Datasheet MX27C1000PC-15, MX27C1000PC-70, MX27C1000PC-55, MX27C1000PC-90, MX27C1000QC-90 Datasheet (MXIC)

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FEATURES

• 128K x 8 organization

• Single +5V power supply

• +12.5V programming voltage

• Fast access time: 45/55/70/90/100/120/150 ns

• Totally static operation

• Completely TTL compatible

• Operating current: 30mA

• Standby current: 100uA

• Package type:

- 32 pin plastic DIP

- 32 pin SOP

- 32 pin PLCC

- 32 pin TSOP

REV. 5.8, NOV. 09, 2001

P/N: PM0234

GENERAL DESCRIPTION

The MX27C1000 is a 5V only, 1M-bit, One Time Programmable Read Only Memory. It is organized as 128K words by 8 bits per word, operates from a single + 5 volt supply, has a static standby mode, and features fast single address location programming. All programming signals are TTL levels, requiring a single pulse. For programming outside from the system, existing EPROM

programmers may be used. The MX27C1000 supports an intelligent fast programming algorithm which can result in programming time of less than thirty seconds.

This EPROM is packaged in industry standard 32 pin dual-in-line packages, 32 lead PLCC , 32 lead SOP , and 32 lead TSOP packages.

PIN CONFIGURATIONS

PDIP/SOP

PLCC

TSOP

MX27C1000

1M-BIT [128K x 8] CMOS EPROM

14 17 20

A14 A13 A8 A9 A11 OE A10 CE Q7

A7 A6 A5 A4 A3 A2 A1 A0 Q0

GND

Q3Q4Q5

A12

A15

A16

VPP

VCC

PGM

MX27C1000

A11

A8 A13 A14

PGM

VCC VPP

A16 A15 A12

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16

OE A10 CE Q7 Q6 Q5 Q4 Q3 GND Q2 Q1 Q0 A0 A1 A2 A3

32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17

MX27C1000

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16

VPP

A16 A15 A12

A7 A6 A5 A4 A3 A2 A1 A0 Q0 Q1 Q2

GND

32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17

VCC PGM NC A14 A13 A8 A9 A11 OE A10 CE Q7 Q6 Q5 Q4 Q3

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PROGRAM INHIBIT MODE

Programming of multiple MX27C1000s in parallel with different data is also easily accomplished by using the Program Inhibit Mode. Except for CE and OE, all like inputs of the parallel MX27C1000 may be common. A TTL low-level program pulse applied to an MX27C1000 CE input with VPP = 12.5 ± 0.5 V and PGM LOW will program that MX27C1000. A high-level CE input inhibits the other MX27C1000s from being programmed.

PROGRAM VERIFY MODE

Verification should be performed on the programmed bits to determine that they were correctly programmed. The verification should be performed with OE and CE at VIL, PGM at VIH, and VPP at its programming voltage.

AUTO IDENTIFY MODE

The auto identify mode allows the reading out of a binary code from an EPROM that will identify its manufacturer and device type. This mode is intended for use by programming equipment for the purpose of automatically matching the device to be programmed with its corresponding programming algorithm. This mode is functional in the 25°C ± 5°C ambient temperature range that is required when programming the MX27C1000.

BLOCK DIAGRAM

PIN DESCRIPTION

FUNCTIONAL DESCRIPTION

THE PROGRAMMING OF THE MX27C1000

When the MX27C1000 is delivered, or it is erased, the chip has all 1M bits in the "ONE" or HIGH state. "ZEROs" are loaded into the MX27C1000 through the procedure of programming.

For programming, the data to be programmed is applied with 8 bits in parallel to the data pins.

Vcc must be applied simultaneously or before Vpp, and removed simultaneously or after Vpp. When programming an MXIC EPROM, a 01.uF capacitor is required across Vpp and ground to suppress spurious voltage transients which may damage the device.

FAST PROGRAMMING

The device is set up in the fast programming mode when the programming voltage VPP = 12.75V is applied, with VCC = 6.25 V and PGM = VIL(or OE = VIH) (Algorithm is shown in Figure 1). The programming is achieved by applying a single TTL low level 100us pulse to the PGM input after addresses and data line are stable. If the data is not verified, an additional pulse is applied for a maximum of 25 pulses. This process is repeated while sequencing through each address of the device. When the programming mode is completed, the data in all address is verified at VCC = VPP = 5V ± 10%.

