Datasheet MX27C512 Datasheet (MXIC)

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Page 1

FEATURES

CONTROL

LOGIC

OUTPUT

BUFFERS

Q0~Q7

OE/VPP

A0~A15

ADDRESS

INPUTS

Y-DECODER

X-DECODER

Y-SELECT

512K BIT

CELL

MAXTRIX

VCC GND

. . . . . . . .

MX27C512

512K-BIT [64Kx8] CMOS EPROM

• 64K x 8 organization

• Single +5V power supply

• +12.5V programming voltage

• Fast access time: 45/55/70/90/100/120/150ns

• Totally static operation

• Completely TTL compatible

GENERAL DESCRIPTION

The MX27C512 is a 5V only, 512K-bit, ultraviolet Erasable Programmable Read Only Memory. It is organized as 64K words by 8 bits per word, operates from a single +5volt supply, has a static standby mode, and features fast single address location programming. All programming signals are TTL levels, requiring a single pulse. For programming outside from the system, existing EPROM

PIN CONFIGURATIONS

PDIP

A15 A12

A7 A6 A5 A4 A3 A2 A1 A0 Q0 Q1 Q2

GND

1 2 3 4 5 6 7 8 9 10 11 12 13 14

28 27 26 25 24 23 22 21 20

MX27C512

19 18 17 16 15

VCC A14 A13 A8 A9 A11 OE/VPP A10 CE Q7 Q6 Q5 Q4 Q3

PLCC

A12

A6 A5 A4 A3

A2 A1

A0 NC Q0

MX27C512

14 17 20

A15NCVCC

A14

A13

• Operating current: 30mA

• Standby current: 100uA

• Package type:

- 28 pin plastic DIP

- 32 pin PLCC

- 28 pin 8 x 13.4 mm TSOP(I)

programmers may be used. The MX27C512 supports intelligent fast programming algorithm which can result in programming time of less than fifteen seconds.

This EPROM is packaged in industry standard 28 pin dual-in-line packages 32 lead PLCC, and 28 lead TSOP(I) packages.

BLOCK DIAGRAM

A8 A9 A11 NC OE/VPP A10 CE Q7 Q6

8 x 13.4mm 28TSOP(I)

A11

A8 A13 A14

A15 A12

22 23 24 25 26 27 28 1 2 3 4 5 6 7

OE/VPP

VCC

P/N: PM0235

MX27C512

GND

Q3Q4Q5

PIN DESCRIPTION

A10

GND

SYMBOL PIN NAME

A0~A15 Address Input Q0~Q7 Data Input/Output CE Chip Enable Input OE/VPP Output Enable Input/Program Supply

Voltage NC No Internal Connection VCC Power Supply Pin (+5V) GND Ground Pin

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MX27C512

FUNCTIONAL DESCRIPTION

THE PROGRAMMING OF THE MX27C512

When the MX27C512 is delivered, or it is erased, the chip has all 512K bits in the "ONE" or HIGH state. "ZEROs" are loaded into the MX27C512 through the procedure of programming.

For programming, the data to be programmed is applied with 8 bits in parallel to the data pins.

Vcc must be applied simultaneously or before Vpp, and removed simultaneously or after Vpp. When programming an MXIC EPROM, a 0.1uF capacitor is required across Vpp and ground to suppress spurious voltage transients which may damage the device.

FAST PROGRAMMING

The device is set up in the fast programming mode when the programming voltage OE/VPP = 12.75V is applied, with VCC = 6.25 V, (Algorithm is shown in Figure 1). The programming is achieved by applying a single TTL low level 100us pulse to the CE input after addresses and data line are stable. If the data is not verified, an additional pulse is applied for a maximum of 25 pulses. This process is repeated while sequencing through each address of the device. When the programming mode is completed, the data in all address is verified at VCC = 5V ± 10%.

PROGRAM INHIBIT MODE

Programming of multiple MX27C512s in parallel with different data is also easily accomplished by using the Program Inhibit Mode. Except for CE and OE, all like inputs of the parallel MX27C512 may be common. A TTL low-level program pulse applied to an MX27C512 CE input with OE/VPP = 12.5 ± 0.5V will program that MX27C512. A high-level CE input inhibits the other MX27C512s from being programmed.

PROGRAM VERIFY MODE

Verification should be performed on the programmed bits to determine that they were correctly programmed. The verification should be performed with OE/VPP and CE, at VIL. Data should be verified tDV after the falling edge of CE.

