Datasheet MSM9803-xxxRS, MSM9805-xxxGS-AK, MSM9805-xxxGS-K, MSM9805-xxxRS, MSM9803-xxxGS-K Datasheet (OKI)

E2D0018-39-93

This version: Sep. 1999

MSM9802/03/05-xxx¡ Semiconductor

¡ Semiconductor

Previous version: May. 1997

MSM9802/03/05-xxx

Voice Synthesis IC with Built-in Mask ROM

GENERAL DESCRIPTION

The MSM9802/03/05 is a PCM voice synthesis IC with built-in mask ROM.
This IC has two user selectable playback algorithms, OKI Non-linear PCM and straight PCM. It
also contains a current mode 10-bit D/A converter and a low-pass filter.
External control has been made easy by the built-in edit ROM that can form sentences by linking
phrases. By using Oki's Sound Analysis and Editing Tool, ROM data such as Phrase Control
Table can be easily set, created, edited, and evaluated.
With the stand-alone mode/microcontroller interface mode switching pin, the MSM9802/03/
05 can support various applications.

FEATURES

Device

MSM9802
MSM9803
MSM9805

* Actual voice ROM area is smaller by 11 Kbits.

• ROM custom

• 8-bit OKI nonlinear PCM method/8-bit straight PCM method

• Built-in edit ROM

• Random playback function

• Sampling frequency : 4.0 kHz/5.3 kHz/6.4 kHz/8.0 kHz/10.6 kHz/12.8 kHz/

• Maximum number of phrases : 63 (Microcontroller interface mode)

• Built-in current mode 10-bit D/A converter

• Built-in low-pass filter

• Standby function

• RC oscillation (256 kHz)/ceramic oscillation (4.096 MHz) selectable

• Package options:
18-pin plastic DIP (DIP18-P-300-2.54) (Product name: MSM9802-xxxRS/MSM9803-xxxRS/

24-pin plastic SOP (SOP24-P-430-1.27-K) (Product name: MSM9802-xxxGS-K/MSM9803-xxxGS-K/

30-pin plastic SSOP (SSOP30-P-56-0.65-K) (Product name: MSM9802-xxxGS-AK/MSM9803-xxxGS-

Chip

ROM size*

512 Kbits 16.0 10.0 8.0 4.0

1 Mbit 32.4 20.2 16.2 8.1

2 Mbits 65.1 40.7 32.5 16.2

=4.0 kHz f

f

SAM

16.0 kHz
Note: If RC oscillation is selected, 10.6 kHz, 12.8 kHz, and

16.0 kHz cannot be selected.

56 (Stand-alone mode)

Speech period (sec)

=6.4 kHz f

SAM

MSM9805-xxxRS)

MSM9805-xxxGS-K)

AK/MSM9805-xxxGS-AK)

=8.0 kHz f

SAM

xxx indicates code number.

=16.0 kHz

SAM

Note: This data sheet explains a stand-alone mode and a microcontroller interface mode,

separately.

1/51

MSM9802/03/05-xxx¡ Semiconductor

CONTENTS

(1) Stand-alone Mode

BLOCK DIAGRAM ............................................................................................................................. 3

PIN CONFIGURATION ..................................................................................................................... 4

PIN DESCRIPTIONS ........................................................................................................................... 6

ABSOLUTE MAXIMUM RATINGS ................................................................................................. 8

RECOMMENDED OPERATING CONDITIONS ........................................................................... 8

ELECTRICAL CHARACTERISTICS ................................................................................................ 9

TIMING DIAGRAMS ....................................................................................................................... 12

FUNCTIONAL DESCRIPTION....................................................................................................... 14

1. Playback Code Specification ............................................................................................. 14

2. Pull-up/Pull-down Resistor .............................................................................................. 14

3. Stand-alone Mode ............................................................................................................... 14

APPLICATION CIRCUITS .............................................................................................................. 19

(2) Microcontroller Interface Mode

BLOCK DIAGRAM ........................................................................................................................... 21

PIN CONFIGURATION ................................................................................................................... 22

PIN DESCRIPTIONS ......................................................................................................................... 24

ABSOLUTE MAXIMUM RATINGS ............................................................................................... 25