SYMBOL PIN NAME

A0~A16 Address Input Q0~Q7 Data Input/Output CE Chip Enable Input OE Output Enable Input PGM Programmable Enable Input VPP Program Supply Voltage N C No Internal Connection VC C Power Supply Pin (+5V) GN D Ground Pin

CONTROL

LOGIC

OUTPUT

BUFFERS

Q0~Q17

PGM

A0~A16

ADDRESS

INPUTS

Y -DECODER

X-DECODER

Y -SELECT

1M BIT

CELL

MAXTRIX

VCC GND

VPP

. . . . . . . .

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the primary device-selecting function, while OE be made a common connection to all devices in the array and connected to the READ line from the system control bus. This assures that all deselected memory devices are in their low-power standby mode and that the output pins are only active when data is desired from a particular memory device.

SYSTEM CONSIDERATIONS

During the switch between active and standby conditions, transient current peaks are produced on the rising and falling edges of Chip Enable. The magnitude of these transient current peaks is dependent on the output capacitance loading of the device. At a minimum, a 0.1 uF ceramic capacitor (high frequency, low inherent inductance) should be used on each device between VCC and GND to minimize transient effects. In addition, to overcome the voltage drop caused by the inductive effects of the printed circuit board traces on EPROM arrays, a 4.7 uF bulk electrolytic capacitor should be used between VCC and GND for each eight devices. The location of the capacitor should be close to where the power supply is connected to the array.

To activate this mode, the programming equipment must force 12.0 ± 0.5 V on address line A9 of the device. Two identifier bytes may then be sequenced from the device outputs by toggling address line A0 from VIL to VIH. All other address lines must be held at VIL during auto identify mode.

Byte 0 ( A0 = VIL) represents the manufacturer code, and byte 1 (A0 = VIH), the device identifier code. For the MX27C1000, these two identifier bytes are given in the Mode Select Table. All identifiers for manufacturer and device codes will possess odd parity, with the MSB (DQ7) defined as the parity bit.

READ MODE

The MX27C1000 has two control functions, both of which must be logically satisfied in order to obtain data at the outputs. Chip Enable (CE) is the power control and should be used for device selection. Output Enable (OE) is the output control and should be used to gate data to the output pins, independent of device selection. Assuming that addresses are stable, address access time (tACC) is equal to the delay from CE to output (tCE). Data is available at the outputs tQE after the falling edge of OE, assuming that CE has been LOW and addresses have been stable for at least tACC - tQE.

STANDBY MODE

The MX27C1000 has a CMOS standby mode which reduces the maximum VCC current to 100 uA. It is placed in CMOS standby when CE is at VCC ± 0.3 V. The MX27C1000 also has a TTL-standby mode which reduces the maximum VCC current to 1.5 mA. It is placed in TTL-standby when CE is at VIH. When in standby mode, the outputs are in a high-impedance state, independent of the OE input.

TWO-LINE OUTPUT CONTROL FUNCTION

To accommodate multiple memory connections, a twoline control function is provided to allow for:

1. Low memory power dissipation,

2. Assurance that output bus contention will not occur.

It is recommended that CE be decoded and used as

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REV. 5.8, NOV. 09, 2001

P/N: PM0234

NOTES:

1. VH = 12.0 V ± 0.5 V

2. X = Either VIH or VIL

3. A1 - A8 = A10 - A16 = VIL(For auto select)

4. See DC Programming Characteristics for VPP voltage during programming.

MODE SELECT TABLE

PINS

MODE CE OE PGM A0 A9 VP P OUTPUTS

Read VI L VI L X X X VCC DOUT Output Disable VIL VIH X X X VCC High Z Standby (TTL) VIH X X X X VC C High Z Standby (CMOS) VCC±0.3V X X X X VCC High Z Program VIL VIH VIL X X VPP DIN Program Verify VIL VIL VIH X X VPP DOUT Program Inhibit VIH X X X X VPP High Z Manufacturer Code(3) VIL VIL X VIL VH VCC C2 H Device Code(27C1000)(3) VIL VIL X VIH VH VCC 0EH

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START

ADDRESS = FIRST LOCATION

VCC = 6.25V VPP = 12.75V

X = 0

PROGRAM ONE 100us PULSE

INCREMENT X

X = 25?

