERFACE
REGISTER
(CIR)
COMMAND
DATA
DECODER
COMMAND
DATA LATCH
P/N: PM0615
Q0-Q15/A-1
PAGE
PROGRAM
DATA LATCH
I/O BUFFER
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REV. 1.1, JUN. 15, 2001
Page 4
MX29F1615
Table1.PIN DESCRIPTIONS
SYMBOL TYPE NAME AND FUNCTION
A0 - A19 INPUT ADDRESS INPUTS: for memory addresses. Addresses are internally latched
during a write cycle.
Q0 - Q7 INPUT/OUTPUT LOW-BYTE DATA BUS: Input data and commands during Command Interface
Register(CIR) write cycles. Outputs array,status and identifier data in the
appropriate read mode. Floated when the chip is de-selected or the outputs are
disabled.
Q8 - Q14 INPUT/OUTPUT HIGH-BYTE DATA BUS: Inputs data during x 16 Data-Write operations. Outputs
array, identifier data in the appropriate read mode; not used for status register
reads. Floated when the chip is de-selected or the outputs are disabled
Q15/A -1 INPUT/OUTPUT Selects between high-byte data INPUT/OUTPUT(BYTE/VPP = HIGH) and LSB
ADDRESS(BYTE/VPP = LOW) for read operation.
CE INPUT CHIP ENABLE INPUTS: Activate the device's control logic, Input buffers,
decoders and sense amplifiers. With CE high, the device is de-selected and
power consumption reduces to Standby level upon completion of any current
program or erase operations. CE must be low to select the device. Device
selection occurs with the latter falling edge of CE. The first rising edge of CE
disables the device.
OE INPUT OUTPUT ENABLES: Gates the device's data through the output buffers during a
read cycle OE is active low.
BYTE/VPP INPUT BYTE ENABLE: While operating read mode, BYTE/VPP Low places device in x8
mode. All data is then input or output on Q0-7 and Q8-14 float. AddressQ15/A1 selects between the high and low byte. While operating read mode, BYTE/VPP
high places the device in x16 mode, and turns off the Q15/A-1 input buffer.
Address A0, then becomes the lowest order address. Write Enable is active while
apply 10V on the BYTE/VPP pin.
VC C DEVICE POWER SUPPLY(5V±10%)
GND GROUND
P/N: PM0615
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REV. 1.1, JUN. 15, 2001
Page 5
MX29F1615
BUS OPERATION
Flash memory reads, erases and writes in-system via the local CPU . All bus cycles to or from the flash memory conform
to standard microprocessor bus cycles.
Table2.1 Bus Operations
Mode Notes CE OE BYTE/VPP A0 A 1 A9 Q0-Q7 Q8-Q14 Q15/A-1
Read 1,5 VIL VIL VIH/VIL X X X DOUT HighZ/DOUT VIL/VIH/DOUT
Output Disable 1 VIL VIH VIH/VIL X X X High Z HIghZ High Z/X
Standby 1 VIH X X X X X X X X
Manufacturer ID 2,4 VIL VIL VIH/VIL VIL VIL VID C2H High Z/00H VIL/OB
Device ID 2,4 VIL VIL VIH/VIL VIH VIL VID 6BH High Z/00H VIL/OB
MX29F1615
Write 1,3,6 VIL VIH VHH X X X DIN DIN DIN
NOTES :
1. X can be VIH or VIL for address or control pins.
2. A0 and A1 at VIL provide manufacturer ID codes. A0 at VIH and A1 at VIL provide device ID codes.
3. Commands for different Erase operations or Data program operations can only be successfully completed through proper command
sequence.
