Datasheet MTCH6102 Datasheet
MTCH6102
MTCH6102 Low-Power Projected Capacitive Touch Controller
Description:
Microchip’s MTCH6102 is a turnkey projected
capacitive touch controller that simplifies adding
gestures to touch interface designs with
industry-leading low-power performance. It utilizes up
to 15 channels to support taps, swipes, and scrolling on
XY touch pads and touch screens. MTCH6102 allows
designers to quickly and easily integrate projected
capacitive touch into their cost-sensitive, low-power
application. MTCH6102 provides developers with a
flexible touch-sensing solution to optimize common
constraints of size, power and cost that are critical to
applications such as wearable devices, remote
controls, gaming devices and track pads.
Applications:
• Wearable Devices such as Headphones,
Watches, Fitness Wristbands
• Track Pads and Computer Peripherals
• Input Devices with Configurable Button, Keypad
or Scrolling Functions
• Any Interface with Single-Finger Gestures to
Swipe, Scroll, or Doubletap Controls
• Home Automation Control Panels
• Security Control Keypads
• Automotive Center Stack Controls
• Gaming Devices
• Remote Control Touch Pads
Touch Features:
• Gesture Detection and Reporting
• Self-Capacitance Signal Acquisition
• Multiple Built-in Filtering Options
Power Management:
• Configurable Sleep/Idle Frame Rates
• Standby mode <500 nA (typical)
• Active mode <12 uA possible
Communication Interface:
•I2C™ (up to 400 kbps)
• Both Polling and Interrupt Schemes Supported
• Sync Signal Allows for Host Frame Detection
• Field Upgradeable over I
2
C
Operating Conditions:
• 1.8V to 3.6V, -40°C to +85°C
Package Types:
• 28-Pin SSOP
• 28-Pin UQFN
Touch Sensor Support:
• Up to 15 Channels
• Sensor Sizes up to 120 mm (4.7”)
• Individual Channel Tuning for Optimal Sensitivity
• Works with Printed Circuit Board (PCB) Sensors,
Film, Glass and Flexible Printed Circuit (FPC)
Sensors
Cover Layer Support:
• Plastic: up to 3 mm
• Glass: up to 5 mm
Touch Performance:
• >200 Reports per Second (configurable)
• 12-Bit Resolution Coordinate Reporting
2014 Microchip Technology Inc. DS40001750A-page 1
MTCH6102
Table of Contents
1.0 MTCH6102 Block Diagram........................................................................................................................................................... 3
2.0 Pin Diagrams................................................................................................................................................................................ 4
3.0 MTCH6102 Pinout Description..................................................................................................................................................... 5
4.0 Layout........................................................................................................................................................................................... 6
5.0 Communication ............................................................................................................................................................................ 8
6.0 Sensor Design Considerations................................................................................................................................................... 10
7.0 Operating Modes........................................................................................................................................................................ 13
8.0 Controller Commands ................................................................................................................................................................ 15
9.0 Touch Frame Control ................................................................................................................................................................. 16
10.0 Touch Data Registers................................................................................................................................................................. 17
11.0 Acquisition and Touch Parameters ............................................................................................................................................ 18
12.0 Compensation RAM ................................................................................................................................................................... 20
13.0 Baseline...................................................................................................................................................................................... 21
14.0 Gesture Features and Parameters ............................................................................................................................................. 22
15.0 Configuring a Non-Default Application ....................................................................................................................................... 26
16.0 Manufacturing Testing ................................................................................................................................................................ 27
17.0 Memory Map .............................................................................................................................................................................. 28
18.0 Electrical Characteristics ............................................................................................................................................................ 31
19.0 Ordering Information .................................................................................................................................................................. 35
20.0 Packaging Information................................................................................................................................................................ 36
The Microchip Web Site........................................................................................................................................................................ 43
Customer Change Notification Service................................................................................................................................................. 43
Customer Support ............................................................................................................................................................................... 43
Worldwide Sales and Service............................................................................................................................................................... 45
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DS40001750A-page 2 2014 Microchip Technology Inc.
