•Internal cont rol lat ches and add ress d eco der
•Short setup a nd h old time s
•Wide ope rating v oltag e: 4. 5V to 13.2V
•12Vpp anal og s ignal capabi lity
•R
•∆R
65Ω max. @ VDD=12V, 25°C
ON
≤ 10Ω @ VDD=12V, 25° C
ON
•Full CMOS switch for low distortion
•Minimum f eedthr oug h and c ros stal k
•Low power consumption ISO-CMOS technology
•Internal pull-up resistor for RESET
pin
Applications
•Key systems
•PBX systems
•Mobile rad io
•Test equipme nt /inst rum enta tion
•Analo g/ di gita l m ult ip le xers
•Audio/Video switching
ISSUE 2November 1988
Ordering Information
MT8809AC28 Pin Ce r am i c D IP
MT8809AE28 Pin Pla stic D IP
MT8809AP28 Pin PL C C
-40° to 85°C
Description
The Mitel MT8809 is fabricated in MITEL’s ISOCMOS technology providing low power dissipation
and high reliability. The device contains a 8 x 8 array
of crosspoint switches along with a 6 to 64 line
decoder and latch circuits. Any one of the 64
switches can be addressed by selecting the
appropriate six address bits. The selected switch can
be turned on or off by applying a logical one or
zero to th e D ATA inpu t. Chip Sele ct (CS
crosspoint array to be cascaded for matrix
expansion.
) allows the
AX0
AX1
AX2
AY0
AY1
AY2
STROBE
CS
6 to 64
Decoder
DATA RESETVDDVSS
11
8 x 8
Latches
Switch
Array
6464
• • • • • • • • • • • • • • • • • • •
Yi I/O (i=0-7)
Figure 1 - Functional Block Diagram
• • • • • • • • • • • • • • • •
Xi I/O
(i=0-7)
3-21
3-21
Page 2
MT8809ISO-CMOS
CS
X0
X2
X4
X6
Y7
Y6
Y5
Y4
1
2
3
4
5
6
7
8
9
10
11
12
13
14
AY2
STROBE
DATA
VSS
RESET
28
27
26
25
24
23
22
21
20
19
18
17
16
15
AY1
AY0
AX2
AX1
AX0
X1
X3
X5
X7
VDD
Y0
Y1
Y2
Y3
VSS
X0
X2
X4
X6
RESET
Y7
5
6
7
8
9
10
11
E
B
A
O
T
A
D
4
2
1
6
Y
CSS
3
3
1
5
Y
1
2
0
2
R
T
2
•
4
1
4
Y
X
Y
Y
Y
A
A
A
A
1
8
7
6
2
2
2
AX1
25
AX0
24
X1
23
22
X3
21
X5
20
X7
19
5
7
6
1
1
1
1
3
2
Y
Y
Y
VDD
8
1
0
Y
28 PIN CERDIP/PLASTIC DIP
28 PIN PLCC
Figure 2 - Pin Connections
Pin Description
Pin #NameDescription
1AY2AY2 Address Line (Input).
2STROBE
3CS
4DATADATA (Input): a logic high input will turn on the selected switch and a logic low will turn off
5V
6-9X0, X2,
X4, X6
STROBE (Input): enables function selected by address and data. Address must be stable
before STROBE
goes low and DATA must be stab le on the rising edge of STROBE .
Active Low.
Chip Select (Inpu t ): this is used to select the device. Active Low.
the selected switch. Active High.
Ground Reference.
SS
X0, X2, X4 and X6 Analog (Inputs/Outputs): these are connected to the X0, X2, X4 and
X6 rows of the switch array.
10RESET
Master RESET (Input): this is use d to turn off all switches regardless of the condition of
CS
. A 100kΩ internal pull-up resistor is also provided. This can be used in conjunction
with a 0.1µF capacitor (connected to the RESET
pin) to perform power-on reset of the
device. Active Low.
