Datasheet MX27C4000MI-12, MX27C4000MI-15, MX27C4000PC-10, MX27C4000PC-12, MX27C4000PC-15 Datasheet (MXIC)

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programmers may be used. The MX27C4000 supports a intelligent fast programming algorithm which can result in programming time of less than two minutes.
This EPROM is packaged in industry standard 32 pin dual-in-line packages, 32 lead PLCC, 32 lead SOP, and 32 lead TSOP packages.
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REV. 3.4, AUG. 20, 2001
PIN CONFIGURATIONS
32 PDIP/SOP
32 PLCC
PIN DESCRIPTION
FEATURES
512K x 8 organization
Single +5V power supply
+12.5V programming voltage
Fast access time: 90/100/120/150 ns
Totally static operation
Completely TTL compatible
Operating current: 40mA
Standby current: 100uA
Package type:
- 32 pin plastic DIP
- 32 pin PLCC/SOP
- 32 pin TSOP
GENERAL DESCRIPTION
The MX27C4000 is a 5V only, 4M-bit, One Time Programmable Read Only Memory. It is organized as 512K words by 8 bits per word, operates from a single +5 volt supply, has a static standby mode, and features fast single address location programming. All program­ming signals are TTL levels, requiring a single pulse. For programming outside from the system, existing EPROM
BLOCK DIAGRAM
32 TSOP
SYMBOL PIN NAME
A0~A18 Address Input Q0~Q7 Data Input/Output CE Chip Enable Input OE Output Enable Input VPP Program Supply Voltage VCC Power Supply Pin (+5V) GND Ground Pin
MX27C4000
4M-BIT [512K x8] CMOS EPROM
CONTROL
LOGIC
OUTPUT
BUFFERS
Q0~Q7
CE
OE
A0~A18
ADDRESS
INPUTS
Y-DECODER
X-DECODER
Y-SELECT
4M BIT
CELL
MAXTRIX
VCC VSS
. . . . . . . .
. . . . . . . .
MX27C4000
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
VPP
A16 A15 A12
A7 A6 A5 A4 A3 A2 A1
A0 Q0 Q1 Q2
GND
32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17
VCC A18 A17 A14 A13 A8 A9 A11 OE A10 CE Q7 Q6 Q5 Q4 Q3
1
4
5
9
13
14 17 20
21
25
29
32
30
A14 A13 A8 A9 A11 OE A10 CE Q7
A7 A6 A5 A4 A3 A2 A1 A0 Q0
Q1
Q2
GND
Q3Q4Q5
Q6
A12
A15
A16
VPP
VCC
A18
A17
MX27C4000
A11
A9
A8 A13 A14 A17 A18
VCC VPP
A16 A15 A12
A7
A6
A5
A4
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
OE A10 CE Q7 Q6 Q5 Q4 Q3 GND Q2 Q1 Q0 A0 A1 A2 A3
32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17
MX27C4000
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MX27C4000
REV. 3.4, AUG. 20, 2001
FUNCTIONAL DESCRIPTION
THE PROGRAMMING OF THE MX27C4000
When the MX27C4000 is delivered, or it is erased, the chip has all 4M bits in the "ONE" or HIGH state. "ZEROs" are loaded into the MX27C4000 through the procedure of programming.
For programming, the data to be programmed is applied with 8 bits in parallel to the data pins.
Vcc must be applied simultaneously or before Vpp, and removed simultaneously or after Vpp. When programming an MXIC EPROM, a 01uF capacitor is required across Vpp and ground to suppress spurious voltage transients which may damage the device.
FAST PROGRAMMING
The device is set up in the fast programming mode when the programming voltage VPP = 12.75V is applied, with VCC = 6.25 V and OE = VIH (Algorithm is shown in Figure 1). The programming is achieved by applying a single TTL low level 100us pulse to the CE input after addresses and data line are stable. If the data is not verified, an additional pulse is applied for a maximum of 25 pulses. This process is repeated while sequencing through each address of the device. When the programming mode is completed, the data in all address is verified at VCC = VPP = 5V ± 10%.
PROGRAM INHIBIT MODE
Programming of multiple MX27C4000s in parallel with different data is also easily accomplished by using the Program Inhibit Mode. Except for CE and OE, all like inputs of the parallel MX27C4000 may be common. A TTL low-level program pulse applied to an MX27C4000 CE input with VPP = 12.5 ± 0.5 V and CE LOW will program that MX27C4000. A high-level CE input inhibits the other MX27C4000s from being programmed.