1.0 MTCH6102 BLOCK DIAGRAM
I2C
dD
CONFIGURATION
RAM
TOUCH
RAM
ACQUISITION
RAM
CVD ACQUISITION
ENGINE
TOUCH
DECODING
GESTURE
ENGINE
CORE RAM
TIMING ENGINE
RX Sensor
Channels
Host
Controller
SYNC
INT
Host
Controller
Host
Controller
FIGURE 1-1: MTCH6102 BLOCK DIAGRAM
MTCH6102
2014 Microchip Technology Inc. DS40001750A-page 3
MTCH6102
MTCH6102
RX11
RX12
NC
RX13
V
SS
NC
NC
RX10
RX9
RESETNCNC
RX8
RX7
RX6
RX5
RX4
RX3
V
DD
V
SS
RX2
INT
SYNC
RX14
SCL
SDA
RX0
RX1
28272625242322
8
9
1011121314
1
2
3
4
5
6
7
21
20
19
18
17
16
15
MTCH6102
RESET
RX9
RX10
RX11
RX12
NC
RX13
V
SS
NC
NC
INT
SYNC
RX14
SCL
NC
NC
RX8
RX7
RX6
RX5
RX4
RX3
V
DD
V
SS
RX2
RX1
RX0
SDA
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
2.0 PIN DIAGRAMS
FIGURE 2-1: 28-PIN UQFN (4X4)
FIGURE 2-2: 28-PIN SSOP
DS40001750A-page 4 2014 Microchip Technology Inc.
MTCH6102
3.0 MTCH6102 PINOUT DESCRIPTION
TABLE 3-1: MTCH6102 PINOUT DESCRIPTION
Pin Name UQFN Pin SSOP Pin Pin Type Description
RESET 26 1 I Master Reset with Internal Pull-up
SCL 11 14 I/O I
SDA 12 15 I/O I2C Data Input/Output
INT 8 11 O Interrupt Request Output
SYNC 9 12 O Synchronous Frame Output
RX0 13 16 I/O Touch Sensor Channel Input
RX1 14 17 I/O
RX2 15 18 I/O
RX3 18 21 I/O
RX4 19 22 I/O
RX5 20 23 I/O
RX6 21 24 I/O
RX7 22 25 I/O
RX8 23 26 I/O
RX9 27 2 I/O
RX10 28 3 I/O
RX11 1 4 I/O
RX12 2 5 I/O
RX13 4 7 I/O
RX14 10 13 I/O
V
DD 17 20 Power Positive Supply
V
SS 5,16 8,19 Power Ground Reference
N/C 3, 6, 7, 24, 25 6, 9, 10, 27, 28 N/C No Connect
2
C™ Clock
2014 Microchip Technology Inc. DS40001750A-page 5
MTCH6102
MTCH6102
RX11
RX12
NC
RX13
V
SS
NC
NC
RX10
RX9
RESET
NC
NC
RX8
RX7
RX6
RX5
RX4
RX3
V
DD
V
SS
RX2
INT
SYNC
RX14
SCL
SDA
RX0
RX1
28272625242322
891011121314
1
2
3
4
5
6
7
21
20
19
18
17
16
15
0.1ʅF
10ʅF
V
20k
4.7k1.8k
V
V
Host Controller
V
4.0 LAYOUT
FIGURE 4-1: TYPICAL APPLICATION CIRCUIT
DS40001750A-page 6 2014 Microchip Technology Inc.
4.1 Decoupling Capacitors
The use of decoupling capacitors on power-supply
pins, such as V
following criteria when using decoupling capacitors:
1. Value and type of capacitor:
A value of 0.1 µF (100 nF), 10-20V is recommended.
The capacitor should be a low Equivalent Series
Resistance (low ESR) capacitor and have resonance
frequency in the range of 20 MHz and higher. It is
further recommended that ceramic capacitors be used.