AUTO IDENTIFY MODE

The auto identify mode allows the reading out of a binary code from an EPROM that will identify its manufacturer and device type. This mode is intended for use by programming equipment for the purpose of automatically matching the device to be programmed with its corresponding programming algorithm. This mode is functional in the 25°C ± 5°C ambient temperature range that is required when programming the MX27C512.

To activate this mode, the programming equipment must force 12.0 ± 0.5(VH) on address line A9 of the device. Two identifier bytes may then be sequenced from the device outputs by toggling address line A0 from VIL to VIH. All other address lines must be held at VIL during auto identify mode.

Byte 0 ( A0 = VIL) represents the manufacturer code, and byte 1 (A0 = VIH), the device identifier code. For the MX27C512, these two identifier bytes are given in the Mode Select Table. All identifiers for manufacturer and device codes will possess odd parity, with the MSB (Q7) defined as the parity bit.

READ MODE

The MX27C512 has two control functions, both of which must be logically satisfied in order to obtain data at the outputs. Chip Enable (CE) is the power control and should be used for device selection. Output Enable (OE) is the output control and should be used to gate data to the output pins, independent of device selection. Assuming that addresses are stable, address access time (tACC) is equal to the delay from CE to output (tCE). Data is available at the outputs tOE after the falling edge of OE, assuming that CE has been LOW and addresses have been stable for at least tACC - tOE.

STANDBY MODE

The MX27C512 has a CMOS standby mode which reduces the maximum VCC current to 100uA . It is placed in CMOS standby when CE is at VCC ± 0.3 V. The MX27C512 also has a TTL-standby mode which reduces the maximum VCC current to 1.5 mA. It is placed in TTL-standby when CE is at VIH. When in standby mode, the outputs are in a high-impedance state, independent of the OE input.

P/N:PM0235

REV. 4.5, NOV. 09, 2001

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MX27C512

TWO-LINE OUTPUT CONTROL FUNCTION

To accommodate multiple memory connections, a twoline control function is provided to allow for:

SYSTEM CONSIDERATIONS

During the switch between active and standby conditions, transient current peaks are produced on the rising and falling edges of Chip Enable. The magnitude

1. Low memory power dissipation,

2. Assurance that output bus contention will not occur.

of these transient current peaks is dependent on the output capacitance loading of the device. At a minimum, a 0.1 uF ceramic capacitor (high frequency, low inherent inductance) should be used on each device between

It is recommended that CE be decoded and used as the primary device-selecting function, while OE be made a common connection to all devices in the array and connected to the READ line from the system control bus. This assures that all deselected memory devices are in their low-power standby mode and that the output pins are only active when data is desired from a particular

VCC and GND to minimize transient effects. In addition, to overcome the voltage drop caused by the inductive effects of the printed circuit board traces on EPROM arrays, a 4.7 uF bulk electrolytic capacitor should be used between VCC and GND for each eight devices. The location of the capacitor should be close to where the power supply is connected to the array.

memory device.

MODE SELECT TABLE

PINS

MODE CE OE/VPP A0 A9 OUTPUTS

Read VIL VIL X X DOUT Output Disable VIL VIH X X High Z Standby (TTL) VIH X X X High Z Standby (CMOS) VCC±0.3V X X X High Z Program VIL VPP X X DIN Program Verify VIL VIL X X DOUT Program Inhibit VIH VPP X X High Z Manufacturer Code(3) VIL VIL VIL VH C2H Device Code(3) VIL VIL V IH VH 91H

NOTES: 1. VH = 12.0 V ± 0.5 V

2. X = Either VIH or VIL

P/N:PM0235

3. A1 - A8 = A10 - A15 = VIL(For auto select)

4. See DC Programming Characteristics for VPP voltage during programming.

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Figure1. FAST PROGRAMMING FLOW CHART

ADDRESS = FIRST LOCATION

OE/VPP = 12.75V

PROGRAM ONE 100us PULSE

MX27C512

START

VCC = 6.25V

INCREMENT ADDRESS

LAST

ADDRESS ?

YES

PASS

ADDRESS = FIRST LOCATION

PROGRAM ONE 100us PULSE

LAST

ADDRESS ?

