Datasheet MTCH6102 Datasheet

MTCH6102

MTCH6102 Low-Power Projected Capacitive Touch Controller

Description:

Microchip’s MTCH6102 is a turnkey projected
capacitive touch controller that simplifies adding
gestures to touch interface designs with
industry-leading low-power performance. It utilizes up
to 15 channels to support taps, swipes, and scrolling on
XY touch pads and touch screens. MTCH6102 allows
designers to quickly and easily integrate projected
capacitive touch into their cost-sensitive, low-power
application. MTCH6102 provides developers with a
flexible touch-sensing solution to optimize common
constraints of size, power and cost that are critical to
applications such as wearable devices, remote
controls, gaming devices and track pads.

Applications:

• Wearable Devices such as Headphones,
Watches, Fitness Wristbands

• Track Pads and Computer Peripherals

• Input Devices with Configurable Button, Keypad
or Scrolling Functions

• Any Interface with Single-Finger Gestures to
Swipe, Scroll, or Doubletap Controls

• Home Automation Control Panels

• Security Control Keypads

• Automotive Center Stack Controls

• Gaming Devices

• Remote Control Touch Pads

Touch Features:

• Gesture Detection and Reporting

• Self-Capacitance Signal Acquisition

• Multiple Built-in Filtering Options

Power Management:

• Configurable Sleep/Idle Frame Rates

• Standby mode <500 nA (typical)

• Active mode <12 uA possible

Communication Interface:

•I2C™ (up to 400 kbps)

• Both Polling and Interrupt Schemes Supported

• Sync Signal Allows for Host Frame Detection

• Field Upgradeable over I

2

C

Operating Conditions:

• 1.8V to 3.6V, -40°C to +85°C

Package Types:

• 28-Pin SSOP

• 28-Pin UQFN

Touch Sensor Support:

• Up to 15 Channels

• Sensor Sizes up to 120 mm (4.7”)

• Individual Channel Tuning for Optimal Sensitivity

• Works with Printed Circuit Board (PCB) Sensors,
Film, Glass and Flexible Printed Circuit (FPC)
Sensors

Cover Layer Support:

• Plastic: up to 3 mm

• Glass: up to 5 mm

Touch Performance:

• >200 Reports per Second (configurable)

• 12-Bit Resolution Coordinate Reporting

 2014 Microchip Technology Inc. DS40001750A-page 1

MTCH6102

Table of Contents

1.0 MTCH6102 Block Diagram........................................................................................................................................................... 3

2.0 Pin Diagrams................................................................................................................................................................................ 4

3.0 MTCH6102 Pinout Description..................................................................................................................................................... 5

4.0 Layout........................................................................................................................................................................................... 6

5.0 Communication ............................................................................................................................................................................ 8

6.0 Sensor Design Considerations................................................................................................................................................... 10

7.0 Operating Modes........................................................................................................................................................................ 13

8.0 Controller Commands ................................................................................................................................................................ 15

9.0 Touch Frame Control ................................................................................................................................................................. 16

10.0 Touch Data Registers................................................................................................................................................................. 17

11.0 Acquisition and Touch Parameters ............................................................................................................................................ 18

12.0 Compensation RAM ................................................................................................................................................................... 20

13.0 Baseline...................................................................................................................................................................................... 21

14.0 Gesture Features and Parameters ............................................................................................................................................. 22

15.0 Configuring a Non-Default Application ....................................................................................................................................... 26

16.0 Manufacturing Testing ................................................................................................................................................................ 27

17.0 Memory Map .............................................................................................................................................................................. 28

18.0 Electrical Characteristics ............................................................................................................................................................ 31

19.0 Ordering Information .................................................................................................................................................................. 35

20.0 Packaging Information................................................................................................................................................................ 36

The Microchip Web Site........................................................................................................................................................................ 43

Customer Change Notification Service................................................................................................................................................. 43

Customer Support ............................................................................................................................................................................... 43

Worldwide Sales and Service............................................................................................................................................................... 45

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DS40001750A-page 2  2014 Microchip Technology Inc.

1.0 MTCH6102 BLOCK DIAGRAM

I2C

dD

CONFIGURATION

RAM

TOUCH

RAM

ACQUISITION

RAM

CVD ACQUISITION

ENGINE

TOUCH

DECODING

GESTURE

ENGINE

CORE RAM

TIMING ENGINE

RX Sensor

Channels

Host

Controller

SYNC

INT

Host

Controller

Host

Controller

FIGURE 1-1: MTCH6102 BLOCK DIAGRAM

MTCH6102

 2014 Microchip Technology Inc. DS40001750A-page 3

MTCH6102

MTCH6102

RX11
RX12

NC

RX13

V

SS

NC
NC

RX10

RX9

RESETNCNC

RX8

RX7

RX6
RX5
RX4
RX3

V

DD

V

SS

RX2

INT

SYNC

RX14

SCL

SDA

RX0

RX1

28272625242322

8

9

1011121314

1
2
3
4
5
6
7

21
20
19
18
17
16
15

MTCH6102

RESET

RX9
RX10
RX11
RX12

NC

RX13

V

SS

NC
NC

INT
SYNC
RX14

SCL

NC
NC
RX8
RX7
RX6
RX5
RX4
RX3

V

DD

V

SS

RX2
RX1
RX0
SDA

1
2
3
4
5
6
7
8
9
10
11
12
13
14

28
27
26
25
24
23
22
21
20
19
18
17
16
15

2.0 PIN DIAGRAMS

FIGURE 2-1: 28-PIN UQFN (4X4)

FIGURE 2-2: 28-PIN SSOP

DS40001750A-page 4  2014 Microchip Technology Inc.

MTCH6102

3.0 MTCH6102 PINOUT DESCRIPTION

TABLE 3-1: MTCH6102 PINOUT DESCRIPTION

Pin Name UQFN Pin SSOP Pin Pin Type Description

RESET 26 1 I Master Reset with Internal Pull-up

SCL 11 14 I/O I

SDA 12 15 I/O I2C Data Input/Output

INT 8 11 O Interrupt Request Output

SYNC 9 12 O Synchronous Frame Output

RX0 13 16 I/O Touch Sensor Channel Input

RX1 14 17 I/O

RX2 15 18 I/O

RX3 18 21 I/O

RX4 19 22 I/O

RX5 20 23 I/O

RX6 21 24 I/O

RX7 22 25 I/O

RX8 23 26 I/O

RX9 27 2 I/O

RX10 28 3 I/O

RX11 1 4 I/O

RX12 2 5 I/O

RX13 4 7 I/O

RX14 10 13 I/O

V

DD 17 20 Power Positive Supply

V

SS 5,16 8,19 Power Ground Reference

N/C 3, 6, 7, 24, 25 6, 9, 10, 27, 28 N/C No Connect

2

C™ Clock

 2014 Microchip Technology Inc. DS40001750A-page 5

MTCH6102

MTCH6102

RX11
RX12
NC
RX13

V

SS

NC
NC

RX10

RX9

RESET

NC

NC

RX8

RX7

RX6
RX5
RX4
RX3

V

DD

V

SS

RX2

INT

SYNC

RX14

SCL

SDA

RX0

RX1

28272625242322

891011121314

1
2
3
4
5
6
7

21
20
19
18
17
16
15

0.1ʅF

10ʅF

V



20k

4.7k1.8k

V



V



Host Controller

V



4.0 LAYOUT

FIGURE 4-1: TYPICAL APPLICATION CIRCUIT

DS40001750A-page 6  2014 Microchip Technology Inc.