4. VID = 11.5V- 12.5V.
5. Q15/A-1 = VIL, Q0 - Q7 =D0-D7 out . Q15/A-1 = VIH, Q0 - Q7 = D8 -D15 out.
6.VHH=9.5V~10.5V
P/N: PM0615
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REV. 1.1, JUN. 15, 2001
Page 6
MX29F1615
WRITE OPERATIONS
Commands are written to the COMMAND INTERFACE
REGISTER (CIR) using standard microprocessor write
timings. The CIR serves as the interface between the
microprocessor and the internal chip operation. The CIR
can decipher Read Array, Read Silicon ID, Erase and
Program command. In the event of a read command, the
CIR simply points the read path at either the array or the
silicon ID, depending on the specific read command
given. For a program or erase cycle, the CIR informs the
write state machine that a program or erase has been
requested. During a program cycle, the write state
machine will control the program sequences and the CIR
TABLE 3. COMMAND DEFINITIONS(Word-Wide Mode, BYTE/VPP=VHH)
Command Read/ Silicon Page Chip Read Clear
Sequence Reset ID Read Program Erase Status Reg. Status Reg.
Bus Write 4 4 4 6 4 3
Cycles Req'd
First Bus Addr 5555H 5555H 5555H 5555H 5555H 5555H
Write Cycle Data AAH AAH AAH AAH AAH AAH
Second Bus Addr 2AAAH 2AAAH 2AAAH 2AAAH 2AAAH 2AAAH
Write Cycle Data 55H 55H 55H 55H 55H 55H
Third Bus Addr 5555H 5555H 5555H 5555H 5555H 5555H
Write Cycle Data F0H 90H A0 H 80H 70H 50H
Fourth Bus Addr RA 00H/01H PA 5555H X
Read/Write Cycle Data RD C2H/6BH PD AAH SRD
Fifth Bus Addr 2AAAH
Write Cycle Data 55H
Sixth Bus Addr 5555H
Write Cycle Data 10H
will only respond to status reads. During a sector/chip
erase cycle, the CIR will respond to status reads and
erase suspend. After the write state machine has
completed its task, it will allow the CIR to respond to its full
command set. The CIR stays at read status register
mode until the microprocessor issues another valid
command sequence.
Device operations are selected by writing commands into
the CIR. Table 3 below defines 16 Mbit flash command.
Notes:
1. Address bit A15 -- A19 = X = Don't care for all address commands except for Program Address(PA).
5555H and 2AAAH address command codes stand for Hex number starting from A0 to A14.
2. Bus operations are defined in Table 2.
3. RA = Address of the memory location to be read.
PA = Address of the memory location to be programmed. Addresses are latched on the falling edge of the CE pulse.
4. RD = Data read from location RA during read operation.
PD = Data to be programmed at location PA. Data is latched on the rising edge of CE.
SRD = Data read from status register.
5. Only Q0-Q7 command data is taken, Q8-Q15 = Don't care.
P/N: PM0615
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REV. 1.1, JUN. 15, 2001
Page 7
DEVICE OPERATION
SILICON ID READ
MX29F1615
The Silicon ID Read mode allows the reading out of a binary
code from the device and will identify its manufacturer and
type. This mode is intended for use by programming
equipment for the purpose of automatically matching the
device to be programmed with its corresponding
The manufacturer and device codes may also be read via
the command register, for instances when the MX29F1615
is erased or programmed in a system without access to
high voltage on the A9 pin. The command sequence is
illustrated in Table 3.
programming algorithm. This mode is functional over the
entire temperature range of the device.
Byte 0 (A0=VIL) represents the manfacturer's code
(MXIC=C2H) and byte 1 (A0=VIH) the device identifier
To activate this mode, the programming equipment must
code (MX29F1615=6BH).
force VID (11.5V~12.5V) on address pin A9. Two
identifier bytes may then be sequenced from the device
outputs by toggling address A0 from VIL to VIH. All
addresses are don't cares except A0 and A1.
The Silicon ID Read mode will be terminated after the
following write command cycle.
