•Internal cont rol lat ches and add ress d eco der
•Short set-up and hold times
•Wide ope rating v oltag e: 4. 5V to 14.5V
•14Vpp anal og s ignal capabi lity
•R
•∆R
65Ω max. @ VDD=14V, 25°C
ON
≤10Ω @ VDD=14V, 25°C
ON
•Full CMOS switch for low distortion
•Minimum f eedthr oug h and c ros stal k
•Low power consumption ISO-CMOS technology
Applications
•PBX systems
•Mobile rad io
•Test e quipme nt / instru men tatio n
•Analo g/ di gita l m ult ip le xers
•Audio/Video switching
ISSUE 5November 1988
Ordering Information
MT8812AC40 Pin Ce r am i c D IP
MT8812AE40 Pin Pla stic D IP
MT8812AP44 Pin PL C C
0° to 70°C
Description
The Mitel MT8812 is fabricated in MITEL’s ISOCMOS technology providing low power dissipation
and high reliability. The device contains a 8 x12 array
of crosspoint switches along with a 7 to 96 line
decoder and latch circuits. Any one of the 96
switches can be addressed by selecting the
appropriate seven input bits. The selected switch
can be turned on or off by applying a logical one or
zero to the DATA inpu t.
1Y3Y3 Analog (Input/Output): this is connected to the Y3 column of the switch array.
2AY2Y2 Address Line (Input).
3RESETMaster RESET (Input): this is used to turn off all switches. Active High.
4,5AX3,AX0 X3 and X0 Address Lines (Inputs).
6,7NCNo Connection.
8-13X6-X11 X6-X11 Analog (Inputs/Outputs): these are connected to the X6-X11 rows of the switch
array.
14NCNo Connection.
15Y7Y7 Analog (Input/Output): this is connected to the Y7 column of the switch array.
16NCNo Connection.
17Y6Y6 Analog (Input/Output): this is connected to the Y6 column of the switch array.
18STROBE STROBE (In put): enables function selected by address and data. Address must be stable
before STROB E goes high and DATA mu st be stable on the falling edge of the STRO BE.
Active High.
19Y5Y5 Analog (Input/Output): this is connected to the Y5 column of the switch array.
20V
21Y4Y4 Analog (Input/Output): this is connected to the Y4 column of the switch array.
28 - 33X5-X0X5-X0 Analo g (Inputs/ Ou tpu t s): these are connected to the X5-X0 rows of the switch array.
34NCNo Connection.
35Y0Y0 Analog (Input/Output): this is connected to the Y0 column of the switch array.
36NCNo Connection.
37Y1Y1 Analog (Input/Output): this is connected to the Y1 column of the switch array.
38DATADATA (Input): a logic high input will turn on the selected switch and a logic low will turn off the
39Y2Y2 Analog (Input/Output): this is connected to the Y2 column of the switch array.
40V
* Plastic DIP and CERDIP only.
Ground Reference.
SS
selected switch. Active High.
Positive Power Sup pl y.
DD
3-28
Page 3
ISO-CMOSMT8812
Functional Description
The MT8812 is an analog switch matrix with an array
size of 8 x 12. The switch array is arranged such that
there are 8 columns by 12 rows. The columns are
referred to as the Y input/output lines and the rows
are the X input/output lines. The crosspoint analog
switch array will interconnect any X line wit h any Y
line when turned on and provide a high degree of
isolation when turned off. The control memory
consists of a 96 bit write only RAM in which the bits
are selected by the address input lines (AY0-AY2,
AX0-AX3) . Data is presented to the memory on the
DATA input line. Data is asynchro-nously written into
memory whenever the STROBE input is high and is
latched on the falling edge of STROBE. A logical “1”
written into a memory cell turns the corresponding
crosspoint switch on and a logical “0” turns the
crosspoint off. Only the crosspoint switches
corresponding to the addressed memory location are
altered when data is written into memory. The
remaining switches retain their previous s tates. Any
combination of X and Y lines can be interconnected
by establishing appropriate patterns in the control
memory. A logical “1” on the RESET input line will
asynchronously return all memory locations to logical
“0” turnin g off al l cr o ssp oi n t s witches.
Address Decode
The seven address lines along with the STROBE
input are logically ANDed to form an enable signal
for the resettable transparent latches. The DATA
input is buffered and is used as the input to all
latches. To write to a location, RESET mu st be low
while the address and data lines are set up. Then the
STROBE input is set high and then low causing the
data to be latched. The data can be changed while
STROBE is high, however, the corresponding switch
will turn on and off in accordance with the data. Data
must be stable on the falling edge of STROBE in
order for corr e ct da ta to be written to th e latc h .
3-29
Page 4
MT8812ISO-CMOS
Absolute Maximum Ratings*- Voltages are with respect to V
unless otherwise stated.