4.1 Decoupling Capacitors

The use of decoupling capacitors on power-supply
pins, such as V
following criteria when using decoupling capacitors:

1. Value and type of capacitor:

A value of 0.1 µF (100 nF), 10-20V is recommended.
The capacitor should be a low Equivalent Series
Resistance (low ESR) capacitor and have resonance
frequency in the range of 20 MHz and higher. It is
further recommended that ceramic capacitors be used.

2. Placement on the Printed Circuit Board:

The decoupling capacitors should be placed as close to
the pins as possible. It is recommended that the
capacitors be placed on the same side of the board as
the device. If space is constricted, the capacitor can be
placed on another layer on the PCB using a via;
however, ensure that the trace length from the pin to
the capacitor is within one-quarter inch (6 mm) in
length.

3. Handling high-frequency noise:

If the board is experiencing high-frequency noise,
upward of tens of MHz, add a second ceramic-type
capacitor in parallel to the above-described decoupling
capacitor. The value of the second capacitor can be in
the range of 0.01 µF to 0.001 µF. Place this second
capacitor next to the primary decoupling capacitor. In
high-speed circuit designs, consider implementing a
decade pair of capacitances as close to the power and
ground pins as possible (for example, 0.1 µF in parallel
with 0.001 µF).

4. Maximizing performance:

On the board layout from the power supply circuit, run
the power and return traces to the decoupling
capacitors first, and then to the device pins. This
ensures that the decoupling capacitors are first in the
power chain. It is equally important to keep the trace
length between the capacitor and the power pins to a
minimum, thereby reducing PCB track inductance.

DD and VSS, is required. Consider the

MTCH6102

4.2 Bulk Capacitors

The use of a bulk capacitor is recommended to improve
power-supply stability. Typical values range from

4.7 µF to 47 µF. This capacitor should be located as

close to the device as possible.

 2014 Microchip Technology Inc. DS40001750A-page 7

MTCH6102

DATA

IN

DATA

IN

... P

SR I2CADDR R

DATA

OUT

... PDATA

OUT

S I2CADDR W REGADDR

Write

Read

S W

R

P I2CADDR

REGADDR

Start Condition Write Bit

Read Bit

Stop Condition

SR Restart Condition

I2CTM Device Address (ďŝƚ7)

Register Address

S

0x25 W

ACK

0x04 0x80

P

/

ϮCdD

ACK ACK

Address

Data

S

0x25 W

ACK

SR

0x10 0x25 R

ACK

0x01

NK

P

INT

I

ϮCdD

ACK

Address Data

5.0 COMMUNICATION

5.1 I2C Pin Specification

5.1.1 DESCRIPTION

The MTCH6102 low-power projected capacitive touch
controller uses a standard register-based read/write

2

C protocol based upon the memory map. This

I
protocol is similar to many other devices such as
temperature sensors and serial EEPROMs. Although
data can be read at any time (polling), an interrupt pin
(INT) is provided for flexible integration options.

FIGURE 5-1: I2C™ TRANSACTION DIAGRAM

5.1.2 READING/WRITING REGISTERS

To access memory (both to read or write), the I2C
transaction must start by addressing the chip with the
Write bit set, then writing out a single byte of data
representing the memory address to be operated on.
After that, the host can choose to do either of the
following (see Figure 5-1):

1. To write memory, continue writing [n] data bytes
(see Figure 5-2).

2. To read memory, restart the I
either a Stop-Start or Restart), then address the
chip with the Read bit set. Continue to read in [n]
data bytes (see Figure 5-3).

During either of these transactions, multiple bytes
within the same block may be read or written due to the
device’s address auto-increment feature. See

Section 17.0 “Memory Map” for block separation.

2

C transaction (via

FIGURE 5-2: EXAMPLE I

FIGURE 5-3: EXAMPLE I

DS40001750A-page 8  2014 Microchip Technology Inc.

2

C™ WRITE TRANSACTION

2

C™ READ TRANSACTION

MTCH6102

I2C

dD

INT

SYNC

b

a

c

d

e

f

g

j

hi

a Controller sleeping f INT is released as controller goes to Sleep

b Controller decoding g INT is asserted due to (d)

c Touch frame h INT is released due to I

2

C™ read

d Finger is present i INT is released due to I2C™ read

e INT asserted due to (d) j Finger is not present

5.1.3 DEVICE ADDRESSING

The MTCH6102 default 7-bit base address is 0x25.
Every transmission must be prefixed with this address,
as well as a bit signifying whether the transmission is a
master write (‘0’) or master read (‘1’). After appending
this Read/Write bit to the base address, this first byte
becomes either 0x4A (write) or 0x4B (read).

2

This address can be modified (see I
requires initially communicating with the device under
the default address. If this is not feasible in the user’s
application, contact Microchip support for additional
options.

CADDR), but this

FIGURE 5-4: EXAMPLE INT/SYNC LOGIC

5.2 Interrupt Pin

MTCH6102 provides an open-collector active-low
Interrupt pin (INT) that will be asserted any time new
data is available. INT is automatically released under
two conditions:

1. A read is performed of any register within the

device.

2. The next frame of decoding has started.

5.3 SYNC Output Pin

MTCH6102 provides an active-high sync signal that
correlates with the current touch frame status. The
SYNC pin is low while the device is sleeping (between
frames) and high while touch sensing/decoding is
occurring. A common use of this pin includes a host
that makes use of data on every frame (such as
raw-acquisition data), for host-side decoding (see

Figure 5-4).

 2014 Microchip Technology Inc. DS40001750A-page 9

MTCH6102

b

a

Dim. Typ. Min. Max.

a 6 mm 4 mm 10 mm

b 0.2 mm — 0.5 mm

6.0 SENSOR DESIGN CONSIDERATIONS

6.1 General Guidelines

FIGURE 6-1: DIAMOND DIMENSION

GUIDELINES

6.1.3 OPERATION WITH AN LCD

MTCH6102 has integrated algorithms to detect and
minimize the effects of noise, but proper care should
always be taken in selecting an LCD and support
components with a focus on reducing noise as much as
possible. Since the interaction between the touch
sensor and display is highly dependent upon the
physical arrangement of the components, proper
testing should always be executed with a fully
integrated device. Please reference the appropriate
projected capacitive touch screen manufacturer’s
integration guide for additional design considerations.

6.1.1 PROTOTYPING DESIGNS

Touch sensor designs typically require a thorough
debugging phase to ensure a reliable product. If
possible, it is suggested that flexible prototyping
hardware be created with this in mind. A common
example is providing external access to the
communication lines for quick test and tuning while
in-circuit.

6.1.2 SENSOR OVERLAY MATERIAL

To prevent saturation of sensor levels, a minimum
overlay of 0.5 mm plastic or glass is required for proper
operation of the device, even during a prototyping
phase, even if this value is different than the final
design.

Note: At no time should the device be expected

to respond correctly to a user touching a
bare PCB sensor.

DS40001750A-page 10  2014 Microchip Technology Inc.

MTCH6102

6.2 Sensor Layout Configuration

TABLE 6-1: REGISTERS ASSOCIATED WITH SENSOR LAYOUT CONFIGURATION

Address Name Description

0x20 NUMBEROFXCHANNELS Number of channels used for X axis

0x21 NUMBEROFYCHANNELS Number of channels used for Y axis

MTCH6102 is designed to work with sensors with a
minimum of 3x3 sensor channels, and a total maximum
of 15 channels. The number of channels on each axis
is governed by the registers in Tab le 6 -1 . For all sensor
configurations, the following conditions must be met:

1. Channel layout must start at RX0.

2. Each axis must have the associated channels in
either ascending or descending order.

3. No unconnected channel pins are allowed in the
middle of a layout.

Table 6-2 shows an example of each rule being broken

by a 6x5 sensor layout, followed by the correct layout
in the last column.

