The MTCH6301 is a turnkey projected capacitive controller that allows easy integration of multi-touch and
gestures to create a rich user interface in your design.
Through a sophisticated combination of Self and
Mutual Capacitive scanning for both XY screens and
touch pads, the MTCH6301 allows designers to quickly
and easily integrate projected capacitive touch into
their application.
Applications:
• Human-machine interfaces with configurable
button, keypad or scrolling functions
• Single-finger gesture based interfaces to swipe,
scroll, or doubletap controls
• Home automation control panels
• Security control keypads
• Automotive center stack controls
• Gaming devices
• Remote control touch pads
Touch Sensor Support
• Up to 13RX x 18TX channels
• Works with printed circuit board (PCB), film, glass,
and flexible circuit board (FPC) sensors
• Supports sensor sizes up to 4.3”
• Individual channel tuning for optimal sensitivity
2.0Configuration and Setup............................................................................................................................................................... 3
7.0Special Features ........................................................................................................................................................................ 18
9.0Ordering Information .................................................................................................................................................................. 24
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DS41663A-page 2 2012 Microchip Technology Inc.
Page 3
MTCH6301 PROJECTED CAPACITIVE TOUCH CONTROLLER
Touch Sensor
TX0..17
RX0..12
User Configuration Data
Noise Reduction / Filtering Engine
Gesture Engine
MultiTouch
Decode
I2C™
Module
Signal Acquisition Controller
TX Drive
RX
Sense
ADC
MTCH6301
Communications Engine
[Master Controller]
Touch Data
MICROCHIP
PICkit™ Serial
Analyzer
USB
Connection only for initial tuning or configuration
1.0SYSTEM BLOCK DIAGRAM
The MTCH6301 is a turnkey projected capacitive touch
controller that allows easy integration of multitouch and
gestures to create a rich user interface in your design.
Through a sophisticated combination of Self and
Mutual Capacitive scanning for both XY screens and
touch pads, the MTCH6301 allows designers to quickly
and easily integrate projected capacitive touch into
their application.
FIGURE 1-1:BLOCK DIAGRAM
The Projected Capacitive Configuration Utility with an
autotune feature allows fast customization for different
sizes and top layer thicknesses.
For further customization, designers can also get
access to the firmware library to optimize and improve
designs as needed.
2.0CONFIGURATION AND SETUP
The MTCH6301 is pre-configured for a 12 Receiver
(RX)/9 Transmitter (TX) touch sensor, mapped as
shown in Section4.0 “Layout”. While the device will
work out of the box using this specific sensor configuration, most applications will require additional configuration and sensor tuning to determine the correct set of
parameters to be used in the final application.
Microchip provides a PC-based configuration tool for
this purpose, available in the mTouch™ Sensing Solution Design Center (www.microchip.com/mtouch). Use
of this tool requires a PICkit™ Serial Analyzer (updated
with MTCH6301 support), as well as access to the I
communications bus of the MTCH6301.
2012 Microchip Technology Inc.DS41663A-page 3
2
C
Once the development process is complete, these
modified parameters must either be written permanently to the controller (via NVRAM, refer to
Section 7.3 “Non-Volatile RAM (NVRAM)”), or alter-
natively can be sent every time the system is powered
on. Either the PICkit Serial Analyzer or the Master I
Controller can be used for this purpose.
2
C
Page 4
MTCH6301 PROJECTED CAPACITIVE TOUCH CONTROLLER
44-Pin TQFP
(1,2)
44-Pin QFN
(1,2)
Note 1: All RX/TX are remappable. Refer to Section 4.3 “Sensor Layout Configuration” for further
information.
2: The metal plane at the bottom of the device is not connected to any pins and is recommended to be
connected to V
SS externally.
MTCH6301
SDA
TX17
TX16
TX15
TX14
VSS
VCAP
INT
N/C
RX12
RX11
SCL
TX11
TX10
TX9
VDD
VSS
TX5
TX6
TX7
TX8
TX4
TX0
TX1
TX2
TX3
VSS
VDD
RX0
RX1
RX2
RX3
RX4
TX13
TX12
RX10
RX9
VSS
VDD
RESET
RX8
RX7
RX6
RX5
MTCH6301
44
43
42
41
40
39
38
37
36
35
34
12
13
141516
17
18
19
20
21
22
1
2
3
4
5
6
7
8
9
10
11
33
32
31
30
29
28
27
26
25
24
23
3.0PIN DIAGRAM
FIGURE 3-1:PIN DIAGRAM
DS41663A-page 4 2012 Microchip Technology Inc.
