(•) Pulse widthlimited by safeoperating area
First digit of the datecode being Zor K identifies silicon characterized in this datasheet.
July 1999
Dra in- sour c e Voltage ( VGS=0)60V
DS
Dra in- gate V ol t age (RGS=20kΩ)60V
DGR
Gat e-source Voltage
GS
I
Dra in Current (contin uous) at Tc=25oC12A
D
Dra in Current (pulsed) at Tc= 100oC9A
DM
20V
±
(•)Dra in Current (pulsed)48A
Tot al Dissipation at Tc=25oC40W
tot
St orage Tem pe r at ur e-65 to 175
stg
T
Max. Operat ing Junc tion Tem perature175
j
o
C
o
C
1/8
Page 2
MTP3055E
THERMAL DATA
R
thj-case
R
thj-amb
R
thc-s
T
AVALANCHE CHARACTERISTICS
SymbolParameterMax ValueUnit
I
AR
E
Ther mal Resistanc e Junct ion-caseMax
Ther mal Resistanc e Junct ion-ambientMax
Ther mal Resistanc e Case-sinkTy p
Maximum L ead T emperat ure For Solder ing Purp os e
l
Avalanche Current, Repetitive or Not-Repetitive
(pulse width limited by T
Single Pulse A v alan che Ener gy
AS
(starting T
=25oC, ID=IAR,VDD=25V)
j
max)
j
3.75
62.5
0.5
300
12A
50mJ
o
C/W
oC/W
o
C/W
o
C
ELECTRICAL CHARACTERISTICS
=25oC unless otherwisespecified)
(T
case
OFF
SymbolParameterTest ConditionsMin.Typ.Max.Unit
V
(BR)DSS
Drain-source
ID=250µAVGS=060V
Break dow n Volt age
I
DSS
I
GSS
Zero Gate Voltage
Drain Current (V
GS
Gat e- bod y Leakage
Current (V
DS
=0)
=0)
V
=MaxRating
DS
=MaxRatingx0.8 Tc=125oC
V
DS
V
=± 20 V
GS
1
10
100nA
±
ON(∗)
SymbolParameterTest ConditionsMin.Typ.Max.Unit
V
GS(th)
R
DS(on)
Gate Threshold Voltage VDS=VGSID= 250 µA22.94V
Sta t ic Drain-sour c e On
VGS=10V ID=7A0.10.15
Resistance
I
D(on)
On State Drain Current VDS>I
D(on)xRDS(on )maxVGS
=10V12A
DYNAMIC
SymbolParameterTest ConditionsMin.Typ.Max.Unit
g
(∗)Forward
fs
Tr ansc on duc tance
C
C
C
Input Capacitanc e
iss
Out put Capacitance
oss
Reverse Transfer
rss
Capacit a nc e
VDS>I
D(on)xRDS(on )maxID
=6A46S
VDS=25V f=1MHz VGS= 0760
100
30
µ
µA
Ω
pF
pF
pF
A
2/8
Page 3
MTP3055E
ELECTRICAL CHARACTERISTICS
(continued)
SWITCHING RESISTIVE LOAD
SymbolParameterTest ConditionsMin.Typ.Max.Unit
t
d(on)
t
d(off)
Q
Q
Q
t
Turn-on Time
Rise T ime
r
Tur n-of f Delay Time
t
Fall T ime
f
Tot al Gate Charge
g
Gat e- Source Char g e
gs
Gate-Drain Charge
gd
VDD=30V ID=7A
R
G
=50
Ω
VGS=10V
(see t est circuit)
ID=12A VGS=10V
=40V
V
DD
(see t est circuit)
20
65
70
35
15
7
5
SOURCEDRAINDIODE
SymbolParameterTest ConditionsMin.Typ.Max.Unit
I
SD
I
SDM
V
SD
t
Q
(∗) Pulsed:Pulse duration = 300µs, duty cycle 1.5%
(•) Pulse width limited by safeoperating area
Source-drain Current
Source-drain Current
(•)
(pulsed)
12
48
(∗)ForwardOnVoltage ISD=12A VGS=02.0V
Reverse Recovery
rr
Time
Reverse Recovery
rr
ISD= 12 Adi/dt = 100 A/µs
=30V Tj= 150oC
V
DD
65
0.17
Charge
ns
ns
ns
ns
nC
nC
nC
A
A
ns
µ
C
SafeOperating AreaThermalImpedance
3/8
Page 4
MTP3055E
OutputCharacteristics
Transconductance
TransferCharacteristics
Static Drain-sourceOn Resistance
Gate Charge vs Gate-sourceVoltage
4/8
CapacitanceVariations
Page 5
MTP3055E
NormalizedGate ThresholdVoltage vs
Temperature
Source-drainDiode Forward Characteristics
NormalizedOn Resistancevs Temperature
5/8
Page 6
MTP3055E
Fig. 1:
UnclampedInductiveLoad TestCircuit
Fig. 3: SwitchingTimes Test Circuits For
ResistiveLoad
Information furnished is believed to beaccurateand reliable.However, STMicroelectronics assumes no responsibilityfor the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is
granted by implication or otherwise under anypatent or patent rights ofSTMicroelectronics. Specificationmentioned in this publicationare
subjecttochange withoutnotice.This publication supersedes andreplaces all informationpreviously supplied.STMicroelectronics products
are not authorized for use as critical components in lifesupportdevices or systems without express written approval of STMicroelectronics.
The STlogo is a trademark of STMicroelectronics
1999STMicroelectronics – Printed in Italy– All Rights Reserved
STMicroelectronics GROUP OF COMPANIES
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8/8
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