TABLE 6-2: EXAMPLE OF INCORRECT

6X5 SENSOR CONNECTIONS

(1) (2) (3) Correct

RX0

RX1

RX2

RX3

RX4 X0

RX5 X1 X5 X5

RX6 X2 Y0

RX7 X3

RX8 X4

RX9 X5 Y3 Y1

RX10 Y0 Y4 Y2

RX11 Y1

RX12 Y2

RX13 Y3 Y4

RX14 Y4

X0 X0 X0

X1 X1 X1

X2 X2 X2

X4 X3 X3

X3 X4 X4

X5

Y0

Y2 Y1

Y1 Y0 Y2

Y3

Y4

Y3

6.3 Sensor Output Resolution

MTCH6102 interpolates 64 discrete points between
each channel and 32 points past the centerline of each
edge. As a result, the maximum value in the TOUCHX
and TOUCHY registers will be
(64xNUMBEROFCHANNELS) on each axis. For the
default 9x6 sensor, this results in a maximum resolution
of 576x384.

 2014 Microchip Technology Inc. DS40001750A-page 11

MTCH6102

RX0 RX8

RX9

RX14

(0,0)

(0,384)

(576,0)

(576,384)

RX0 RX8

RX14

RX9

(0,0)

(0,384)

(576,0)

(576,384)

RX8 RX0

RX9

RX14

(0,0)

(0,384)

(576,0)

(576,384)

RX8 RX0

RX14

RX9

(0,0)

(0,384)

(576,0)

(576,384)

6.4 Sensor Orientation

To aid in PCB layout, the sensor can be oriented in any
direction, have either axis reversed, or even have the
axes swapped. The host controller must take into
account the X/Y output and gesture orientation based
on Figure 6-2.

FIGURE 6-2: SENSOR ORIENTATION EXAMPLES

DS40001750A-page 12  2014 Microchip Technology Inc.

MTCH6102

7.0 OPERATING MODES

MTCH6102 operates in multiple modes (see Table 7-1)
governed by the MODE register (see Register 7-1).

TABLE 7-1: OPERATING MODE DESCRIPTIONS

Mode
Name

Full Full X/Y and gesture decoding occurs (Default mode) Asserted if touch is present or if a change in

Touch Full X/Y decoding only Asserted if touch is present or if a change in

Gesture Full X/Y and gesture decoding occurs, but INT is no

longer asserted for touch data

Raw Raw-capacitance signals are stored in RAWADC

registers, no decoding done. Channel selection and
type of measurement is governed by the MODECON
register

Standby Device is no longer sensing or performing baseline

tasks

Note 1: Data in TOUCH registers is still valid.

Description INT Behavior

touch status or a gesture have occurred

touch status occurs

Asserted for gestures only

None

None

(1)

REGISTER 7-1: MODE: TOUCH DECODE MODE REGISTER

U-x U-x U-x U-x R/W-0 R/W-0 R/W-1 R/W-1

— — — — MODE<3:0>

bit 7 bit 0

Legend:

R = Readable bit ‘1’ = Bit is set x = Bit is unknown -n = Value after initialization

(default)

W = Writable bit ‘0’ = Bit is cleared U = Unimplemented bit q = Conditional

bit 7-4 Unimplemented: Read as ‘0’

bit 3-0 MODE<3:0>: Touch Decoding mode bits

0000 = Standby
0001 = Gesture
0010 = Touch only
0011 = Full (touch and gesture)
01XX =Raw ADC

 2014 Microchip Technology Inc. DS40001750A-page 13

MTCH6102

REGISTER 7-2: MODECON: RAWADC MODE CONTROL REGISTER

R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

TYPE<3:0> CH<3:0>

bit 7 bit 0

Legend:

R = Readable bit ‘1’ = Bit is set x = Bit is unknown -n = Value after initialization

(default)

W = Writable bit ‘0’ = Bit is cleared U = Unimplemented bit q = Conditional

bit 7-4 TYPE<3:0>: CVD Result Arithmetic bits

0000 = (1023 – Result1) + Result 2
0001 = Result 1 only
0010 = Result 2 only

bit 3-0 CH<3:0>: RX Sense Channel bits

0000 =RX0
..
..

1110 =RX14
1111 = Reserved, do not use

DS40001750A-page 14  2014 Microchip Technology Inc.

MTCH6102

8.0 CONTROLLER COMMANDS

Various controller commands can be initiated by writing
a ‘1’ to the appropriate bit in the CMD register
(Register 8-1). This bit will automatically be cleared
after the command has been completed.

REGISTER 8-1: CMD: COMMAND REGISTER

R/W-0 R/W-0 R/W-0 U-x R/W-0 U-x U-x R/W-0

NV DEF CFG —MFG — —BS

bit 7 bit 0

Legend:

R = Readable bit ‘1’ = Bit is set x = Bit is unknown -n = Value after initialization

(default)

W = Writable bit ‘0’ = Bit is cleared U = Unimplemented bit q = Conditional

bit 7 NV: Nonvolatile Storage Write bit

bit 6 DEF: Restore Controller to Default Configuration Values bit

bit 5 CFG: Configure Controller bit (after parameters have been changed)

bit 4 Unimplemented: Read as ‘0’

bit 3 MFG: Execute Manufacturing Test bit

bit 2-1 Unimplemented: Read as ‘0’

bit 0 BS: Force Baseline bit (recalibration) to occur

 2014 Microchip Technology Inc. DS40001750A-page 15

MTCH6102

Duration ms1000

31

-------------------------------------------------------





1 PERIOD=+

Touch Present

SYNC

Up Timer (4)

Down Timer (2)

IdleTimer (5)

TCH bit

0 5

0 101201

2 3 3301233 0100000

455 45555545555454321

00

0

000000000005 5555 555432

000000000

0

0

0

1

05555555

INT

IDLETIMEOUT (5)DEBOUNCEUP (4)DEBOUNCEDOWN (2)

9.0 TOUCH FRAME CONTROL

Touch decoding is based around the concept of a touch
frame that begins with acquisition, followed by
decoding of the acquired values, and lastly a Sleep
phase for power savings. The duration of the touch
frame is governed by the current touch state, as well as
the timing registers outlined in this section (see

Table 9-1). Figure 9-1 shows the interaction between

these registers during a typical touch cycle.

TABLE 9-1: REGISTERS ASSOCIATED

WITH TOUCH FRAME
CONTROL

Address Name Description

0x25 ACTIVEPERIODL Active Period

0x26 ACTIVEPERIODH

0x27 IDLEPERIODL Idle Period

0x28 IDLEPERIODH

0x29 IDLETIMEOUT Idle Timeout

0x2B DEBOUNCEUP Liftoff Debounce

0x2C DEBOUNCEDOWN Touch Down

Debounce

Both active and idle period calculations are as shown
in Equation 9-1.

EQUATION 9-1:

Typical frame rates have been computed for the user’s
convenience and are shown in Tab le 9- 2.

TABLE 9-2: EXAMPLE FRAME RATE

PERIOD CALCULATIONS

Desired Rate

(ms)

10 0x0142

20 0x0284

50 0x064C

100 0x0C99

Period

FIGURE 9-1: TOUCH FRAME TIMING

DS40001750A-page 16  2014 Microchip Technology Inc.