Table 4. MX29F1615 Silion ID Codes
Type A19 A18 A17A16A1A0Code(HEX) Q7Q
Manufacturer Code X X X X VIL VIL C2H* 1 1 0 0 0 0 1 0
MX29F1615 Device Code X X X X VIL VIH 6BH 0 1 1 0 1 0 1 1
Q5Q4Q3Q2Q1Q
6
0
* MX29F1615 Manufacturer Code = C2H, Device Code = 6BH when BYTE/VPP = VIL
MX29F1615 Manufacturer Code = 00C2H, Device Code = 006BH when BYTE/VPP= VIH
P/N: PM0615
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REV. 1.1, JUN. 15, 2001
Page 8
MX29F1615
READ/RESET COMMAND
The read or reset operation is initiated by writing the read/
reset command sequence into the command register.
Microprocessor read cycles retrieve array data from the
memory. The device remains enabled for reads until the
CIR contents are altered by a valid command sequence.
The device will automatically power-up in the read/reset
state. In this case, a command sequence is not required
to read data. Standard microprocessor read cycles will
retrieve array data. This default value ensures that no
spurious alteration of the memory content occurs during
the power transition. Refer to the AC Read
Characteristics and Waveforms for the specific timing
parameters.
The MX29F1615 is accessed like an EPROM. When CE
and OE are low and BYTE/VPP is high or low the data
stored at the memory location determined by the address
pins is asserted on the outputs. The outputs are put in the
high impedance state whenever CE or OE is high. This
dual line control gives designers flexibility in preventing
bus contention.
Note that the read/reset command is not valid when
program or erase is in progress.
PROGRAM
Any page to be programmed should have the page in the
erased state first, i.e. performing sector erase is
suggested before page programming can be performed.
The device is programmed on a page basis. If a word of
data within a page is to be changed, data for the entire page
can be loaded into the device. Any word that is not loaded
during the programming of its page will be still in the erased
state (i.e. FFH). Once the words of a page are loaded into
the device, they are simultaneously programmed during
the internal programming period. After the first data word
has been loaded into the device, successive words are
entered in the same manner. The time between word
loads must be less than 30us otherwise the load period
could be teminated. A6 to A19 specify the page address,
i.e., the device is page-aligned on 64 words boundary. The
page address must be valid during each high to low
transition of CE. A0 to A5 specify the byte address within
the page. The word may be loaded in any order; sequential
loading is not required. If a high to low transition of CE is
not detected whithin 100us of the last low to high transition,
the load period will end and the internal programming
period will start. The Auto page program terminates when
status on Q7 is '1' at which time the device stays at read
status register mode until the CIR contents are altered by
a valid command sequence.
PAGE PROGRAM
To initiate Page program mode, a three-cycle command
sequence is required. There are two " unlock" write cycles.
These are followed by writing the page program commandA0H.
Any attempt to write to the device without the three-cycle
command sequence will not start the internal Write State
Machine(WSM), no data will be written to the device.
After three-cycle command sequence is given, a word load
is performed by applying a low pulse on the CE input with
CE low (respectively) and OE high. The address is latched
on the falling edge of CE, whichever occurs last. The data
is latched by the first rising edge of CE. Maximum of 64
words of data may be loaded into each page by the same
procedure as outlined in the page program section below.
P/N: PM0615
CHIP ERASE
Chip erase is a six-bus cycle operation. There are two
"unlock" write cycles. These are followed by writing the
"set-up" command-80H. Two more "unlock" write cycles
are then followed by the chip erase command-10H.
Chip erase does not require the user to program the
device prior to erase.
The automatic erase begins on the rising edge of the last
CE pulse in the command sequence and terminates when
the status on Q7 is "1" at which time the device stays at
read status register mode. The device remains enabled for
read status register mode until the CIR contents are
altered by a valid command sequence.
