Datasheet MT8809AE, MT8809AP, MT8809AC Datasheet (MITEL)

Page 1
ISO-CMOS
8 x 8 Analog Switch Array
MT8809
Features
• Internal cont rol lat ches and add ress d eco der
• Short setup a nd h old time s
• Wide ope rating v oltag e: 4. 5V to 13.2V
•R
• ∆R
65Ω max. @ VDD=12V, 25°C
ON
≤ 10Ω @ VDD=12V, 25° C
ON
• Full CMOS switch for low distortion
• Minimum f eedthr oug h and c ros stal k
• Low power consumption ISO-CMOS technology
• Internal pull-up resistor for RESET
pin
Applications
• Key systems
• PBX systems
• Mobile rad io
• Test equipme nt /inst rum enta tion
• Analo g/ di gita l m ult ip le xers
• Audio/Video switching
ISSUE 2 November 1988
Ordering Information
MT8809AC 28 Pin Ce r am i c D IP MT8809AE 28 Pin Pla stic D IP MT8809AP 28 Pin PL C C
-40° to 85°C
Description
The Mitel MT8809 is fabricated in MITEL’s ISO­CMOS technology providing low power dissipation and high reliability. The device contains a 8 x 8 array of crosspoint switches along with a 6 to 64 line decoder and latch circuits. Any one of the 64 switches can be addressed by selecting the appropriate six address bits. The selected switch can be turned on or off by applying a logical one or zero to th e D ATA inpu t. Chip Sele ct (CS crosspoint array to be cascaded for matrix expansion.
) allows the
AX0 AX1
AX2
AY0 AY1 AY2
STROBE
CS
6 to 64
Decoder
DATA RESET VDD VSS
11
8 x 8
Latches
Switch
Array
6464
• • • • • • • • • • • • • • • • • • •
Yi I/O (i=0-7)
Figure 1 - Functional Block Diagram
• • • • • • • • • • • • • • • •
Xi I/O (i=0-7)
3-21
3-21
Page 2
MT8809 ISO-CMOS
CS
X0 X2 X4 X6
Y7 Y6 Y5 Y4
1 2
3 4 5
6 7 8
9 10 11 12 13 14
AY2
STROBE
DATA
VSS
RESET
28 27 26 25 24 23 22 21 20 19 18 17 16 15
AY1 AY0 AX2 AX1 AX0 X1 X3 X5 X7 VDD Y0 Y1 Y2 Y3
VSS
X0 X2 X4 X6
RESET
Y7
5 6 7 8 9 10 11
E B
A
O T A D
4
2
1
6 Y
CSS
3
3
1
5 Y
1
2
0
2
R
T
2
•
4
1
4 Y
X
Y
Y
Y
A
A
A
A
1
8
7
6
2
2
2
AX1
25
AX0
24
X1
23 22
X3
21
X5
20
X7
19
5
7
6
1
1
1
1
3
2 Y
Y
Y
VDD
8
1
0 Y
28 PIN CERDIP/PLASTIC DIP
28 PIN PLCC
Figure 2 - Pin Connections
Pin Description
Pin # Name Description
1AY2AY2 Address Line (Input). 2 STROBE
3CS 4DATADATA (Input): a logic high input will turn on the selected switch and a logic low will turn off
5V
6-9 X0, X2,
X4, X6
STROBE (Input): enables function selected by address and data. Address must be stable before STROBE
goes low and DATA must be stab le on the rising edge of STROBE .
Active Low. Chip Select (Inpu t ): this is used to select the device. Active Low.
the selected switch. Active High.
Ground Reference.
SS
X0, X2, X4 and X6 Analog (Inputs/Outputs): these are connected to the X0, X2, X4 and X6 rows of the switch array.
10 RESET
Master RESET (Input): this is use d to turn off all switches regardless of the condition of CS
. A 100kΩ internal pull-up resistor is also provided. This can be used in conjunction
with a 0.1µF capacitor (connected to the RESET
pin) to perform power-on reset of the
device. Active Low.
11-18 Y7 - Y0 Y7 - Y0 Analog (Inputs/Outputs): these are connected to the Y0 - Y7 columns of the
switch array.
19 V
20-23 X7, X5,
X3, X1
Positive Power Sup pl y.
DD
X7, X5, X3 and X1 Analog (Inputs/Outputs): these are connected to the X7, X5, X3 and X1 rows of the switch array.
24-26 AX0-AX2 AX0 - AX2 Address Lines (Inputs).