PROGRAM VERIFY MODE
Verification should be performed on the programmed bits to determine that they were correctly programmed. The verification should be performed with OE and CEat VIL, and VPP at its programming voltage.
AUTO IDENTIFY MODE
The auto identify mode allows the reading out of a binary code from an EPROM that will identify its manufacturer and device type. This mode is intended for use by programming equipment for the purpose of automatically matching the device to be programmed with its corresponding programming algorithm. This mode is functional in the 25°C ± 5°C ambient temperature range that is required when programming the MX27C4000.
To activate this mode, the programming equipment must force 12.0 ± 0.5 V on address line A9 of the device. Two identifier bytes may then be sequenced from the device outputs by toggling address line A0 from VIL to VIH. All other address lines must be held at VIL during auto identify mode.
Byte 0 ( A0 = VIL) represents the manufacturer code, and byte 1 (A0 = VIH), the device identifier code. For the MX27C4000, these two identifier bytes are given in the Mode Select Table. All identifiers for manufacturer and device codes will possess odd parity, with the MSB (Q7) defined as the parity bit.
READ MODE
The MX27C4000 has two control functions, both of which must be logically satisfied in order to obtain data at the outputs. Chip Enable (CE) is the power control and should be used for device selection. Output Enable (OE) is the output control and should be used to gate data to the output pins, independent of device selection. Assuming that addresses are stable, address access time (tACC) is equal to the delay from CE to output (tCE). Data is available at the outputs tOE after the falling edge of OE's, assuming that CE has been LOW and addresses have been stable for at least tACC - tOE.
STANDBY MODE
The MX27C4000 has a CMOS standby mode which reduces the maximum VCC current to 100 uA. It is placed in CMOS standby when CE is at VCC ± 0.3 V. The MX27C4000 also has a TTL-standby mode which reduces the maximum VCC current to 1.5 mA. It is placed in TTL-standby when CE is at VIH. When in standby mode, the outputs are in a high-impedance state, independent of the OE input.
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MX27C4000
REV. 3.4, AUG. 20, 2001
NOTES: 1. VH = 12.0 V ± 0.5 V
2. X = Either VIH or VIL
3. A1 - A8 = A10 - A18 = VIL(For auto select)
4. See DC Programming Characteristics for VPP voltage during programming.
MODE SELECT TABLE
PINS
MODE CE OE A0 A9 VPP OUTPUTS
Read VIL VIL X X VCC DOUT Output Disable VIL VIH X X VCC High Z Standby (TTL) VI H X X X VCC High Z Standby (CMOS) VCC±0.3V X X X VCC High Z Program VIL VIH X X VPP DIN Program Verify VI H VIL X X VP P DOUT Program Inhibit VIH VIH X X VPP High Z Manufacturer Code(3) VIL VIL VIL V H VCC C2H Device Code(3) V IL VIL VIH VH VCC 40H
TWO-LINE OUTPUT CONTROL FUNCTION
To accommodate multiple memory connections, a two­line control function is provided to allow for:
1. Low memory power dissipation,
2. Assurance that output bus contention will not
occur. It is recommended that CE be decoded and used as the primary device-selecting function, while OE be made a common connection to all devices in the array and connected to the READ line from the system control bus. This assures that all deselected memory devices are in their low-power standby mode and that the output pins are only active when data is desired from a particular memory device.
SYSTEM CONSIDERATIONS
During the switch between active and standby conditions, transient current peaks are produced on the rising and falling edges of Chip Enable. The magnitude of these transient current peaks is dependent on the output capacitance loading of the device. At a minimum, a 0.1 uF ceramic capacitor (high frequency, low inherent inductance) should be used on each device between VCC and GND to minimize transient effects. In addition, to overcome the voltage drop caused by the inductive effects of the printed circuit board traces on EPROM arrays, a 4.7 uF bulk electrolytic capacitor should be used between VCC and GND for each eight devices. The location of the capacitor should be close to where the power supply is connected to the array.
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MX27C4000
REV. 3.4, AUG. 20, 2001
START
ADDRESS = FIRST LOCATION
VCC = 6.25V VPP = 12.75V
X = 0
PROGRAM ONE 100us PULSE
INCREMENT X
X = 25?
VERIFY BYTE
LAST ADDRESS
VCC = VPP = 5.25V
DEVICE PASSED
VERIFY ALL BYTES
?
DEVICE FAILED
INCREMENT ADDRESS
INTERACTIVE SECTION
VERIFY SECTION
FAIL
PASS
YES
PASS
NO
YES
NO
FAIL
FIGURE 1. FAST PROGRAMMING FLOW CHART
FAIL
?