MTCH6102

10.0 TOUCH DATA REGISTERS

REGISTER 10-1: TOUCHSTATE: CURRENT TOUCH STATE REGISTER

R/W-0 R/W-0 R/W-0 R/W-0 U-x R/W-0 R/W-0 R/W-0

FRAME<3:0> — LRG GES TCH

bit 7 bit 0

Legend:

R = Readable bit ‘1’ = Bit is set x = Bit is unknown -n = Value after initialization

(default)

W = Writable bit ‘0’ = Bit is cleared U = Unimplemented bit q = Conditional

bit 7-4 FRAME<3:0>: Increments on Every Touch Frame

bit 3 Unimplemented: Read as ‘0’

bit 2 LRG: Large Activation is Present

bit 1 GES: Gesture is Present

bit 0 TCH: Touch is Present

REGISTER 10-2: TOUCHLSB REGISTER

R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

TOUCHX<3:0> TOUCHY<3:0>

bit 7 bit 0

Legend:

R = Readable bit ‘1’ = Bit is set x = Bit is unknown -n = Value after initialization

(default)

W = Writable bit ‘0’ = Bit is cleared U = Unimplemented bit q = Conditional

bit 7-4 TOUCHX<3:0>: Current X Position (Least Significant bits)

bit 3-0 TOUCHY<3:0>: Current Y Position (Least Significant bits)

TABLE 10-1: SUMMARY OF REGISTERS ASSOCIATED WITH TOUCH DATA

Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

0x10 TOUCHSTATE FRAME<3:0>

0x11 TOUCHX TOUCHX<11:4>

0x12 TOUCHY TOUCHY<11:4>

0x13 TOUCHLSB TOUCHX<3:0> TOUCHY<3:0>

—LRGGES TCH

 2014 Microchip Technology Inc. DS40001750A-page 17

MTCH6102

Hysteresis

Touch Threshold

Sensor Amplitude

Touch Detected

11.0 ACQUISITION AND TOUCH PARAMETERS

TABLE 11-1: REGISTERS ASSOCIATED

WITH ACQUISITION AND
TOUCH PARAMETERS

Address Name Default

0x22 SCANCOUNT 6

0x23 TOUCHTHRESHX 55

0x24 TOUCHTHRESHY 40

0x2A HYSTERESIS 4

0x31 FILTERTYPE 2

0x32 FILTERSTRENGTH 1

0x35 LARGEACTIVATIONTHRESHL 0

0x36 LARGEACTIVATIONTHRESHH 0

11.1 SCANCOUNT

Every time a channel is scanned, it is scanned multiple
times (SCANCOUNT) and summed. Increasing this
number will give an inherent averaging effect, but at the
cost of time and subsequently increased power
consumption.

11.2 TOUCHTHRESHX/ TOUCHTHRESHY and HYSTERESIS

The presence of a touch is determined by the sensor
channel’s current value compared to the touch
thresholds set by TOUCHTHRESHX (or
TOUCHTHRESHY if the channel is on the Y axis).

The HYSTERESIS register contains a threshold
modifier that acts as a dynamic threshold modifier
depending on the state of the touch (higher without a
touch). A single channel of touch is shown in

Figure 11-1.

FIGURE 11-1: TOUCH THRESHOLD AND HYSTERESIS FUNCTIONALITY

DS40001750A-page 18  2014 Microchip Technology Inc.

MTCH6102

Unfiltered (raw) data:

Median - Strength 5 (Window size 5)

I

IR

- Strength 1 (50/50)

Average – Strength 2 (Window size 4)

11.3 FILTERTYPE/FILTERSTRENGTH

As new sensor values are acquired, they are filtered
based on the settings of the FILTERTYPE/
FILTERSTRENGTH registers (see Table 11-2).
Examples of the effects of each filter type are shown in

Figure 11-2.

TABLE 11-2: FILTERTYPE AND FILTERSTRENGTH DEFINITIONS

FILTERTYPE FILTERSTRENGTH Valid Values

0 – No Filter N/A —

1 – Median Size of median window 3, 5, 7, 9

2 – I

IR Weighting of previous to current value 1, 2, 3 (1/2, 1/4 and 1/8 weighting accordingly)

3 – Average Size of average window 1, 2, 3 (2, 4 and 8 accordingly)

FIGURE 11-2: FILTER EXAMPLES

11.4 Large Activation

The LARGEACTIVATIONTHRESH registers provide a
way to do simple rejection of signals that are too large
to interpret. The amplitude of all sensor channels are
added together and compared to this threshold. If
greater, the LRG bit of the TOUCHSTATE register
(Register 10-1) will be set.

Note that this does not affect touch decoding. In other
words, even if the large activation threshold is
breached, the controller will still decode the touch
position as normal. The LRG bit merely serves to
inform the host that the large activation threshold has
been reached.

If this functionality is not intended to be used, this
register should be set to zero, which will disable the
large activation routines from running.

Choosing the correct filtering option for the user’s
application depends on the environment and sensor.
Note that while the median filter has good
characteristics, it is not the most efficient and will
consume more power than other filters.

 2014 Microchip Technology Inc. DS40001750A-page 19

MTCH6102

RAW VALUESENSORCOMP

64

---------------------------------------------------------------------------------------- FINAL VALUE=

12.0 COMPENSATION RAM

It is very common for a typical touch sensor to have
non-uniform capacitive properties. To equalize the
sensor, a series of coefficients can be written to the
compensation RAM block. These coefficients
represent a ratio that is applied to the individual
channel in post-acquisition, before touch decoding
occurs.

EQUATION 12-1: COMPENSATION RAM CALCULATION

To obtain the correct compensation RAM values, the
following procedure should be used:

1. Set all SENSORVALUES registers to zero (if

necessary).

2. Record the peak values that occur in the

SENSORVALUES registers when using the
sensor under normal conditions (column A of

Table 12-1).

3. Pick a commonly occurring value to represent

the median of the set (‘125’).

4. Calculate the ratio of the peak value by dividing

the median value by the peak (column B).

5. Multiply this value by 64 and truncate (column

C). These are the compensation values that
should be written to the SENSORCOMP
registers. Please note that, if no compensation
is required (value of ‘64’, ratio of ‘1’), the register
should be set to ‘0’, to save time running
compensation routines for that channel.

6. To see the expected output from the

compensation values, follow Equation 12-1
(result in column D).

TABLE 12-1: COMPENSATION RAM

EXAMPLE CALCULATION

CH A B C D

0 102 1.225 78 124

1 113 1.106 71 125

2 118 1.059 68 125

3 125 1 64 (0) 125

4 125 1 64 (0) 125

5 128 0.977 63 126

6 132 0.947 61 126

7 160 0.781 50 125

DS40001750A-page 20  2014 Microchip Technology Inc.

MTCH6102

13.0 BASELINE

Capacitive touch principles rely on analyzing a change
in capacitance from a previously-stored baseline value
(sometimes referred to as a calibration value). Baseline
routines and behavior can be tweaked using the
registers listed in Table 13-1.

TABLE 13-1: REGISTERS ASSOCIATED WITH BASELINE

Address Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Default

0x04

0x2D BASEINTERVALL 10

0x2E BASEINTERVALH 0

0x2F BASEPOSFILTER 20

0x30 BASENEGFILTER 20

0x33 BASEFILTERTYPE 2

0x34 BASEFILTERSTRENGTH 1

NV DEF CFG - MFG - -BS 0

13.1 BS Bit (CMD Register)

The BS bit forces the current sensor values to be
stored as the baseline values, disregarding the
constraints of BASEPOSFILTER and
BASENEGFILTER.