27, 28 AY0, AY1 AY0 and AY1 Address Lines (Inputs).
3-22
Page 3
ISO-CMOS MT8809
Functional Description
The MT8809 is an analog switch matrix with an array size of 8 x 8. The switch array is arranged such that there are 8 columns by 8 rows. The columns are referred to as the Y inputs/outputs and the rows are the X inputs/outputs. The crosspoint analog switch array will i n te r co n ne c t a n y X I/O with an y Y I/O when turned on and provide a high degree of isolation when turned off. The control memory consists of a 64 bit write only RAM in which the bits are selected by the address inputs (AY0-AY2, AX0-AX2). Data is presented to the memory on the DATA input. Data is asynchronously written into memory whenever both the CS and are latched on the rising edge of STROBE logical “1” written into a memory cell turns the corresponding crosspoint switch on and a logical “0” turns the crosspoint off. Only the crosspoint switches corresponding to the addressed memory location are altered when data is written into memory. The remaining switches retain their previous states. Any combination of X and Y inputs/outputs can be interconnected by establishing appropriate patterns in the control memory. A logical “0” on the RESET input will asynchronously return all memory locations to logical “0” turning off all crosspoint switches regardless of whether CS
(Chip Select) and STROBE inputs are low
. A
is high or low.
Address Decode
The six address inputs along with the STROBE and CS
(Chip Select) are logically ANDed to form an enable signal for the resettable transparent latches. The DATA input is buffered and is used as the input to all latches. To write to a l ocation, RESET high and CS are set up. Then the STROBE then high causing the data to be latched. The data can be changed while STROBE corresponding switch will turn on and off in accordance with the DATA input. DATA must be stable on the rising edge of STROBE correct data to be written to the latch.
must go low while the address and data
input is set low and
is low, however, the
must be
in order for
3-23
Page 4
MT8809 ISO-CMOS
Absolute Maximum Ratings*- Voltages are with respect to V
unless otherwise stated.
SS
Parameter Symbol Min Max Units
1 Supply Voltage V
2 Analog Input Voltage V 3 Digital Input Voltage V
DD
V
SS
INA
IN
-0.3
-0.3
V
15.0
DD
+0.3
-0.3 VDD+0.3 V
VSS-0.3 VDD+0.3 V 4 Current on any I/O Pin I ± 15 mA 5 Storage Temperature T 6 Package Power Dissipation PLASTIC DIP
CERDIP
* Exceeding these values may cause permanent damage. Functional operation under these conditions is not implied.
Recommended Operating Conditions - Voltages are with respect to V
S
P
D
P
D
SS
-65 +150 °C
0.6
1.0
unless otherwise stated.
Characteris tics Sym Min Typ Max Units Test Conditions
1 Operating Temperat ure T 2 Supply Voltage V 3 Analog In put Voltage V
4 Digital In put Voltage V
DC Electrical Characteristics
†
Characteristics Sym Min Typ
DD
INA
- Voltages are with respect to V
-40 2 5 85 °C
O
4.5 13.2 V
V
SS
V
IN
SS
SS
‡
Max Units Test Conditio ns
V
DD
V
DD
=0V, V
V V
=12V unless otherwi se stated .
DD
V V
W W
1 Quiescent Supply Current I
DD
1100µA All digital inp uts at VIN=V
V
except RESET = V
DD
120 40 0 µA All digital inputs at VIN=VSS or
V
except RESET = V
DD
0.5 1.6 mA A ll digi tal i np uts at VIN=2.4V, =5.0V
V
DD
5 15 mA All digital inputs at V
2 Off-state Leakage Current
(See G.9 in Appendix) 3 Input Logic “0” level V 4 Input Logic “1” level V 6 Input Leakage (digital pins) I
† DC Electrical Characteristics are over recommended temperature range. ‡ Typical figu res are at 25°C and are for desi gn aid only; not gua rantee d and not subje ct to producti on testing.
DC Electrical Characteristics- Switch Resistance - V
I
OFF
IL IH
LEAK
±1 ± 500 nA IVXi - VYjI = VDD - V
0.8 V
3.0 V
0.1 10 µA All digi tal i np uts at VIN = VSS
is the external DC offset applied at the analog I/O pins.