RECOMMENDED OPERATING CONDITIONS ......................................................................... 25

ELECTRICAL CHARACTERISTICS .............................................................................................. 26

TIMING DIAGRAMS ....................................................................................................................... 29

FUNCTIONAL DESCRIPTION....................................................................................................... 31

1. Playback Code Specification ............................................................................................. 31

2. Address Data ....................................................................................................................... 31

3. Stop Code ............................................................................................................................. 32

4. Generating Pseudo - BUSY Signal through NAR pin .................................................... 33

APPLICATION CIRCUIT................................................................................................................. 34

(3) Common

1. Sampling Frequency ........................................................................................................... 35

2. Recording/Playback Time................................................................................................. 35

3. Playback Method ................................................................................................................ 36

4. Phrase Control Table ..........................................................................................................37

5. RC Oscillation ...................................................................................................................... 39

6. Ceramic Oscillation ............................................................................................................ 40

7. Low-pass Filter .................................................................................................................... 42

8. Standby Transition.............................................................................................................. 43

9. Voice Output Unit Equivalent Circuit (AOUT, V

Pins) .......................................... 44

REF

D/A CONVERTER CURRENT CHARACTERISTICS ................................................................ 45

PAD CONFIGURATION ................................................................................................................. 46

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MSM9802/03/05-xxx¡ Semiconductor

(1) STAND-ALONE MODE (CPU/STD: "L" level)

BLOCK DIAGRAM

512-Kbit (MSM9802)
1-Mbit (MSM9803)
2-Mbit (MSM9805)

Multiplexer

Address &
Switching
Controller

6

PCM

Synthesizer

10

8

10-Bit

DAC

&

LPF

AOUT

DATA

Controller

16-Bit (MSM9802)
17-Bit (MSM9803)
18-Bit (MSM9805)

Timing Controller

GNDV

DD

RESET

Random

Circuit

I/O

Interface

OSC

XT/RC

XT/CR

A2
A1

A0
SW2
SW1
SW0

RND

BUSY

OSC1
OSC2

OSC3/TEST

CPU/STD

V

REF

16-Bit (MSM9802)
17-Bit (MSM9803)
18-Bit (MSM9805)

Address Counter

ROM

(Including 11 Kbits of

Edit ROM & Address ROM)

PIN CONFIGURATION (TOP VIEW)

MSM9802/03/05-xxx¡ Semiconductor

A0
A1

A2

RESET

XT/CR

BUSY

GND

V

REF

AOUT

1
2

3
4
5
6
7
8
9

18

SW2

17

SW1

16

SW0

15

RND

14

CPU/STD

13

OSC3/TEST

12

OSC2

11

OSC1

10

V

DD

18-Pin Plastic DIP

Note: Applicable to MSM9802-xxxRS, MSM9803-xxxRS, and MSM9805-xxxRS.

V

1

DD

24

AOUT

23
22

21
20
19
18
17
16
15
14
13

NC

NC

RND

NC

SW0
SW1
SW2

2
3

4
5
6
7
8
9

10
11
12

OSC1
OSC2

OSC3/TEST

CPU/STD XT/CR

NC: No connection

24-Pin Plastic SOP

V

REF

GND
NC

BUSY

NC

RESET

NC
A2

A1
A0

Note: Applicable to MSM9802-xxxGS-K, MSM9803-xxxGS-K, and MSM9805-xxxGS-K.

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MSM9802/03/05-xxx¡ Semiconductor

V

DD

OSC1
OSC2

NC
NC

OSC3/TEST

NC

CPU/STD

NC

RND

NC

SW2

30
29

28
27
26
25
24
23
22

21
20

16

AOUT
V

GND
NC
NC

BUSY

NC
XT/CR
NC

RESET

NC

A0

1
2

3
4
5
6
7
8
9

10
11
12 19NC NC
13 18SW0 A2
14 17SW1 A1
15

REF

NC: No connection

30-Pin Plastic SSOP

Note: Applicable to MSM9802-xxxGS-AK, MSM9803-xxxGS-AK, and MSM9805-xxxGS-AK.

