A= Assembly Location
Y= Year
WW= Work Week
G= Pb−Free Package
U8xxxE = Device Code
KA= Diode Polarity
ORDERING INFORMATION
DevicePackageShipping
MUR8100ETO−22050 Units / Rail
MUR8100EGTO−220
MUR880ETO−220
Preferred devices are recommended choices for future use
and best overall value.
xxx = 100 or 80
(Pb−Free)
(Pb−Free)
50 Units / Rail
50 Units / Rail
50 Units / RailMUR880EGTO−220
MUR8100E/D
Page 2
MUR8100E, MUR880E
MAXIMUM RATINGS
RatingSymbolValueUnit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking VoltageMUR880E
MUR8100E
Average Rectified Forward Current
(Rated V
, TC = 150°C) Total Device
R
Peak Repetitive Forward Current
(Rated V
, Square Wave, 20 kHz, TC = 150°C)
R
Non−Repetitive Peak Surge Current
(Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz)
Operating Junction and Storage Temperature RangeTJ, T
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously . If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
* The curves shown are typical for the highest voltage device in the voltage
* grouping. Typical reverse current for lower voltage selections can be
1000
* estimated from these same curves if V
is sufficiently below rated VR.
R
m
100
175°C
150°C
10
1.0
, REVERSE CURRENT ( A)
R
I
0.1
100°C
TJ = 25°C
0.01
0
2004006008001000
V
, REVERSE VOLTAGE (VOLTS)
R
Figure 2. Typical Reverse Current*
10
9.0
8.0
7.0
6.0
SQUARE WAVE
5.0
4.0
3.0
2.0
, AVERAGE FORWARD CURRENT (AMPS)
1.0
F(AV)
0
I
1.80.4
150140
, CASE TEMPERATURE (°C)
T
C
160
RATED VR APPLIED
dc
170180
10
9.0
8.0
7.0
6.0
5.0
4.0
3.0
2.0
, AVERAGE FORWARD CURRENT (AMPS)I
1.0
F(AV)
SQUARE WAVE
SQUARE WAVE
0
20600
Figure 1. Typical Forward Voltage
Figure 3. Current Derating, Case
14
R
= 16°C/W
q
JA
R
= 60°C/W
q
JA
(No Heat Sink)
dc
TJ = 175°C
12
SQUARE WAVE
10
8.0
6.0
dc
80120100
, AMBIENT TEMPERATURE (°C)
T
A
140160200180
, AVERAGE POWER DISSIPATION (WATTS)
F(AV)
P
4.0
2.0
0
1.00
2.03.05.0
I
, AVERAGE FORWARD CURRENT (AMPS)
F(AV)
4.040
6.09.07.08.010
Figure 4. Current Derating, AmbientFigure 5. Power Dissipation
http://onsemi.com
3
dc
Page 4
MERCURY
SWITCH
MUR8100E, MUR880E
+V
DD
I
L
40 mH COIL
BV
DUT
V
D
I
D
I
I
S
1
DUT
L
D
V
DD
Figure 6. Test CircuitFigure 7. Current−Voltage Waveforms
The unclamped inductive switching circuit shown in
Figure 6 was used to demonstrate the controlled avalanche
capability of the new “E’’ series Ultrafast rectifiers. A
mercury switch was used instead of an electronic switch to
simulate a noisy environment when the switch was being
opened.
When S
up linearly; and energy is stored in the coil. At t
is closed at t0 the current in the inductor IL ramps
1
the switch
1
is opened and the voltage across the diode under test begins
to rise rapidly, due to di/dt effects, when this induced voltage
reaches the breakdown voltage of the diode, it is clamped at
BV
and the diode begins to conduct the full load current
DUT
which now starts to decay linearly through the diode, and
goes to zero at t
.