Page 5
MTCH6301 PROJECTED CAPACITIVE TOUCH CONTROLLER
TABLE 3-1:PINOUT I/O DESCRIPTIONS
Pin NamePin NumberPin TypeDescription
RESET18I/PReset device (active low)
SCL44ISynchronous serial clock input/output for I2C™
SDA1I/OSynchronous serial data input/output for I2C
2
INT8OInterrupt (from MTCH6301 to master) for I
RX027I/O
RX126I/O
RX225I/O
RX324I/O
RX423I/O
RX522I/O
RX621I/O
RX720I/O
RX819I/O
RX915I/O
RX1014I/O
RX 1111I/O
RX1210I/O
TX033O
TX132O
TX231O
TX330O
TX434O
TX538O
TX637O
TX736O
TX835O
TX941O
TX1042O
TX1143O
TX1213O
TX1312O
TX145O
TX154O
TX163O
TX172O
N/C9N/CNo Connect
CAP7PCPU logic filter capacitor connection
V
VDD17, 28, 40PPositive supply for peripheral logic and I/O pins
V
SS6, 16, 29, 39PGround reference for logic and I/O pins. This pin must be
RX Sense (or TX Drive)
TX Drive
connected at all times
C
2012 Microchip Technology Inc.DS41663A-page 5
Page 6
MTCH6301 PROJECTED CAPACITIVE TOUCH CONTROLLER
Master I2C™
Controller
MTCH6301
TX3
TX2
TX1
TX0
VSS
VDD
RX0
RX1
RX2
RX3
RX4
30
31
32
33
29
28
27
26
25
24
23
4
3
2
1
5
6
7
8
9
10
11
TX15
TX16
TX17
SDA
TX14
VSS
VCAP
INT
N/C
RX12
RX11
TX9
TX10
TX11
SCL
VDD
VSS
TX5
TX6
TX7
TX8
TX4
41
42
43
44
40393837363534
RX9
RX10
TX12
TX13
VSS
VDD
RESET
RX8
RX7
RX6
RX5
15
14
13
12
16171819202122
10 µF
20k O
0.1 µF
0.1 µF
0.1 µF
RX0RX11
TX0TX8
GPIO/INT
SCL
SDA
MICROCHIP
PICkit™ Serial
Analyzer
4.0LAYOUT
4.1Typical Application Circuit
The following schematic portrays a typical application
circuit, based on a 12RX/9TX touch sensor.
FIGURE 4-1:TYPICAL APPLICATION CIRCUIT
4.2Touch Sensor Design
Please refer to the mTouch Sensing Solution design
center at www.microchip.com/mtouch for additional
information regarding design and layout of touch
sensors.
4.3.1RX/TX PIN MAP
By default, the RX and TX pins are set as shown in the
Typical Application Circuit (Figure 4.1). If you require a
different layout or a different amount of sensor channels, the RX and TX pins are configured via pin map
arrays. To access these arrays, reference Section 5.0
4.3Sensor Layout Configuration
To properly configure a sensor from a physical layout
standpoint, the following registers must be correctly
configured:
• RX Pin Map/TX Pin Map
• RX Scaling Coefficient/TX Scaling Coefficient
•Flip State
DS41663A-page 6 2012 Microchip Technology Inc.
“Communication Protocol” and Section 6.0 “Memory Map” of this document.
The RX and TX lines are configurable for the purpose
of making trace routing and board layout more convenient. Please note that while RX pins can be used as
TX pins instead, a single pin cannot be used as BOTH
an RX and a TX channel concurrently. The pin maps
are comprised of “Pin Map ID” numbers, which are
shown in Tab le 4 -1 .
Page 7
MTCH6301 PROJECTED CAPACITIVE TOUCH CONTROLLER
4.3.3RX/TX SCALING COEFFICIENTS
TABLE 4-1:PIN MAP ID CHART
Pin
RX0278
RX1267
RX2256
RX3125
RX4114
RX5103
RX692
RX711
RX800
RX9249
RX102310
RX 112211
RX122112
TX013
TX16
TX23—
TX32—
TX44
TX57—
TX628—
TX729
TX830—
TX914—
TX1015
TX1116—
TX125—
TX138
TX1434
TX1533
TX1632
TX1731—
.