11-18Y7 - Y0Y7 - Y0 Analog (Inputs/Outputs): these are connected to the Y0 - Y7 columns of the
switch array.
19V
20-23X7, X5,
X3, X1
Positive Power Sup pl y.
DD
X7, X5, X3 and X1 Analog (Inputs/Outputs): these are connected to the X7, X5, X3 and
X1 rows of the switch array.
24-26AX0-AX2 AX0 - AX2 Address Lines (Inputs).
27, 28AY0, AY1 AY0 and AY1 Address Lines (Inputs).
3-22
Page 3
ISO-CMOSMT8809
Functional Description
The MT8809 is an analog switch matrix with an array
size of 8 x 8. The switch array is arranged such that
there are 8 columns by 8 rows. The columns are
referred to as the Y inputs/outputs and the rows are
the X inputs/outputs. The crosspoint analog switch
array will i n te r co n ne c t a n y X I/O with an y Y I/O when
turned on and provide a high degree of isolation
when turned off. The control memory consists of a 64
bit write only RAM in which the bits are selected by
the address inputs (AY0-AY2, AX0-AX2). Data is
presented to the memory on the DATA input. Data is
asynchronously written into memory whenever both
the CS
and are latched on the rising edge of STROBE
logical “1” written into a memory cell turns the
corresponding crosspoint switch on and a logical “0”
turns the crosspoint off. Only the crosspoint switches
corresponding to the addressed memory location are
altered when data is written into memory. The
remaining switches retain their previous states. Any
combination of X and Y inputs/outputs can be
interconnected by establishing appropriate patterns
in the control memory. A logical “0” on the RESET
input will asynchronously return all memory
locations to logical “0” turning off all crosspoint
switches regardless of whether CS
(Chip Select) and STROBE inputs are low
. A
is high or low.
Address Decode
The six address inputs along with the STROBE and
CS
(Chip Select) are logically ANDed to form an
enable signal for the resettable transparent latches.
The DATA input is buffered and is used as the input
to all latches. To write to a l ocation, RESET
high and CS
are set up. Then the STROBE
then high causing the data to be latched. The data
can be changed while STROBE
corresponding switch will turn on and off in
accordance with the DATA input. DATA must be
stable on the rising edge of STROBE
correct data to be written to the latch.
must go low while the address and data
input is set low and
is low, however, the
must be
in order for
3-23
Page 4
MT8809ISO-CMOS
Absolute Maximum Ratings*- Voltages are with respect to V
unless otherwise stated.
SS
ParameterSymbolMinMaxUnits
1Supply VoltageV
2Analog Input VoltageV
3Digital Input VoltageV
DD
V
SS
INA
IN
-0.3
-0.3
V
15.0
DD
+0.3
-0.3VDD+0.3V
VSS-0.3VDD+0.3V
4Current on any I/O PinI± 15mA
5Storage TemperatureT
6Package Power DissipationPLASTIC DIP
CERDIP
* Exceeding these values may cause permanent damage. Functional operation under these conditions is not implied.
Recommended Operating Conditions - Voltages are with respect to V
S
P
D
P
D
SS
-65+150°C
0.6
1.0
unless otherwise stated.
Characteris ticsSymMinTypMaxUnitsTest Conditions
1Operating Temperat ureT
2Supply VoltageV
3Analog In put VoltageV
4Digital In put VoltageV
DC Electrical Characteristics
†
CharacteristicsSymMinTyp
DD
INA
- Voltages are with respect to V
-402 585°C
O
4.513.2V
V
SS
V
IN
SS
SS
‡
MaxUnitsTest Conditio ns
V
DD
V
DD
=0V, V
V
V
=12V unless otherwi se stated .