X = 0

VERIFY BYTE

VCC = 5.25V

OE/VPP = VIL

COMPARE

ALL BYTES

TO ORIGINAL

DATA

DEVICE PASSED

YES

PASS

FAIL

INCREMENT X

X = 25 ?

YES

DEVICE FAILED

P/N:PM0235

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SWITCHING TEST CIRCUITS

MX27C512

DEVICE UNDER

TEST

CL = 100 pF including jig capacitance (30pF for 45/55/70 ns parts)

SWITCHING TEST WAVEFORMS

AC driving levels

AC TESTING: AC driving levels are 2.4V/0.4V for commercial grade, 3.0V/0V for industrial grade.

Input pulse rise and fall times are < 10ns.

INPUT

2.0V

0.8V

6.2K ohm

TEST POINTS

1.8K ohm +5V

DIODES = IN3064 OR EQUIVALENT

2.0V

0.8V OUTPUT

P/N:PM0235

AC driving levels

1.5V

INPUT

AC TESTING: (1) AC driving levels are 3.0V/0V for both commercial grade and industrial grade.

Input pulse rise and fall times are < 10ns. (2) For MX27C1000-45, MX27C1000/1001-55, MX27C1000/1001-70.

TEST POINTS

OUTPUT

1.5V

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MX27C512

ABSOLUTE MAXIMUM RATINGS

RATING VALUE

Ambient Operating Temperature -40oC to 125oC Storage Temperature -65oC to 125oC Applied Input Voltage -0.5V to 7.0V Applied Output Voltage -0.5V to VCC + 0.5V VCC to Ground Potential -0.5V to 7.0V A9 & Vpp -0.5V to 13.5V

NOTICE:

Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended period may affect reliability.

NOTICE:

Specifications contained within the following tables are subject to change.

DC/AC Operating Conditions for Read Operation

MX27C512

-45 -55 -70 -90 -10 -12 -15

Operating Commercial 0 °C to 55°C0°C to 70°C0°C to 70°C0°C to 70°C0°C to 70°C0°C to 70°C0°C to 70°C Temperature Industrial -40°C to 85°C -40°C to 85°C -40°C to 85°C -40°C to 85°C -40°C to 85°C -40°C to 85°C -40°C to 85°C

Automotive -40°C to 125°C -40°C to 125°C -40°C to 125°C -40°C to 125°C

Vcc Power Supply 5V ± 5% 5V ± 10% 5V ± 10% 5V ± 10% 5V ± 10% 5V ± 10% 5V ± 10%

DC CHARACTERISTICS

SYMBOL PARAMETER MIN. MAX. UNIT CONDITIONS

VOH Output High Voltage 2.4 V IOH = -0.4mA VOL Output Low Voltage 0.4 V IOL = 2.1mA VIH Input High Voltage 2.0 VCC + 0.5 V VIL Input Low Voltage -0.2 0.8 V ILI Input Leakage Current -10 10 uA VIN = 0 to 5.5V ILO Output Leakage Current -10 10 uA VOUT = 0 to 5.5V ICC3 VCC Power-Down Current 100 uA CE = VCC ± 0.3V ICC2 VCC Standby Current 1.5 mA CE = VIH ICC1 VCC Active Current 30 mA CE = VIL, f=5MHz, Iout =0mA IPP VPP Supply Current Read 10 uA CE = VIL, VPP = 5.5V

CAPACITANCE TA = 25

SYMBOL PARAMETER MIN. MAX. UNIT CONDITIONS

CIN Input Capacitance 8 12 pF VIN = 0V COUT Output Capacitance 8 12 pF VOUT = 0V Vpp VPP Capacitance 18 25 pF VPP = 0V

C, f = 1.0 MHz (Sampled only)

P/N:PM0235

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MX27C512

AC CHARACTERISTICS

27C512-45 27C512-55 27C512-70 27C512-90

SYMBOL PARAMETER MIN. MAX. MIN. MAX. MIN. MAX. MIN. MAX. UNIT CONDITIONS

tACC Address to Output Delay 45 55 70 90 ns CE = OE = VIL tCE Chip Enable to Output Delay 45 55 70 90 ns OE = VIL tOE Output Enable to Output 25 30 35 40 ns CE = VIL

