- 5.0V only operation for read, erase and program
operation
• Fast access time: 55/70/90/120ns
• Low power consumption
- 30mA maximum active current(5MHz)
- 1uA typical standby current
• Command register architecture
- Byte Programming (7us typical)
- Sector Erase
8 equal sectors of 64K-Byte each
• Auto Erase (chip & sector) and Auto Program
- Automatically erase any combination of sectors
with Erase Suspend capability.
- Automatically program and verify data at specified
address
• Erase suspend/Erase Resume
- Suspends an erase operation to read data from,
GENERAL DESCRIPTION
or program data to, another sector that is not being
erased, then resumes the erase.
• Status Reply
- Data polling & Toggle bit for detection of program
and erase cycle completion.
• Sector protect/unprotect for 5V only system or 5V/
12V system.
• Sector protection
- Hardware method to disable any combination of
sectors from program or erase operations
• 100,000 minimum erase/program cycles
• Latch-up protected to 100mA from -1V to VCC+1V
• Low VCC write inhibit is equal to or less than 3.2V
• Package type:
- 32-pin PLCC, TSOP or PDIP
• Compatibility with JEDEC standard
- Pinout and software compatible with single-power
supply Flash
• 20 years data retention
The MX29F040 is a 4-mega bit Flash memory organized
as 512K bytes of 8 bits. MXIC's Flash memories offer the
most cost-effective and reliable read/write non-volatile
random access memory. The MX29F040 is packaged
in 32-pin PLCC, TSOP, PDIP. It is designed to be
reprogrammed and erased in system or in standard
EPROM programmers.
The standard MX29F040 offers access time as fast as
55ns, allowing operation of high-speed microprocessors
without wait states. To eliminate bus contention, the
MX29F040 has separate chip enable (CE) and output
enable (OE ) controls.
MXIC's Flash memories augment EPROM functionality
with in-circuit electrical erasure and programming. The
MX29F040 uses a command register to manage this
functionality. The command register allows for 100%
TTL level control inputs and fixed power supply levels
during erase and programming, while maintaining
maximum EPROM compatibility.
MXIC Flash technology reliably stores memory
contents even after 100,000 erase and program
cycles. The MXIC cell is designed to optimize the
erase and program mechanisms. In addition, the
combination of advanced tunnel oxide processing
and low internal electric fields for erase and
programming operations produces reliable cycling.
The MX29F040 uses a 5.0V±10% VCC supply to
perform the High Reliability Erase and auto
Program/Erase algorithms.
The highest degree of latch-up protection is
achieved with MXIC's proprietary non-epi process.
Latch-up protection is proved for stresses up to
100 milliamps on address and data pin from -1V to
VCC + 1V.
P/N:PM0538REV. 1.6, AUG. 08, 2001
1
Page 2
PIN CONFIGURATIONS
MX29F040
32 PDIP
A18
A16
A15
A12
GND
A7
A6
A5
A4
A3
A2
A1
A0
Q0
Q1
Q2
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
MX29F040
VCC
32
WE
31
A17
30
A14
29
A13
28
A8
27
A9
26
A11
25
OE
24
A10
23
CE
22
Q7
21
Q6
20
Q5
19
Q4
18
Q3
17
32 TSOP (Standard Type) (8mm x 20mm)
1
A11
2
A9
3
A8
4
A13
5
A14
6
A17
7
WE
A18
A16
A15
A12
8
9
10
11
12
13
A7
14
A6
15
A5
16
A4
MX29F040
VCC
32 PLCC
A12
A15
A16
A18
VCCWEA17
4
5
A7
A6
A5
A4
9
A3
A2
A1
A0
13
Q0
141720
Q1
32
OE
31
A10
30
CE
29
Q7
28
Q6
27
Q5
26
Q4
25
Q3
24
GND
23
Q2
22
Q1
21
Q0
20
A0
19
A1
18
A2
17
A3
1
MX29F040
Q2
Q3Q4Q5
GND
32
30
29
A14
A13
A8
A9
25
A11
OE
A10
CE
21
Q7
Q6
PIN DESCRIPTION
SYMBOLPIN NAME
A0~A18Address Input
Q0~Q7Data Input/Output
CEChip Enable Input
WEWrite Enable Input
OEOutput Enable Input
GNDGround Pin
VCC+5.0V single power supply
The MX29F040 is byte programmable using the
Automatic Programming algorithm. The Automatic
Programming algorithm makes the external system do
not need to have time out sequence nor to verify the data
programmed. The typical chip programming time at
room temperature of the MX29F040 is less than 4
seconds.
AUTOMATIC CHIP ERASE
The entire chip is bulk erased using 10 ms erase pulses
according to MXIC's Automatic Chip Erase algorithm.
Typical erasure at room temperature is accomplished in
less than 4 second. The Automatic Erase algorithm
automatically programs the entire array prior to electrical
erase. The timing and verification of electrical erase are
controlled internally within the device.