13.2 BASEINTERVAL

It represents the number of touch frames between
baseline sampling. Data that is sampled will be applied
at the next baseline interval, provided that a touch has
not occurred between the two.

If at any point, the touch threshold is breached, the
baseline counter is reset, and a full interval without a
touch must occur before baselining resumes.

Note that this value is specified in terms of the number
of touch frames, so any changes in frame rate should
take this into consideration by raising or lowering this
interval accordingly.

13.3 BASEPOSFILTER/BASENEGFILTER

The positive and negative filters act as slew-rate
limiters for a new baseline being applied. For example,
if the new baseline value is larger than the previous by
a value of 35, and the BASEPOSFILTER is set to 20
(default), the new baseline will only be increased by 20.

Use of these registers helps prevent unwanted spikes
in the baseline value.

13.4 BASEFILTERTYPE/ BASEFILTERSTRENGTH

Baseline acquisition frames follow the same filter type
and strength parameters as normal acquisition filters,
defined in Section 11.3 “FILTERTYPE/FILTER-

STRENGTH”.

 2014 Microchip Technology Inc. DS40001750A-page 21

MTCH6102

14.0 GESTURE FEATURES AND PARAMETERS

Gesture detection and reporting is governed by the
registers outlined in Table 14-1.

TABLE 14-1: SUMMARY OF REGISTERS ASSOCIATED WITH GESTURES

Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Default

0x10 TOUCHSTATE FRAME<3:0>

0x14 GESTURESTATE GESTURESTATE 0

0x15 GESTUREDIAG GESTUREDIAG 0

0x37 HORIZONTALSWIPEDISTANCE HORIZONTALSWIPEDISTANCE 64

0x38 VERTICALSWIPEDISTANCE VERTICALSWIPEDISTANCE 64

0x39 SWIPEHOLDBOUNDARY SWIPEHOLDBOUNDARY 25

0x3A TAPDISTANCE TAPDISTANCE 25

0x3B DISTANCEBETWEENTAPS DISTANCEBETWEENTAPS 64

0x3C

0x3D TAPHOLDTIMEH 0

0x3E GESTURECLICKTIME GESTURECLICKTIME 12

0x3F SWIPEHOLDTHRESH SWIPEHOLDTHRESH 32

0x40 MINSWIPEVELOCITY MINSWIPEVELOCITY 4

0x41 HORIZONTALGESTUREANGLE HORIZONTALGESTUREANGLE 45

0x42 VERTICALGESTUREANGLE VERTICALGESTUREANGLE 45

When a gesture is performed, the gesture ID will be
placed in GESTURESTATE, and the GES bit of the
TOUCHSTATE register will be set. Both of these items
are cleared after reading the GESTURESTATE
register. The GESTUREDIAG register contains a code
explaining the logic behind the last operation of the
gesture engine, primarily to help with debugging of the
gesture parameters. These diagnostic codes are
shown in Register 14-2.

TAPHOLDTIME

TAPHOLDTIMEL 50

- LRG GES TCH N/A

DS40001750A-page 22  2014 Microchip Technology Inc.

MTCH6102

RX0 RX8

RX9

RX14

(0,384)

(0,0)

(576,384)

(576,0)

0x41

RIGHT

0x61
LEFT

0x51

UP

0x31

DOWN

REGISTER 14-1: GESTURESTATE: CURRENT GESTURE STATE REGISTER

R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

GESTURESTATE<7:0>

bit 7 bit 0

Legend:

R = Readable bit ‘1’ = Bit is set x = Bit is unknown -n = Value after initialization

(default)

W = Writable bit ‘0’ = Bit is cleared U = Unimplemented bit q = Conditional

bit 7-0 GESTURESTATE<7:0>:

0x00 No Gesture Present
0x10 Single Click
0x11 Click and Hold
0x20 Double Click
0x31 Down Swipe
0x32 Down Swipe and Hold
0x41 Right Swipe
0x42 Right Swipe and Hold
0x51 Up Swipe
0x52 Up Swipe and Hold
0x61 Left Swipe
0x62 Left Swipe and Hold

Please note that the gesture orientations listed in

Register 14-1 are correct for a default layout, with right

moving on increasing X-axis channels, and down
moving on increasing Y-axis channels. These default
orientations are shown in Figure 14-1. Depending on
the application, the host may need to associate the
gesture IDs differently.

FIGURE 14-1: GESTURE ORIENTATION

 2014 Microchip Technology Inc. DS40001750A-page 23

MTCH6102

REGISTER 14-2: GESTUREDIAG: GESTURE DIAGNOSTICS REGISTER

R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

GESTUREDIAG<7:0>

bit 7 bit 0

Legend:

R = Readable bit ‘1’ = Bit is set x = Bit is unknown -n = Value after initialization

(default)

W = Writable bit ‘0’ = Bit is cleared U = Unimplemented bit q = Conditional

bit 7-0 GESTUREDIAG<7:0>:

0x01 Click Timeout
0x02 Swipe Timeout
0x03 General Timeout
0x04 Click Threshold Exceeded
0x05 Swipe Threshold Exceeded
0x06 Swipe and Hold Threshold Exceeded
0x07 Swipe Opposite Direction Threshold Exceeded
0x08 Reserved
0x09 Swipe and Hold Value Exceeded
0x0A Outside Swipe Angle

DS40001750A-page 24  2014 Microchip Technology Inc.

14.1 Gesture Tuning

a

f

e

b

Start

End

g

d

c

h

1

2

i

Legend:

1. HORIZONTALSWIPEDISTANCE/VERTICALSWIPEDISTANCE (a/b): Distance that a touch must move
from the initial touchdown to be considered a swipe.

2. SWIPEHOLDTHRESH (c): Allowed movement in the opposite direction before a swipe is canceled.

3. MINSWIPEVELOCITY (d): Once a movement is classified as a swipe, this distance must be kept frame to
frame before the swipe is classified as a hold (direction of travel is not important).

4. HORITZONTALGESTUREANGLE/VERTICALGESTUREANGLE (f/e): Angle in degrees allowed on
horizontal (X-axis) and vertical (Y-axis) swipe movements. Swipes outside this parameter are detected, but
not reported.

5. SWIPEHOLDBOUNDARY (g): Once a swipe is classified as a hold, movement must not exceed this
parameter in any direction.

6. DISTANCEBETWEENTAPS (h): Distance allowed between two taps to be considered a double click.

7. TAPDISTANCE (i): Even when a sensor is pressed for a very short time (click), multiple frames of touch
data occur. This parameter governs how close those individual touch points must be for a click.

8. TAPHOLDTIME (not shown): Duration of time a click must be held for to be considered a click and hold.

9. GESTURECLICKTIME (not shown): Maximum time between two clicks to be considered a double click.

FIGURE 14-2: GESTURE PARAMETER VISUALIZATION

MTCH6102

 2014 Microchip Technology Inc. DS40001750A-page 25

MTCH6102

15.0 CONFIGURING A NON-DEFAULT APPLICATION

When modifying sensor configuration parameters, the
CFG bit of the CMD register must be set for the
configuration to take effect. Setting this bit analyzes the
following registers for validity and coerces them if
necessary:

1. IDLEPERIOD/ACTIVEPERIOD

2. FILTERTYPE/FILTERSTRENGTH

3. BASELINEFILTERTYPE/FILTERSTRENGTH

4. NUMBEROFXCHANNELS/NUMBEROFYCHAN-

NELS

Afterwards, the values take effect, and the sensor is
base-lined and ready for use.