VERIFY BYTE

LAST ADDRESS

VCC = VPP = 5.25V

DEVICE PASSED

VERIFY ALL BYTES

DEVICE FAILED

INCREMENT ADDRESS

INTERACTIVE SECTION

VERIFY SECTION

FAIL

PASS

YES

PASS

YES

FAIL

FIGURE 1. FAST PROGRAMMING FLOW CHART

FAIL

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SWITCHING TEST CIRCUITS

SWITCHING TEST WAVEFORMS

2.0V

0.8V

TEST POINTS

INPUT

2.0V

0.8V OUTPUT

AC TESTING: AC driving levels are 2.4V/0.4V for commercial grade, 3.0V/0V for industrial grade.

Input pulse rise and fall times are < 10ns.

AC driving levels

DEVICE UNDER

TEST

DIODES = IN3064 OR EQUIVALENT

CL = 100 pF including jig capacitance(30pF for 45/55/70 ns parts)

6.2K ohm

1.8K ohm +5V

1.5V

TEST POINTS

INPUT

1.5V

OUTPUT

AC TESTING: (1) AC driving levels are 3.0V/0V for both commercial grade and industrial grade.

Input pulse rise and fall times are < 10ns. (2) For MX27C1000-45, MX27C1000-55, MX27C1000-70.

AC driving levels

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REV. 5.8, NOV. 09, 2001

P/N: PM0234

SYMBOL PARAMETER MIN. MAX. UNIT CONDITIONS

VOH Output High Voltage 2.4 V IOH = -0.4mA VOL Output Low Voltage 0.4 V IOL = 2.1mA VIH Input High Voltage 2.0 VCC + 0.5 V VIL Input Low Voltage -0.2 0.8 V ILI Input Leakage Current -10 10 uA VIN = 0 to 5.5V ILO Output Leakage Current -10 10 uA VOUT = 0 to 5.5V ICC3 VCC Power-Down Current 100 uA CE = VCC ± 0.3V ICC2 VCC Standby Current 1.5 mA CE = VIH ICC1 VCC Active Current 30 mA CE = VIL, f=5MHz, Iout = 0mA IPP VPP Supply Current Read 10 uA CE = VIL, VPP = 5.5V

NOTICE:

Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended period may affect reliability.

NOTICE:

Specifications contained within the following tables are subject to change.

DC CHARACTERISTICS

ABSOLUTE MAXIMUM RATINGS

RATING VALUE

Ambient Operating Temperature -40oC to 125oC Storage Temperature -65oC to 125oC Applied Input Voltage -0.5V to 7.0V Applied Output Voltage -0.5V to VCC + 0.5V VCC to Ground Potential -0.5V to 7.0V A9 & Vpp -0.5V to 13.5V

DC/AC Operating Conditions for Read Operation

MX27C1000

-45 -55 -70 -90 -10 -12 -15

Operating Commercial 0°C to 70°C0°C to 70°C0°C to 70°C0°C to 70°C0°C to 70°C0°C to 70°C0°C to 70°C Temperature Industrial -40°C to 85°C -40°C to 85°C -40°C to 85°C -40°C to 85°C -40°C to 85°C-40°C to 85°C

Automotive -40°C to 125°C-40°C to 125°C -40°C to 125°C-40°C to 125°C

Vcc Power Supply 5V ± 5% 5V ± 5% 5V ± 10% 5V ±10% 5V ± 10% 5V ± 10% 5V ± 10%

CAPACITANCE TA = 25

C, f = 1.0 MHz (Sampled only)

SYMBOL PARAMETER MIN. MAX. UNIT CONDITIONS

CIN Input Capacitance 8 12 pF VIN = 0V COUT Output Capacitance 8 12 pF VOUT = 0V Vpp VPP Capacitance 18 25 pF VPP = 0V

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DC PROGRAMMING CHARACTERISTICS TA = 25

C ± 5oC

SYMBOL PARAMETER MIN. MAX. UNIT CONDITIONS

VOH Output High Voltage 2.4 V IOH = -0.40mA VOL Output Low Voltage 0.4 V IOL = 2.1mA VIH Input High Voltage 2.0 VCC + 0.5 V VIL Input Low Voltage -0.3 0.8 V ILI Input Leakage Current -10 10 uA VIN = 0 to 5.5V VH A9 Auto Select Voltage 11.5 12.5 V ICC3 VCC Supply Current (Program & Verify) 5 0 mA IPP2 VPP Supply Current(Program) 30 mA CE = PGM = VIL,

OE = VIH VCC1 Fast Programming Supply Voltage 6.00 6.50 V VPP1 Fast Programming Voltage 12.5 13.0 V