Note:Trace routing for sensors requires proper
design technique. Please refer to the
mTouch Sensing Solution design center at
www.microchip.com/mtouch for additional
information on correctly routing touch
sensor traces.
Map ID
(TX)
Map ID
(RX)
—
—
—
—
—
—
—
—
—
Scaling coefficient registers exist in RAM for each axis
(RX/TX) and must be modified in accordance with the
number of channels that are in use. Special attention
must be paid to sensor dimensions that have fewer
than 5 channels, which will have a smaller maximum
touch output value (coordinate).
The relationship between these constant, as well as the
maximum coordinates that will be transmitted are
displayed in Tab le 4 -2 .
TABLE 4-2:RX/TX SCALING
COEFFICIENTS
Number of
Channels
3
4[0-3071]
5
652429
743691
837449
932768
1029127
1126214
1223831
1321845
1420165
1518725
1617476
1716384
1815420
RX/TX
Scaling
Coefficient
65535
Controller
Output Range
[0-2047]
[0-4095]
4.3.4SENSOR ORIENTATION
The final output orientation is configured via the
FLIPSTATE register. This register can be adjusted during operation for applications where rotation occurs
during use.
Figure 4-2 shows the initial upright orientation
FLIPSTATE register values for all possible sensor
layouts.
4.3.2UNUSED RX/TX PINS
Unused RX/TX pins are driven to Vss automatically,
and should be left as no connects.
2012 Microchip Technology Inc.DS41663A-page 7
Page 8
MTCH6301 PROJECTED CAPACITIVE TOUCH CONTROLLER
SENSOR
RX0RXn
TX0
TXn
SENSOR
RXnRX0
TX0
TXn
SENSOR
RX0RXn
TXn
TX0
SENSOR
RXnRX0
TXn
TX0
SENSOR
SENSOR
SENSOR
TX0TXn
SENSOR
TXnTX0
0, 04096, 0
4096, 40960, 4096
0, 04096, 0
4096, 40960, 4096
0, 04096, 0
4096, 40960, 4096
0, 04096, 0
4096, 40960, 4096
0, 04096, 0
4096, 40960, 4096
0, 04096, 0
4096, 40960, 4096
0, 04096, 0
4096, 40960, 4096
0, 04096, 0
4096, 40960, 4096
RX0
RXn
RX0
RXn
RX0
RXn
RX0
RXn
TX0TXn
TXnTX0
SWAP
TXFLIP
RXFLIP
0
0
1
SWAP
TXFLIP
RXFLIP
0
0
0
SWAP
TXFLIP
RXFLIP
0
1
1
SWAP
TXFLIP
RXFLIP
0
1
0
SWAP
TXFLIP
RXFLIP
1
0
1
SWAP
TXFLIP
RXFLIP
1
0
0
SWAP
TXFLIP
RXFLIP
1
1
1
SWAP
TXFLIP
RXFLIP
1
1
0
Default Configuration
REGISTER 4-1:FLIPSTATE REGISTER
U-0U-0U-0U-0U-0R/W-0R/W-0R/W-1
—————SWAPTXFLIPRXFLIP
bit 7bit 0
Legend:
R = Readable bitW = Writable bitU = Unimplemented bit, read as ‘0’
-n = Value at POR‘1’ = Bit is set‘0’ = Bit is clearedx = Bit is unknown
1 = Invert the TX axis
0 = Do not invert the TX axis
bit 0RXFLIP
1 = Invert the RX axis
0 = Do not invert the RX axis
FIGURE 4-2:SENSOR ORIENTATION CHART
DS41663A-page 8 2012 Microchip Technology Inc.
Page 9
MTCH6301 PROJECTED CAPACITIVE TOUCH CONTROLLER
Sensor Line
MTCH63001
Pin
Map ID
TX
0TX1116
1TX1731
2TX1632
3TX1533
4TX1434
5RX1221
6RX1122
7TX138
8TX125
9RX1023
10RX924
RX
0RX510
1RX69
2RX71
3RX80
MTCH6301
TX3
TX2
TX1
TX0
VSS
VDD
RX0
RX1
RX2
RX3
RX4
TX15
TX16
TX17
SDA
TX14
VSS
VCAP
INT
N/C
RX12
RX11
TX9
TX10
TX11
SCL
VDD
VSS
TX5
TX6
TX7
TX8
TX4
RX9
RX10
TX12
TX13
VSS
VDD
RESET
RX8
RX7
RX6
RX5
RX0RX3
TX0TX10
SENSOR
The Pin Map arrays for this particular setup are as
follows (arrays are shown as organized in memory):
RXPinMap: {10,9,1,0}
TXPinMap: {16,31,32,33,34,21,22,8,5,23,24}
4.4Example Custom Application
Layout
An example 4-channel RX/11-channel TX sensor is
shown in Figure 4-3. In addition to using a completely
modified pin layout, this example differs from the
default configuration by also having the TX axis along
the bottom (X) and RX axis along the side (Y). Note that
some RX pins are used as TX lines in this example.