AUTOMATIC SECTOR ERASE
The MX29F040 is sector(s) erasable using MXIC's
Auto Sector Erase algorithm. Sector erase modes
allow sectors of the array to be erased in one erase
cycle. The Automatic Sector Erase algorithm
automatically programs the specified sector(s) prior to
electrical erase. The timing and verification of
electrical erase are controlled internally within the
device.
AUTOMATIC PROGRAMMING ALGORITHM
MXIC's Automatic Programming algorithm require the
user to only write program set-up commands (including
2 unlock write cycle and A0H) and a program command
(program data and address). The device automatically
times the programming pulse width, provides the program
verification, and counts the number of sequences. A
status bit similar to DATA polling and a status bit toggling
between consecutive read cycles, provide feedback to
the user as to the status of the programming operation.
AUTOMATIC ERASE ALGORITHM
MXIC's Automatic Erase algorithm requires the user to
write commands to the command register using standard
microprocessor write timings. The device will
automatically pre-program and verify the entire array.
Then the device automatically times the erase pulse
width, provides the erase verification, and counts the
number of sequences. A status bit toggling between
consecutive read cycles provides feedback to the user
as to the status of the programming operation.
Register contents serve as inputs to an internal statemachine which controls the erase and programming
circuitry. During write cycles, the command register
internally latches address and data needed for the
programming and erase operations. During a system
write cycle, addresses are latched on the falling edge of
WE or CE, whichever happeds later, and data are latched
on the rising edge of WE or CE, whichever happeds first.
MXIC's Flash technology combines years of EPROM
experience to produce the highest levels of quality,
reliability, and cost effectiveness. The MX29F040
electrically erases all bits simultaneously using FowlerNordheim tunneling. The bytes are programmed by
using the EPROM programming mechanism of hot
electron injection.
During a program cycle, the state-machine will control
the program sequences and command register will not
respond to any command set. During a Sector Erase
cycle, the command register will only respond to Erase
Suspend command. After Erase Suspend is completed,
the device stays in read mode. After the state machine
has completed its task, it will allow the command register
to respond to its full command set.
P/N:PM0538
REV. 1.6, AUG. 08, 2001
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MX29F040
TABLE1. SOFTWARE COMMAND DEFINITIONS
First BusSecond BusThird BusFourth BusFifth BusSixth Bus
1. ADI = Address of Device identifier; A1=0, A0 = 0 for manufacture code,A1=0, A0 = 1 for device code A2-A18=Do
not care.
(Refer to table 3)
DDI = Data of Device identifier : C2H for manufacture code, A4H for device code.
X = X can be VIL or VIH
RA=Address of memory location to be read.
RD=Data to be read at location RA.
2.PA = Address of memory location to be programmed.
PD = Data to be programmed at location PA.
SA = Address to the sector to be erased.
3.The system should generate the following address patterns: 555H or 2AAH to Address A10~A0 .
Address bit A11~A18=X=Don't care for all address commands except for Program Address (PA) and Sector
Address (SA). Write Sequence may be initiated with A11~A18 in either state.
4.For Sector Protect Verify Operation : If read out data is 01H, it means the sector has been protected.If read out data
is 00H,it means the sector is still not being protected.
COMMAND DEFINITIONS
Device operations are selected by writing specific address
and data sequences into the command register. Writing
incorrect address and data values or writing them in the
improper sequence will reset the device to the read
mode. Table 1 defines the valid register command
sequences. Note that the Erase Suspend (B0H) and
Erase Resume (30H) commands are valid only while the
Sector Erase operation is in progress. Either of the two
reset command sequences will reset the device(when
applicable).
P/N:PM0538
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MX29F040
TABLE 2. MX29F040 BUS OPERATION
ModePins
CEOEWEA0A1A6A9Q0 ~ Q7
Read Silicon IDLLHLLXVID(2)C2H
Manfacturer Code(1)
Read Silicon IDLLHHLXVID(2)A4H
Device Code(1)
ReadLLHA0A1A6A9D
StandbyHXXXXXXHIGH Z
Output DisableLHHXXXXHIGH Z
WriteLHLA0A1A6A9DIN(3)
Sector Protect with 12VLVID(2)LXXLVID(2)X
system(6)
Chip Unprotect with 12VLVID(2)LXXHVID(2)X
system(6)
Verify Sector ProtectLLHXHXVID(2)Code(5)
with 12V system
Sector Protect without 12VLHLXXLHX
system (6)
Chip Unprotect without 12VLHLXXHHX
system (6)
Verify Sector Protect/UnprotectLLHXHXHCode(5)
without 12V system (7)
ResetXXXXXXXHIGH Z
OUT
NOTES:
1. Manufacturer and device codes may also be accessed via a command register write sequence. Refer to Table 1.
2. VID is the Silicon-ID-Read high voltage, 11.5V to 12.5V.
3. Refer to Table 1 for valid Data-In during a write operation.
4. X can be VIL or VIH.
5. Code=00H means unprotected.
Code=01H means protected.
