Industrial (-40oC to +85oC)IT
Military (-55oC to +125oC)XT
• 2V data retention/low powerL
*Electrical characteristics identical to those provided for the 45ns
access devices.
PIN ASSIGNMENT
(Top View)
24-Pin DIP (C)
(300 MIL)
1
24
2
3
4
5
6
7
8
9
10
11
12
Vcc
23
A15
22
A14
21
A13
20
A12
19
A11
18
A10
17
DQ4
16
DQ3
15
DQ2
14
DQ1
13
WE\
CE\
Vss
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
28-Pin LCC (EC)
A1A0NC
NC
Vss
NC
Vcc
WE\
CE\
A2
A3
A4
A5
A6
A7
10
A8
11
A9
12
3 2 1 28 27
4
5
6
7
8
9
13 14 15 16 17
NC
DQ1
26
A15
25
A14
24
A13
23
A12
22
A11
21
A10
20
DQ4
19
DQ3
18
DQ2
GENERAL DESCRIPTION
The Austin Semiconductor SRAM family employs
high-speed, low-power CMOS and are fabricated using doublelayer metal, double-layer polysilicon technology.
For flexibility in high-speed memory applications,
Austin Semiconductor offers chip enable (CE\) on all organizations. This enhancement can place the outputs in High-Z for
additional flexibility in system design. The x4 configuration
features common data input and output.
Writing to these devices is accomplished when write
enable (WE\) and CE\ inputs are both LOW . Reading is accomplished when WE\ remains HIGH and CE\ goes LOW. The
device offers a reduced power standby mode when disabled.
This allows system designs to achieve low standby power requirements.
These devices operate from a single +5V power supply and all inputs and outputs are fully TTL compatible.
For more products and information
please visit our web site at
www.austinsemiconductor .com
MT5C2564
Rev. 2.0 11/00
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
*Stresses greater than those listed under "Absolute Maximum
Ratings" may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at
these or any other conditions above those indicated in the
operation section of this specification is not implied. Exposure
to absolute maximum rating conditions for extended periods
may affect reliability .
ELECTRICAL CHARACTERISTICS AND RECOMMENDED DC OPERATING CONDITIONS
(-55oC < TC < 125oC; VCC = 5V +10%)
DESCRIPTIONCONDITIONSSYMMINMAXUNITSNOTES
Input High (Logic 1) Voltage
Input Low (Logic 0) Voltage
Input Leakage Current
Output Leakage Current
Output High Voltage
Output Low Voltage
0V<
VIN<V
CC
Output(s) disabled
0V<V
OUT<VCC
I
=-4.0mAV
OH
I
=8.0mAV
OL
V
IL
IH
V
IL
IL
I
O
OH
OL
2.2
V
+0.5
CC
V1
-0.50.8V1, 2
-1010µA
-1010µA
2.4V1
0.4V1
MAX
PARAMETER
Power Supply
Current: Operating
Power Supply
Current: Standby
CONDITIONS
VIL; VCC = MAX
CE\ <
f = MAX = 1/t
Output Open
VIH; All Other Inputs
CE\ >
VIL or > VIH, VCC = MAX
<
f = 0 Hz
V
CE\ >
V
-0.2V; VCC = MAX
CC
V
< VSS +0.2V
IL
> VCC -0.2V; f = 0 Hz
IH
"L" Version Only
(MIN)
RC
SYM-15-20-25-35-45UNITS NOTES
I
I
SBT2
I
SBC2
I
SBC2
165150140120120mA3
cc
4545402525mA
2020202020mA
44444mA
CAPACITANCE
DESCRIPTIONCONDITIONSSYMMAXUNITSNOTES
Input Capacitance
Output Capacitance
T
= 25oC, f = 1MHz
A
= 5V
V
CC
C
I
C
O
10pF4
12pF4
MT5C2564
Rev. 2.0 11/00
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
3
Page 4
SRAM
MT5C2564
Austin Semiconductor, Inc.
ELECTRICAL CHARACTERISTICS AND RECOMMENDED AC OPERATING CONDITIONS
(Note 5) (-55oC < TC < 125oC; VCC = 5V +10%)
DESCRIPTION
READ CYCLE
READ cycle time
Address access time
Chip Enable access time
Output hold from address change
Chip Enable to output in Low-Z
Chip disable to output in High-Z
Chip Enable to power-up time
Chip disable to power-down time
WRITE CYCLE
WRITE cycle time
Chip Enable to end of write
Address valid to end of write
Address setup time
Address hold from end of write
WRITE pulse width
Data setup time
Data hold time
Write disable to output in Low-Z
Write Enable to output in High-Z
SYMBOL
t
RC
t
AA
t
ACE
t
OH
t
LZCE
t
HZCE
t
PU
t
PD
t
WC
t
CW
t
AW
t
AS
t
AH
t
WP
t
DS
t
DH
t
LZWE
t
HZWE
-20
-25-15
MIN MAX MIN MAX MI N MAX MI N MAX MI N MAX UNITS NOTES