Datasheet MX27C1000AMC-12, MX27C1000AMC-10, MX27C1000AMI-10, MX27C1000AMC-90, MX27C1000API-90 Datasheet (MXIC)

FEATURES

PRELIMINARY

MX27C1000A

1M-BIT [128K x 8] CMOS EPROM

• 128K x 8 organization

• Single +5V power supply

• +12.5V programming voltage

• Fast access time: 90/100/120/150 ns

• Totally static operation

• Completely TTL compatible

GENERAL DESCRIPTION

The MX27C1000A is a 5V only, 1M-bit, One Time
Programmable Read Only Memory. It is organized as
128K words by 8 bits per word, operates from a single +
5 volt supply, has a static standby mode, and features
fast single address location programming. All program­ming signals are TTL levels, requiring a single pulse. For
programming outside from the system, existing EPROM

PIN CONFIGURATIONS
32 PDIP/SOP

VCC

32

PGM

31

NC

30

A14

29

A13

28

A8

27

A9

26

A11

25

OE

24

A10

23

CE

22

Q7

21

Q6

20

Q5

19

Q4

18

Q3

17

32

OE

31

A10

30

CE

29

Q7

28

Q6

27

Q5

26

Q4

25

Q3

24

GND

23

Q2

22

Q1

21

Q0

20

A0

19

A1

18

A2

17

A3

32 TSOP

A9
A8

NC

A7
A6
A5
A4

1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16

A11

A13
A14

PGM

VCC
VPP

A16
A15
A12

VPP

A16
A15
A12

GND

A7
A6
A5
A4
A3
A2
A1
A0
Q0
Q1
Q2

1
2
3
4
5
6
7
8
9
10

MX27C1000A

11
12
13
14
15
16

MX27C1000A

• Operating current: 30mA

• Standby current: 100uA

• Package type:

- 32 pin plastic DIP

- 32 pin PLCC

- 32 pin SOP

- 32 pin TSOP

programmers may be used. The MX27C1000A supports
an intelligent fast programming algorithm which can
result in programming time of less than thirty seconds.

This One Time Programmable Read Only is packaged in
industry standard 32 pin dual-in-line packages, 32 lead
PLCC, 32 lead SOP and 32 lead TSOP packages.

32 PLCC

A12

A15

A16

VPP

VCC

PGM

NC

4

5

A7
A6
A5
A4

9

A3
A2
A1
A0

13

Q0

14 17 20

Q1

PIN DESCRIPTION

SYMBOL PIN NAME

A0~A16 Address Input
Q0~Q7 Data Input/Output
CE Chip Enable Input
OE Output Enable Input
PGM Programmable Enable Input
VPP Program Supply Voltage
N C No Internal Connection
VC C Power Supply Pin (+5V)
GN D Ground Pin

1

32

MX27C1000A

Q2

Q3Q4Q5

GND

30

A14

29

A13
A8
A9
A11

25

OE
A10
CE
Q7

21

Q6

P/N: PM0733

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REV. 1.1, JUL. 19, 2001

MX27C1000A

BLOCK DIAGRAM

CE

PGM

OE

A0~A16

ADDRESS

INPUTS

VCC
GND

.
.
.
.
.
.
.
.

CONTROL

LOGIC

Y-DECODER

X-DECODER

VPP

OUTPUT

BUFFERS

.

Y-SELECT

.
.
.

1M BIT

.
.
.
.

CELL

MAXTRIX

Q0~Q17

FUNCTIONAL DESCRIPTION
THE PROGRAMMING OF THE MX27C1000A

When the MX27C1000A is delivered, or it is erased,
the chip has all 1M bits in the "ONE" or HIGH state.
"ZEROs" are loaded into the MX27C1000 through the
procedure of programming.

For programming, the data to be programmed is applied
with 8 bits in parallel to the data pins.

Vcc must be applied simultaneously or before Vpp, and
removed simultaneously or after Vpp. When
programming an MXIC OTP ROM, a 01.uF capacitor
is required across Vpp and ground to suppress spurious
voltage transients which may damage the device.