A18~A16=Sector address for sector protect.
6. Refer to sector protect/unprotect algorithm and waveform.
Must issue "unlock for sector protect/unprotect" command before "sector protect/unprotect without 12V system"
command.
7. The "verify sector protect/unprotect without 12V sysytem" is only following "Sector protect/unprotect without 12V system"
command.
P/N:PM0538
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REV. 1.6, AUG. 08, 2001
Page 7
MX29F040
READ/RESET COMMAND
The read or reset operation is initiated by writing the
read/reset command sequence into the command
register. Microprocessor read cycles retrieve array
data. The device remains enabled for reads until the
command register contents are altered.
If program-fail or erase-fail happen, the write of F0H will
reset the device to abort the operation. A valid command
must then be written to place the device in the desired
state.
SILICON-ID-READ COMMAND
Flash memories are intended for use in applications
where the local CPU alters memory contents. As such,
manufacturer and device codes must be accessible
while the device resides in the target system. PROM
programmers typically access signature codes by raising
A9 to a high voltage. However, multiplexing high voltage
onto address lines is not generally desired system
design practice.
The MX29F040 contains a Silicon-ID-Read operation to
supplement traditional PROM programming
methodology. The operation is initiated by writing the
read silicon ID command sequence into the command
register. Following the command write, a read cycle with
A1=VIL,A0=VIL retrieves the manufacturer code of C2H.
A read cycle with A1=VIL, A0=VIH returns the device
code of A4H for MX29F040.
SET-UP AUTOMATIC CHIP/SECTOR ERASE
Chip erase is a six-bus cycle operation. There are two
"unlock" write cycles. These are followed by writing the
"set-up" command 80H. Two more "unlock" write cycles
are then followed by the chip erase command 10H.
The Automatic Chip Erase does not require the device
to be entirely pre-programmed prior to executing the
Automatic Chip Erase. Upon executing the Automatic
Chip Erase, the device will automatically program and
verify the entire memory for an all-zero data pattern.
When the device is automatically verified to contain an
all-zero pattern, a self-timed chip erase and verify begin.
The erase and verify operations are completed when the
data on Q7 is "1" at which time the device returns to the
Read mode. The system is not required to provide any
control or timing during these operations.
When using the Automatic Chip Erase algorithm, note
that the erase automatically terminates when adequate
erase margin has been achieved for the memory array(no
erase verification command is required).
If the Erase operation was unsuccessful, the data on Q5
is "1"(see Table 4), indicating the erase operation exceed
internal timing limit.
The automatic erase begins on the rising edge of the last
WE or CE, whichever happeds first pulse in the command
sequence and terminates when the data on Q7 is "1" and
the data on Q6 stops toggling for two consecutive read
cycles, at which time the device returns to the Read
mode.
TABLE 3. EXPANDED SILICON ID CODE
PinsA0A1Q7Q6Q5Q4Q3Q2Q1Q0Code(Hex)
Manufacture codeVILVIL11000010C2H
Device code for MX29F040VIHVIL10100100A4H
Sector Protection VerificationXVIH0000000101H(Protected)
XVIH0000000000H(Unprotected)
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REV. 1.6, AUG. 08, 2001
Page 8
SECTOR ERASE COMMANDS
MX29F040
The Automatic Sector Erase does not require the
device to be entirely pre-programmed prior to
executing the Automatic Set-up Sector Erase
command and Automatic Sector Erase command.
Upon executing the Automatic Sector Erase
command, the device will automatically program and
verify the sector(s) memory for an all-zero data
pattern. The system is not required to provide any
control or timing during these operations.
When the sector(s) is automatically verified to contain
an all-zero pattern, a self-timed sector erase and
verify begin. The erase and verify operations are
complete when the data on Q7 is "1" and the data on
Q6 stops toggling for two consecutive read cycles, at
which time the device returns to the Read mode. The
system is not required to provide any control or timing
during these operations.
When using the Automatic Sector Erase algorithm,
note that the erase automatically terminates when
adequate erase margin has been achieved for the
memory array (no erase verification command is
required). Sector erase is a six-bus cycle operation.
There are two "unlock" write cycles. These are
followed by writing the set-up command 80H. Two
more "unlock" write cycles are then followed by the
sector erase command 30H. The sector address is
latched on the falling edge of WE or CE, whichever
happeds later, while the command(data) is latched on
the rising edge of WE o r CE, whichever happeds first.
Sector addresses selected are loaded into internal
register on the sixth falling edge of WE or CE,
whichever happeds later. Each successive sector load
cycle started by the falling edge of WE or CE,
whichever happeds later must begin within 30us from
the rising edge of the preceding WE or CE, whichever
happeds first. Otherwise, the loading period ends and
internal auto sector erase cycle starts. (Monitor Q3 to
determine if the sector erase timer window is still
open, see section Q3, Sector Erase Timer.) Any
command other than Sector Erase(30H) or Erase
Suspend(B0H) during the time-out period resets the
device to read mode.