DC
See Appendix, Fig. A.1
or V
DD;
Characteristics Sym 25°C 70°C 85° C Units Test Conditions
Typ Max Typ Max Typ Max
1 On-sta te V
Resistance V
=12V
DD
=10V
DD
V
= 5V
DD
R
ON
45 55
120
65 75
185
75 85
215
80 90
225
Ω
VSS=0V,VDC=VDD/2,
Ω
IV See Appendix, Fig. A.2
Ω
(See G.1, G.2, G.3 in Appendix)
2 Difference in on-state
resistance between two switches (See G.4 in Appendix)
∆R
510 10 10 ΩVDD=12V, VSS=0,
ON
V IV See Appendix, Fig. A.2
RESET = V
I = 0.4V
Xi-VYj
DC=VDD
Xi-VYj
/2,
I = 0.4V
IN
SS
DD
SS
DD.
SS.
=3.4V
3-24
Page 5
ISO-CMOS MT8809
AC Electrical Characteristics† - Crosspoint Performance- V
Voltages are with respect to V
=5V, VDC=0V, VSS=-7V, unless otherwi se stated.
DD
is the external DC offset at the analog I/O pins.
DC
Characteristics Sym Min Typ‡Max Units Test Conditions
1 Switch I/O Capacitance C 2 Feedthrough Capacitance C 3 Frequency Response
F Channel “ON” 20LOG(V
OUT/VXi
4 Total Harmonic Distortion
)=-3dB
THD 0.01 % Switch is “ON”; V (See G.5, G.6 in Appendix)
5 Feedthrough
FDT -95 dB All Switches “OFF”; V Channel “OFF” Feed.=20LOG (V
OUT/VXi
)
(See G.8 in Appendix)
6 Crosstalk between any two
X channels for switches Xi-Yi and Xj-Yj .
Xtalk=20LOG (V
Yj/VXi
).
(See G.7 in Appendix).
S F
3dB
talk
20 pF f=1 MHz
0.2 pF f=1 MHz 45 MHz Switch is “ON”; V
sinewave; R
= 1kΩ
L
See Appendix, Fig. A.3
sinewave f= 1k Hz; R
2Vpp sinewave f= 1kHz; R
= 1kΩ.
L
See Appendix, Fig. A.4
-45 dB V
-90 dB V
-85 dB V
-80 dB V
=2Vpp sinewave
INA
f= 10MHz; R
=2Vpp sinewave
INA
f= 10kHz; R
=2Vpp sinewave
INA
f= 10kHz; R
=2Vpp sinewave
INA
f= 1kHz; R
L
= 75Ω.
L
= 600Ω.
L
= 1kΩ.
L
= 10kΩ. Refer to Appendix, Fig. A.5 for test circuit.
7 Propagation delay thro ugh
t
PS
30 ns RL=1kΩ; CL=50pF
switc h
† Timing is over recommended tempera tu re range . See Fig. 3 for control and I/O timing details. ‡ Typical figu res are at 25°C and are for design aid only; not guaran te ed and not subject to prod ucti on testin g. Crosstal k m ea su r em e nts a re fo r Pl as tic D I PS o nl y, cross tal k va lu es f or PLCC pa ckag e s a re approxim ately 5dB b etter.
AC Electrical Characteristics† - Control and I/O Timings- V
I/O pins. Voltages are with respect to V
=5V, VDC=0V , VSS=-7V, unless otherwise stated.
DD
is the external DC offset applied at the analog
DC
Characteristics Sym Min Typ‡Max Units Test Conditions
= 2Vpp
INA
= 2Vpp
INA
L
=1kΩ
=
INA
1 Control Input crosstalk to switch
(for CS
, DATA, STROBE,
CX
talk
Address) 2 Digital Input Capacitance C 3 Switching Frequency F 4 Setup Time DATA to STROBE 5 Hold Time DATA to STROBE t 6 Setup Time Address to STROBE t 7 Hold Time Address to STROBE t 8 Setup Time CS to STROBE t 9 Hold Time CS to STROBE t
10 STROBE Pulse Width t
11 RESET Pulse Width t 12 STROBE to Switch Status Delay t 13 DATA to Switch Status Delay t 14 RESET to Switch Status Delay t
† Timing is over recommended temperature range. See Fig. 3 for control and I/O timing details. Digital Inp ut ris e tim e (t r) an d fall time (tf) = 5 ns . ‡ Typical figu res are at 25°C and are for desi gn aid only; not guaran tee d and not subject to producti on testing.
Refer to Ap pe nd ix , Fig. A.7 for te st ci rc uit .