FIGURE 4-3:NON-STANDARD LAYOUT EXAMPLE
Using the scaling coefficient table generates the values
displayed in Tab le 4 -3 .
TABLE 4-3:CUSTOM APPLICATION
AxisChannels
RX465535[0-3071]
TX1126214[0-4095]
The FLIPSTATE register, using Figure 4-2, should be
set to 0b111, or 0x7, for this particular example.
2012 Microchip Technology Inc.DS41663A-page 9
Scaling
Coefficient
SCALING COEFFICIENTS
Maximum
Output
Page 10
MTCH6301 PROJECTED CAPACITIVE TOUCH CONTROLLER
5.0COMMUNICATION PROTOCOL
5.1Overview
The MTCH6301 has two basic communication types:
Touch & Gesture Protocol, and Command Protocol.
Touch & Gesture Protocol
Fully processed touch coordinates and gestures will be
transmitted immediately as they are processed by the
MTCH6301. Since it is a slave device, the INT pin will
be asserted whenever one of these packets is ready for
transmission. This requires the master controller to initiate a READ command to receive the touch or gesture
packet.
Command Protocol
2
All other commands are invoked by the I
controller. Commands are used for configuring and
controlling the device.
Master Read Details
Please note that any read from the controller by the
master, including both touch & gesture protocol and
command protocol, will be prefixed by a single byte.
This single byte denotes the number of bytes that are
to be transferred. This byte is NOT represented in the
tables and figures for the protocol, but is detailed in
Figure 5-6 and Figure 5-7.
C master
5.2Touch Protocol
The packet in Tab le 5 -1 is transmitted for each touch
that is present on the sensor.
TABLE 5-1:TOUCH PROTOCOL
PacketBit 7Bit 6Bit 5Bit 4Bit 3Bit 2Bit 1Bit 0
01TOUCHID<3:0>TCH(0)0PEN
10X<6:0>
2000 X<11:7>
30Y<6:0>
4000 Y<11:7>
Legend:TOUCHID:
PEN:
X:
Y:
TCH:
Touch ID (0-9)
Pen State
0 = Pen Up
1 = Pen Down
X Coordinate of Touch
Y Coordinate of Touch
Always 0, denotes a touch packet
5.3Gesture Protocol
The packet in Ta bl e 5- 2 is transmitted whenever a gesture is performed on the sensor. This feature can be
enabled via the Gesture Protocol register (Table 5-2).
Gestures are NOT enabled by default.
Note:For any “hold” gestures, packets are sent
continuously until the gesture (touch) is
released.
DS41663A-page 10 2012 Microchip Technology Inc.
Page 11
MTCH6301 PROJECTED CAPACITIVE TOUCH CONTROLLER
0x810x7D0x050x6A0x010x880x560x020x720x0F0x840x61
Touch ID0, Pen Down
X: 765, Y: 234
Touch ID1, Pen Up
X: 342, Y: 2034
Gesture for Touch ID0:
Swipe Left
……
TABLE 5-2:GESTURE PROTOCOL
PacketBit 7Bit 6Bit 5Bit 4Bit 3Bit 2Bit 1Bit 0
01TOUCHID<3:0>GEST(1)00
10GESTURE<6:0>
Legend:TOUCHID:
GESTURE:
GEST:
5.4Example Touch Data
Figure 5-1 depicts multitouch transmission in one touch
activation that is already in progress (ID0), and a second activation (ID1) being removed from the sensor.
The first activation also completes a gesture. The I
prefix bytes are not shown in this example.