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MX27C4000
REV. 3.4, AUG. 20, 2001
SWITCHING TEST CIRCUITS
SWITCHING TEST WAVEFORMS
DEVICE UNDER
TEST
DIODES = IN3064 OR EQUIVALENT
CL = 100 pF including jig capacitance
6.2K ohm
1.8K ohm +5V
CL
2.0V
0.8V
TEST POINTS
INPUT
2.0V
0.8V OUTPUT
AC TESTING: (1) AC driving levels are 2.4V/0.4V for commercial grade for MX27C4000-10/12/15.
(2) AC driving levels are 3.0V/0V for industrial grade of all speeds and commercial grade MX27C4000-90. (3) Input pulse rise and fall times are < 10ns.
AC driving levels
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MX27C4000
REV. 3.4, AUG. 20, 2001
NOTICE:
Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended period may affect reliability.
NOTICE:
Specifications contained within the following tables are subject to change.
ABSOLUTE MAXIMUM RATINGS
RATING VALUE
Ambient Operating Temperature -40°C to 85°C Storage Temperature -65°C to 125°C Applied Input Voltage -0.5V to 7.0V Applied Output Voltage -0.5V to VCC + 0.5V VCC to Ground Potential -0.5V to 7.0V V9 & VPP -0.5V to 13.5V
DC/AC Operating Conditions for Read Operation
MX27C4000
-90 -10 -12 -15 Operating Commercial 0°C to 70°C0°C to 70°C0°C to 70°C0°C to 70°C Temperature Industrial -40°C to 85°C -40°C to 85°C Vcc Power Supply 5V ± 10% 5V ± 10% 5V ± 10% 5V ± 10%
CAPACITANCE
SYMBOL PARAMETER TYP. MAX. UNIT CONDITIONS
CIN Input Capacitance 8 12 pF VIN = 0V COUT Output Capacitance 8 12 pF VOUT = 0V CVPP VPP Capacitance 18 25 pF VPP = 0V
DC CHARACTERISTICS
SYMBOL PARAMETER MIN. MAX. UNIT CONDITIONS
VOH Output High Voltage 2.4 V IOH = -0.4mA VOL Output Low Voltage 0.4 V IOL = 2.1mA VIH Input High Voltage 2.0 VCC + 0.5 V VIL Input Low Voltage -0.3 0.8 V ILI Input Leakage Current -10 10 uA VIN = 0 to 5.5V ILO Output Leakage Current -10 10 uA VOUT = 0 to 5.5V ICC3 VCC Power-Down Current 100 uA CE = VCC ± 0.3V ICC2 VCC Standby Current 1.5 mA CE = VIH ICC1 VCC Active Current 40 mA CE = VIL, f=5MHz, Iout = 0mA IPP VPP Supply Current Read 10 uA CE = OE = VIL, VPP = 5.5V
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MX27C4000
REV. 3.4, AUG. 20, 2001
AC CHARACTERISTICS
27C4000-90 27C4000-10 27C4000-12 27C4000-15
SYMBOL PARAMETER MIN. MAX. MIN. MAX. MIN. MAX. MIN. MAX. UNIT CONDITIONS
tACC Address to Output Delay 90 100 120 150 ns CE = OE = VIL tCE Chip Enable to Output Delay 90 100 120 150 ns OE = VIL tOE Output Enable to Output Delay 40 45 50 65 ns CE = VIL tDF OE High to Output Float, 0 25 0 30 0 35 0 50 n s
or CE High to Output Float
tOH Output Hold from Address, 0 0 0 0 ns
CE or OE which ever occurred first
AC PROGRAMMING CHARACTERISTICS TA = 25°C± 5°C
SYMBOL PARAMETER MIN. MAX. UNIT CONDITIONS
tAS Address Setup Time 2.0 us tOES OE Setup Time 2.0 us tDS Data Setup Time 2.0 us tAH Address Hold Time 0 us tDH Data Hold Time 2.0 us tDFP Out put Enable to Output Float Delay 0 130 ns tVPS VPP Setup Time 2.0 us tPW PGM Program Pulse Width 95 105 us tVCS VCC Setup Time 2.0 us tOE Data valid from OE 150 ns
DC PROGRAMMING CHARACTERISTICS TA = 25°C± 5°C
SYMBOL PARAMETER MIN. MAX. UNIT CONDITIONS