FAST PROGRAMMING

PROGRAM INHIBIT MODE

Programming of multiple MX27C1000As in parallel with
different data is also easily accomplished by using the
Program Inhibit Mode. Except for CE and OE, all like
inputs of the parallel MX27C1000A may be common.
A TTL low-level program pulse applied to an
MX27C1000A CE input with VPP = 12.5 ± 0.5 V and
PGM LOW will program that MX27C1000A. A high-level
CE input inhibits the other MX27C1000As from being
programmed.

PROGRAM VERIFY MODE

Verification should be performed on the programmed bits
to determine that they were correctly programmed. The
verification should be performed with OE and CE at VIL,
PGM at VIH, and VPP at its programming voltage.

AUTO IDENTIFY MODE

The auto identify mode allows the reading out of a binary
code from an EPROM that will identify its manufacturer
and device type. This mode is intended for use by
programming equipment for the purpose of automatically
matching the device to be programmed with its
corresponding programming algorithm. This mode is
functional in the 25°C ± 5°C ambient temperature range
that is required when programming the MX27C1000A.

To activate this mode, the programming equipment must
force 12.0 ± 0.5 V on address line A9 of the device.
Two identifier bytes may then be sequenced from the
device outputs by toggling address line A0 from VIL to
VIH. All other address lines must be held at VIL during
auto identify mode.

The device is set up in the fast programming mode when
the programming voltage VPP = 12.75V is applied, with
VCC = 6.25 V and PGM = VIL(or OE = VIH) (Algorithm
is shown in Figure 1). The programming is achieved
by applying a single TTL low level 10us pulse to the
PGM input after addresses and data line are stable. If
the data is not verified, an additional pulse is applied
for a maximum of 25 pulses. This process is repeated
while sequencing through each address of the device.
When the programming mode is completed, the data in
all address is verified at VCC = VPP = 5V ± 10%.

P/N: PM0733

Byte 0 ( A0 = VIL) represents the manufacturer code,
and byte 1 (A0 = VIH), the device identifier code. For
the MX27C1000A, these two identifier bytes are given
in the Mode Select Table. All identifiers for manufacturer
and device codes will possess odd parity, with the MSB
(DQ7) defined as the parity bit.

READ MODE

The MX27C1000A has two control functions, both of
which must be logically satisfied in order to obtain data
at the outputs. Chip Enable (CE) is the power control
and should be used for device selection. Output Enable

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2

MX27C1000A

(OE) is the output control and should be used to gate
data to the output pins, independent of device selection.
Assuming that addresses are stable, address access
time (tACC) is equal to the delay from CE to output (tCE).
Data is available at the outputs tQE after the falling edge
of OE, assuming that CE has been LOW and addresses
have been stable for at least tACC - tQE.

STANDBY MODE

The MX27C1000A has a CMOS standby mode which
reduces the maximum VCC current to 100 uA. It is
placed in CMOS standby when CE is at VCC ± 0.3 V.
The MX27C1000A also has a TTL-standby mode which
reduces the maximum VCC current to 1.5 mA. It is
placed in TTL-standby when CE is at VIH. When in
standby mode, the outputs are in a high-impedance
state, independent of the OE input.

TWO-LINE OUTPUT CONTROL FUNCTION

To accommodate multiple memory connections, a two­line control function is provided to allow for:

1. Low memory power dissipation,

2. Assurance that output bus contention will not occur.

It is recommended that CE be decoded and used as
the primary device-selecting function, while OE be made
a common connection to all devices in the array and
connected to the READ line from the system control
bus. This assures that all deselected memory devices
are in their low-power standby mode and that the output
pins are only active when data is desired from a particular
memory device.

SYSTEM CONSIDERATIONS

During the switch between active and standby
conditions, transient current peaks are produced on the
rising and falling edges of Chip Enable. The magnitude
of these transient current peaks is dependent on the
output capacitance loading of the device. At a minimum,
a 0.1 uF ceramic capacitor (high frequency, low inherent
inductance) should be used on each device between
VCC and GND to minimize transient effects. In addition,
to overcome the voltage drop caused by the inductive
effects of the printed circuit board traces on EPROM
arrays, a 4.7 uF bulk electrolytic capacitor should be
used between VCC and GND for each eight devices.
The location of the capacitor should be close to where
the power supply is connected to the array.