5/51

PIN DESCRIPTIONS

MSM9802/03/05-xxx¡ Semiconductor

Pin

DIP4SOP17SSOP

21

62025

51823

14 7 8

82329

92430

72228

10 1 1

11 2 2

12 3 3

13 5 6

15810

Symbol Type Description

The IC enters the standby state if this pin is set to "L" level. At this time,
oscillation stops and AOUT drives a current of 0mA and becomes GND

RESET I

level, then the IC returns to the initial state.
Apply a "L" pulse upon power-on.
This pin has an internal pull-up resistor.
Outputs "L" level while voice is being played back.

BUSY O

At power-on, this pin is at "H" level.
XT/RC switching pin. Set to "H" level if ceramic oscillation is used.

XT/CR I

Set to "L" level if RC oscillation is used.
Microcontroller interface/stand-alone mode switching pin.

CPU/STD I

Set to "L" level if the MSM9802/03/05 is used in stand-alone mode.
Volume setting pin. If this pin is set to GND level, the maximum
current is forced in. If this pin is set to V

V

REF

I

is forced in. A pull-down resistor of approx. 10 W is internally
connected to this pin during operation.
Voice output pin.

AOUT O

The voice signals are output as current changes. In standby state, this
pin drives a current of 0 mA and becomes GND level.

GND —

Ground pin.
Power supply pin. Insert a bypass capacitor of 0.1 mF or more between

V

DD

—

and GND pins.

V

DD

Ceramic oscillator connection pin when ceramic oscillation is selected.

OSC1 I

RC connection pin when RC oscillation is selected.
Input from this pin if external clock is used.
Ceramic oscillator connection pin when ceramic oscillation is selected.
RC connection pin when RC oscillation is selected.

OSC2 O

Leave this pin open if external clock is used.
Outputs "L" level in standby state.
Leave this pin open when ceramic oscillation is used.

OSC3/TEST O

RC connection pin when RC oscillation is selected.
Outputs "H" level in standby state when RC oscillation is selected.
Random playback starts if RND pin is set to "L" level.
Fetches addresses from random address generation circuit in the IC at

RND I

fall of RND. Set to "H" level when the random playback function is not
used. This pin has internal pull-up resistor.

level, the minimum current

DD

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MSM9802/03/05-xxx¡ Semiconductor

Pin

DIP SOP SSOP

16-18 10-12 13-15

1-3 13-15 16-18

Symbol Type Description

Phrase input pins corresponding to playback sound.

SW0 - SW2 I

A0 - A2 I

If input changes, SW0 to SW2 pins fetch addresses after 16 ms and
start voice synthesis.
Each of these pins has internal pull-down resistor.
Phrase input pins corresponding to playback sound.
Input logic of A0 pin becomes invalid if the random playback function
is used.

7/51

ABSOLUTE MAXIMUM RATINGS

Parameter Symbol Condition Rating Unit

Power Supply Voltage
Input Voltage
Storage Temperature

T

V

V

DD

IN

STG

Ta=25°C

RECOMMENDED OPERATING CONDITIONS

Parameter Symbol Condition Range Unit

Power Supply Voltage V
Operating Temperature —

Master Clock Frequency 1

T

f

OSC1

OSC2

DD

op

— 2.0 to 5.5 V

MSM9802/03/05-xxx¡ Semiconductor

–0.3 to +7.0 V

–0.3 to VDD+0.3 V

–55 to +150 °C—

–40 to +85 °C

Min. Max.

Typ.

4.0963.5 4.5
256200 300Master Clock Frequency 2 f

(GND=0 V)

(GND=0 V)

MHzWhen crystal is selected

kHzWhen RC is selected (*1)

*1 The accuracy of the oscillation frequency when RC oscillation is selected depends largely on

the accuracy of the external R and C.

8/51

ELECTRICAL CHARACTERISTICS

DC Characteristics

(V

=5.0 V, GND=0 V, Ta=–40 to +85°C, unless otherwise specified)

DD

Parameter Symbol Condition Unit

"H" Input Voltage V
"L" Input Voltage —

*1

*2

*3

*4

Standby Current I

V

Pin Pull-down Resistance

REF

IH

V

IL

V

OH

V

OL

IH1

Internal pull-down resistor

Applies to OSC1 pin only.