Table 4. Write Operation Status
StatusQ7Q6Q5Q3Q2
Note1Note2
Byte Program in Auto Program AlgorithmQ7Toggle0N/A No Toggle
Auto Erase Algorithm0Toggle01Toggle
Byte Program in Auto Program AlgorithmQ7Toggle1N/A No Toggle
ExceededAuto Erase Algorithm0Toggle11Toggle
Time Limits Erase Suspend ProgramQ7Toggle1N/AN/A
Note:
1. Q7 and Q2 require a valid address when reading status information. Refer to the appropriate subsection for further
details.
2. Q5 switches to '1' when an Auto Program or Auto Erase operation has exceeded the maximum timing limits.
See "Q5:Exceeded Timing Limits " for more information.
P/N:PM0538
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MX29F040
ERASE SUSPEND
This command only has meaning while the state machine
is executing Automatic Sector Erase operation, and
therefore will only be responded during Automatic Sector
Erase operation. When the Erase Suspend command is
written during a sector erase operation, the device requires
a maximum of 100us to suspend the erase operations.
However, When the Erase Suspend command is written
during the sector erase time-out, the device immediately
terminates the time-out period and suspends the erase
operation. After this command has been executed, the
command register will initiate erase suspend mode. The
state machine will return to read mode automatically after
suspend is ready. At this time, state machine only allows
the command register to respond to the Read Memory
Array, Erase Resume and program commands.
The system can determine the status of the program
operation using the Q7 or Q6 status bits, just as in the
standard program operation. After an erase-suspend
program operation is complete, the system can once
again read array data within non-suspended sectors.
ERASE RESUME
This command will cause the command register to clear
the suspend state and return back to Sector Erase mode
but only if an Erase Suspend command was previously
issued. Erase Resume will not have any effect in all
other conditions.Another Erase Suspend command can
be written after the chip has resumed erasing.
If the program opetation was unsuccessful, the data on
Q5 is "1"(see Table 4), indicating the program operation
exceed internal timing limit. The automatic programming
operation is completed when the data read on Q6 stops
toggling for two consecutive read cycles and the data on
Q7 and Q6 are equivalent to data written to these two
bits, at which time the device returns to the Read
mode(no program verify command is required).
DATA POLLING-Q7
The MX29F040 also features Data Polling as a method
to indicate to the host system that the Automatic Program
or Erase algorithms are either in progress or completed.
While the Automatic Programming algorithm is in
operation, an attempt to read the device will produce the
complement data of the data last written to Q7. Upon
completion of the Automatic Program Algorithm an
attempt to read the device will produce the true data last
written to Q7. The Data Polling feature is valid after the
rising edge of the fourth WE or CE, whichever happeds
first pulse of the four write pulse sequences for automatic
program.
While the Automatic Erase algorithm is in operation, Q7
will read "0" until the erase operation is competed. Upon
completion of the erase operation, the data on Q7 will
read "1". The Data Polling feature is valid after the rising
edge of the sixth WE or CE, whichever happeds first
pulse of six write pulse sequences for automatic chip/
sector erase.
SET-UP AUTOMATIC PROGRAM
COMMANDS
To initiate Automatic Program mode, A three-cycle
command sequence is required. There are two "unlock"
write cycles. These are followed by writing the Automatic
Program command A0H.
Once the Automatic Program command is initiated, the
next WE or CE pulse causes a transition to an active
programming operation. Addresses are latched on the
falling edge, and data are internally latched on the rising
edge of the WE or CE, whichever happeds first pulse.
The rising edge of WE or CE, whichever happeds first
also begins the programming operation. The system is
not required to provide further controls or timings. The
device will automatically provide an adequate internally
generated program pulse and verify margin.
P/N:PM0538
The Data Polling feature is active during Automatic
Program/Erase algorithm or sector erase time-out.(see
section Q3 Sector Erase Timer)
REV. 1.6, AUG. 08, 2001
9
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Q6:Toggle BIT I
Toggle Bit I on Q6 indicates whether an Automatic
Program or Erase algorithm is in progress or complete,
or whether the device has entered the Erase Suspend
mode. Toggle Bit I may be read at any address, and is
valid after the rising edge of the final WE or CE, whichever
happeds first pulse in the command sequence(prior to the
program or erase operation), and during the sector timeout.
During an Automatic Program or Erase algorithm
operation, successive read cycles to any address cause
Q6 to toggle. The system may use either OE or CE to
control the read cycles. When the operation is complete,
Q6 stops toggling.
After an erase command sequence is written, if all
sectors selected for erasing are protected, Q6 toggles
and returns to reading array data. If not all selected
sectors are protected, the Automatic Erase algorithm
erases the unprotected sectors, and ignores the selected
sectors that are protected.