Touch ID (0-7)
Gesture ID
0x10 Single Tap
0x11 Single Tap (hold)
0x20 Double Tap
0x31 Up Swipe
0x32 Up Swipe (hold)
0x41 Right Swipe
0x42 Right Swipe (hold)
0x51 Down Swipe
0x52 Down Swipe (hold)
0x61 Left Swipe
0x62 Left Swipe (hold)
Always 1, denotes a gesture packet
2
C
FIGURE 5-1:EXAMPLE TOUCH DATA
2012 Microchip Technology Inc.DS41663A-page 11
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MTCH6301 PROJECTED CAPACITIVE TOUCH CONTROLLER
size:Number of remaining bytes in packet
cmd:Command invoked for being responded to
result:Controller command-specific result
0x00 = Success
0x80 = Parameter out of range
0xFE = Timeout (not enough bytes received)
0xFF = Unrecognized command
0xFD = Invalid parameter
0xFC = Missing or extra parameter
A complete listing of MTCH6301 commands is shown
in Ta bl e 5- 3. Any commands which contain data bytes,
either sent or received, are shown alongside an
example stream of data in the following sections.
TABLE 5-3:COMMAND SET
IDNameDescription
0x00Enable TouchEnable touch functionality
0x01Disable TouchDisable touch functionality
0x14Scan BaselineInstruct controller to scan for a new sensor baseline
0x15Write RegisterWrite data to a specific register
0x16Read RegisterRead data from a specific register
0x17Write NVRAMWrite all current register values to NVRAM
0x18Software SleepInstructs the controller to enter sleep mode
0x19Erase NVRAMErase the contents of the non-volatile RAM section.
0x1AManufacturing TestPerform manufacturing tests on all sensor I/O channels
5.6.1WRITE REGISTER/READ
REGISTER
Writes or reads a single register. Note that all registers
are volatile, and any modified data will be lost on power
down. Registers must be saved to NVRAM to store the
configuration permanently
DS41663A-page 12 2012 Microchip Technology Inc.
Page 13
MTCH6301 PROJECTED CAPACITIVE TOUCH CONTROLLER
0x550x040x15[D0][D1][D2]0x550x020x000x15
Master CommandController Response
D0 = Index Location
D1 = Offset Location
D2 = Value to Write to Specified Register
0x550x030x16[D0][D1]0x550x030x000x16[D2]
Master CommandController Response
D0 = Index Location
D1 = Offset Location
D2 = Read Value at Specified Register
0x550x010x1A0x550x030x000x1A[D0]
Master Command
Controller Response
D0 = Result; 0 = success, 1 = I/O error
FIGURE 5-3:WRITE REGISTER COMMAND
FIGURE 5-4:READ REGISTER COMMAND
5.6.2MANUFACTURING TEST
The manufacturing test ensures electrical functionality
of the sensor. This test performs the following checks
on all mapped sensor pins: short to VDD, Short to GND,
and pin-to-pin short.
If an I/O error is reported, bits for the pins in question
will be set in the “TX Short Status” and “RX Short Status” registers.
Please note that:
1.The RX7/RX8 pins will always report an error.
2.If the sensor has more than 16 TX channels,
then channels 17 and 18 will never report an
error.
The MTCH6301 device supports the I2C serial proto-
stretching, and this should be taken into account by the
master controller. The maximum speed at which the
MTCH6301 can operate is 400 kbps.
col, with the addition of an interrupt pin for notifying the
master that data is ready. The device operates in Slave
mode, meaning that the device does not generate the
serial clock.
5.7.1SERIAL DATA (SDA)
5.7.3INTERRUPT (INT)
This pin is utilized by the MTCH6301 to signal that data
is available, and that the master controller should
invoke a MASTER READ. INT is an active high pin, and
is held low during all other activities.
The Serial Data (SDA) signal is the data signal of the
device. The value on this pin is latched on the rising
Note:If the device is not read within 25 ms of
edge of the SCL signal when the signal is an input. With
the exception of the START (RESTART) and STOP
conditions, the high or low state of the SDA pin can only
change when the clock signal on the SCL pin is low.
During the high period of the clock, the SDA pin’s value
(high or low) must be stable. Changes in the SDA pin’s
value while the SCL pin is HIGH will be interpreted as
a START or a STOP condition.
5.7.2SERIAL CLOCK (SCL)
The Serial Clock (SCL) signal is the clock signal of the
5.7.4DEVICE ADDRESSING
The MTCH6301 7-bit base address is set to 0x25, and
is not configurable by the user. Every transmission
must be prefixed with this address, as well as a bit signifying whether the transmission is a MASTER WRITE
(‘0’) or MASTER READ (‘1’). After appending this
read/write bit to the base address, this first byte
becomes either 0x4A (WRITE) or 0x4B (READ).
device. The rising edge of the SCL signal latches the
value on the SDA pin. The MTCH6301 employs clock
FIGURE 5-6:SINGLE TRANSMISSION I2C™ FORMAT
asserting the INT pin, it will time out and
data will no longer be available.