I

IH2

IH3

IL1

IL2

V

DD1

AOUT bias voltage=0V

At maximum output current

DD2

V

AOUT bias voltage=0V

DS

At maximum output current,

AOUT

V

AOUT bias voltage=0V

R

VREF

MSM9802/03/05-xxx¡ Semiconductor

Min. Max.

——V

4.2 —
— 0.8

4.6 —

DD

V

IH=VDD

REF=VDD

REF

REF

,

=GND,

=GND,

Typ.

—V
—V"H" Output Voltage IOH=–1 mA
—— 0.4
——10"H" Input Current 1 I
9030 200"H" Input Current 2 I

——15"H" Input Current 3

—–10 —"L" Input Current 1 I

–90–200 –30"L" Input Current 2 I

0.4—1Dynamic Supply Current 1 I

——16Dynamic Supply Current 2 I

V"L" Output Voltage IOL=2 mA
µAVIH=V
µA

µA

µAVIL=GND
µAInternal pull-up resistor

mA

mA

——10µATa=–40 to +70°C
——50

9.5615AOUT Output Current I

10713

µATa=70 to 85°C

mA

kW—

*1 Applicable to SW0-SW2
*2 Applicable to RESET, RND
*3 Dynamic supply current (excluding DAC output current)
*4 Dynamic supply current at maximum output current

9/51

DC Characteristics

(V

=3.1 V, GND=0 V, Ta=–40 to +85°C, unless otherwise specified)

DD

Parameter Symbol Condition Unit

"H" Input Voltage V
"L" Input Voltage —

*1

*2

*3

*4

Standby Current I

V

Pin Pull-down Resistance

REF

IH

V

IL

V

OH

V

OL

IH1

IH2

Internal pull-down resistor

Applies to OSC1 pin only.

IH3

IL1

IL2

V

DD1

AOUT bias voltage=0V

At maximum output current

I

DD2

V

AOUT bias voltage=0V

DS

At maximum output current,

AOUT

V

AOUT bias voltage=0V

R

VREF

MSM9802/03/05-xxx¡ Semiconductor

Min. Max.

——V

2.7 —
— 0.5

2.6 —

DD

V

IH=VDD

REF=VDD

REF

REF

,

=GND,

=GND,

Typ.

—V
—V"H" Output Voltage IOH=–1 mA
—— 0.4
——10"H" Input Current 1 I
3010 100"H" Input Current 2 I

——15"H" Input Current 3 I

—–10 —"L" Input Current 1 I

–30–100 –10"L" Input Current 2 I

0.15— 0.5Dynamic Supply Current 1 I

—— 5.5Dynamic Supply Current 2

V"L" Output Voltage IOL=2 mA
µAVIH=V
µA

µA

µAVIL=GND
µAInternal pull-up resistor

mA

mA

——5µATa=–40 to +70°C
——20

3.21.4 5AOUT Output Current I

10713

µATa=70 to 85°C

mA

kW—

*1 Applicable to SW2-SW0
*2 Applicable to RESET, RND
*3 Dynamic supply current (excluding DAC output current)
*4 Dynamic supply current at maximum output current

10/51

AC Characteristics

Parameter Symbol Condition Unit

Master Clock Duty Cycle f

RESET Input Pulse Width —
RESET Input Time After Power-on

BUSY

Output Time t

duty

t

w(RST)

t

D(RST)

t

w(RAN)

w(SW)

SBS

CHA

CHB

, t

DAR

DAF

STB

BLN

RA

f

MSM9802/03/05-xxx¡ Semiconductor

(V

=5.0 V, GND=0 V, Ta=–40 to +85°C)

DD

Min. Max.

—50%

40 60
10 —

—

0—

(note)

(note)

—

(note)
(note)
(note)

SAM

=8 kHz

(note)
(note)

Typ.

—µs
—µs
—100 —
—16 —SW0-SW2 Input Pulse Width t
——10
1514 16Chattering Prevention Time 1 t
——16Chattering Prevention Time 2 t

6460 68D/A Converter Change Time t
250200 300Standby Transition Time t
375350 500Silence Time Between Phrases t

1615 17Random Address Fetch Time t

µsRND Input Pulse Width —

ms—

µs—
ms—
ms
ms—
ms—

µs

µs—

(Note) Proportional to master the periods of oscillation frequencies f

The rated values show values when the standard master oscillation frequency is used.