Note: If the controller is not in Standby mode

when changing configuration parameters,
unreliable touch data may be generated
until the CFG is set.

Most applications will require custom parameters to be
stored in the configuration RAM. The following
methods are recommended for achieving this:

1. For permanent configuration: Either during

manufacturing test or on first start-up, the host
controller writes all configuration values to the
controller, sets the CFG bit and stores them to
NVRAM by using the NV bit.

2. For configuration on every power-up: The host

writes all configuration data to the controller and
sets the CFG bit on start-up.

DS40001750A-page 26  2014 Microchip Technology Inc.

16.0 MANUFACTURING TESTING

16.1 Automated Manufacturing Test

To start the automated manufacturing test, set the MFG
bit of the CMD register. This test re-purposes the same
RAM used for RAWADC commands to store the
results. When the test is complete, the MFG bit will be
cleared. The results of the manufacturing test are
stored in the registers shown in Tab le 16- 1.

MTCH6102

TABLE 16-1: MFG TEST RX LOOK-UP TABLE

Address Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

0XD0

0XD1

0XD2

0XD3

0XD4 RX2H RX1H RX0H

0XD5 RX2L RX1L RX0L

Note 1: RXnH: Pin was unable to set high and is likely shorted to V

2: RXnL: Pin was unable to set low and is likely shorted to GND.

— —RX13H— RX12H RX11H RX10H RX9H

— — RX13L — RX12L RX11L RX10L RX9L

— — RX8H RX7H RX6H RX5H RX4H RX3H

— — RX8L RX7L RX6L RX5L RX4L RX3L

(1,2)

— — RX14H — —

— — RX14L — —

DD.

16.2 Sensor Integrity Testing

To test the integrity of both the touch sensor and the
overlay for defects, the following test outline is advised:

1. For this test, a way to retrieve data from the
MTCH6102 will be required. This can be either
through a host controller, or the host controller
can conduct the test itself with pre-set test
values.

2. Collect the raw-capacitance values by reading
the RAWVALUES registers under normal
conditions on a set of at least 30 completely
assembled sensors.

3. Use the information collected in step 2 to
determine the variance and average value for
each sensor channel. These values will be used
as the standard by which manufactured sensors
will need to fall within.

4. For each new sensor produced, compare the
RAWVALUES to the range described in step 3.
If the sensor falls out of this range, inspect the
sensor assembly for defects.

5. To test for touch acquisition ability, repeat steps
1-4 with a known touch stimulus applied (e.g.,
simulated metal finger).

The above outline is intentionally generic, as
manufacturing test setup will need to be modified for
every application.

 2014 Microchip Technology Inc. DS40001750A-page 27

MTCH6102

17.0 MEMORY MAP

TABLE 17-1: CORE RAM MEMORY MAP

Addr. Name

0x00 FWMAJOR FW MAJOR 0x02

0x01 FWMINOR FW MINOR 0x00

0x02

0x03 APPIDL <7:0> 0x12

0x04 CMD NV DEF CFG —MFG— —BS 0x00

0x05 MODE

0x06 MODECON TYPE<3:0> CH<3:0> 0x00

APPID

TABLE 17-2: TOUCH RAM MEMORY MAP

Addr. Name

0x10 TOUCHSTATE FRAME<3:0> — LRG GES TCH 0x00

0x11 TOUCHX TOUCHX<11:4> 0x00

0x12 TOUCHY TOUCHY<11:4> 0x00

0x13 TOUCHLSB TOUCHX<3:0> TOUCHY<3:0> 0x00

0x14 GESTURESTATE GESTURESTATE 0x00

0x15 GESTUREDIAG GESTUREDIAGNOSTIC 0x00

Core RAM

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Default

APPIDH <15:8> 0x00

— — — — MODE<3:0> 0x03

Touch RAM

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Default

TABLE 17-3: COMPENSATION RAM MEMORY MAP

Addr.

0x50 SENSORCOMP<RX0>

0x5F SENSORCOMP<RX14>

Compensation RAM

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

... ...

DS40001750A-page 28  2014 Microchip Technology Inc.

TABLE 17-4: ACQUISITION RAM MEMORY MAP

Acquisition RAM

Addr.

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

0x80 SENSORVALUES<RX0>

... ...

0x8E SENSORVALUES<RX14>

—

0x90 RAWVALUES<RX0>

... ...

0xAC RAWVALUES<RX14>

—

0xB0 BASEVALUES<RX0>

... ...

0xCC BASEVALUES<RX15>

—

0xD0 RAWADC<0>

... ...

0xEF SENSORVALUES<31>

MTCH6102

 2014 Microchip Technology Inc. DS40001750A-page 29

MTCH6102

TABLE 17-5: CONFIGURATION RAM MEMORY MAP

Addr.

0x20 NUMBEROFXCHANNELS 0x09

0x21 NUMBEROFYCHANNELS 0x06

0x22 SCANCOUNT 0x06

0x23 TOUCHTHRESHX 0x37

0x24 TOUCHTHRESHY 0x28

0x25 ACTIVEPERIODL 0x85

0x26 ACTIVEPERIODH 0x02

0x27 IDLEPERIODL 0x4C

0x28 IDLEPERIODH 0x06

0x29 IDLETIMEOUT 0x10

0x2A HYSTERESIS 0x04

0x2B DEBOUNCEUP 0x01

0x2C DEBOUNCEDOWN 0x01

0x2D BASEINTERVALL 0x0A

0x2E BASEINTERVALH 0x00

0x2F BASEPOSFILTER 0x14

0x30 BASENEGFILTER 0x14

0x31 FILTERTYPE 0x02

0x32 FILTERSTRENGTH 0x01

0x33 BASEFILTERTYPE 0x01

0x34 BASEFILTERSTRENGTH 0x05

0x35 LARGEACTIVATIONTHRESHL 0x00

0x36 LARGEACTIVATIONTHRESHH 0x00

0x37 HORIZONTALSWIPEDISTANCE 0x40

0x38 VERTICALSWIPEDISTANCE 0x40

0x39 SWIPEHOLDBOUNDARY 0x19

0x3A TAPDISTANCE 0x19

0x3B DISTANCEBETWEENTAPS 0x40

0x3C TAPHOLDTIMEL 0x32

0x3D TAPHOLDTIMEH 0x00

0x3E GESTURECLICKTIME 0x0C

0x3F SWIPEHOLDTHRESH 0x20

0x40 MINSWIPEVELOCITY 0x04

0x41 HORIZONTALGESTUREANGLE 0x2D

0x42 VERTICALGESTUREANGLE 0x2D

0x43 I

Configuration RAM

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Default

2

CADDR 0x25

DS40001750A-page 30  2014 Microchip Technology Inc.

18.0 ELECTRICAL

CHARACTERISTICS

MTCH6102

18.1 Absolute Maximum Ratings

Ambient temperature under bias........................................................................................................ -40°C to +85°C

Storage temperature ........................................................................................................................ -65°C to +150°C

Voltage on pins with respect to VSS

on VDD pin ................................................................................................................................. -0.3V to +4.0V

on all other pins................................................................................................................0.3V to (V

Maximum current

out of V

into V

Maximum output current

sunk by any I/O pin ...............................................................................................................................25 mA

sourced by any I/O pin .......................................................................................................................... 25 mA

Note: This device is sensitive to ESD damage and must be handled appropriately. Failure to properly handle and

† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure above maximum rating conditions for
extended periods may affect device reliability.

SS pin ....................................................................................................................................... 340 mA

DD pin .........................................................................................................................................255 mA

protect the device in an application may cause partial to complete failure of the device.