8
REV. 1.1, JUN. 15, 2001
Page 9
MX29F1615
READ STATUS REGISTER
The MXIC's16 Mbit flash family contains a status register
which may be read to determine when a program or erase
operation is complete, and whether that operation
completed successfully. The status register may be read
at any time by writing the Read Status command to the
CIR. After writing this command, all subsequent read
operations output data from the status register until
another valid command sequence is written to the CIR.
A Read Array command must be written to the CIR to
return to the Read Array mode.
The status register bits are output on Q2 - Q7(table 6)
whether the device is in the byte-wide (x8) or word-wide
(x16) mode for the MX29F1615. In the word-wide mode the
upper byte, Q(8:15) is set to 00H during a Read Status
command. In the byte-wide mode, Q(8:14) are tri-stated
and Q15/A-1 retains the low order address function. Q0Q1 is set to 0H in either x8 or x16 mode.
It should be noted that the contents of the status register
are latched on the falling edge of OE or CE whichever
occurs last in the read cycle. This prevents possible bus
errors which might occur if the contents of the status
register change while reading the status register. CE or
OE must be toggled with each subsequent status read, or
the completion of a program or erase operation will not be
evident.
CLEAR STATUS REGISTER
The Eraes fail status bit (Q5) and Program fail status bit
(Q4) are set by the write state machine, and can only be
reset by the system software. These bits can indicate
various failure conditions. By allowing the system software
to control the resetting of these bits, several operations
may be performed (such as cumulatively programming
several pages or erasing multiple blocks in squence). The
status register may then be read to determine if an error
occurred during that programming or erasure series. This
adds flexibility to the way the device may be programmed
or erased. Additionally, once the program(erase) fail bit
happens, the program (erase) operation can not be
performed further. The program(erase) fail bit must be
reset by system software before further page program or
sector (chip) erase are attempted. To clear the status
register, the Clear Status Register command is written to
the CIR. Then, any other command may be issued to the
CIR. Note again that before a read cycle can be initiated,
a Read command must be written to the CIR to specify
whether the read data is to come from the Array, Status
Register or Silicon ID.
The Status Register is the interface between the
microprocessor and the Write State Machine (WSM).
When the WSM is active, this register will indicate the
status of the WSM, and will also hold the bits indicating
whether or not the WSM was successful in performing the
desired operation. The WSM sets status bits four through
seven and clears bits six and seven, but cannot clear
status bits four and five. If Erase fail or Program fail status
bit is detected, the Status Register is not cleared until the
Clear Status Register command is written. The
MX29F1615 automatically outputs Status Register data
when read after Chip Erase, Page Program or Read Status
Command write cycle. The internal state machine is set
for reading array data upon device power-up, or after deep
power-down mode.
P/N: PM0615
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REV. 1.1, JUN. 15, 2001
Page 10
MX29F1615
TABLE 5. MX29F1615 STATUS REGISTER
STATUS NOTES Q7 Q6 Q5 Q4 Q3
IN PROGRESS PROGRAM 1, 2 0 0 0 0 0
ERASE 1, 3 0 0 0 0 0
COMPLETE PROGRAM 1, 2 1 0 0 0 0
ERASE 1, 3 1 0 0 0 0
FAIL PROGRAM 1, 4 1 0 0 1 0
ERASE 1, 4 1 0 1 0 0
AFTER CLEARING STATUS REGISTER 1000 0
NOTES:
1. Q7 : WRITE STATE MACHINE STATUS
1 = READY, 0 = BUSY
Q6 : RESERVED FOR FUTURE ENHANCEMENTS
Q5 : ERASE FAIL STATUS
1 = FAIL IN ERASE, 0 = SUCCESSFUL ERASE
Q4 : PROGRAM FAIL STATUS
1 = FAIL IN PROGRAM, 0 = SUCCESSFUL PROGRAM
Q3=0 = RESERVED FOR FUTURE ENHANCEMENTS.
Other bits are reserved for future use ; mask them out when polling the Status Register.