OSC1

and f

OSC2

.

11/51

TIMING DIAGRAMS

AC Characteristics at Power-On

MSM9802/03/05-xxx¡ Semiconductor

V

DD

VDDMin

t

D(RST)

RESET (I)

t

W(RST)

BUSY (O)

SW2-SW0 (I)

AC Characteristics in Standby Status and when the IC is Activated

A2-A0 (I)

SW2-SW0 (I)

SW0 (I)

BUSY (O)

t

t

SBS

First phrase

First phrase"000" "000"
t

w(SW)

CHA

Address data fetch

AOUT (O)

t

DAR

Standby status

Oscillation start

Repeated Playback Timing

A2-A0 (I)

SW2-SW0 (I)

SW0 (I)

BUSY (O)

AOUT (O)

Standby transition time

D/A converter change time

First phrase

First phrase"000" "000"

t

STB

Single phrase

playback

t

DAF

Standby status

Single phrase

repeated playback

t

BLN

12/51

Timing when Changing from SW2 to SW0 During Playback

MSM9802/03/05-xxx¡ Semiconductor

A2-A0 (I)

SW2-SW0 (I)

SW2 (I) "L"

SW1 (I)

SW0 (I)

BUSY (O)

AOUT (O)

First phrase

First phrase"000" "000"

First phrase

playback

First phrase playback stops

t

CHB

Repeated Playback Timing for Random Playback

RND (I)

Second phrase

Second phrase "000"

t

BLN

Second phrase

playback

BUSY (O)

AOUT (O)

First phrase

playback

repeated playback

Oscillation start

Timing when Changing from A2 to A0 During Playback

A2-A0 (I)

SW2-SW0 (I)

(Ex.)

"000" "000"

SW0 (I)

First phrase

First phrase

t

CHA

First phrase

Same phrase

t

BLN

Second phrase

(Second phrase)

Second phrase

Address data fetch

BUSY (O)

AOUT (O)

First phrase

playback

t

BLN

Second phrase

playback

13/51

MSM9802/03/05-xxx¡ Semiconductor

FUNCTIONAL DESCRIPTION

1. Playback Code Specification

The user can specify a maximum of 56 phrases. Table 1.1 shows the settings by the A2-A0 and
SW2-SW0 pins.

Table 1.1 User-specified Phrases

A2-A0 Code Details

000

111

SW2-SW0

000
001

111

Inhibit code

User-specified phrase

(56 phrases)

2. Pull-up/Pull-down Resistor

The RESET and RND pins have internal pull-up resistors and the SW2-SW0 pins have internal
pull-down resistors.

3. Stand-alone Mode

In a stand-alone mode, the SW input interface function and the random playback function can
be used.

3.1 SW input interface

With the SW input interface, speech synthesis starts when the state of the SW2-SW0 pins has
changed. To prevent chattering, the address data is latched 16 ms (t

) after the state of SW2-

CHA

SW0 has changed. Voice synthesis does not start if the state of the A2-A0 pins has changed. Set
the RND pin to "H" level if the random playback function is not used.

Set the A2-A0 pins to "L" level at power-on or at reset.
The SW input interface is effective when the MSM9802/03/05 is operated using a push-button
switch. Voice synthesis starts when an address is changed by pressing the push-button switch.
If the push-button switch is released during playback, then playback stops after the current
phrase is completed.

A2-A0 (I)

SW2-SW1 (I) "L"

t

CHA

t

w(SW)

SW0 (I)

BUSY (O)

AOUT (O)

Oscillation start

Figure 3.1 SW Input Interface Single-Phrase Playback Timing

14/51

MSM9802/03/05-xxx¡ Semiconductor

If playback is attempted at an unused address in the phrases, AOUT goes to 1/2 I

AOUT

and

playback does not occur. Figure 3.2 shows the timing.

A2-A0 (I)

SW2-SW1 (I) "L"

SW0 (I)

BUSY (O)

AOUT (O)

Oscillation start

Figure 3.2 Timing when Playback is Attempted at an Unused Phrase Address

In the SW input interface, no phrase is triggered when SW2 to SW0 are all set to "0". Therefore,
when the circuit consists of a diode matrices that use push-button switches, the maximum
playback phrases are 56 phrases.