(†)

DD + 0.3V)

18.2 Standard Operating Conditions

The standard operating conditions for any device are defined as:

Operating Voltage: V
Operating Temperature: TA_MIN TA TA_MAX

VDD — Operating Supply Voltage

MTCH6102

VDDMIN ....................................................................................................................................... 1.8V

DDMAX ...................................................................................................................................... 3.6V

V

T

A — Operating Ambient Temperature Range

Industrial Temperature

TA_MIN ...................................................................................................................................... –40°C

A_MAX .................................................................................................................................... +85°C

T

DDMIN VDD VDDMAX

 2014 Microchip Technology Inc. DS40001750A-page 31

MTCH6102

18.3 DC Characteristics

TABLE 18-1: OPERATING CONDITIONS

Rating Min. Typ. Max. Units

Supply Voltage 1.8 — 3.6 V

Supply Current (Full Active, No Frame Rate) 0.7 — 1.17 mA

Supply Current (Sleep) <1 uA

TABLE 18-2: I/O PORTS

DC CHARACTERISTICS Standard Operating Conditions (unless otherwise stated)

Param.

No.

Sym. Characteristic Min. Typ.† Max. Units Conditions

VIL Input Low Voltage

I/O PORT:

D030 with TTL buffer — — 0.15 V

D031 with Schmitt Trigger buffer — — 0.2 V

2

with I

C™ levels — — 0.3 VDD V

with SMBus levels — — 0.8 V 2.7V  V

D032 RESET

, OSC1 (RC mode) — — 0.2 VDD V

D033 OSC1 (HS mode) — — 0.3 V

V

IH Input High Voltage

DD V1.8V  VDD  4.5V

DD V2.0V  VDD  5.5V

DD  5.5V

DD V

I/O ports:

D040 with TTL buffer 0.25 V

D041 with Schmitt Trigger buffer 0.8 V

2

with I

C levels 0.7 VDD ——V

with SMBus levels 2.1 — — V 2.7V  V

D042 RESET

D043A OSC1 (HS mode) 0.7 V

D043B OSC1 (RC mode) 0.9 V

I

IL Input Leakage Current

(2)

DD + 0.8 — — V 1.8V  VDD  4.5V

DD ——V2.0V  VDD  5.5V

DD  5.5V

0.8 VDD ——V

DD ——V

DD ——VNote 1

D060 I/O ports — ± 5 ± 125 nA VSS  VPIN  VDD, Pin at

high-impedance at 85°C

D061 RESET

(2)

—± 50± 200nAVSS  VPIN  VDD at 85°C

* These parameters are characterized but not tested.
† Data in “Typ.” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only

and are not tested.

Note 1: Negative current is defined as current sourced by the pin.

2: The leakage current on the RESET

pin is strongly dependent on the applied voltage level. The specified levels

represent normal operating conditions. Higher leakage current may be measured at different input voltages.

DS40001750A-page 32  2014 Microchip Technology Inc.

TABLE 18-2: I/O PORTS (CONTINUED)

DC CHARACTERISTICS Standard Operating Conditions (unless otherwise stated)

MTCH6102

Param.

No.

D070* 25 100 200 AV

D080 I/O ports — — 0.6 V I

D090 I/O ports V

D101* All I/O pins — — 50 pF

Note 1: Negative current is defined as current sourced by the pin.

Sym. Characteristic Min. Typ.† Max. Units Conditions

IPUR Weak Pull-up Current

DD = 3.3V, VPIN = VSS

VOL Output Low Voltage

OL = 6 mA, VDD = 3.3V

I

OL = 1.8 mA, VDD = 1.8V

V

OH Output High Voltage

DD - 0.7 — — V IOH = 3 mA, VDD = 3.3V

IOH = 1 mA, VDD = 1.8V

C

IO Capacitive Loading Specs on Output Pins

* These parameters are characterized but not tested.
† Data in “Typ.” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only

and are not tested.

2: The leakage current on the RESET

represent normal operating conditions. Higher leakage current may be measured at different input voltages.

pin is strongly dependent on the applied voltage level. The specified levels

 2014 Microchip Technology Inc. DS40001750A-page 33

MTCH6102

SP90

SP91

SP92

SP100

SP101

SP103

SP106

SP107

SP109

SP109

SP110

SP102

SCLx

SDAx
In

SDAx
Out

18.4 AC Characteristics and Timing Parameters

FIGURE 18-1: I2C™ BUS DATA TIMING

2

TABL E 1 8-3: I

Param.

No.

SP100* T

SP101* TLOW Clock low time 400 kHz mode 1.3 — s

SP102* T

SP103* T

SP106* T

SP107* TSU:DAT Data input setup time 400 kHz mode 100 — ns

SP109* TAA Output valid from clock 400 kHz mode — — ns

SP110* T

SP111 C

* These parameters are characterized but not tested.

C™ BUS DATA REQUIREMENTS

Symbol Characteristic Min. Max. Units Conditions

HIGH Clock high time

R SDAx and SCLx rise

time

F SDAx and SCLx fall time 400 kHz mode 20 + 0.1CB 250 ns
HD:DAT Data input hold time 400 kHz mode 0 0.9 s

BUF Bus free time 400 kHz mode 1.3 — s

B Bus capacitive loading — 400 pF

400 kHz mode 0.6 — s

SSP module 1.5T

CY ——

SSP module 1.5TCY ——

400 kHz mode 20 + 0.1CB 300 ns

DS40001750A-page 34  2014 Microchip Technology Inc.

MTCH6102

19.0 ORDERING INFORMATION

TABLE 19-1: ORDERING INFORMATION

Part Number Pin Package Packing

MTCH6102-I/SS 28-Lead SSOP (5.30 mm) Tube

MTCH6102-I/MV 28-Lead UQFN (4x4x0.5 mm) Tube

MTCH6102T-I/SS 28-Lead SSOP (5.30 mm) T/R

MTCH6102T-I/MV 28-Lead UQFN (4x4x0.5 mm) T/R

 2014 Microchip Technology Inc. DS40001750A-page 35

MTCH6102

Legend: XX...X Customer-specific information

Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Pb-free JEDEC

®

designator for Matte Tin (Sn)

* This package is Pb-free. The Pb-free JEDEC designator ( )

can be found on the outer packaging for this package.

Note: In the event the full Microchip part number cannot be marked on one line, it will

be carried over to the next line, thus limiting the number of available
characters for customer-specific information.

3

e

3

e

28-Lead SSOP (5.30 mm) Example

28-Lead UQFN (4x4x0.5 mm) Example

PIN 1 PIN 1

MTCH6102

1412017

-I/SS

MTCH

6102-I

/MV

412017

28-Lead Plastic Shrink Small Outline – 5.30 mm Body [SSOP]

28-Lead Plastic Ultra Thin Quad Flat, No Lead Package – 4x4x0.5 mm Body [UQFN]

20.0 PACKAGING INFORMATION

20.1 Package Marking Information

DS40001750A-page 36  2014 Microchip Technology Inc.