VOH Output High Voltage 2.4 V IOH = -0.40mA VOL Output Low Voltage 0.4 V IOL = 2.1mA VIH Input High Voltage 2.0 VCC + 0.5 V VIL Input Low Voltage -0.3 0.8 V ILI Input Leakage Current -10 10 uA VIN = 0 to 5.5V VH A9 Auto Select Voltage 11.5 12.5 V ICC3 VCC Supply Current (Program & Verify) 50 mA IPP2 VPP Supply Current(Program) 30 mA CE = VIL, OE = VIH VCC1 Fast Programming Supply Voltage 6.00 6.50 V VPP1 Fast Programming Voltage 12.5 13.0 V
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MX27C4000
REV. 3.4, AUG. 20, 2001
WAVEFORMS
READ CYCLE
FAST PROGRAMMING ALGORITHM WAVEFORM
ADDRESS
INPUTS
DATA
OUT
OE
CE
DATA ADDRESS
VALID DATA
tDF
tACC
tCE
tOE
tOH
Addresses
CE
OE
DATA
VPP
VCC
VIH
VIL
VPP1
VCC
VCC1
VCC
VIH
VIL
VIH
VIL
DATA OUT VALID
Hi-z
DATA IN STABLE
tAS
tVPS
tVCS
tOE Max
tPW
tDS
tDH
tOES
tDFP
tAH
PROGRAM VERIFY
PROGRAM
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MX27C4000
REV. 3.4, AUG. 20, 2001
ORDERING INFORMATION
PLASTIC PACKAGE
PART NO. ACCESS TIME(ns) OPERATING STANDBY OPERATING PACKAGE
CURRENT MAX.(mA) CURRENT MAX.(uA) TEMPERATURE
MX27C4000PC-90 90 40 100 0°C to 70°C 32 Pin DIP MX27C4000QC-90 90 40 100 0°C to 70°C 32 Pin PLCC MX27C4000MC-90 90 40 100 0°C to 70°C 32 Pin SOP MX27C4000PC-10 100 40 100 0°C to 70°C 32 Pin DIP MX27C4000QC-10 100 40 100 0°C to 70°C 32 Pin PLCC MX27C4000MC-10 100 40 100 0°C to 70°C 32 Pin SOP MX27C4000PC-12 120 40 100 0°C to 70°C 32 Pin DIP MX27C4000QC-12 120 40 100 0°C to 70°C 32 Pin PLCC MX27C4000MC-12 120 40 100 0°C to 70°C 32 Pin SOP MX27C4000TC-12 120 40 100 0°C to 70°C 32 PIn TSOP MX27C4000PC-15 150 40 100 0°C to 70°C 32 Pin DIP MX27C4000QC-15 150 40 100 0°C to 70°C 32 Pin PLCC MX27C4000MC-15 150 40 100 0°C to 70°C 32 Pin SOP MX27C4000TC-15 150 40 100 0°C to 70°C 32 Pin TSOP MX27C4000PI-12 120 40 100 -40°C to 85°C 32 Pin DIP MX27C4000QI-12 120 40 100 -40°C to 85°C 32 Pin PLCC MX27C4000MI-12 120 40 100 -40°C to 85°C 32 Pin SOP MX27C4000TI-12 120 40 100 -40°C to 85°C 32 PIn TSOP MX27C4000PI-15 150 40 100 -40°C to 85°C 32 Pin DIP MX27C4000QI-15 150 40 100 -40°C to 85°C 32 Pin PLCC MX27C4000MI-15 150 40 100 -40°C to 85°C 32 Pin SOP MX27C4000TI-15 150 40 100 -40°C to 85°C 32 Pin TSOP
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MX27C4000
REV. 3.4, AUG. 20, 2001
PACKAGE INFORMATION
32-PIN PLASTIC DIP(600 mil)
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MX27C4000
REV. 3.4, AUG. 20, 2001
32-PIN PLASTIC SOP (450 mil)
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MX27C4000
REV. 3.4, AUG. 20, 2001
32-PIN PLASTIC LEADED CHIP CARRIER (PLCC)
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MX27C4000
REV. 3.4, AUG. 20, 2001
32-PIN PLASTIC TSOP
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MX27C4000
REV. 3.4, AUG. 20, 2001
REVISION HISTORY
Revision No. Description Page Date
3.0 1) Eliminate Interactive Programming Mode. 5/29/1997
2) MX27C4000-90 AC driving levels changed from 2.4V/0.4V to 3.0V/0V.
3.1 IPP1 100uA -----> 10uA 7/17/1997
3.2 Change TSOP Orientation. 4/09/1998
3.3 Cancel ceramic DIP package type P1,2,9,10 MAR/01/2000
3.4 Cancel "Ultraviolet Erasable" wording in General Description P1 AUG/20/2001 To modify Package Information P10~13
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MX27C4000
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