A2-A0

000
001
002

111

8 codes

SW2-SW0

¥

¥

(000)

001
002

111

7 codes

Code Prohibited

= 56 Phrases

= 56

3.2 Random playback function

The random playback function randomly generates 15 different addresses corresponding to the
four bits of the addresses of A0 and SW2-SW0 (except ALL "L") on the IC, after which playback
commences.

Therefore, any input to A0 and SW2 to SW0 pins from external control is invalid. Hold these 4
pins either "H" or "L" level. SW2 to SW0 pins may be held open as they have internal pull-down
resistor.

Playback may not occur if all the 15 addresses have not been assigned a phrase. Care must be
taken when creating ROM data.

For example, when four phrases, "sunny", "rainy", "cloudy", and "snowy", are to be played
randomly, set the phrases as shown in Table 3.1 in which a phrase is assigned to all the 15
addresses. The four phrases are then played back at random as shown below.

15/51

MSM9802/03/05-xxx¡ Semiconductor

Table 3.1 Random Address Setup Example

A2, A1 A0, SW2-SW0 Phrase

00 0001

0010
0011
0100
0101

1110
1111

sunny

rainy
cloudy
snowy

sunny

rainy
snowy

Random playback starts when the timing shown in Figure 3.3 is input to the RND pin. A random
address is fixed based on the "H" level time of the RND pin during IC oscillation. Random
address is captured at the fall of the RND pin, and voice playback commences. Therefore, when
power is turned on, or when RESET is input, the phrase at fixed address "0001" is played while
the random counter remains initialized until random playback is initiated.

RESET (I)

RND (I)

BUSY (O)

AOUT (O)

Oscillation start

t

W (RAN)

t

RA

t

W (RAN)

Random address fixed time Random address fixed time

t

RA

Playback

(Address = 0001)

Playback

(Address = random)

Figure 3.3 Random Address Capture

16/51

Table 3.2 Random Playback Address

A2, A1 A0, SW2 to SW0 Phrase (Sample)

MSM9802/03/05-xxx¡ Semiconductor

00

01

10

11

0001
0010
0011
0100

1111
0001

0010
0011
0100

1111
0001

0010
0011
0100

1111
0001

1111

··· ··· ··· ···

Hit
Hit
Hit

Out

Out

Hit
Out
Out
Out

Out

White

Black

Red

Blue

··· ··· ···

Green

··· ······

For a random address, 15 phrases can be set for each logical condition of addresses A2 and A1
(i.e., "00", "01", "10", and "11").

In random playback, the four logic states ("000000", "010000", "100000" and "110000") in user­specified phrases cannot be used. Take it into consideration when creating ROM data.

A random address is set by the "H" level time of the RND pin, so if the same pulse width is input
by microcontroller, the random address fixed time becomes constant, and a random phrase may
not be played under these conditions. The random address fixed time must be inconsistent in
order to produce random playback.

RND (I)

Invalid pulse

Pulse input during this time period is invalid

BUSY (O)

AOUT (O)

Oscillation start

Figure 3.4 Timing when a Pulse is Input to the RND Pin During Random Playback

17/51

MSM9802/03/05-xxx¡ Semiconductor

Table 3.3 Random Playback and Stop Address

A2, A1 A0, SW2-SW0* Code Details

0001

00

1111

01 0001 Stop address

Random playback address

* Address(es) corresponding to the A0 and SW2-SW0 pins

SW0
SW1
SW2

A0
A1
A2

RND

(15 addresses)

Figure 3.5 Circuit Example for Random Playback Stop

An unused user-specified address is used as a stop address, therefore the IC can enter standby

without voice playback, as shown in Figure 3.2.