The system can use Q6 and Q2 together to determine
whether a sector is actively erasing or is erase suspended.
When the device is actively erasing (that is, the Automatic
Erase algorithm is in progress), Q6 toggling. When the
device enters the Erase Suspend mode, Q6 stops
toggling. However, the system must also use Q2 to
determine which sectors are erasing or erase-suspended.
Alternatively, the system can use Q7.
If a program address falls within a protected sector, Q6
toggles for approximately 2us after the program command
sequence is written, then returns to reading array data.
MX29F040
Q2 toggles when the system reads at addresses within
those sectors that have been selected for erasure. (The
system may use either OE or CE to control the read
cycles.) But Q2 cannot distinguish whether the sector is
actively erasing or is erase-suspended. Q6, by
comparison, indicates whether the device is actively
erasing, or is in Erase Suspend, but cannot distinguish
which sectors are selected for erasure. Thus, both
status bits are required for sectors and mode information.
Refer to Table 4 to compare outputs for Q2 and Q6.
Reading Toggle Bits Q6/ Q2
Whenever the system initially begins reading toggle bit
status, it must read Q7-Q0 at least twice in a row to
determine whether a toggle bit is toggling. Typically, the
system would note and store the value of the toggle bit
after the first read. After the second read, the system
would compare the new value of the toggle bit with the
first. If the toggle bit is not toggling, the device has
completed the program or erase operation. The system
can read array data on Q7-Q0 on the following read
cycle.
However, if after the initial two read cycles, the system
determines that the toggle bit is still toggling, the system
also should note whether the value of Q5 is high (see the
section on Q5). If it is, the system should then determine
again whether the toggle bit is toggling, since the toggle
bit may have stopped toggling just as Q5 went high. If
the toggle bit is no longer toggling, the device has
successfuly completed the program or erase operation.
If it is still toggling, the device did not complete the
operation successfully, and the system must write the
reset command to return to reading array data.
Q6 also toggles during the erase-suspend-program
mode, and stops toggling once the Automatic Program
algorithm is complete.
Table 4 shows the outputs for Toggle Bit I on Q6.
Q2:Toggle Bit II
The "Toggle Bit II" on Q2, when used with Q6, indicates
whether a particular sector is actively eraseing (that is,
the Automatic Erase alorithm is in process), or whether
that sector is erase-suspended. Toggle Bit I is valid after
the rising edge of the final WE or CE, whichever happeds
first pulse in the command sequence.
P/N:PM0538
The remaining scenario is that system initially determines
that the toggle bit is toggling and Q5 has not gone high.
The system may continue to monitor the toggle bit and
Q5 through successive read cycles, determining the
status as described in the previous paragraph.
Alternatively, it may choose to perform other system
tasks. In this case, the system must start at the beginning
of the algorithm when it returns to determine the status
of the operation.
REV. 1.6, AUG. 08, 2001
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MX29F040
Q5
Exceeded Timing Limits
Q5 will indicate if the program or erase time has exceeded
the specified limits(internal pulse count). Under these
conditions Q5 will produce a "1". This time-out condition
indicates that the program or erase cycle was not
successfully completed. Data Polling and Toggle Bit are
the only operating functions of the device under this
condition.
If this time-out condition occurs during sector erase
operation, it specifies that a particular sector is bad and
it may not be reused. However, other sectors are still
functional and may be used for the program or erase
operation. The device must be reset to use other
sectors. Write the Reset command sequence to the
device, and then execute program or erase command
sequence. This allows the system to continue to use the
other active sectors in the device.
If this time-out condition occurs during the chip erase
operation, it specifies that the entire chip is bad or
combination of sectors are bad.
If this time-out condition occurs during the byte
programming operation, it specifies that the entire sector
containing that byte is bad and this sector maynot be
reused, (other sectors are still functional and can be
reused).
with its control register architecture, alteration of the
memory contents only occurs after successful completion
of specific command sequences. The device also
incorporates several features to prevent inadvertent
write cycles resulting from VCC power-up and powerdown transition or system noise.
Q3
Sector Erase Timer
After the completion of the initial sector erase command
sequence, the sector erase time-out will begin. Q3 will
remain low until the time-out is complete. Data Polling
and Toggle Bit are valid after the initial sector erase
command sequence.
If Data Polling or the Toggle Bit indicates the device has
been written with a valid erase command, Q3 may be
used to determine if the sector erase timer window is still
open. If Q3 is high ("1") the internally controlled erase
cycle has begun; attempts to write subsequent
commands to the device will be ignored until the erase
operation is completed as indicated by Data Polling or
Toggle Bit. If Q3 is low ("0"), the device will accept
additional sector erase commands. To insure the
command has been accepted, the system software
should check the status of Q3 prior to and following each
subsequent sector erase command. If Q3 were high on
the second status check, the command may not have
been accepted.
