The MX27L4000 is a 4M-bit, One Time Programmable
Read Only Memory. It is organized as 512K words by 8
bits per word, operates from a single +3 volt supply, has
a static standby mode, and features fast single address
location programming. All programming signals are TTL
levels, requiring a single pulse. For programming outside from the system, existing EPROM programmers
PIN CONFIGURATIONS
32 PDIP/SOP
VPP
1
A16
2
A15
3
A12
4
A7
5
A6
6
A5
7
A4
8
A3
9
A2
10
A1
11
A0
12
Q0
13
Q1
14
Q2
15
GND
16
VCC
32
A18
31
A17
30
A14
29
A13
28
A8
27
A9
26
A11
25
OE
24
A10
23
MX27L4000
CE
22
Q7
21
Q6
20
Q5
19
Q4
18
Q3
17
32 PLCC32TSOP
A12
A15
A16
VPP
VCC
A18
A17
4
5
A7
A6
A5
A4
9
A3
A2
A1
A0
13
Q0
141720
Q1
1
32
MX27L4000
Q2
Q3Q4Q5
GND
30
29
25
21
Q6
• Operating current: 20mA @ 3.6V, 5MHz
• Standby current: 50uA
• Package type:
- 32 pin plastic DIP
- 32 pin PLCC/SOP
- 32pin TSOP
may be used. The MX27L4000 supports a intelligent fast
programming algorithm which can result in programming
time of less than two minutes.
This EPROM is packaged in industry standard 32 pin
dual-in-line packages, 32 lead PLCC, 32 lead SOP, and
32 lead TSOP(I) packages.
When the MX27L4000 is delivered, or it is erased, the
chip has all 4M bits in the "ONE" or HIGH state. "ZEROs"
are loaded into the MX27L4000 through the procedure
of programming.
For programming, the data to be programmed is applied
with 8 bits in parallel to the data pins.
VCC must be applied simultaneously or before VPP, and
removed simultaneously or after VPP. When
programming an MXIC EPROM, a 0.1uF capacitor is
required across Vpp and ground to suppress spurious
voltage transients which may damage the device.
FAST PROGRAMMING
The device is set up in the fast programming mode when
the programming voltage VPP = 12.75V is applied, with
VCC = 6.25 V and OE = VIH (Algorithm is shown in
Figure 1). The programming is achieved by applying a
single TTL low level 100us pulse to the CE input after
addresses and data line are stable. If the data is not
verified, an additional pulse is applied for a maximum of
25 pulses. This process is repeated while sequencing
through each address of the device. When the
programming mode is completed, the data in all address
is verified at VCC = VPP = 5V ± 10%.
PROGRAM INHIBIT MODE
Programming of multiple MX27L4000s in parallel with
different data is also easily accomplished by using the
Program Inhibit Mode. Except for CE and OE, all like
inputs of the parallel MX27L4000 may be common. A
TTL low-level program pulse applied to an MX27L4000
CE input with VPP = 12.5 ± 0.5 V and CE LOW will
program that MX27L4000. A high-level CE input inhibits
the other MX27L4000s from being programmed.
PROGRAM VERIFY MODE
Verification should be performed on the programmed
bits to determine that they were correctly programmed.
The verification should be performed with OE and CE at
VIL, and VPP at its programming voltage.
AUTO IDENTIFY MODE
The auto identify mode allows the reading out of a binary
code from an EPROM that will identify its manufacturer
and device type. This mode is intended for use by
programming equipment for the purpose of
automatically matching the device to be programmed
with its corresponding programming algorithm. This
mode is functional in the 25°C ± 5°C ambient
temperature range that is required when programming
the MX27L4000.
To activate this mode, the programming equipment
must force 12.0 ± 0.5 V on address line A9 of the device.
Two identifier bytes may then be sequenced from the
device outputs by toggling address line A0 from VIL to
VIH. All other address lines must be held at VIL during
auto identify mode.
Byte 0 ( A0 = VIL) represents the manufacturer code,
and byte 1 (A0 = VIH), the device identifier code. For the
MX27L4000, these two identifier bytes are given in the
Mode Select Table. All identifiers for manufacturer and
device codes will possess odd parity, with the MSB (Q7)
defined as the parity bit.
READ MODE
The MX27L4000 has two control functions, both of
which must be logically satisfied in order to obtain data
at the outputs. Chip Enable (CE) is the power control
and should be used for device selection. Output Enable
(OE) is the output control and should be used to gate
data to the output pins, independent of device selection.
Assuming that addresses are stable, address access
time (tACC) is equal to the delay from CE to output (tCE).
Data is available at the outputs tOE after the falling edge
of OE's, assuming that CE has been LOW and
addresses have been stable for at least tACC - tOE.