18/51

APPLICATION CIRCUITS

S3 S2 S1

MSM9802/03/05-xxx¡ Semiconductor

V

DD

S4

SW0

SW1

SW2

RND

A0
A1

A2

XT/CR

CPU/STD

GND

AOUT

V

REF

BUSY

RESET

OSC3

OSC2

OSC1

S4="L"

S4="H"

Address [HEX]SW0SW1SW2A0A1A2
100000S1
010000S2
001000S3
100100S1
010100S2
001100S3

Application Circuit for Playing Six Phrases Using Four Switches

01
02
04
09
0A
0C

19/51

V

DD

AOUT

SW0

SW1

SW2

REF

V

BUSY

RESET

XT/CR

CPU/STD

RND

A0

OSC3

A1

MSM9802/03/05-xxx¡ Semiconductor

OSC2

OSC1

GND

A2

1234567

Application Circuit Using Switches

20/51

21/51

MSM9802/03/05-xxx¡ Semiconductor

(2) MICROCONTROLLER INTERFACE MODE (CPU/STD: "H" level)

BLOCK DIAGRAM

ROM

(Including 11Kbit of

Edit ROM & Address ROM)

Multiplexer

Address
Controller

6

PCM

Synthesizer

10

8

10-Bit

DAC

&

LPF

AOUT

DATA

Controller

Address Counter

Timing Controller

GNDV

DD

RESET

I/O

Interface

OSC

XT/RC

XT/CR

I5
I4
I3
I2
I1
I0

ST

NAR

OSC1
OSC2

OSC3/TEST

CPU/STD

V

REF

512-Kbit (MSM9802)
1-Mbit (MSM9803)
2-Mbit (MSM9805)

16-Bit (MSM9802)
17-Bit (MSM9803)
18-Bit (MSM9805)

16-Bit (MSM9802)
17-Bit (MSM9803)
18-Bit (MSM9805)

PIN CONFIGURATION (TOP VIEW)

MSM9802/03/05-xxx¡ Semiconductor

RESET

XT/CR

NAR

GND

V

REF

AOUT

I3
I4

I5

1
2

3
4
5
6
7
8
9

18

I2

17

I1

16

I0

15

ST

14

CPU/STD

13

OSC3/TEST

12

OSC2

11

OSC1

10

V

DD

18-Pin Plastic DIP

Note: Applicable to MSM9802-xxxRS, MSM9803-xxxRS, and MSM9805-xxxRS.

V

1

DD

24

AOUT

23
22

21
20
19
18
17
16
15
14
13

V

REF

GND
NC
NAR
NC
XT/CR

RESET

NC
I5

I4
I3

OSC1
OSC2

NC

OSC3/TEST

NC

CPU/STD

ST

NC

I0
I1
I2

2
3

4
5
6
7
8
9

10
11
12

NC: No connection

24-Pin Plastic SOP

Note: Applicable to MSM9802-xxxGS-K, MSM9803-xxxGS-K, and MSM9805-xxxGS-K.

22/51

MSM9802/03/05-xxx¡ Semiconductor

V

DD

OSC1
OSC2

NC
NC

OSC3/TEST

NC

CPU/STD

NC

ST

NC

I2

30
29

28
27
26
25
24
23
22

21
20

16

AOUT
V

GND
NC
NC
NAR
NC
XT/CR
NC

RESET

NC

I3

1
2

3
4
5
6
7
8
9

10
11
12 19NC NC
13 18I0 I5
14 17I1 I4
15

REF

NC: No connection

30-Pin Plastic SSOP

Note: Applicable to MSM9802-xxxGS-AK, MSM9803-xxxGS-AK, and MSM9805-xxxGS-AK.

23/51

PIN DESCRIPTIONS

MSM9802/03/05-xxx¡ Semiconductor

Pin

DIP SOP SSOP

41721

62025

51823

14 7 8

82329

92430

72228

10 1 1

11 2 2

12 3 3

13 5 6

15810

16-18

10-15 13-18

1-3

Symbol Type Description

The IC enters the standby state if this pin is set to "L" level. At this time,
oscillation stops and AOUT drives a current of 0 mA and becomes GND

RESET I

level, then the IC returns to the initial state.
Apply a "L" pulse upon power-on.
This pin has an internal pull-up resistor.
Signal output pin that indicates whether the 6-bit LATCH (see Block

NAR O

Diagram) is idle. NAR at "H" level indicates that the LATCH is empty
and ST input is enabled.

XT/RC switching pin. Set to "H" level if ceramic oscillation is used.