DD
V
V
W
W
1Quiescent Supply CurrentI
DD
1100µAAll digital inp uts at VIN=V
V
except RESET = V
DD
12040 0µAAll digital inputs at VIN=VSS or
V
except RESET = V
DD
0.51.6mAA ll digi tal i np uts at VIN=2.4V,
=5.0V
V
DD
515mAAll digital inputs at V
2Off-state Leakage Current
(See G.9 in Appendix)
3Input Logic “0” levelV
4Input Logic “1” levelV
6Input Leakage (digital pins)I
† DC Electrical Characteristics are over recommended temperature range.
‡ Typical figu res are at 25°C and are for desi gn aid only; not gua rantee d and not subje ct to producti on testing.
DC Electrical Characteristics- Switch Resistance - V
I
OFF
IL
IH
LEAK
±1± 500nAIVXi - VYjI = VDD - V
0.8V
3.0V
0.110µAAll digi tal i np uts at VIN = VSS
is the external DC offset applied at the analog I/O pins.
THD0.01%Switch is “ON”; V
(See G.5, G.6 in Appendix)
5Feedthrough
FDT-95dBAll Switches “OFF”; V
Channel “OFF”
Feed.=20LOG (V
OUT/VXi
)
(See G.8 in Appendix)
6Crosstalk between any two
X
channels for switches Xi-Yi and
Xj-Yj .
Xtalk=20LOG (V
Yj/VXi
).
(See G.7 in Appendix).
S
F
3dB
talk
20pFf=1 MHz
0.2pFf=1 MHz
45MHzSwitch is “ON”; V
sinewave; R
= 1kΩ
L
See Appendix, Fig. A.3
sinewave f= 1k Hz; R
2Vpp sinewave f= 1kHz;
R
= 1kΩ.
L
See Appendix, Fig. A.4
-45dBV
-90dBV
-85dBV
-80dBV
=2Vpp sinewave
INA
f= 10MHz; R
=2Vpp sinewave
INA
f= 10kHz; R
=2Vpp sinewave
INA
f= 10kHz; R
=2Vpp sinewave
INA
f= 1kHz; R
L
= 75Ω.
L
= 600Ω.
L
= 1kΩ.
L
= 10kΩ.
Refer to Appendix, Fig. A.5
for test circuit.
7Propagation delay thro ugh
t
PS
30nsRL=1kΩ; CL=50pF
switc h
† Timing is over recommended tempera tu re range . See Fig. 3 for control and I/O timing details.
‡ Typical figu res are at 25°C and are for design aid only; not guaran te ed and not subject to prod ucti on testin g.
Crosstal k m ea su r em e nts a re fo r Pl as tic D I PS o nl y, cross tal k va lu es f or PLCC pa ckag e s a re approxim ately 5dB b etter.
AC Electrical Characteristics† - Control and I/O Timings- V
I/O pins. Voltages are with respect to V
=5V, VDC=0V , VSS=-7V, unless otherwise stated.
DD
is the external DC offset applied at the analog
DC
CharacteristicsSymMinTyp‡MaxUnitsTest Conditions
= 2Vpp
INA
= 2Vpp
INA
L
=1kΩ
=
INA
1Control Input crosstalk to switch
(for CS
, DATA, STROBE,
CX
talk
Address)
2Digital Input CapacitanceC
3Switching FrequencyF
4Setup Time DATA to STROBE
5Hold Time DATA to STROBEt
6Setup Time Address to STROBEt
7Hold Time Address to STROBEt
8Setup Time CS to STROBEt
9Hold Time CS to STROBEt
10STROBE Pulse Widtht
11RESET Pulse Widtht
12STROBE to Switch Status Delayt
13DATA to Switch Status Delayt
14RESET to Switch Status Delayt
† Timing is over recommended temperature range. See Fig. 3 for control and I/O timing details.
Digital Inp ut ris e tim e (t r) an d fall time (tf) = 5 ns .
‡ Typical figu res are at 25°C and are for desi gn aid only; not guaran tee d and not subject to producti on testing.
Refer to Ap pe nd ix , Fig. A.7 for te st ci rc uit .