2. Placement on the Printed Circuit Board:
The decoupling capacitors should be placed as close to
the pins as possible. It is recommended that the
capacitors be placed on the same side of the board as
the device. If space is constricted, the capacitor can be
placed on another layer on the PCB using a via;
however, ensure that the trace length from the pin to
the capacitor is within one-quarter inch (6 mm) in
length.
3. Handling high-frequency noise:
If the board is experiencing high-frequency noise,
upward of tens of MHz, add a second ceramic-type
capacitor in parallel to the above-described decoupling
capacitor. The value of the second capacitor can be in
the range of 0.01 µF to 0.001 µF. Place this second
capacitor next to the primary decoupling capacitor. In
high-speed circuit designs, consider implementing a
decade pair of capacitances as close to the power and
ground pins as possible (for example, 0.1 µF in parallel
with 0.001 µF).
4. Maximizing performance:
On the board layout from the power supply circuit, run
the power and return traces to the decoupling
capacitors first, and then to the device pins. This
ensures that the decoupling capacitors are first in the
power chain. It is equally important to keep the trace
length between the capacitor and the power pins to a
minimum, thereby reducing PCB track inductance.
DD and VSS, is required. Consider the
MTCH6102
4.2 Bulk Capacitors
The use of a bulk capacitor is recommended to improve
power-supply stability. Typical values range from
4.7 µF to 47 µF. This capacitor should be located as
close to the device as possible.
2014 Microchip Technology Inc. DS40001750A-page 7
MTCH6102
DATA
IN
DATA
IN
... P
SR I2CADDR R
DATA
OUT
... PDATA
OUT
S I2CADDR W REGADDR
Write
Read
S W
R
P I2CADDR
REGADDR
Start Condition Write Bit
Read Bit
Stop Condition
SR Restart Condition
I2CTM Device Address (ďŝƚ7)
Register Address
S
0x25 W
ACK
0x04 0x80
P
/
ϮCdD
ACK ACK
Address
Data
S
0x25 W
ACK
SR
0x10 0x25 R
ACK
0x01
NK
P
INT
I
ϮCdD
ACK
Address Data
5.0 COMMUNICATION
5.1 I2C Pin Specification
5.1.1 DESCRIPTION
The MTCH6102 low-power projected capacitive touch
controller uses a standard register-based read/write
2
C protocol based upon the memory map. This
I
protocol is similar to many other devices such as
temperature sensors and serial EEPROMs. Although
data can be read at any time (polling), an interrupt pin
(INT) is provided for flexible integration options.
FIGURE 5-1: I2C™ TRANSACTION DIAGRAM
5.1.2 READING/WRITING REGISTERS
To access memory (both to read or write), the I2C
transaction must start by addressing the chip with the
Write bit set, then writing out a single byte of data
representing the memory address to be operated on.
After that, the host can choose to do either of the
following (see Figure 5-1):
1. To write memory, continue writing [n] data bytes
(see Figure 5-2).
2. To read memory, restart the I
either a Stop-Start or Restart), then address the
chip with the Read bit set. Continue to read in [n]
data bytes (see Figure 5-3).
During either of these transactions, multiple bytes
within the same block may be read or written due to the
device’s address auto-increment feature. See
Section 17.0 “Memory Map” for block separation.
2
C transaction (via
FIGURE 5-2: EXAMPLE I
FIGURE 5-3: EXAMPLE I
DS40001750A-page 8 2014 Microchip Technology Inc.
2
C™ WRITE TRANSACTION
2
C™ READ TRANSACTION
MTCH6102
I2C
dD
INT
SYNC
b
a
c
d
e
f
g
j
hi
a Controller sleeping f INT is released as controller goes to Sleep
b Controller decoding g INT is asserted due to (d)
c Touch frame h INT is released due to I
2
C™ read
d Finger is present i INT is released due to I2C™ read
e INT asserted due to (d) j Finger is not present
5.1.3 DEVICE ADDRESSING
The MTCH6102 default 7-bit base address is 0x25.