MODE SELECT TABLE

PINS

MODE CE OE PGM A0 A9 VP P OUTPUTS

Read VI L VI L X X X VCC DOUT
Output Disable VIL VIH X X X VCC High Z
Standby (TTL) VIH X X X X VCC High Z
Standby (CMOS) VCC±0.3V X X X X VCC High Z
Program VIL VIH VIL X X VPP DIN
Program Verify VIL VIL VIH X X VPP DOUT
Program Inhibit VIH X X X X VPP High Z
Manufacturer Code(3) VIL VIL X VIL VH VCC C2H
Device Code(27C1000)(3) VIL VIL X VIH VH VCC CAH

NOTES:

1. VH = 12.0 V ± 0.5 V

2. X = Either VIH or VIL

3. A1 - A8 = A10 - A16 = VIL(For auto select)

4. See DC Programming Characteristics for VPP voltage during programming.

P/N: PM0733

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REV. 1.1, JUL. 19, 2001

FIGURE 1. FAST PROGRAMMING FLOWCHART

MX27C1000A

ST ART

ADDRESS = FIRST LOCATION

VCC = 6.25V
VPP = 12.75V

X = 0

PROGRAM ONE 10us PULSE

INTERACTIVE
SECTION

VERIFY SECTION

INCREMENT ADDRESS

FAIL

NO

INCREMENT X

X = 25?

NO

VERIFY BYTE

?

PASS

LAST ADDRESS

YES

VCC = VPP = 5.25V

VERIFY ALL BYTES

?

PASS

DEVICE PASSED

YES

FAIL

FAIL

DEVICE FAILED

P/N: PM0733

4

REV. 1.1, JUL. 19, 2001

SWITCHING TEST CIRCUITS

MX27C1000A

DEVICE
UNDER

TEST

CL = 100 pF including jig capacitance

SWITCHING TEST WAVEFORMS

AC driving levels

AC TESTING: AC driving levels are 2.4V/0.4V for commercial grade.

Input pulse rise and fall times are equal to or less than 10ns.

INPUT

CL

2.0V

0.8V

6.2K ohm

TEST POINTS

1.8K ohm

DIODES = IN3064
OR EQUIVALENT

2.0V

0.8V
OUTPUT

+5V

P/N: PM0733

5

REV. 1.1, JUL. 19, 2001

MX27C1000A

ABSOLUTE MAXIMUM RATINGS

RATING VALUE

Ambient Operating Temperature -40oC to 85oC
Storage Temperature -65oC to 125oC
Applied Input Voltage -0.5V to 7.0V
Applied Output Voltage -0.5V to VCC + 0.5V
VCC to Ground Potential -0.5V to 7.0V
A9 & Vpp -0.5V to 13.5V

NOTICE:

Stresses greater than those listed under ABSOLUTE
MAXIMUM RATINGS may cause permanent damage to the
device. This is a stress rating only and functional operation
of the device at these or any other conditions above those
indicated in the operational sections of this specification is not
implied. Exposure to absolute maximum rating conditions for
extended period may affect reliability.

NOTICE:

Specifications contained within the following tables are sub­ject to change.

DC/AC Operating Condition for Read Operation

MX27C1000A

-90 -10 -12 -15

Operating Temperature Industrial -40°C to 85°C -40°C to 85°C -40°C to 85°C -40°C to 85°C
Vcc Power Supply 5V ± 10% 5V ± 10% 5V ± 10% 5V ± 10%

DC CHARACTERISTICS

SYMBOL PARAMETER MIN. MAX. UNIT CONDITIONS

VOH Output High Voltage 2.4 V IOH = -0.4mA
VOL Output Low Voltage 0.4 V IOL = 2.1mA
VIH Input High Voltage 2. 0 VCC + 0.5 V
VIL Input Low Voltage -0.2 0.8 V
ILI Input Leakage Current -10 10 uA VIN = 0 to 5.5V
ILO Output Leakage Current -10 10 uA VOUT = 0 to 5.5V
ICC3 VCC Power-Down Current 100 uA CE = VCC ± 0.3V
ICC2 VCC Standby Current 1.5 mA CE = VIH
ICC1 VCC Active Current 30 mA CE = VIL, f=5MHz, Iout = 0mA
IPP VPP Supply Current Read 10 uA CE = VIL, VPP = 5.5V