STANDBY MODE
The MX27L4000 has a CMOS standby mode which
reduces the maximum VCC current to 50 uA. It is placed
in CMOS standby when CE is at VCC ± 0.3 V. The
MX27L4000 also has a TTL-standby mode which
reduces the maximum VCC current to 0.25 mA. It is
placed in TTL-standby when CE is at VIH. When in
standby mode, the outputs are in a high-impedance
state, independent of the OE input.
P/N: PM00255
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MX27L4000
TWO-LINE OUTPUT CONTROL FUNCTION
To accommodate multiple memory connections, a twoline control function is provided to allow for:
SYSTEM CONSIDERATIONS
During the switch between active and standby
conditions, transient current peaks are produced on the
rising and falling edges of Chip Enable. The magnitude
1. Low memory power dissipation,
2. Assurance that output bus contention will not
occur.
of these transient current peaks is dependent on the
output capacitance loading of the device. At a minimum,
a 0.1 uF ceramic capacitor (high frequency, low inherent
inductance) should be used on each device between
It is recommended that CE be decoded and used as the
primary device-selecting function, while OE be made a
common connection to all devices in the array and
connected to the READ line from the system control bus.
This assures that all deselected memory devices are in
their low-power standby mode and that the output pins
are only active when data is desired from a particular
VCC and GND to minimize transient effects. In addition,
to overcome the voltage drop caused by the inductive
effects of the printed circuit board traces on EPROM
arrays, a 4.7 uF bulk electrolytic capacitor should be
used between VCC and GND for each eight devices.
The location of the capacitor should be close to where
the power supply is connected to the array.
memory device.
MODE SELECT TABLE
PINS
MODECEOEA0A9VPPOUTPUTS
ReadVILVILXXVCCDOUT
Output DisableVILVIHXXVCCHigh Z
Standby (TTL)VIHXXXVCCHigh Z
Standby (CMOS)VCC±0.3VXXXVCCHigh Z
ProgramVILVIHXXVPPDIN
Program VerifyVIHVILXXVPPDOUT
Program InhibitVIHVIHXXVPPHigh Z
Manufacturer Code(3)VILVILVILVHVCCC2H
Device Code(3)VILVILVIHVHVCC40H
NOTES:
1. VH = 12.0 V ± 0.5 V
2. X = Either VIH or VIL
3. A1 - A8 = A10 - A18 = VIL(For auto select)
4. See DC Programming Characteristics for VPP voltage during programming.
P/N: PM00255
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FIGURE 1. FAST PROGRAMMING FLOW CHART
MX27L4000
START
ADDRESS = FIRST LOCATION
VCC = 6.25V
VPP = 12.75V
X = 0
PROGRAM ONE 100us PULSE
INTERACTIVE
SECTION
VERIFY SECTION
INCREMENT ADDRESS
FAIL
NO
INCREMENT X
X = 25?
NO
VERIFY BYTE
?
PASS
LAST ADDRESS
YES
VCC = VPP = 5.25V
VERIFY ALL BYTES
?
PASS
DEVICE PASSED
YES
FAIL
FAIL
DEVICE FAILED
P/N: PM00255
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Page 5
SWITCHING TEST CIRCUITS
MX27L4000
DEVICE
UNDER
TEST
CL = 100 pF including jig capacitance
SWITCHING TEST WAVEFORMS
AC driving levels
AC TESTING: (1) AC driving levels are 3.0V/0V for both commercial grade and industrial grade.
CL
6.2K ohm
2.0V
TEST POINTS
0.8V
INPUT
(2) Input pulse rise and fall times are < 10ns.
1.8K ohm
+5V
DIODES = IN3064
OR EQUIVALENT
2.0V
0.8V
OUTPUT
P/N: PM00255
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MX27L4000
ABSOLUTE MAXIMUM RATINGS
RATINGVALUE
Ambient Operating Temperature -40oC to 85oC
Storage Temperature-65oC to 125oC
Applied Input Voltage-0.5V to 7.0V
NOTICE:
Stresses greater than those listed under ABSOLUTE
MAXIMUM RATINGS may cause permanent damage to the
device. This is a stress rating only and functional operation
of the device at these or any other conditions above those
indicated in the operational sections of this specification is not
implied. Exposure to absolute maximum rating conditions for
extended period may affect reliability.
Applied Output Voltage-0.5V to VCC+0.5V
VCC to Ground Potential-0.5V to 7.0V
V9 & VPP-0.5V to 13.5V
NOTICE:
Specifications contained within the following tables are subject to change.