20.2 Package Details

/HDG3ODVWLF6KULQN6PDOO2XWOLQH66±PP%RG\>6623@

1RWHV

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 'LPHQVLRQV'DQG(GRQRWLQFOXGHPROGIODVKRUSURWUXVLRQV0ROGIODVKRUSURWUXVLRQVVKDOOQRWH[FHHGPPSHUVLGH
 'LPHQVLRQLQJDQGWROHUDQFLQJSHU$60(<0

%6& %DVLF'LPHQVLRQ7KHRUHWLFDOO\H[DFWYDOXHVKRZQZLWKRXWWROHUDQFHV
5() 5HIHUHQFH'LPHQVLRQXVXDOO\ZLWKRXWWROHUDQFHIRULQIRUPDWLRQSXUSRVHVRQO\

1RWH )RUWKHPRVWFXUUHQWSDFNDJHGUDZLQJVSOHDVHVHHWKH0LFURFKLS3DFNDJLQJ6SHFLILFDWLRQORFDWHGDW

KWWSZZZPLFURFKLSFRPSDFNDJLQJ

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2YHUDOO+HLJKW $ ± ± 

0ROGHG3DFNDJH7KLFNQHVV $   

6WDQGRII $  ± ±

2YHUDOO:LGWK (   

0ROGHG3DFNDJH:LGWK (   

2YHUDOO/HQJWK '   

)RRW/HQJWK /   

)RRWSULQW / 5()

/HDG7KLFNQHVV F  ± 

)RRW$QJOH    

/HDG:LGWK E  ± 

L

L1

c

A2

A1

A

E

E1

D

N

1

2

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b

e

φ

0LFURFKLS 7HFKQRORJ\ 'UDZLQJ &%

The following sections give the technical details of the packages.

MTCH6102

 2014 Microchip Technology Inc. DS40001750A-page 37

MTCH6102

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

DS40001750A-page 38  2014 Microchip Technology Inc.

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

MTCH6102

 2014 Microchip Technology Inc. DS40001750A-page 39

MTCH6102

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

DS40001750A-page 40  2014 Microchip Technology Inc.

MTCH6102

 2014 Microchip Technology Inc. DS40001750A-page 41

MTCH6102

APPENDIX A: DATA SHEET

REVISION HISTORY

Revision A (03/2014)

Initial release of the document.

DS40001750A-page 42  2014 Microchip Technology Inc.

MTCH6102

THE MICROCHIP WEB SITE

Microchip provides online support via our WWW site at

www.microchip.com. This web site is used as a means

to make files and information easily available to
customers. Accessible by using your favorite Internet
browser, the web site contains the following
information:

• Product Support – Data sheets and errata,
application notes and sample programs, design
resources, user’s guides and hardware support
documents, latest software releases and archived
software

• General Technical Support – Frequently Asked
Questions (FAQ), technical support requests,
online discussion groups, Microchip consultant
program member listing

• Business of Microchip – Product selector and
ordering guides, latest Microchip press releases,
listing of seminars and events, listings of
Microchip sales offices, distributors and factory
representatives

CUSTOMER CHANGE NOTIFICATION
SERVICE

CUSTOMER SUPPORT

Users of Microchip products can receive assistance
through several channels:

• Distributor or Representative

• Local Sales Office

• Field Application Engineer (FAE)

• Technical Support

Customers should contact their distributor,
representative or Field Application Engineer (FAE) for
support. Local sales offices are also available to help
customers. A listing of sales offices and locations is
included in the back of this document.

Technical support is available through the web site
at: http://microchip.com/support

Microchip’s customer notification service helps keep
customers current on Microchip products. Subscribers
will receive e-mail notification whenever there are
changes, updates, revisions or errata related to a
specified product family or development tool of interest.

To register, access the Microchip web site at

www.microchip.com. Under “Support”, click on

“Customer Change Notification” and follow the
registration instructions.

 2014 Microchip Technology Inc. DS40001750A-page 43

Note the following details of the code protection feature on Microchip devices:

YSTEM

CERTIFIED BY DNV

== ISO/TS 16949 ==

• Microchip products meet the specification contained in their particular Microchip Data Sheet.

• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.

• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

• Microchip is willing to work with the customer who is concerned about the integrity of their code.

• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.

Trademarks

The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, K
PICSTART, PIC
and UNI/O are registered trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.

FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MTP, SEEVAL and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.

Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.

Analog-for-the-Digital Age, Application Maestro, BodyCom,
chipKIT, chipKIT logo, CodeGuard, dsPICDEM,
dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB
Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O,
Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA
and Z-Scale are trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.

SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.

GestIC and ULPP are registered trademarks of Microchip
Technology Germany II GmbH & Co. KG, a subsidiary of
Microchip Technology Inc., in other countries.

All other trademarks mentioned herein are property of their
respective companies.

© 2014, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.

Printed on recycled paper.

ISBN: 978-1-63276-043-2

EELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,

32

logo, rfPIC, SST, SST Logo, SuperFlash

QUALITY MANAGEMENT S

DS40001750A-page 44  2014 Microchip Technology Inc.

Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.

®

MCUs and dsPIC® DSCs, KEELOQ

®

code hopping

Worldwide Sales and Service

AMERICAS

Corporate Office

2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: [phone]
Fax: [phone]
Technical Support:

http://www.microchip.com/
support

Web Address:

www.microchip.com

Atlanta

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Tel: [phone]
Fax: [phone]

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Detroit

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Tel: [phone]

Houston, TX

Tel: [phone]

Indianapolis

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Fax: [phone]

Los Angeles

Mission Viejo, CA
Tel: [phone]
Fax: [phone]

New York, NY

Tel: [phone]

San Jose, CA

Tel: [phone]

Canada - Toronto

Tel: [phone]
Fax: [phone]

ASIA/PACIFIC

Asia Pacific Office

Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
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Tel: [phone]
Fax: [phone]

Australia - Sydney

Tel: [phone]
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China - Beijing

Tel: [phone]
Fax: [phone]

China - Chengdu

Tel: [phone]
Fax: [phone]

China - Chongqing

Tel: [phone]
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China - Hangzhou

Tel: [phone]
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China - Hong Kong SAR

Tel: [phone]
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Tel: [phone]
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China - Zhuhai

Tel: [phone]
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ASIA/PACIFIC

India - Bangalore

Tel: [phone]
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India - New Delhi

Tel: [phone]
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India - Pune

Tel: [phone]

Japan - Osaka

Tel: [phone]
Fax: [phone]

Japan - Tokyo

Tel: [phone]
Fax: [phone]

Korea - Daegu

Tel: [phone]
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Korea - Seoul

Tel: [phone]
Fax: [phone] or
82-2-558-5934

Malaysia - Kuala Lumpur

Tel: [phone]
Fax: [phone]

Malaysia - Penang

Tel: [phone]
Fax: [phone]

Philippines - Manila

Tel: [phone]
Fax: [phone]

Singapore

Tel: [phone]
Fax: [phone]

Taiwan - Hsin Chu

Tel: [phone]
Fax: [phone]

Taiwan - Kaohsiung

Tel: [phone]

Taiwan - Taipei

Tel: [phone]
Fax: [phone]

Thailand - Bangkok

Tel: [phone]
Fax: [phone]

EUROPE

Austria - Wels

Tel: [phone]
Fax: [phone]

Denmark - Copenhagen

Tel: [phone]
Fax: [phone]

France - Paris

Tel: [phone]
Fax: [phone]

Germany - Dusseldorf

Tel: [phone]

Germany - Munich

Tel: [phone]
Fax: [phone]

Germany - Pforzheim

Tel: [phone]

Italy - Milan

Tel: [phone]
Fax: [phone]

Italy - Venice

Tel: [phone]

Netherlands - Drunen

Tel: [phone]
Fax: [phone]

Poland - Warsaw

Tel: [phone]

Spain - Madrid

Tel: [phone]
Fax: [phone]

Sweden - Stockholm

Tel: [phone]

UK - Wokingham

Tel: [phone]
Fax: [phone]

03/25/14

 2014 Microchip Technology Inc. DS40001750A-page 45