Delay

tDF OE High to Output Float, 0 17 0 20 0 20 0 25 ns

or CE High to Output Float

tOH Output Hold from Address, 0000 ns

CE or OE which ever occurred first

27C512-10 27C512-12 27C512-15

SYMBOL PARAMETER MIN. MAX. MIN. MAX. MIN. MAX. UNIT CONDITIONS

tACC Address to Output Delay 100 120 150 ns CE = OE = VIL tCE Chip Enable to Output Delay 100 120 150 ns OE = VIL tOE Output Enable to Output 45 50 65 ns CE = VIL

Delay

tDF OE High to Output Float, 0 30 0 35 0 50 ns

or CE High to Output Float

tOH Output Hold from Address, 0 0 0 n s

CE or OE which ever occurred first

DC PROGRAMMING CHARACTERISTICS TA = 25

SYMBOL PARAMETER MIN. MAX. UNIT CONDITIONS

VOH Output High Voltage 2.4 V IOH = -0.40mA VOL Output Low Voltage 0.4 V IOL = 2.1mA VIH Input High Voltage 2.0 VCC + 0.5 V VIL Input Low Voltage -0.2 0.8 V ILI Input Leakage Current -10 10 u A VIN = 0 to 5.5V VH A9 Auto Select Voltage 11.5 12.5 V ICC3 VCC Supply Current(Program & Verify) 40 mA IPP2 VPP Supply Current(Program) 30 mA CE = VIL VCC1 Fast Programming Supply Voltage 6.00 6.50 V VPP1 Fast Programming Voltage 12.5 13.0 V

P/N:PM0235

C ± 5°C

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MX27C512

AC PROGRAMMING CHARACTERISTICS TA = 25

SYMBOL PARAMETER MIN. MAX. UNIT CONDITIONS

tAS Address Setup Time 2 us tDS Data Setup Time 2 us tAH Address Hold Time 0 us tDH Data Hold Time 2 us tDFP Chip Enable to Output Float Delay 0 130 ns tVPS VPP Setup Time 2 us tPW CE Program Pulse Width 95 105 us tVCS Vcc Setup Time 2 us tDV Data Valid from CE 150 ns tOEH OE/VPP Hold Time 2 ns tVR OE/VPP Recovery Time 2 ns

