MOTOR CONTROL, LIGHTING FOR
INDUSTRIAL AND CONSUMER
ENVIRONMENT
3
2
1
TO-220
INTERNAL SCHEMATIC DIAGRAM
ABSOLUTE MAXIMUM RATINGS
Symb o lParamet erVal u eUnit
V
V
V
I
DM
P
T
(•) Pulsewidth limited bysafe operating area
November 1996
Drain - s ource Voltage (VGS= 0)600V
DS
Drain- gate Voltage (RGS=20kΩ)600V
DGR
Gate-source Voltage± 20V
GS
Drain Current (continuous) at Tc=25oC6.8A
I
D
Drain Current (continuous) at Tc=100oC4.2A
I
D
(•)Drain Current (pulsed)30A
Total D i ssipation at Tc=25oC125W
tot
Derating Factor1W/
St or a ge Tem perature-65 to 150
stg
Max. Operating Junctio n Temperatur e150
T
j
o
C
o
C
o
C
1/9
Page 2
MTP6N60
THERMAL DATA
R
thj-case
R
thj-amb
R
thj-amb
T
AVALANCHE CHARACTERISTICS
SymbolParameterMax Valu eUni t
I
AR
E
E
I
AR
Thermal Res istance Junction -c as eMax
Thermal Resis tance Junction- ambientMax
Thermal Res istance Case-sinkTyp
Maximum Lead Temperature For Soldering Purpose
l
Avalanc h e Cu rr ent , Repet itive or Not-R epetitive
(pulse width limited by Tjmax, δ <1%)
Single Pul se Avalanche Ener gy
AS
(starti ng Tj=25oC, ID=IAR,VDD=25V)
Repetitive Avalanc he Energ y
AR
(pulse width limited by Tjmax, δ <1%)
Avalanc h e Cu rr ent , Repet itive or Not-R epetitive
(Tc= 100oC, puls e width limited by Tjmax, δ <1%)
1
62.5
0.5
300
6.8A
460mJ
21mJ
4.2A
o
C/W
o
C/W
o
C/W
o
C
ELECTRICAL CHARACTERISTICS (T
=25oC unless otherwise specified)
case
OFF
SymbolParameterTest Condition sMin.Typ.Max.Unit
V
(BR)DSS
Drain - s ource
ID=250µAVGS= 0600V
Break d own Volta ge
I
DSS
I
GSS
Zer o Gate Voltage
Drain Current (V
GS
Gat e- body Leakage
=0)
=MaxRating
V
DS
V
= Max R ating x 0.8 Tc=125oC
DS
25
250
VGS= ± 20 V± 100nA
Current (VDS=0)
ON (∗)
SymbolParameterTest Condition sMin.Typ.Max.Unit
V
GS(th)
R
DS(on)
Gate Threshold V oltage VDS=VGSID=1mA23.14.5V
St at ic Drain-s our ce O n
VGS=10V ID=3A11.2Ω
Resistance
I
D(on)
On St ate Dra in Current VDS>I
D(on)xRDS(on)max
6.8A
VGS=10V
DYNAMIC
SymbolParameterTest Condition sMin.Typ.Max.Unit
(∗)Forward
g
fs
Tr ansconductance
C
C
C
Input Capacitance
iss
Out put Capacitance
oss
Reverse Transfer
rss
Capacitance
VDS>I
D(on)xRDS(on)maxID
=3A24.8S
VDS=25V f=1MHz VGS= 01150
160
75
1500
240
110
µA
µA
pF
pF
pF
2/9
Page 3
MTP6N60
ELECTRICAL CHARACTERISTICS (continued)
SWITCHING ON
SymbolParameterTest Condition sMin.Typ.Max.Unit
t
d(on)
(di/dt)
Q
Q
Q
Turn-on Time
t
Rise Time
r
Turn-on C urrent SlopeVDD=480V ID=6A
on
Total Gate Charge
g
Gat e- Source Charge
gs
Gate-Drain Charge
gd
SWITCHING OFF
SymbolParameterTest Condition sMin.Typ.Max.Unit
t
r(Voff)
t
Off -voltage R ise Time
t
Fall Time
f
Cross-over Time
c
SOURCE DRAIN DIODE
VDD=300V ID=3A
RG=50 ΩVGS=10V
50
14065175
(see test circuit, figure 3)
240A/µs
RG=50 ΩVGS=10V
(see test circuit, figure 5)
VDD= 480 VID=6A VGS=10V78
8
41
VDD=480V ID=6A
RG=50 Ω VGS=10V
(see test circuit, figure 5)
100
27
145
98nC
125
34
180
ns
ns
nC
nC
ns
ns
ns
SymbolParameterTest Condition sMin.Typ.Max.Unit
I
I
SDM
SD
Source-drain Current
(•)
Source-drain Current
3.8
24
(pulsed)
V
(∗)For w ar d On Volt ageISD=6A VGS=02V
SD
t
Reverse Recovery
rr
Time
Q
Reverse Recovery
rr
ISD=6A di/dt=100A/µs
VDD= 100 VTj=150oC
(see test circuit, figure 5)
750
13.5
Charge
I
RRM
Reverse Recovery
38
Current
(∗) Pulsed:Pulse duration = 300 µs, dutycycle 1.5 %
(•) Pulse widthlimited by safeoperating area
Safe Operating AreaThermal Impedance
A
A
ns
µC
A
3/9
Page 4
MTP6N60
Derating Curve
Transfer Characteristics
Output Characteristics
Transconductance
Static Drain-source On Resistance
4/9
Gate Charge vs Gate-source Voltage
Page 5
Capacitance VariationsNormalized Gate Threshold Voltage vs
Temperature
Normalized On Resistance vs TemperatureTurn-on Current Slope
MTP6N60
Cross-over TimeTurn-off Drain-source Voltage Slope
5/9
Page 6
MTP6N60
Switching SafeOperating AreaAccidental Overload Area
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1996 SGS-THOMSONMicroelectronics - Printed in Italy- All Rights Reserved
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