2. PROGRAM STATUS is for the status during Page Programming.
3. ERASE STATUS is for the status during Chip Erase.
4. FAIL STATUS bit(Q4 or Q5) is provided during Page Program or Chip Erase modes respectively.
5. Q3 = 0 all the time.
P/N: PM0615
10
REV. 1.1, JUN. 15, 2001
Page 11
DATA PROTECTION
The MX29F1615 is designed to offer protection against
accidental erasure or programming caused by spurious
system level signals that may exist during power
transitions. During power up the device automatically
resets the internal state machine in the Read Array mode.
Also, with its control register architecture, alteration of the
memory contents only occurs after successful completion
of specific multi-bus cycle command sequences.
The device also incorporates several features to prevent
inadvertent write cycles resulting from VCC power-up
and power-down transitions or system noise.
LOW VCC WRITE INHIBIT
To avoid initiation of a write cycle during VCC power-up and
power-down, a write cycle is locked out for VCC less than
VLKO(= 3.2V , typically 3.5V). If VCC < VLKO, the
command register is disabled and all internal program/
erase circuits are disabled. Under this condition the device
will reset to the read mode. Subsequent writes will be
ignored until the VCC level is greater than VLKO. It is the
user's responsibility to ensure that the control pins are
logically correct to prevent unintentional write when VCC is
above VLKO.
MX29F1615
WRITE PULSE "GLITCH" PROTECTION
Noise pulses of less than 10ns (typical) on CE will not
initiate a write cycle.
LOGICAL INHIBIT
Writing is inhibited by holding any one of OE = VIL,CE =
VIH or BYTE/VPP=VIH/VIL To initiate a write cycle CE
must be a logical zero, BYTE/VPP must be at VHH while
OE is a logical one.
P/N: PM0615
11
REV. 1.1, JUN. 15, 2001
Page 12
Figure 1. AUTOMATIC PAGE PROGRAM FLOW CHART
START
BYTE/VPP=VHH
Write Data AAH Address 5555H
Write Data 55H Address 2AAAH
Write Data A0H Address 5555H
Write Program Data/Address
MX29F1615
YES
Loading End?
YES
Wait 100us
BYTE/VPP=VIH/VIL
Read Status Register
SR7 = 1
?
YES
SR4 = 0
?
YES
Page Program Completed
Program
another page?
NO
NO
NO
Program Error
To Continue Other Operations,
Do Clear S.R. Mode First
P/N: PM0615
NO
Operation Done, Device Stays At Read S.R. Mode
12
Note : S.R. Stands for Status Register
REV. 1.1, JUN. 15, 2001
Page 13
Figure 2. AUTOMATIC CHIP ERASE FLOW CHART
START
BYTE/VPP=VHH
Write Data AAH Address 5555H
Write Data 55H Address 2AAAH
Write Data 80H Address 5555H
Write Data AAH Address 5555H
MX29F1615
Write Data 55H Address 2AAAH
Write Data 10H Address 5555H
BYTE/VPP=VIH/VIL
Read Status Register
SR7 = 1
?
YES
SR5 = 0
?
YES
Chip Erase Completed
NO
NO
Erase Error
P/N: PM0615
Operation Done,
Device Stays at
Read S.R. Mode
13
To Continue Other
Operations, Do Clear
S.R. Mode First
REV. 1.1, JUN. 15, 2001
Page 14
MX29F1615
ELECTRICAL SPECIFICATIONS
ABSOLUTE MAXIMUM RATINGS
RATING VALUE
Ambient Operating Temperature 0°C to 70°C
Storage Temperature -65°C to 125°C
Applied Input Voltage -0.5V to 7.0V
Applied Output Voltage -0.5V to 7.0V
VCC to Ground Potential -0.5V to 7.0V
A9 -0.5V to 13.5V
BYTE/VPP -0.5V to 10.5V
CAPACITANCE TA = 25°C, f = 1.0 MHz
SYMBOL PARAMETER MIN. TYP. MAX. UNIT CONDITIONS
CIN1 Input Capacitance 14 pF VIN = 0V
CIN2 Control Pin Input Capacitance 16 pF VIN=0V
COUT Output Capacitance 16 pF VOUT = 0V
NOTICE:
Stresses greater than those listed under ABSOLUTE
MAXIMUM RATINGS may cause permanent damage to the
device. This is stress rating only and functional operational
sections of this specification is not implied. Exposure to
absolute maximum rating conditions for extended period may
affect reliability.