27C1000-90 27C1000-10 27C1000-12 27C1000-15

SYMBOL PARAMETER MIN. MAX. MIN. MAX. MIN. MAX. MIN. MAX. UNIT CONDITIONS

tACC Address to Output Delay 9 0 1 0 0 1 2 0 150 ns CE=OE=VIL tCE Chip Enable to Output Delay 90 10 0 12 0 150 ns OE=VIL tOE Output Enable to Output Delay 40 45 5 0 65 ns CE=VIL tDF OE High to Output Float, 0 25 0 30 0 35 0 50 ns

or CE High to Output Float

tOH Output Hold from Address, 0 0 0 0 n s

CE or OE which ever occurred first

AC CHARACTERISTICS

27C1000-45 27C1000-55 27C1000-70

SYMBOL PARAMETER MIN. MAX. MIN. MAX. MIN. MAX. UNIT CONDITIONS

tACC Address to Output Delay 45 55 70 ns CE = OE = VIL tCE Chip Enable to Output Delay 45 5 5 7 0 n s OE = VIL tOE Output Enable to Output Delay 25 3 0 35 ns CE = VIL tDF OE High to Output Float, 0 17 0 20 0 20 ns

or CE High to Output Float

tOH Output Hold from Address, 0 0 0 ns

CE or OE which ever occurred first

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REV. 5.8, NOV. 09, 2001

P/N: PM0234

AC PROGRAMMING CHARACTERISTICS TA = 25

C ± 5oC

SYMBOL PARAMETER MIN. MAX. UNIT

tAS Address Setup Time 2.0 us tOES OE Setup Time 2.0 us tDS Data Setup Time 2.0 us tAH Address Hold Time 0 us tD H Data Hold Time 2.0 us tDFP Output Enable to Output Float Delay 0 130 ns tVPS VPP Setup Time 2. 0 us tPW PGM Program Pulse Width 9 5 10 5 us tVCS VCC Setup Time 2.0 us tCES CE Setup Time 2.0 us tOE Data valid from OE 15 0 ns

WAVEFORMS READ CYCLE

ADDRESS

INPUTS

DATA

OUT

DATA ADDRESS

VALID DATA

tDF

tACC

tCE

tOE

tOH

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FAST PROGRAMMING ALGORITHM WAVEFORMS

Addresses

PGM

DATA

VPP

VCC

VIH

VIL

VPP1

VCC

VCC1

VCC

VIH

VIL

VIH

VIL

VIH

VIL

DATA OUT VALID

Hi-z

DATA IN STABLE

tAS

tVPS

tVCS

tCES

tOE Max

tPW

tDS

tDH

tOES

tDFP

tAH

PROGRAM VERIFY

PROGRAM

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PLASTIC PACKAGE

PART NO. ACCESS TIME OPERATING STANDBY OPERATING PACKAGE

(ns) Current MAX.(mA) Current MAX.(uA) TEMPERATURE

MX27C1000PC-45 45 30 100 0°C to 70°C 32 PIN DIP MX27C1000MC-45 45 30 100 0°C to 70°C 32 Pin SOP MX27C1000QC-45 45 3 0 100 0°C to 70°C 32 Pin PLCC MX27C1000TC-45 45 3 0 100 0°C to 70°C 32 Pin TSOP MX27C1000PC-55 55 30 100 0°C to 70°C 32 Pin DIP MX27C1000MC-55 55 30 100 0°C to 70°C 32 Pin SOP MX27C1000QC-55 55 3 0 100 0°C to 70°C 32 Pin PLCC MX27C1000TC-55 55 3 0 100 0°C to 70°C 32 Pin TSOP MX27C1000PC-70 70 30 100 0°C to 70°C 32 Pin DIP MX27C1000MC-70 70 30 100 0°C to 70°C 32 Pin SOP MX27C1000QC-70 70 3 0 100 0°C to 70°C 32 Pin PLCC MX27C1000TC-70 70 3 0 100 0°C to 70°C 32 Pin TSOP MX27C1000PC-90 90 30 100 0°C to 70°C 32 Pin DIP MX27C1000MC-90 90 30 100 0°C to 70°C 32 Pin SOP MX27C1000QC-90 90 3 0 100 0°C to 70°C 32 Pin PLCC MX27C1000TC-90 90 3 0 100 0°C to 70°C 32 Pin TSOP MX27C1000PC-10 100 30 100 0°C to 70°C 32 Pin DIP MX27C1000MC-10 100 30 100 0°C to 70°C 32 Pin SOP MX27C1000QC-10 100 30 100 0°C to 70°C 32 Pin PLCC MX27C1000TC-10 100 30 100 0°C to 70°C 32 Pin TSOP MX27C1000PC-12 120 30 100 0°C to 70°C 32 Pin DIP MX27C1000MC-12 120 30 100 0°C to 70°C 32 Pin SOP MX27C1000QC-12 120 30 100 0°C to 70°C 32 Pin PLCC MX27C1000TC-12 120 30 100 0°C to 70°C 32 Pin TSOP MX27C1000PC-15 150 30 100 0°C to 70°C 32 Pin DIP MX27C1000MC-15 150 30 100 0°C to 70°C 32 Pin SOP MX27C1000QC-15 150 30 100 0°C to 70°C 32 Pin PLCC MX27C1000TC-15 150 30 100 0°C to 70°C 32 Pin TSOP