CAPACITANCE TA = 25

o

C, f = 1.0 MHz (Sampled only)

SYMBOL PARAMETER MIN. MAX. UNIT CONDITIONS

CIN Input Capacitance 8 12 pF VIN = 0V
COUT Output Capacitance 8 12 pF VOUT = 0V
Vpp VPP Capacitance 18 25 pF VPP = 0V

P/N: PM0733

6

REV. 1.1, JUL. 19, 2001

MX27C1000A

AC CHARACTERISTICS

27C1000A-90 27C1000A-10 27C1000A-12 27C1000A-15

Symbol PARAMETER MIN. MAX. MIN. MAX. MIN. MAX. MIN. MAX. Unit Conditions

tACC Address to Output Delay 90 1 0 0 120 150 ns CE=OE=VIL
tCE Chip Enable to Output Delay 90 1 0 0 120 150 ns OE=VIL
tOE Output Enable to Output Delay 4 0 45 5 0 65 n s CE=VIL
tDF OE High to Output Float, 0 25 0 35 0 35 0 50 ns

or CE High to Output Float

tOH Output Hold from Address,CE or 0 0 0 0 ns

OE which ever occurred first

DC PROGRAMMING CHARACTERISTICS TA = 25

o

C ± 5oC

SYMBOL PARAMETER MIN. MAX. UNIT CONDITIONS

VOH Output High Voltage 2.4 V IOH = -0.40mA
VOL Output Low Voltage 0.4 V IOL = 2.1mA
VIH Input High Voltage 2.0 VCC + 0.5 V
VIL Input Low Voltage -0.3 0.8 V
ILI Input Leakage Current -10 10 uA VIN = 0 to 5.5V
VH A9 Auto Select Voltage 11.5 12.5 V
ICC3 VCC Supply Current (Program & Verify) 50 mA
IPP2 VPP Supply Current(Program) 30 mA CE = PGM = VIL,

OE = VIH
VCC1 Fast Programming Supply Voltage 6.00 6.50 V
VPP1 Fast Programming Voltage 12.5 13.0 V

AC PROGRAMMING CHARACTERISTICS TA = 25

o

C ± 5oC

SYMBOL PARAMETER MIN. MAX. UNIT CONDITIONS

tAS Address Setup Time 2.0 us
tOES OE Setup Time 2.0 us
tDS Data Setup Time 2.0 us
tAH Address Hold Time 0 us
tD H Data Hold Time 2.0 us
tDFP Output Enable to Output Float Delay 0 130 ns
tVPS VPP Setup Time 2.0 us
tPW PGM Program Pulse Width 10 50 us
tVCS VCC Setup Time 2.0 us
tCES CE Setup Time 2.0 us
tOE Data valid from OE 15 0 ns