The time-out condition may also appear if a user tries to
program a non blank location without erasing. In this
case the device locks out and never completes the
Automatic Algorithm operation. Hence, the system
never reads a valid data on Q7 bit and Q6 never stops
toggling. Once the Device has exceeded timing limits,
the Q5 bit will indicate a "1". Please note that this is not
a device failure condition since the device was incorrectly
used.
DATA PROTECTION
The MX29F040 is designed to offer protection against
accidental erasure or programming caused by spurious
system level signals that may exist during power
transition. During power up the device automatically
resets the state machine in the Read mode. In addition,
P/N:PM0538
WRITE PULSE "GLITCH" PROTECTION
Noise pulses of less than 5ns(typical) on CE or WE will
not initiate a write cycle.
LOGICAL INHIBIT
Writing is inhibited by holding any one of OE = VIL, CE
= VIH or WE = VIH. To initiate a write cycle CE and WE
must be a logical zero while OE is a logical one.
POWER SUPPLY DECOUPLING
In order to reduce power switching effect, each device
should have a 0.1uF ceramic capacitor connected
between its VCC and GND.
REV. 1.6, AUG. 08, 2001
11
Page 12
SECTOR PROTECTION WITH 12V SYSTEM
The MX29F040 features sector protection. This feature
will disable both program and erase operations for these
sectors protected. To activate this mode, the
programming equipment must force VID on address pin
A9 and control pin OE, (suggest VID = 12V) A6 = VIL and
CE = VIL.(see Table 2) Programming of the protection
circuitry begins on the falling edge of the WE or CE,
whichever happeds later pulse and is terminated on the
rising edge. Please refer to sector protect algorithm and
waveform.
To verify programming of the protection circuitry, the
programming equipment must force VID on address pin
A9 ( with CE and OE at VIL and WE at VIH). When A1=1,
it will produce a logical "1" code at device output Q0 for
a protected sector. Otherwise the device will produce
00H for the unprotected sector. In this mode, the
addresses, except for A1, are don't care. Address
locations with A1 = VIL are reserved to read manufacturer
and device codes.(Read Silicon ID)
It is also possible to determine if the sector is protected
in the system by writing a Read Silicon ID command.
Performing a read operation with A1=VIH, it will produce
a logical "1" at Q0 for the protected sector.
MX29F040
It is also possible to determine if the chip is unprotected
in the system by writing the Read Silicon ID command.
Performing a read operation with A1=VIH, it will produce
00H at data outputs(Q0-Q7) for an unprotected sector.
It is noted that all sectors are unprotected after the chip
unprotect algorithm is completed.
POWER-UP SEQUENCE
The MX29F040 powers up in the Read only mode. In
addition, the memory contents may only be altered after
successful completion of the predefined command
sequences.
SECTOR PROTECTION WITHOUT 12V
SYSTEM
The MX29F040 also feature a sector protection method
in a system without 12V power suppply. The programming
equipment do not need to supply 12 volts to protect
sectors. The details are shown in sector protect algorithm
and waveform.
CHIP UNPROTECT WITHOUT 12V SYSTEM
CHIP UNPROTECT WITH 12V SYSTEM
The MX29F040 also features the chip unprotect mode,
so that all sectors are unprotected after chip unprotect
is completed to incorporate any changes in the code. It
is recommended to protect all sectors before activating
chip unprotect mode.
To activate this mode, the programming equipment
must force VID on control pin OE and address pin A9.
The CE pins must be set at VIL. Pins A6 must be set to
VIH.(see Table 2) Refer to chip unprotect algorithm and
waveform for the chip unprotect algorithm. The
unprotection mechanism begins on the falling edge of
the WE or CE, whichever happeds later, pulse and is
terminated on the rising edge.
The MX29F040 also feature a chip unprotection method
in a system without 12V power supply. The programming
equipment do not need to supply 12 volts to unprotect all
sectors. The details are shown in chip unprotect algorithm
and waveform.
DC CHARACTERISTICS (TA = 0°C TO 70°C, VCC = 5V±10%)
SYMBOLPARAMETERMIN.TYPMAX.UNITCONDITIONS
ILIInput Leakage Current1uAVIN = GND to VCC
ILOOutput Leakage Current10uAVOUT = GND to VCC
ISB1Standby VCC current1mACE = VIH
ISB215uACE = VCC + 0.3V
ICC1Operating VCC current30mAIOUT = 0mA, f=5MHz
ICC250mAIOUT = 0mA, f=10MHz
VILInput Low Voltage-0.3(NOTE 1)0.8V
VIHInput High Voltage2.0VCC + 0.3V
VOLOutput Low Voltage0.45VIOL = 2.1mA
VOH1Output High Voltage(TTL)2.4VIOH = -2mA
VOH2Output High Voltage(CMOS) VCC-0.4VIOH = -100uA,VCC=VCC MIN
NOTES:
1. VIL min. = -1.0V for pulse width is equal to or less than 50 ns.
VIL min. = -2.0V for pulse width is equal to or less than 20 ns.