2
By solving the loop equation at the point in time when S
is opened; and calculating the energy that is transferred to
the diode it can be shown that the total energy transferred is
equal to the ener gy stored in the inductor plus a finite amount
of energy from the V
power supply while the diode is in
DD
t
0
breakdown (from t
to t2) minus any losses due to finite
1
t
1
component resistances. Assuming the component resistive
elements are small Equation (1) approximates the total
energy transferred to the diode. It can be seen from this
equation that if the V
voltage is low compared to the
DD
breakdown voltage of the device, the amount of energy
contributed by the supply during breakdown is small and the
total energy can be assumed to be nearly equal to the energy
stored in the coil during the time when S
Equation (2).
The oscilloscope picture in Figure 8, shows the
MUR8100E in this test circuit conducting a peak current of
one ampere at a breakdown voltage of 1300 V, and using
Equation (2) the energy absorbed by the MUR8100E is
approximately 20 mjoules.
1
Although it is not recommended to design for this
condition, the new “E’’ series provides added protection
against those unforeseen transient viruses that can produce
unexplained random failures in unfriendly environments.
t
2
was closed,
1
t
EQUATION (1):
W
AVAL
EQUATION (2):
W
AVAL
[
[
1
LI
2
1
LI
2
2
LPK
2
LPK
ǒ
BV
BV
DUT
DUT–VDD
CH1
CH2
50mV
A
20ms
953 VVERT500V
Ǔ
ACQUISITIONS
1217:33 HRS
SAVEREF SOURCE
CH1CH2REFREF
Figure 8. Current−Voltage Waveforms
http://onsemi.com
4
STACK
CHANNEL 2:
I
L
0.5 AMPS/DIV.
CHANNEL 1
V
DUT
500 VOLTS/DIV.
TIME BASE
20 ms/DIV.
:
:
Page 5
MUR8100E, MUR880E
1.0
0.7
D = 0.5
0.5
0.3
0.2
0.1
0.1
0.05
0.07
(NORMALIZED)
0.05
0.01
0.03
r(t), TRANSIENT THERMAL RESISTANCE
0.02
SINGLE PULSE
0.01
0.010.020.050.10.20.5200500 1000
2.05.0102050
t, TIME (ms)
Figure 9. Thermal Response
1000
300
P
(pk)
t
1
t
2
DUTY CYCLE, D = t1/t
TJ = 25°C
Z
(t) = r(t) R
q
JC
R
q
JC
q
JC
= 1.5°C/W MAX
D CURVES APPLY FOR POWER
PULSE TRAIN SHOWN
READ TIME AT t
T
2
J(pk)
− TC = P
(pk)
1
Z
1001.0
(t)
q
JC
100
C, CAPACITANCE (pF)
30
10
101.0
V
, REVERSE VOLTAGE (VOLTS)
R
Figure 10. Typical Capacitance
100
http://onsemi.com
5
Page 6
MUR8100E, MUR880E
PACKAGE DIMENSIONS
TO−220 TWO−LEAD
CASE 221B−04
ISSUE D
C
Q
B
4
F
T
S
A
13
U
H
K
L
D
G
R
J
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
DIM MINMAXMINMAX
A 0.595 0.620 15.11 15.75
B 0.380 0.4059.65 10.29
C 0.160 0.1904.064.82
D 0.025 0.0350.640.89
F 0.142 0.1473.613.73
G 0.190 0.2104.835.33
H 0.110 0.1302.793.30
J 0.018 0.0250.460.64
K 0.500 0.562 12.70 14.27
L 0.045 0.0601.141.52
Q 0.100 0.1202.543.04
R 0.080 0.1102.042.79
S 0.045 0.0551.141.39
T 0.235 0.2555.976.48
U 0.000 0.050 0.0001.27
MILLIMETERSINCHES
SWITCHMODE is a trademark of Semiconductor Components Industries, LLC.
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
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Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada
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Email: [email protected]
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Japan: ON Semiconductor, Japan Customer Focus Center
2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051
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http://onsemi.com
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For additional information, please contact your
local Sales Representative.
MUR8100E/D
6
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