DI O
t
DS DH AS
AH CSS CSH SPW RPW
S D R
10 ns RL= 1kΩ, CL=50pF 10 ns RL= 1kΩ, CL=50pF 10 ns RL= 1kΩ, CL=50pF 10 ns RL= 1kΩ, CL=50pF 10 ns RL= 1kΩ, CL=50pF 10 ns RL= 1kΩ, CL=50pF 20 ns RL= 1kΩ, CL=50pF 40 ns RL= 1kΩ, CL=50pF
30 mVpp VIN=3V+VDC squarewave;
R See Appendix, Fi g. A.6
10 pF f=1MHz
20 MHz
40 100 ns RL= 1kΩ, CL=50pF 50 100 ns RL= 1kΩ, CL=50pF 35 100 ns RL= 1kΩ, CL=50pF
=1kΩ, RL=1kΩ.
IN
3-25
Page 6
MT8809 ISO-CMOS
t
CSS
CS
RESET
STROBE
ADDRESS
DATA
SWITCH*
50% 50%
t
SPW
50% 50% 50%
50% 50%
t
AS
50% 50%
t
DS
ON OFF
Figure 3 - Control Memory Timing Diagram
* See Appendix, Fig. A.7 for switching waveform
t
CSH
t
RPW
50% 50%
t
AH
t
DH
t
D
t
S
t
R
t
R
AY2 AY1 AY0 AX2 AX1 AX0 Connection AY2 AY1 AY0 AX2 AX1 AX0 Connection
0 0 0 0 0 0 0 0
0 0 0 0 0 0 0 0
0 0 0 0 0 0 0 0
0 0 0 0 0 0 0 0
0 0 0 0 0 0 0 0
0 0 0 0 0 0 0 0
1 1 1 1 1 1 1 1
1 1 1 1 1 1 1 1
0 0 0 0 0 0 0 0
1 1 1 1 1 1 1 1
0 0 0 0 0 0 0 0
1 1 1 1 1 1 1 1
0 0 0 0 1 1 1 1
0 0 0 0 1 1 1 1
0 0 0 0 1 1 1 1
0 0 0 0 1 1 1 1
0 0 1 1 0 0 1 1
0 0 1 1 0 0 1 1
0 0 1 1 0 0 1 1
0 0 1 1 0 0 1 1
0 1 0 1 0 1 0 1
0 1 0 1 0 1 0 1
0 1 0 1 0 1 0 1
0 1 0 1 0 1 0 1
X0 Y0 X1 Y0 X2 Y0 X3 Y0 X4 Y0 X5 Y0 X6 Y0 X7 Y0
X0 Y1 X1 Y1 X2 Y1 X3 Y1 X4 Y1 X5 Y1 X6 Y1 X7 Y1
X0 Y2 X1 Y2 X2 Y2 X3 Y2 X4 Y2 X5 Y2 X6 Y2 X7 Y2
X0 Y3 X1 Y3 X2 Y3 X3 Y3 X4 Y3 X5 Y3 X6 Y3 X7 Y3
1 1 1 1 1 1 1 1
1 1 1 1 1 1 1 1
1 1 1 1 1 1 1 1
1 1 1 1 1 1 1 1
0 0 0 0 0 0 0 0
0 0 0 0 0 0 0 0
1 1 1 1 1 1 1 1
1 1 1 1 1 1 1 1
0 0 0 0 0 0 0 0
1 1 1 1 1 1 1 1
0 0 0 0 0 0 0 0
1 1 1 1 1 1 1 1
0 0 0 0 1 1 1 1
0 0 0 0 1 1 1 1
0 0 0 0 1 1 1 1
0 0 0 0 1 1 1 1
0 0 1 1 0 0 1 1
0 0 1 1 0 0 1 1
0 0 1 1 0 0 1 1
0 0 1 1 0 0 1 1
0 1 0 1 0 1 0 1
0 1 0 1 0 1 0 1
0 1 0 1 0 1 0 1
0 1 0 1 0 1 0 1
X0 Y4 X1 Y4 X2 Y4 X3 Y4 X4 Y4 X5 Y4 X6 Y4 X7 Y4
X0 Y5 X1 Y5 X2 Y5 X3 Y5 X4 Y5 X5 Y5 X6 Y5 X7 Y5
X0 Y6 X1 Y6 X2 Y6 X3 Y6 X4 Y6 X5 Y6 X6 Y6 X7 Y6
X0 Y7 X1 Y7 X2 Y7 X3 Y7 X4 Y7 X5 Y7 X6 Y7 X7 Y7
3-26
Table 1. Address Decode Truth Table
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