AC CHARACTERISTICS (TA = 0oC to 70oC, VCC = 5V
29F040-55(note2)29F040-70 29F040-90 29F040-12
Symbol PARAMETERMIN. MAX.MIN. MAX. MIN. MAX. MIN. MAX. UnitConditions
tACCAddress to Output Delay557 09012 0nsCE=OE=VIL
tCECE to Output Delay557090120n sOE=VIL
tOEOE to Output Delay30404050nsCE=VIL
tDFOE High to Output Float (Note1)030030040040nsCE=VIL
tOHAddress to Output hold0000nsCE=OE=VIL
TEST CONDITIONS:
• Input pulse levels: 0.45V/2.4V
• Input rise and fall times is equal to or less than 0ns
• Reference levels for measuring timing: 0.8V, 2.0V
2. VIH max. = VCC + 1.5V for pulse width is equal to or less
than 20 ns.
If VIH is over the specified maximum value, read operation
cannot be guaranteed.
±±
±10%)
±±
NOTE:
1. tDF is defined as the time at which the output achieves the
open circuit condition and data is no longer driven.
2.Under condition of VCC=5V±10%,CL=50pF,VIH/VIL=3.0/
0V,VOH/VOL=1.5/1.5V,IOL=2mA,IOH=-2mA.
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MX29F040
ABSOLUTE MAXIMUM RATINGS
RATINGVALUE
Ambient Operating Temperature0oC to 70oC
Storage Temperature-65oC to 125oC
Ambient Temperature with Power -55oC to 125oC
Applied
Applied Input Voltage-0.5V to 7.0V
Applied Output Voltage-0.5V to 7.0V
VCC to Ground Potential-0.5V to 7.0V
A9 & OE-0.5V to 13.5V
READ TIMING WAVEFORMS
Addresses
CE
WE
VIH
VIL
VIH
VIL
VIH
VIL
NOTICE:
Stresses greater than those listed under ABSOLUTE
MAXIMUM RATINGS may cause permanent damage to
the device. This is a stress rating only and functional
operational sections of this specification is not implied.
Exposure to absolute maximum rating conditions for
extended period may affect reliability.
NOTICE:
Specifications contained within the following tables are
subject to change.
1. VIL min. = -0.6V for pulse width is equal to or less than
20ns.
2. If VIH is over the specified maximum value, programming
operation cannot be guranteed.
±±
±10%)
±±
3. ICCES is specified with the device de-selected. If the
device is read during erase suspend mode, current draw is
the sum of ICCES and ICC1 or ICC2.
4. All current are in RMS unless otherwise noted.
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MX29F040
AC CHARACTERISTICS TA = 0oC to 70oC, VCC = 5V
±±
± 10%
±±
29F040-55(Note2) 29F040-70 29F040-90 29F040-12
SYMBOL PARAMETERMIN.MAX. MIN.MAX. MIN.MAX.MIN.MAX. Unit
tOESOE setup time5050505 0ns
tCWCCommand programming cycle707090120n s
tCEPWE programming pulse width454 54550n s
tCEPH1WE programming pluse width High20202020n s
tCEPH2WE programming pluse width High20202020n s
tASAddress setup time0000n s
tAHAddress hold time45454550n s
tDSData setup time3030455 0ns
tDHData hold time0000ns
tCESCCE setup time before command write0000n s
tDFOutput disable time (Note 1)303 04040ns
tAETCTotal erase time in auto chip erase4(TYP.) 324(TYP.)324(TYP.) 324(TYP.) 32s
tAETBTotal erase time in auto sector erase1.3(TYP.)10.41.3(TYP.) 10.41.3(TYP.)10.41.3(TYP.)10.4s
tAVTTotal programming time in auto verify72107 21072107210us
tBALSector address load time1001001001 00u s
tCHCE Hold Time0000ns
tCSCE setup to WE going low0000n s
tVLHTVoltge Transition Time4444us
tOESPOE Setup Time to WE Active4444us
tWPP1Write pulse width for sector protect1 0101010u s
tWPP2Write pulse width for sector unprotect12121 212ms
NOTES:
1. tDF defined as the time at which the output achieves the open circuit condition and data is no longer driven.
2.Under conditions of VCC=5V±10%,CL=50pF,VIH/VIL=3.0/0V,VOL/VOH=1.5/1.5, IOL=2mA,IOH=-2mA.
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Page 16
SWITCHING TEST CIRCUITS
MX29F040
DEVICE UNDER
TEST
SWITCHING TEST WAVEFORMS
2.4V
0.45V
AC TESTING: Inputs are driven at 2.4V for a logic "1" and 0.45V for a logic "0".