P/N: PM0733

7

REV. 1.1, JUL. 19, 2001

WAVEFORMS
READ CYCLE

MX27C1000A

ADDRESS

INPUTS

tACC

DATA ADDRESS

CE

tCE

OE

DATA

OUT

tOE

FAST PROGRAMMING ALGORITHM WAVEFORMS

PROGRAM

Addresses

VIH

VIL

tAS

VALID DATA

Hi-z

tDF

tOH

PROGRAM VERIFY

tAH

P/N: PM0733

DATA

VPP

VCC

CE

PGM

OE

VPP1

VCC

VCC1

VCC

VIH

VIL

VIH

VIL

VIH

VIL

DATA IN STABLE

tDS

tVPS

tVCS

tCES

tPW

tDH

DATA OUT VALID

tDFP

tOES

tOE
Max

REV. 1.1, JUL. 19, 2001

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MX27C1000A

ORDERING INFORMATION

PLASTIC PACKAGE

PART NO. ACCESS TIME(ns) OPERATING STANDBY OPERATING PACKAGE

Current MAX.(mA) Current MAX.(uA) TEMPERATURE

MX27C1000APC-90 90 30 100 0°C to 70°C 32 Pin DIP
MX27C1000AQC-90 90 3 0 1 00 0°C to 70°C 32 Pin PLCC
MX27C1000AMC-90 90 3 0 100 0°C to 70°C 32 Pin SOP
MX27C1000ATC-90 90 30 100 0°C to 70°C 32 Pin TSOP
MX27C1000APC-10 100 30 1 0 0 0°C to 70°C 32 Pin DIP
MX27C1000AQC-10 100 30 10 0 0°C to 70°C 32 Pin PLCC
MX27C1000AMC-10 100 30 10 0 0°C to 70°C 32 Pin SOP
MX27C1000ATC-10 10 0 30 10 0 0°C to 70°C 32 Pin TSOP
MX27C1000APC-12 120 30 1 0 0 0°C to 70°C 32 Pin DIP
MX27C1000AQC-12 120 30 10 0 0°C to 70°C 32 Pin PLCC
MX27C1000AMC-12 120 30 10 0 0°C to 70°C 32 Pin SOP
MX27C1000ATC-12 12 0 30 10 0 0°C to 70°C 32 Pin TSOP
MX27C1000APC-15 150 30 1 0 0 0°C to 70°C 32 Pin DIP
MX27C1000AQC-15 150 30 10 0 0°C to 70°C 32 Pin PLCC
MX27C1000AMC-15 150 30 10 0 0°C to 70°C 32 Pin SOP
MX27C1000ATC-15 15 0 30 10 0 0°C to 70°C 32 Pin TSOP
MX27C1000API-90 90 30 100 -40°C to 85°C 32 Pin DIP
MX27C1000AQI-90 90 30 1 00 -40°C to 85°C 32 Pin PLCC
MX27C1000AMI-90 9 0 30 1 00 -40°C to 85°C 32 Pin SOP
MX27C1000ATI-90 90 3 0 100 -40°C to 85°C 32 Pin TSOP
MX27C1000API-10 100 30 1 00 -40°C to 85°C 32 Pin DIP
MX27C1000AQI-10 10 0 30 1 00 -40°C to 85°C 32 Pin PLCC
MX27C1000AMI-10 1 00 3 0 100 -40°C to 85°C 32 Pin SOP
MX27C1000ATI-10 100 30 1 0 0 -40°C to 85°C 32 Pin TSOP
MX27C1000API-12 120 30 1 00 -40°C to 85°C 32 Pin DIP
MX27C1000AQI-12 12 0 30 1 00 -40°C to 85°C 32 Pin PLCC
MX27C1000AMI-12 1 20 3 0 100 -40°C to 85°C 32 Pin SOP
MX27C1000ATI-12 120 30 1 0 0 -40°C to 85°C 32 Pin TSOP
MX27C1000API-15 150 30 1 00 -40°C to 85°C 32 Pin DIP
MX27C1000AQI-15 15 0 30 1 00 -40°C to 85°C 32 Pin PLCC
MX27C1000AMI-15 1 50 3 0 100 -40°C to 85°C 32 Pin SOP
MX27C1000ATI-15 150 30 1 0 0 -40°C to 85°C 32 Pin TSOP

P/N: PM0733

9

REV. 1.1, JUL. 19, 2001

PACKAGE INFORMATION

32-PIN PLASTIC DIP(600 mil)

MX27C1000A

P/N: PM0733

10

REV. 1.1, JUL. 19, 2001

32-PIN PLASTIC LEADED CHIP CARRIER (PLCC)

MX27C1000A

P/N: PM0733

11

REV. 1.1, JUL. 19, 2001

32-PIN PLASTIC SOP (450 mil)

MX27C1000A

P/N: PM0733

12

REV. 1.1, JUL. 19, 2001

32-PIN PLASTIC TSOP

MX27C1000A

P/N: PM0733

13

REV. 1.1, JUL. 19, 2001

MX27C1000A

REVISION HISTORY

Revision No. Description Page Date

1.0 To change data sheet title to Preliminary P1 MAR/13/2001
To added access time 100/150ns and 32SOP/TSOP type package P1,6,7,9

1.1 To modify Package Information P10~13 JUL/19/2001

P/N: PM0733

14

REV. 1.1, JUL. 19, 2001

MX27C1000A

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