SS
ParameterSymbolMinMaxUnits
1Supply VoltageV
2Analog Input VoltageV
3Digital Input VoltageV
DD
V
SS
INA
IN
-0.3
-0.3
V
16.0
DD
+0.3
-0.3VDD+0.3V
VSS-0.3VDD+0.3V
4Current on any I/O PinI±15mA
5Storage Tem peratureT
6Package Power DissipationPLASTIC DIP
CERDIP
* Exceeding these values may cause permanent damage. Functional operation under these conditions is not implied.
Recommended Operating Conditions - Voltages are with respect to V
S
P
D
P
D
SS
-65+150°C
0.6
1.0
unless otherwise stated.
Characteris ticsSymMinTypMaxUnitsTest Conditio ns
1Operating TemperatureT
2Supply VoltageV
3Analog In put VoltageV
4Digital In put VoltageV
DC Electrical Characteristics
†
CharacteristicsSymMinTyp
O
DD
INA
IN
- Voltages are with respect to V
025 70 °C
4.514.5V
V
SS
V
SS
‡
SS
V
DD
V
DD
=0V, V
DD
V
V
=14V unless otherwi se stated .
MaxUnitsTest Conditio ns
V
V
W
W
1Quiescent Supply CurrentI
DD
1100µAAll digital inputs at VIN=VSS or
V
DD
715mAA ll digi tal inp uts at VIN=2.4V
2Off-state Leakage Current
(See G.9 in Appendix)
3Input Logic “0” levelV
4Input Logic “1” levelV
5Input Leakage (digital pins)I
† DC Electrical Characteristics are over recommended temperature range.
‡ Typical figures are at 25°C and are for design aid only; not guaran teed and no t subject to producti on testing .
DC Electrical Characteristics- Switch Resistance - V
I
OFF
IL
IH
LEAK
±1± 500nAIVXi - VYjI = VDD - V
0.8V
2.4V
0.110µAAll digital inp uts at VIN = VSS
is the external DC offset applied at the analog I/O pins.
THD0.01%Switch is “ON”; V
(See G.5, G.6 in Appendix)
5Feedthrough
FDT-95dBAll Switches “OFF”; V
Channel “OFF”
Feed.=20LOG (V
OUT/VXi
)
(See G.8 in Appendix)
6Crosstalk between any two
X
channels for switches Xi-Yi and
Xj-Yj .
Xtalk=20LOG (V
Yj/VXi
).
(See G.7 in Appendix).
S
F
3dB
talk
20pFf=1 MHz
0.2pFf=1 MHz
45MHzSwitch is “ON”; V
sinewave; R
= 1kΩ
L
See Appendix, Fig. A.3
sinewave f= 1k Hz; R
2Vpp sinewave f= 1kHz;
R
= 1kΩ.
L
See Appendix, Fig. A.4
-45dBV
-90dBV
-85dBV
-80dBV
=2Vpp sinewave
INA
f= 10MHz; R
=2Vpp sinewave
INA
f= 10kHz; R
=2Vpp sinewave
INA
f= 10kHz; R
=2Vpp sinewave
INA
f= 1kHz; R
L
= 75Ω.
L
= 600Ω.
L
= 1kΩ.
L
= 10kΩ.
Refer to Appendix, Fig. A.5
for test circuit.
7Propagation delay thro ugh
t
PS
30nsRL=1kΩ; CL=50pF
switc h
† Timing is over recommended temp era tu re range . See Fig. 3 for control and I/O timing details.
‡ Typical figures are at 25°C and are for design aid only; not guaranteed and not subject to producti on testin g.
Crosstal k m ea su r em e nts a re fo r Pl as tic D I PS o nl y, cross tal k va lu es f or PLCC pa ckag es are ap proximately 5d B better.
AC Electrical Characteristics† - Control and I/O Timings- V
I/O pins. Voltages are with respect to V
=7V, VDC=0V, VSS=-7V, unless otherwise stated.
DD
is the external DC offset applied at the analog
DC
CharacteristicsSymMinTyp‡MaxUnitsTest Conditions
= 2Vpp
INA
= 2Vpp
INA
L
=1kΩ
=
INA
1Control Input crosstalk to switch
(for CS, DATA, STROBE,
Address)
2Digit al Input Capa citan ceC
3Switching FrequencyF
4Se tup Time DATA to STRO BEt
5Hold Time DATA to STROBEt
6Setup Time Address to STROBEt
7Hold Time Address to STROBEt
8STROBE Pulse Widtht
9RES E T Pulse Widt ht
10STROBE to Switch Status Delayt
11DATA to Switch Status Delayt
12RESET to Switch Status Delayt
† Timing is over recommended temperature range. See Fig. 3 for control and I/O timing details.
Digital Inp ut ris e tim e (t r) an d fall tim e ( tf) = 5 ns .
‡ Typical figures are at 25°C and are for design aid only; not guaran teed and no t subject to producti on testing .
Refer t o A pp en di x, Fi g. A.7 fo r te st c ircuit.