C ± 5°C

P/N:PM0235

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WAVEFORMS

READ CYCLE

MX27C512

ADDRESS

INPUTS

tACC

tCE

DATA

OUT

tOE

FAST PROGRAMMING ALGORITHM WAVEFORM

PROGRAM

Addresses

VIH

VIL

DATA ADDRESS

tDF

VALID DATA

tOH

PROGRAM VERIFY

DATA

OE/VPP

VCC

VPP1

VIL

VIH

VIL

VCC1

VCC

tAS

tDS

tVPS

tVCS

tPW

tDH

tVPS

tVR

Hi-z

tDV

DATA OUT VALID

tDFP

tAH

P/N:PM0235

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MX27C512

ORDERING INFORMATION

PLASTIC PACKAGE

PART NO. ACCESS TIME OPERATING STANDBY OPERATING PACKAGE

(ns) CURRENT MAX.(mA) CURRENT MAX.(uA) TEMPERATURE

MX27C512PC-45 45 30 100 0°C to 70°C 28 Pin DIP MX27C512QC-45 45 30 100 0°C to 70°C 32 Pin PLCC MX27C512TC-45 45 30 100 0°C to 70°C 28 PinTSOP(I) MX27C512PC-55 55 30 100 0°C to 70°C 28 Pin DIP MX27C512QC-55 55 30 100 0°C to 70°C 32 Pin PLCC MX27C512TC-55 55 30 100 0°C to 70°C 28 Pin TSOP(I) MX27C512PC-70 70 30 100 0°C to 70°C 28 Pin DIP MX27C512QC-70 70 30 100 0°C to 70°C 32 Pin PLCC MX27C512TC-70 70 30 100 0°C to 70°C 28 Pin TSOP(I) MX27C512PC-90 90 30 100 0°C to 70°C 28 Pin DIP MX27C512QC-90 90 30 100 0°C to 70°C 32 Pin PLCC MX27C512TC-90 90 30 100 0°C to 70°C 28 Pin TSOP(I) MX27C512PC-12 120 30 100 0°C to 70°C 28 Pin DIP MX27C512QC-12 120 30 100 0°C to 70°C 32 Pin PLCC MX27C512TC-12 120 30 100 0°C to 70°C 28 Pin TSOP(I) MX27C512PC-15 150 30 100 0°C to 70°C 28 Pin DIP MX27C512QC-15 150 30 100 0°C to 70°C 32 Pin PLCC MX27C512TC-15 150 30 100 0°C to 70°C 28 Pin TSOP(I) MX27C512PI-45 45 30 100 -40°C to 85°C 28 Pin DIP MX27C512QI-45 45 30 100 -40°C to 85°C 32 Pin PLCC MX27C512TI-45 45 30 100 -40°C to 85°C 28 PinTSOP(I) MX27C512PI-55 55 30 100 -40°C to 85°C 28 Pin DIP MX27C512QI-55 55 30 100 -40°C to 85°C 32 Pin PLCC MX27C512TI-55 55 30 100 -40°C to 85°C 28 Pin TSOP(I) MX27C512PI-70 70 30 100 -40°C to 85°C 28 Pin DIP MX27C512QI-70 70 30 100 -40°C to 85°C 32 Pin PLCC MX27C512TI-70 70 30 100 -40°C to 85°C 28 Pin TSOP(I) MX27C512PI-90 90 30 100 -40°C to 85°C 28 Pin DIP MX27C512QI-90 90 30 100 -40°C to 85°C 32 Pin PLCC MX27C512TI-90 90 30 100 -40°C to 85°C 28 Pin TSOP(I) MX27C512PI-12 120 30 100 -40°C to 85°C 28 Pin DIP MX27C512QI-12 120 30 100 -40°C to 85°C 32 Pin PLCC MX27C512TI-12 120 30 100 -40°C to 85°C 28 Pin TSOP(I) MX27C512PI-15 150 30 100 -40°C to 85°C 28 Pin DIP MX27C512QI-15 150 30 100 -40°C to 85°C 32 Pin PLCC MX27C512TI-15 150 30 100 -40°C to 85°C 28 Pin TSOP(I) MX27C512TA-90 90 30 100 -40°C to 125°C 28 Pin TSOP(I) MX27C512TA-120 120 30 100 -40°C to 125°C 28 Pin TSOP(I)

P/N:PM0235

REV. 4.5, NOV. 09, 2001

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PACKAGE INFORMATION

28-PIN PLASTIC DIP (600 mil)

MX27C512

P/N:PM0235

REV. 4.5, NOV. 09, 2001

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32-PIN PLASTIC LEADED CHIP CARRIER (PLCC)

MX27C512

P/N:PM0235

REV. 4.5, NOV. 09, 2001

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8 x 13.4mm 28-PIN PLASTIC TSOP

MX27C512

P/N:PM0235

REV. 4.5, NOV. 09, 2001

Page 14

MX27C512

REVISION HISTORY

Revision # Description Page Date

3.3 Programming Flow Chart corrected, programming verify after whole array programmed with 1 pulse.

4.0 1) Reduce operating current change from 40mA to 30mA.

2) Add 28-TSOP(I) and 28-SOP packages offering.

3) Eliminate Interactive Programming Mode.

4.1 IPP 100uA --> 10uA 08/07/1997

4.2 CDIP 70/90/100/120/150ns speed grades deleted from ordering 05/07/1998 information.

4.3 Cancel ceramic DIP package type P1,2,10,12 MAR/02/2000

4.4 Remove 28-pin SOP Package P1,10 SEP/19/2001 Package Information format changed P11~13

4.5 Add automotive grade P6,10 NOV/09/2001

P/N:PM0235

REV. 4.5, NOV. 09, 2001

Page 15

MX27C512

MACRONIX INTERNATIONAL CO., LTD.

HEADQUARTERS:

TEL:+886-3-578-6688 FAX:+886-3-563-2888

EUROPE OFFICE:

TEL:+32-2-456-8020 FAX:+32-2-456-8021

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TEL:+81-44-246-9100 FAX:+81-44-246-9105

SINGAPORE OFFICE:

TEL:+65-348-8385 FAX:+65-348-8096

TAIPEI OFFICE:

TEL:+886-2-2509-3300 FAX:+886-2-2509-2200

MACRONIX AMERICA, INC.

TEL:+1-408-453-8088 FAX:+1-408-453-8488

CHICAGO OFFICE:

TEL:+1-847-963-1900 FAX:+1-847-963-1909

http : //www.macronix.com

MACRONIX INTERNATIONAL CO., LTD. reserves the right to change product and specifications without notice.

Page 16

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