Input pulse rise and fall times are < 20ns.(5ns for 29F040-55)
Note:VIH/VIL=3.0/0V,VOH/VOL=1.5/1.5V for 29F040-55
INPUT
CL
CL=100pF Including jig capacitance
CL= 50pF for 29F040-55
1.2K ohm
2.0V2.0V
TEST POINTS
0.8V
1.6K ohm
DIODES=IN3064
OR EQUIVALENT
0.8V
+5V
OUTPUT
COMMAND WRITE TIMING WAVEFORM
VCC
Addresses
WE
CE
OE
Data
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VIH
VIL
VIH
VIL
VIH
VIL
VIH
VIL
VIH
VIL
5V
ADD Valid
tAS
tOES
tCStCH
tCEP
tDS
tAH
tCEPH1
tCWC
tDH
DIN
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AUTOMATIC PROGRAMMING TIMING WAVEFORM
MX29F040
One byte data is programmed. Verify in fast algorithm
and additional programming by external control are not
required because these operations are executed
automatically by internal control circuit. Programming
completion can be verified by DATA polling and toggle
AUTOMATIC PROGRAMMING TIMING WAVEFORM
Vcc 5V
A11~A18
A0~A10
WE
CE
555H
tAS
tAH
tCEP
2AAH
tCWC
tCEPH1
bit checking after automatic verification starts. Device
outputs DATA during programming and DATA after
programming on Q7.(Q6 is for toggle bit; see toggle bit,
DATA polling, timing waveform)
ADD Valid
555H
ADD Valid
tAVT
tCESC
OE
Q0,Q1,Q2
Q4(Note 1)
Q7
tDS tDH
Command In
Command InCommand InCommand InData In
Command #AAH
(Q0~Q7)
Command #55H
Command InCommand InData In
Command #A0H
Notes:
(1). Q6:Toggle bit, Q5:Timing-limit bit, Q3: Time-out bit
tDF
DATA
DATA polling
DATADATA
tOE
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AUTOMATIC PROGRAMMING ALGORITHM FLOWCHART
START
Write Data AAH Address 555H
Write Data 55H Address 2AAH
Write Data A0H Address 555H
Write Program Data/Address
MX29F040
Invalid
Command
Toggle Bit Checking
Q6 not Toggled
NO
Verify Byte Ok
Auto Program Completed
YES
YES
NO
Q5 = 1
YES
Reset
Auto Program Exceed
Timing Limit
NO
.
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AUTOMATIC CHIP ERASE TIMING WAVEFORM
MX29F040
All data in chip are erased. External erase verification is
not required because data is erased automatically by
internal control circuit. Erasure completion can be
verified by DATA polling and toggle bit checking after
AUTOMATIC CHIP ERASE TIMING WAVEFORM
Vcc 5V
A11~A18
A0~A10
555H
2AAH
555H
tAS
WE
tAH
CE
automatic erase starts. Device outputs 0 during erasure
and 1 after erasure on Q7.(Q6 is for toggle bit; see toggle
bit, DATA polling, timing waveform)
Sector data indicated by A16 to A18 are erased. External
erase verify is not required because data are erased
automatically by internal control circuit. Erasure com-
checking after automatic erase starts. Device outputs 0
during erasure and 1 after erasure on Q7.(Q6 is for
toggle bit; see toggle bit, DATA polling, timing waveform)
pletion can be verified by DATA polling and toggle bit
Note:1.Not 100% Tested, Excludes external system level over head.
2.Typical values measured at 25°C,5V.
3.Maximunm values measured at 25°C,4.5V.
LATCHUP CHARACTERISTICS
MIN.MAX.
Input Voltage with respect to GND on all pins except I/O pins-1.0V13.5V
Input Voltage with respect to GND on all I/O pins-1.0VVcc + 1.0V
Current-100mA+100mA
Includes all pins except Vcc. Test conditions: Vcc = 5.0V, one pin at a time.
DATA RETENTION
PARAMETERMIN.UNIT
Data Retention Time2 0Years
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PACKAGE INFORMATION
32-PIN PLASTIC DIP
MX29F040
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32-PIN PLASTIC LEADED CHIP CARRIER (PLCC)
MX29F040
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32-PIN PLASTIC TSOP
MX29F040
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MX29F040
REVISION HISTORY
RevisionDescriptionPageDate
1.0To remove "Advanced Information" datasheet marking andP1JUL/01/1999
contain information on products in full production.
1.1To improve ICC1:from 40mA @5MHz to 30mA @5MHzP1,13,14,33JUL/12/1999
1.2To add the description for 100K endurance cycleP1,34OCT/04/1999
To modify timing of sector address loading period whileP8
operating multi-sector erase from 80us to 30us
To modify tBAL from 80us to 100usP15
2.To remove A9 from "timing waveform for sector protection forP28
system without 12V"
To remove A9 from "timing waveform for chip unprotection forP29
system without 12V"
3.To add data retention minimum 20 yearsP1,34
1.4Add erase suspend ready max. 100us in ERASE SUSPEND'sP9MAY/29/2000
section at page 9