Every transmission must be prefixed with this address,
as well as a bit signifying whether the transmission is a
master write (‘0’) or master read (‘1’). After appending
this Read/Write bit to the base address, this first byte
becomes either 0x4A (write) or 0x4B (read).
2
This address can be modified (see I
requires initially communicating with the device under
the default address. If this is not feasible in the user’s
application, contact Microchip support for additional
options.
CADDR), but this
FIGURE 5-4: EXAMPLE INT/SYNC LOGIC
5.2 Interrupt Pin
MTCH6102 provides an open-collector active-low
Interrupt pin (INT) that will be asserted any time new
data is available. INT is automatically released under
two conditions:
1. A read is performed of any register within the
device.
2. The next frame of decoding has started.
5.3 SYNC Output Pin
MTCH6102 provides an active-high sync signal that
correlates with the current touch frame status. The
SYNC pin is low while the device is sleeping (between
frames) and high while touch sensing/decoding is
occurring. A common use of this pin includes a host
that makes use of data on every frame (such as
raw-acquisition data), for host-side decoding (see
Figure 5-4).
2014 Microchip Technology Inc. DS40001750A-page 9
MTCH6102
b
a
Dim. Typ. Min. Max.
a 6 mm 4 mm 10 mm
b 0.2 mm — 0.5 mm
6.0 SENSOR DESIGN CONSIDERATIONS
6.1 General Guidelines
FIGURE 6-1: DIAMOND DIMENSION
GUIDELINES
6.1.3 OPERATION WITH AN LCD
MTCH6102 has integrated algorithms to detect and
minimize the effects of noise, but proper care should
always be taken in selecting an LCD and support
components with a focus on reducing noise as much as
possible. Since the interaction between the touch
sensor and display is highly dependent upon the
physical arrangement of the components, proper
testing should always be executed with a fully
integrated device. Please reference the appropriate
projected capacitive touch screen manufacturer’s
integration guide for additional design considerations.
6.1.1 PROTOTYPING DESIGNS
Touch sensor designs typically require a thorough
debugging phase to ensure a reliable product. If
possible, it is suggested that flexible prototyping
hardware be created with this in mind. A common
example is providing external access to the
communication lines for quick test and tuning while
in-circuit.
6.1.2 SENSOR OVERLAY MATERIAL
To prevent saturation of sensor levels, a minimum
overlay of 0.5 mm plastic or glass is required for proper
operation of the device, even during a prototyping
phase, even if this value is different than the final
design.
Note: At no time should the device be expected
to respond correctly to a user touching a
bare PCB sensor.
DS40001750A-page 10 2014 Microchip Technology Inc.
MTCH6102
6.2 Sensor Layout Configuration
TABLE 6-1: REGISTERS ASSOCIATED WITH SENSOR LAYOUT CONFIGURATION
Address Name Description
0x20 NUMBEROFXCHANNELS Number of channels used for X axis
0x21 NUMBEROFYCHANNELS Number of channels used for Y axis
MTCH6102 is designed to work with sensors with a
minimum of 3x3 sensor channels, and a total maximum
of 15 channels. The number of channels on each axis
is governed by the registers in Tab le 6 -1 . For all sensor
configurations, the following conditions must be met:
1. Channel layout must start at RX0.
2. Each axis must have the associated channels in
either ascending or descending order.
3. No unconnected channel pins are allowed in the
middle of a layout.
Table 6-2 shows an example of each rule being broken
by a 6x5 sensor layout, followed by the correct layout
in the last column.