DC/AC Operating Conditions for Read Operation
MX27L4000
-20-25
Operating TemperatureCommercial0°C to 70°C0°C to 70°C
tACCAddress to Output Delay200250nsCE = OE = VIL
tCEChip Enable to Output Delay200250nsOE = VIL
tOEOutput Enable to Output Delay100120nsCE = VIL
tDFOE High to Output Float,060 070ns
or CE High to Output Float
tOHOutput Hold from Address,0 0ns
CE or OE which ever occurred first
DC PROGRAMMING CHARACTERISTICS TA = 25
o
C ± 5oC
SYMBOLPARAMETERMIN.MAX.UNITCONDITIONS
VOHOutput High Voltage2.4VIOH = -0.40mA
VOLOutput Low Voltage0.4VIOL = 2.1mA
VIHInput High Voltage2.0VCC + 0.5V
VILInput Low Voltage-0.30.8V
ILIInput Leakage Current-1010uAVIN = 0 to 3.6V
VHA9 Auto Select Voltage11.512.5V
ICC3VCC Supply Current (Program & Verify)50mA
IPP2VPP Supply Current(Program)30mACE = VIL, OE = VIH
VCC1Fast Programming Supply Voltage6.006.50V
VPP1Fast Programming Voltage12.513.0V
AC PROGRAMMING CHARACTERISTICS TA = 25
o
C ± 5oC
SYMBOLPARAMETERMIN.MAX.UNIT
tASAddress Setup Time2.0us
tOESOE Setup Time2.0us
tDSData Setup Time2.0us
tAHAddress Hold Time0us
tDHData Hold Time2.0us
tDFPOutput Enable to Output Float Delay0130ns
tVPSVPP Setup Time2.0us
tPWPGM Program Pulse Width95105us
tVCSVCC Setup Time2.0us
tOEData valid from OE150ns
P/N: PM00255
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WAVEFORMS
READ CYCLE
MX27L4000
ADDRESS
INPUTS
tACC
CE
tCE
OE
DATA
OUT
tOE
FAST PROGRAMMING ALGORITHM WAVEFORM
PROGRAM
Addresses
VIH
VIL
tAS
DATA ADDRESS
VALID DATA
Hi-z
tDF
tOH
PROGRAM VERIFY
tAH
DATA
VPP
VCC
CE
OE
VPP1
VCC
VCC1
VCC
VIH
VIL
VIH
VIL
DATA IN STABLE
tDS
tVPS
tVCS
tPW
tDH
tOES
DATA OUT VALID
tDFP
tOE
Max
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MX27L4000
ORDERING INFORMATION
PLASTIC PACKAGE
PART NO.ACCESS TIME(ns)OPERATINGSTANDBYOPERATINGPACKAGE
CURRENT MAX.(mA) CURRENT MAX.(uA)TEMPERATURE
MX27L4000PC-2525020500°C to 70°C32 Pin DIP
MX27L4000PC-2020020500°C to 70°C32 Pin DIP
MX27L4000QC-2525020500°C to 70°C32 Pin PLCC
MX27L4000QC-2020020500°C to 70°C32 Pin PLCC
MX27L4000MC-2525020500°C to 70°C32 Pin SOP
MX27L4000MC-2020020500°C to 70°C32 Pin SOP
MX27L4000TC-2525020500°C to 70°C32 Pin TSOP
MX27L4000TC-2020020500°C to 70°C32 Pin TSOP
MX27L4000PI-252502050-40°C to 85°C32 Pin DIP
MX27L4000PI-202002050-40°C to 85°C32 Pin DIP
MX27L4000QI-252502050-40°C to 85°C32 Pin PLCC
MX27L4000QI-202002050-40°C to 85°C32 Pin PLCC
MX27L4000MI-252502050-40°C to 85°C32 Pin SOP
MX27L4000MI-202002050-40°C to 85°C32 Pin SOP
MX27L4000TI-252502050-40°C to 85°C32 Pin TSOP
MX27L4000TI-202002050-40°C to 85°C32 Pin TSOP
P/N: PM00255
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PACKAGE INFORMATION
32-PIN PLASTIC DIP(600 mil)
MX27L4000
P/N: PM00255
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32-PIN PLASTIC SOP (450 mil)
MX27L4000
P/N: PM00255
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32-PIN PLASTIC LEADED CHIP CARRIER (PLCC)
MX27L4000
P/N: PM00255
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Page 13
32-PIN PLASTIC TSOP
MX27L4000
P/N: PM00255
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Page 14
MX27L4000
REVISION HISTORY
Revision No. DescriptionPageDate
2.01) AC driving levels changed from 2.4V/0.3V to 3.0V/0V.6/05/1997
2) Change package type, from 12 x 20 mm 48TSOP(I) to
8 x 20mm 32TSOP(I)