NOTICE:
Specifications contained within the following tables are subject
to change.
SWITCHING TEST CIRCUITS
DEVICE
UNDER
TEST
CL = 100 pF Including jig capacitance
SWITCHING TEST WAVEFORMS
2.4V
0.45V
AC TESTING: Inputs are driven at 2.4V for a logic "1" and 0.45V for a logic "0".
Input pulse rise and fall times are < 10ns.
INPUT
CL
2.0V
0.8V
1.2K ohm
TEST POINTS
1.6K ohm
DIODES = IN3064
OR EQUIVALENT
2.0V
0.8V
OUTPUT
+5V
P/N: PM0615
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REV. 1.1, JUN. 15, 2001
Page 15
MX29F1615
DC CHARACTERISTICS = 0°C to 70°C, VCC = 5V±10%
SYMBOL PARAMETER NOTES MIN. TYP. MAX. UNITS TEST CONDITIONS
IIL Input Load 1 ±10 uA VCC = VCC Max
Current VIN = VCC or GND
ILO Output Leakage 1 ±10 uA VCC = VCC Max
Current VIN = VCC or GND
ISB1 VCC Standby 1 1 10 0 uA VCC = VCC Max
Current(CMOS) CE= VCC ± 0.2V
ISB2 VCC Standby 2 4 mA VCC = VCC Max
Current(TTL) CE= VIH
ICC1 VCC Read 1 50 60 mA VCC = VCC Max
Current CMOS: CE = GND ± 0.2V
BYTE/VPP=GND ± 0.2VorVCC ± 0.2V
Inputs = GND ± 0.2V or VCC ± 0.2V
TTL : CE = VIL,
BYTE/VPP = VIL or VIH
Inputs = VIL or VIH,
f = 10MHz, IOUT = 0 mA
ICC2 VCC Read 1 30 35 mA VCC = VCC Max,
Current CMOS: CE = GND ± 0.2V
BYTE/VPP = VCC ± 0.2V or GND ± 0.2V
Inputs = GND ± 0.2V or VCC ± 0.2V
TTL: CE = VIL,
BYTE/VPP= VIH or VIL
Inputs = VIL or VIH,
f = 5MHz, IOUT = 0mA
ICC3 VCC Erase 1,2 5 10 mA CE= VIH
Suspend Current BLock Erase Suspended
ICC4 VCC Program 1 3 0 50 mA Program in Progress
Current
ICC5 VCC Erase Current 1 3 0 50 mA Erase in Progress
VIL Input Low Voltage 3 -0.3 0.8 V
VIH Input High Voltage 4 2.4 VCC+0.3V
VOL Output Low Voltage 0.45 V IOL = 2.1mA
VOH Output High Voltage 2. 4 V IOH = -2mA
P/N: PM0615
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Page 16
MX29F1615
DC CHARACTERISTICS = 0°C to 70°C, VCC = 5V±10%(CONTINUE P.15)
NOTES:
1. All currents are in RMS unless otherwise noted. Typical values at VCC = 5.0V, T = 25
versions (package and speeds).
2. ICC3 is specified with the device de-selected. If the device is read while in erase suspend mode, current draw is the sum of ICC3
and ICC1/2.
3. VIL min. = -1.0V for pulse width is equal to or less than 50ns.
VIL min. = -2.0V for pulse width is equal to or less than 20ns.