TABLE 6-2: EXAMPLE OF INCORRECT
6X5 SENSOR CONNECTIONS
(1) (2) (3) Correct
RX0
RX1
RX2
RX3
RX4 X0
RX5 X1 X5 X5
RX6 X2 Y0
RX7 X3
RX8 X4
RX9 X5 Y3 Y1
RX10 Y0 Y4 Y2
RX11 Y1
RX12 Y2
RX13 Y3 Y4
RX14 Y4
X0 X0 X0
X1 X1 X1
X2 X2 X2
X4 X3 X3
X3 X4 X4
X5
Y0
Y2 Y1
Y1 Y0 Y2
Y3
Y4
Y3
6.3 Sensor Output Resolution
MTCH6102 interpolates 64 discrete points between
each channel and 32 points past the centerline of each
edge. As a result, the maximum value in the TOUCHX
and TOUCHY registers will be
(64xNUMBEROFCHANNELS) on each axis. For the
default 9x6 sensor, this results in a maximum resolution
of 576x384.
2014 Microchip Technology Inc. DS40001750A-page 11
MTCH6102
RX0 RX8
RX9
RX14
(0,0)
(0,384)
(576,0)
(576,384)
RX0 RX8
RX14
RX9
(0,0)
(0,384)
(576,0)
(576,384)
RX8 RX0
RX9
RX14
(0,0)
(0,384)
(576,0)
(576,384)
RX8 RX0
RX14
RX9
(0,0)
(0,384)
(576,0)
(576,384)
6.4 Sensor Orientation
To aid in PCB layout, the sensor can be oriented in any
direction, have either axis reversed, or even have the
axes swapped. The host controller must take into
account the X/Y output and gesture orientation based
on Figure 6-2.
FIGURE 6-2: SENSOR ORIENTATION EXAMPLES
DS40001750A-page 12 2014 Microchip Technology Inc.
MTCH6102
7.0 OPERATING MODES
MTCH6102 operates in multiple modes (see Table 7-1)
governed by the MODE register (see Register 7-1).
TABLE 7-1: OPERATING MODE DESCRIPTIONS
Mode
Name
Full Full X/Y and gesture decoding occurs (Default mode) Asserted if touch is present or if a change in
Touch Full X/Y decoding only Asserted if touch is present or if a change in
Gesture Full X/Y and gesture decoding occurs, but INT is no
longer asserted for touch data
Raw Raw-capacitance signals are stored in RAWADC
registers, no decoding done. Channel selection and
type of measurement is governed by the MODECON
register
Standby Device is no longer sensing or performing baseline
tasks
Note 1: Data in TOUCH registers is still valid.
Description INT Behavior
touch status or a gesture have occurred
touch status occurs
Asserted for gestures only
None
None
(1)
REGISTER 7-1: MODE: TOUCH DECODE MODE REGISTER
U-x U-x U-x U-x R/W-0 R/W-0 R/W-1 R/W-1
— — — — MODE<3:0>
bit 7 bit 0
Legend:
R = Readable bit ‘1’ = Bit is set x = Bit is unknown -n = Value after initialization
(default)
W = Writable bit ‘0’ = Bit is cleared U = Unimplemented bit q = Conditional
bit 7-4 Unimplemented: Read as ‘0’
bit 3-0 MODE<3:0>: Touch Decoding mode bits
0000 = Standby
0001 = Gesture
0010 = Touch only
0011 = Full (touch and gesture)
01XX =Raw ADC
2014 Microchip Technology Inc. DS40001750A-page 13
MTCH6102
REGISTER 7-2: MODECON: RAWADC MODE CONTROL REGISTER
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
TYPE<3:0> CH<3:0>
bit 7 bit 0
Legend:
R = Readable bit ‘1’ = Bit is set x = Bit is unknown -n = Value after initialization
(default)
W = Writable bit ‘0’ = Bit is cleared U = Unimplemented bit q = Conditional
bit 7-4 TYPE<3:0>: CVD Result Arithmetic bits
0000 = (1023 – Result1) + Result 2
0001 = Result 1 only
0010 = Result 2 only
bit 3-0 CH<3:0>: RX Sense Channel bits
0000 =RX0
..
..
1110 =RX14
1111 = Reserved, do not use
DS40001750A-page 14 2014 Microchip Technology Inc.
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