5.7.5TYPICAL I
2
C™ COMMAND READ
AND WRITE
Figure 5-7 depicts the master controller reading from
RAM location 0x01 (number of RX channels), and the
device responding accordingly with 0x0C (Figure 5-6).
DS41663A-page 14 2012 Microchip Technology Inc.
Page 15
MTCH6301 PROJECTED CAPACITIVE TOUCH CONTROLLER
SDA
SCL
StartStop
INT
DATA
554A03160001
SDA
SCL
StartStop
INT
DATA
054B5503000C16
Master Write
Master Read
(Controller Response)
SDA
SCL
StartStop
INT
DATA
054B81140F1420
FIGURE 5-7:I2C™ COMMAND READ AND WRITE
5.7.6TYPICAL I
Figure 5-8 depicts a single touch packet being
streamed from the controller. In this case, touch ID 0 at
location (1940,2592).
2
C TOUCH PACKET READ
FIGURE 5-8:I2C™ TOUCH PACKET READ
2
5.7.7WAKE ON I
The MTCH6301 is capable of waking up upon receiving
2
C command from the host. Note that since
an I
wake-up time can take up to 350 µs, the controller must
resend any I2C bytes that were not acknowledged
(ACK) before continuing the transmission.
Since the controller will wake up upon a correct I
address match, it does not matter which command is
sent. For simplicity, the Enable Touch command is
recommended.
gesture. Events below this threshold
will cancel the gesture (touch
removed) or be re-evaluated for
‘swipe-and-hold’ (touch is held)
2Maximum time allowed between two
taps to determine ‘double tap’ gesture
1Determines the width of ‘keepout
barrier’ (inactive edge) of the perimeter
of the sensor to reduce or eliminate
issues due to edge effects
activations before controller enters
Sleep mode
mode
1Gesture Packet Configuration0x81 = Enabled
2Identifies which TX pins are shorted
after executing Manufacturing Test
command – Read Only
2Identifies which RX pins are shorted
after executing Manufacturing Test
command – Read Only
DescriptionData Range
10-255160
10-255150
0-255150
0-25570
0-65535200
0-65535500
1-255120
1-503
50-1000350
0-255128
0-
4,000,000,000
0-117
0x01 = Disabled
0x01 = Disabled
0x01 = Disabled
0x00-0xFF0x00
0x00-0xFF0x00
Default
Value
8000
0x81
0x01
0x01
2012 Microchip Technology Inc.DS41663A-page 17
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MTCH6301 PROJECTED CAPACITIVE TOUCH CONTROLLER
7.0SPECIAL FEATURES
7.1Gestures
Single finger gestures are a fast and intuitive way to
navigate a feature rich human-machine interface. The
MTCH6301 supports 11 single finger gestures natively,
without requiring interaction from the master processor.
Tuning may be required depending on the layout of the
sensor, the time duration, and length of activation
required for your gesture supported application. The
most common defaults are already preloaded and
FIGURE 7-1:GESTURE TYPES
should serve most applications. These parameters and
their descriptions are available in the “Gestures” sec-
tion of the memory map (Section 6.0 “Memory Map”).
Note:Gestures are NOT enabled by default,
and must be enabled via the gesture
packet configuration byte in RAM (refer to
Section 6.0 “Memory Map”).
If your application requires ONLY gesture functionality,
and does not require touch coordinates, the touch
packet configuration byte (refer to Section 6.0 “Mem-
ory Map”) can be used to turn off all touch coordinate
data.
7.2Sleep
Sleep functionality is enabled by default, and follows
the behavior detailed in Figure 7-2. This functionality
can be modified via the registers related to sleep.
SLP1: This delay controls how often the sensor is
scanned for a touch while in Sleep mode. Table 7-1
correlates the value of SLP1 to time (ms).
TABLE 7-1:SLP1 DELAY CHART
SLP1Delay (ms)SLP1Delay (ms)
01664
127
248256
389512
416101024
532112048
Note 1:Default setting.
SLP2: Time (ms) without touch activity before controller
enters sleep mode.
DS41663A-page 18 2012 Microchip Technology Inc.