4. VIH max. = VCC + 1.5V for pulse width is equal to or less than 20ns. If VIH is over the specified maximum value, read operation
cannot be guaranteed.
AC CHARACTERISTICS READ OPERATIONS
29F1615-90 29F1615-10 29F1615-12
SYMBOL DESCRIPTIONS MIN. MAX. MIN. MAX. MIN. MAX. UNIT CONDITIONS
tACC Address to Output Delay 90 10 0 1 2 0 ns CE=OE=VIL
tCE CE to Output Delay 90 100 120 ns OE=VIL
°C. These currents are valid for all product
tOE OE to Output Delay 50 50 60 ns CE=VIL
tDF OE High to Output Delay 0 35 0 35 0 3 5 ns CE=VIL
tOH Address to Output hold 0 0 0 ns CE=OE=VIL
TEST CONDITIONS:
• Input pulse levels: 0.45V/2.4V
• Input rise and fall times: 10ns
NOTE:
1. tDF is defined as the time at which the output achieves the
open circuit condition and data is no longer driven.
• Output load: 1TTL gate+100pF(Including scope and jig)
• Reference levels for measuring timing: 0.8V, 2.0V
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Figure 3. READ TIMING WAVEFORMS
ADDRESSES
tACC
tCE
tDF
tOH
tOE
ADDRESSES STABLE
Data out valid
Vcc
5.0V
GND
DATA OUT
CE
OE
Power-up
Standby
Device and
address selection
Outputs Enabled
Data valid
Standby
Power-down
Vcc
BYTE/VPP(1)
VIH
VIL
VIH
VIL
VIH
VIL
VIH
VIL
VOH
VOL
HIGH Z
HIGH Z
NOTE:
VCC
1.For real world application, BYTE/VPP pin should be either static high(word mode read) or static low(byte mode read);
dynamic switching of BYTE/VPP pin is not recommended.
MX29F1615
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MX29F1615
AC CHARACTERISTICS WORD/BYTE CONFIGURATION (BYTE/VPP)
Speed Options
Symbol Description 90 100 120 unit
tELFL/tELFH CE to BYTE/VPP Switching Low or High MAX 5 5 5 ns
tFLQZ BYTE/VPP Switching Low to Output HIHG ZMax 3 0 30 30 ns
tFHQV BYTE/VPP Switching High to Output ActiveMin 90 100 120 ns
Figure 4. BYTE/VPP TIMING WAVEFORMS
CE
BYTE/VPP
Switching
from word
to byte
mode read
BYTE/VPP
Switching
from byte
to word
mode read
BYTE/VPP
Q0~Q14
Q15/A-1
BYTE/VPP
Q0~Q14
Q15/A-1
OE
VIH
VIL
VIH
VIL
tELFL
tELFL
tFLQZ
Data Output
(Q0~Q7)
Address Input
Data Output
(Q0~Q14)
Q15
Output
Q15
Output
Data Output
(Q0~Q7)
Address Input
Data Output
(Q0~Q14)
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tFHQV
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MX29F1615
AC CHARACTERISTICS WRITE/ERASE/PROGRAM OPERATIONS
29F1615-90 29F1615-10 29F1615-12
SYMBOL DESCRIPTION MIN. MAX. MIN. MAX. MIN. MAX. UNIT
tWC Write Cycle Time 90 10 0 120 ns
tAS Address Setup Time 0 0 0 n s
tAH Address Hold Time 50 50 60 ns
tDS Data Setup Time 50 50 60 ns
tDH Data Hold Time 0 0 0 ns
tOES Output Enable Setup Time 0 0 0 n s
tCES CE Setup Time 0 0 0 n s
tGHWL Read Recover Time Before Write 0 0 0
tCS CE Setup Time 0 0 0 n s
tCH CE Hold Time 0 0 0 n s
tWP Write Pulse Width 50 50 60 ns
tWPH Write Pulse Width High 30 30 50 ns