ORDER INFORMATION

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ORDER INFORMATION (CONTINUED) PLASTIC PACKAGE

PART NO. ACCESS TIME OPERATING STANDBY OPERATING PACKAGE

(ns) Current MAX.(mA) Current MAX.(uA) TEMPERATURE

MX27C1000PI-55 55 3 0 100 -40°C to 85°C 32 Pin DIP MX27C1000MI-55 55 3 0 100 -40°C to 85°C 32 Pin SOP MX27C1000QI-55 55 3 0 100 -40°C to 85°C 32 Pin PLCC MX27C1000TI-55 55 3 0 100 -40°C to 85°C 32 Pin TSOP MX27C1000PI-70 70 3 0 100 -40°C to 85°C 32 Pin DIP MX27C1000MI-70 70 3 0 100 -40°C to 85°C 32 Pin SOP MX27C1000QI-70 70 3 0 100 -40°C to 85°C 32 Pin PLCC MX27C1000TI-70 70 3 0 100 -40°C to 85°C 32 Pin TSOP MX27C1000PI-90 90 3 0 100 -40°C to 85°C 32 Pin DIP MX27C1000MI-90 90 3 0 100 -40°C to 85°C 32 Pin SOP MX27C1000QI-90 90 3 0 100 -40°C to 85°C 32 Pin PLCC MX27C1000TI-90 90 3 0 100 -40°C to 85°C 32 Pin TSOP MX27C1000PI-12 120 30 100 -40°C to 85°C 32 Pin DIP MX27C1000MI-12 120 30 100 -40°C to 85°C 32 Pin SOP MX27C1000QI-12 12 0 30 100 -40°C to 85°C 32 Pin PLCC MX27C1000TI-12 120 30 100 -40°C to 85°C 32 Pin TSOP MX27C1000PI-15 150 30 100 -40°C to 85°C 32 Pin SOP MX27C1000MI-12 120 30 100 -40°C to 85°C 32 Pin SOP MX27C1000QI-15 15 0 30 100 -40°C to 85°C 32 Pin PLCC MX27C1000TI-15 150 30 100 -40°C to 85°C 32 Pin TSOP MX27C1000TA-90 90 3 0 100 -40°C to 125°C 32 Pin TSOP MX27C1000TA-12 120 30 100 -40°C to 125°C 32 Pin TSOP

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PACKAGE INFORMATION 32-PIN PLASTIC DIP(600 mil)

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32-PIN PLASTIC SOP (450 mil)

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REV. 5.8, NOV. 09, 2001

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32-PIN PLASTIC LEADED CHIP CARRIER (PLCC)

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32-PIN PLASTIC TSOP

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REVISION HISTORY

Revision No. Description Page Date

5.0 1) Reduce operating current change from 40mA to 30mA. 5/28/1997

2) Eliminate Interactive Programming Mode.

3) Add 27C1001 pin configuration.

5.1 IPP 100uA --> 10uA 8/08/1997

5.2 Change TSOP Orientation 4/09/1998

5.3 27C1000CDIP 70/90/100/120/150ns speed grades deleted from 5/07/1998 ordering information.

5.4 Add 55ns speed grade parts for industrial grade P6,7,13 5/10/1999

5.5 Cancel 32pin ceramic DIP Package P1,2,11,13,14 FEB/25/2000

5.6 Cancel the MX27C1001 Information P1~4,6~8,11,12 JAN/18/2001

5.7 Cancel "Ultraviolet Erasable" wording in General Description P1 AUG/20/2001 To modify Package Information P13~16

5.8 Add automotive grade P7,12 NOV/09/2001

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MX27C1000

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