(1)
128
(1)
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MTCH6301 PROJECTED CAPACITIVE TOUCH CONTROLLER
No touch for
[SLP2] msec?
[Normal Full Decode
of Sensor]
Transmit
Touch
Sleep for
[SLP1] msec
Wake up;
Touch exists?
Yes
No
Yes
Touch?
No
No
Yes
FIGURE 7-2:SLEEP FUNCTIONALITY
7.3Non-Volatile RAM (NVRAM)
Permanent storage of parameters that have been modified can be achieved using the internal NVRAM. This
NVRAM is not meant for continuous writing, as it has a
low write cycle limit of 20,000.
Upon startup, the NVRAM’s data (if present) is loaded
into the controller. If no data is available in the NVRAM,
the device defaults are loaded instead.
Please note that parameters cannot be written individually to the NVRAM. All registers will be written with
one command. See the applicable command within the
command set for more details. (Section 5.6 “Full
Command Set”)
2012 Microchip Technology Inc.DS41663A-page 19
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MTCH6301 PROJECTED CAPACITIVE TOUCH CONTROLLER
0
100
200
300
400
2x24x46x68x812x913x15
Reports Per Second
Sensor Channel Matrix
7.4Touch Performance
Using default acquisition parameters, Figure 7-3
shows the relationship of single touch report rate with
regard to sensor size.
Larger sensors will have a reduced report rate, due to
the additional time needed to scan the sensor.
FIGURE 7-3:SINGLE-TOUCH REPORT RATE VS SENSOR SIZE
DS41663A-page 20 2012 Microchip Technology Inc.
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MTCH6301 PROJECTED CAPACITIVE TOUCH CONTROLLER
8.0ELECTRICAL
CHARACTERISTICS
This section provides an overview of the MTCH6301
electrical characteristics.
Ambient temperature under bias …………………………………………………..................….....……..............-40 to +85°C
Storage temperature……………………………………………………………….......................…...…….………-65 to 150°C
Voltage on V
Voltage on all other pins with respect to V
Maximum current out of V
Maximum current into V
Maximum output current sunk by any I/O pin…………………………………………………..................………………15 mA
Maximum output current sourced by any I/O pin …………………………………………………...................…………15 mA
Maximum current sunk by all ports. …………………………………………………………………….............………. 200 mA
Maximum current sourced by all ports. ………………………………………………………………………................ 200 mA
Stresses ab ove tho se listed under “Abs olute M aximu m Rat ings” m ay cau se permane nt dama ge to the device . This is a
stress rating only and functional operation of the device at those or any other conditions, above those indicated in the
operation listing s of this s pec ifi ca tio n, is no t im pl ied. Exposure to maxi mu m ra tin g c onditions for extended p eriods may
affect device reliability.
DD with respect to VSS……………………………....…………………….............................………-0.3V to 4.0V
SS………………………………………..…...............………-0.3V to (VDD + 0.3V)
SS pin …..……………………………………………………..........……………...............…300 mA
DD pin(s) ……….………………………………………………………..........…………………300 mA
8.1Absolute Maximum Ratings
Absolute maximum ratings for the MTCH6301 device
are listed below. Exposure to these maximum rating
conditions for extended periods may affect device reliability. Functional operation of the device at these or
any other conditions, above the parameters indicated
in the operation listings of this specification, is not
implied.
8.2DC Characteristics
TABLE 8-1:THERMAL OPERATING CONDITIONS
RatingSymbolMin.Typ.Max.Units
Operating Junction Temperature RangeTJ-40—+125⁰C
Operating Ambient Temperature Range TA-40—+85⁰C
Power Dissipation:
Internal Chip Power Dissipation:
PINT = VDD x (IDD-Ʃ IOH)
I/O Pin Power Dissipation:
PI/O = Ʃ (({VDD - VOH} x IOH) + Ʃ (VOL x IOL))
Maximum Allows Power DissipationPDMAX(TJ - TA) / θJAW
Note 1:Parameter is characterized, but not tested.
2:Open drain structure.
SS0.3 VDDVNote 1
DDVNote 1
SS0.4V IOL < 10 mA, VDD = 3.3V
2.02.3VMin. not tested
(1,2)
8.3AC Characteristics and Timing
Parameters
TABLE 8-5:AC CHARACTERISTICS AND TIMING PARAMETERS
SymbolCharacteristicMin.Typ.MaxUnitsConditions
TPUPower-up Period—400—µsNotes 1, 2
TBORBrown-out Pulse Width (Low)—1—µsNote 1
Note 1:Parameter is characterized, but not tested.