tBALC Word Address Load Cycle 0.3 30 0.3 30 0.3 3 0 us
tBAL Word Address Load Time 10 0 10 0 10 0 us
tSRA Status Register Access Time 70 70 90 ns
tCESR CE Setup before S.R. Read 70 70 70 ns
tVCS VCC Setup Time 5 0 5 0 50 us
tVPS VPP Setup Time 2 2 2 us
tVPH VPP Hold Time 2 2 2 us
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Figure 5. COMMAND WRITE TIMING WAVEFORMS
CE
tOES
OE
MX29F1615
BYTE/VPP
ADDRESSES
DATA
VCC
10V
tVPS
tAS
tVCS
HIGH Z
tVPH
tAH
VALID
tDH
DIN
tDS
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Figure 6. AUTOMATIC PAGE PROGRAM TIMING WAVEFORMS
MX29F1615
A0~A5
A6~A14
A15~A19
CE
BYTE/VPP
10V
tAS
tVPS
55H
55H
tWP
tAH
tWC
tWPH
AAH
2AH
55H
55H
Word offset
Address
Page Address
Page Address
tBALC
Last Word
offset Address
tBAL
tVPH
OE
DATA
tDS
tDH
AAH 55H
A0H SRD
NOTE:
1.Please refer to page 9 for detail page program operation.
Write
Data
tCES
tSRA
Last Write
Data
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Figure 7. AUTOMATIC CHIP ERASE TIMING WAVEFORMS
tAS
tDS
tAH
tDH
CE
OE
DATA
BYTE/VPP
tWPH
tWP
VHH
VIH/VIL
tWC
AAH 55H
80H
SRD
5555H 2AAAH 5555H
A0~A19
tCESR
tCES
tVPH
tSRA
5555H
2AAAH 5555H
AAH
55H 10H
tVPS
10V
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MX29F1615
ERASE AND PROGRAMMING PERFORMANCE(1)
LIMITS
PARAMETER MIN. TYP.(2) MAX. UNITS
Chip Erase Time 32 25 6 sec
Page Programming Time 0.9 27 ms
Chip Programming Time 14 42 sec
Erase/Program Cycles 100 Cycles
Word Program Time 14 42 0 us
Note: 1.Not 100% Tested, Excludes external system level over head.
2.Typical values measured at 25°C,5V.
LATCHUP CHARACTERISTICS
MIN. MAX.
Input Voltage with respect to GND on all pins except I/O pins -1.0V 13.5V
Input Voltage with respect to GND on all I/O pins -1.0V Vcc + 1.0V
Current -100mA +100mA
Includes all pins except Vcc. Test conditions: Vcc = 5.0V, one pin at a time.
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PACKAGE INFORMATION
42-PIN PLASTIC DIP(600 mil)
MX29F1615
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MX29F1615
REVISION HISTORY
Revision Description Page Date
1.1 To modify "Package Information" P24 JUN/15/2001
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Page 26
MX29F1615
MACRONIX INTERNA TIONAL CO., LTD.
HEADQUARTERS:
TEL:+886-3-578-6688
FAX:+886-3-563-2888
EUROPE OFFICE:
TEL:+32-2-456-8020
FAX:+32-2-456-8021
JAPAN OFFICE:
TEL:+81-44-246-9100
FAX:+81-44-246-9105
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TEL:+65-348-8385
FAX:+65-348-8096
TAIPEI OFFICE:
TEL:+886-2-2509-3300
FAX:+886-2-2509-2200
MACRONIX AMERICA, INC.
TEL:+1-408-453-8088
FAX:+1-408-453-8488
CHICAGO OFFICE:
TEL:+1-847-963-1900
FAX:+1-847-963-1909
http : //www.macronix.com
MACRONIX INTERNATIONAL CO., LTD. reserves the right to change product and specifications without notice.
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