2:Power-up period is for core operation to begin, and does not reflect response time to a touch.
FIGURE 8-1:I2C™ BUS START/STOP BIT TIMING CHARACTERISTICS
DS41663A-page 22 2012 Microchip Technology Inc.
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MTCH6301 PROJECTED CAPACITIVE TOUCH CONTROLLER
FIGURE 8-2:I2C™ BUS DATA TIMING CHARACTERISTICS
TABLE 8-6:I2C™ BUS DATA TIMING REQUIREMENTS
Parameter
Number
IS1TLO:SCL Clock Low Time100 kHz Mode4.7—µs—
IS2THI:SCLClock High Time100 kHz Mode4.0—µs—
IS3TF:SCLSDA and SCL
IS4TR:SCLSDA and SCL
IS5TSU:DAT Data Input Setup
IS6THD:DAT Data Input Hold
IS7THD:STA Start Condition
IS8THD:STA Start Condition
IS9TSU:STO Stop Condition
IS10THD:STO Stop Condition
IS11TAA:SCL Output Valid
IS12TDF:SDA Bus Free Time100 kHz Mode4.7—µsTime bus must be free
SymbolCharacteristicMin.Max. UnitsConditions
400 kHz Mode1.3—µs
400 kHz Mode.6—µs
100 kHz Mode—300ns—
Fall Time
Rise Time
Time
Time
Setup Time
Hold Time
Setup Time
Hold Time
from Clock
CBSCL, SDC Capacitive Loading—400pFParameter is characterized,
400 kHz Mode 20+0.1 CB 300ns
100 kHz Mode—1000ns—
400 kHz Mode 20+0.1 CB 300ns
100 kHz Mode250—ns—
400 kHz Mode100—ns
100 kHz Mode0—ns—
400 kHz Mode00.9µs
100 kHz Mode4700—nsOnly relevant for repeated
400 kHz Mode600—ns
100 kHz Mode4000—nsAfter this period, the first
400 kHz Mode600—ns
100 kHz Mode4000—ns—
400 kHz Mode600—ns
100 kHz Mode4000—ns—
400 kHz Mode600—ns
100 kHz Mode03500ns—
400 kHz Mode01000ns
400 kHz Mode1.3—µs
start condition
clock pulse is generated
before new transmission can
start
but not tested
2012 Microchip Technology Inc.DS41663A-page 23
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MTCH6301 PROJECTED CAPACITIVE TOUCH CONTROLLER
9.0ORDERING INFORMATION
TABLE 9-1:ORDERING INFORMATION
Part NumberPin PackagePacking
MTCH6301-I/PT 44 TQFP 10x10x1mmTray
MTCH6301-I/ML44 QFN 8x8x0.9mmTube
MTCH6301T-I/PT44 TQFP 10x10x1mmT/R
MTCH6301T-I/ML44 QFN 8x8x0.9mmT/R
DS41663A-page 24 2012 Microchip Technology Inc.
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MTCH6301 PROJECTED CAPACITIVE TOUCH CONTROLLER
Legend: XX...XCustomer-specific information
YYear code (last digit of calendar year)
YYYear code (last 2 digits of calendar year)
WWWeek code (week of January 1 is week ‘01’)
NNNAlphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
*This package is Pb-free. The Pb-free JEDEC designator ()
can be found on the outer packaging for this package.
Note:In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
Note:For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS41663A-page 30 2012 Microchip Technology Inc.
Page 31
Note the following details of the code protection feature on Microchip devices:
YSTEM
CERTIFIED BY DNV
== ISO/TS 16949==
•Microchip products meet the specification contained in their particular Microchip Data Sheet.
•Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•Microchip is willing to work with the customer who is concerned about the integrity of their code.
•Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
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OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
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devices in life support and/or safety applications is entirely at
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hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, K
PICSTART, PIC
and UNI/O are registered trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MTP, SEEVAL and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
Analog-for-the-Digital Age, Application Maestro, BodyCom,
chipKIT, chipKIT logo, CodeGuard, dsPICDEM,
dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB
Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O,
Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA
and Z-Scale are trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
GestIC and ULPP are registered trademarks of Microchip
Technology Germany II GmbH & Co. & KG, a subsidiary of
Microchip Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
®
MCUs and dsPIC® DSCs, KEELOQ
®
code hopping
Page 32
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