XT/CR I

Set to "L" level if RC oscillation is used.
Microcontroller interface/stand-alone mode switching pin. Set to "H"

CPU/STD I

level if the MSM9802/03/05 is used in microcontroller interface mode.
Volume setting pin. If this pin is set to GND level, the maximum

V

REF

I

forced in. An approx. 10 kW pull-down resistor is internally connected

current is forced in, and if set to V

level, the minimum current is

DD

to this pin during operation.
Voice output pin.

AOUT O

The voice signals are output as current changes. In standby state, this
pin drives a current of 0 mA and becomes GND level.

GND —

Ground pin.
Power supply pin. Insert a bypass capacitor of 0.1 mF or more between

V

DD

—

this pin and the GND pin.
Ceramic oscillator connection pin when ceramic oscillation is selected.

OSC1 I

RC connection pin when RC oscillation is selected.
Input from this pin if external clock is used.
Ceramic oscillator connection pin when ceramic oscillation is selected.
RC connection pin when RC oscillation is selected.

OSC2 O

Leave this pin open if external clock is used.
Outputs "L" level in standby state.
Leave this pin open when ceramic oscillation is used.

OSC3/TEST O

RC connection pin when RC oscillation is selected.
Outputs "H" level in standby state when RC oscillation is selected.
Voice synthesis starts at fall of ST, and addresses I0 to I5 are fetched

ST I

at rise of ST. Input ST when NAR, the status signal, is at "H" level.
This pin has internal pull-up resistor.
Phrase input pins corresponding to playback sound.

I0 - I5 I

24/51

ABSOLUTE MAXIMUM RATINGS

Parameter Symbol Condition Rating Unit

Power Supply Voltage
Input Voltage
Storage Temperature

T

V

DD

V

STG

IN

Ta=25°C

RECOMMENDED OPERATING CONDITIONS

Parameter Symbol Condition Range Unit

Power Supply Voltage V
Operating Temperature —

Original Oscillation Frequency 1

T

f

OSC1

OSC2

DD

op

— 2.0 to 5.5 V

MSM9802/03/05-xxx¡ Semiconductor

–0.3 to +7.0 V

–0.3 to VDD+0.3 V

–55 to +150 °C—

–40 to +85 °C

Min. Max.

Typ.

4.0963.5 4.5
256200 300Original Oscillation Frequency 2 f

(GND=0V)

(GND=0 V)

MHzWhen crystal is selected

kHzWhen RC is selected (*1)

*1 The accuracy of the oscillation frequency when RC oscillation is selected depends largely on

the accuracy of the external R and C.

25/51

ELECTRICAL CHARACTERISTICS

DC Characteristics

(V

=5.0 V, GND=0 V, Ta=–40 to +85°C, unless otherwise specified)

DD

Parameter Symbol Condition Unit

"H" Input Voltage V
"L" Input Voltage —

*1

*2

*3

Standby Current I

V

Pin Pull-down Resistance

REF

IH

V

IL

V

OH

V

OL

IH1

Applies to OSC1 pin only.

IH2

IL1

IL2

DD1

AOUT bias voltage=0V

At maximum output current

DD2

V

AOUT bias voltage=0V

DS

At maximum output current,

AOUT

V

AOUT bias voltage=0V

R

VREF

MSM9802/03/05-xxx¡ Semiconductor

Min. Max.

——V

4.2 —
— 0.8

4.6 —

DD

V

IH=VDD

V

REF=VDD

REF

REF

,

=GND,

=GND,

Typ.

—V
—V"H" Output Voltage IOH=–1 mA
—— 0.4
——10"H" Input Current 1 I

——15"H" Input Current 2 I

—–10 —"L" Input Current 1 I

–90–200 –30"L" Input Current 2 I

0.4—1Dynamic Supply Current 1 I

——16Dynamic Supply Current 2 I

——10

V"L" Output Voltage IOL=2 mA

µAVIH=V

µA

µAVIL=GND
µAInternal pull-up resistor

mA

mA

µATa=–40 to +70°C

——50µATa=70 to 85°C

9.5615AOUT Output Current I

10713

mA

kW—

*1 Applicable to RESET, ST
*2 Dynamic supply current (excluding DAC output current)
*3 Dynamic supply current at maximum output current

26/51

DC Characteristics

(V

=3.1 V, GND=0 V, Ta=–40 to +85°C, unless otherwise specified)

DD

Parameter Symbol Condition Unit

"H" Input Voltage V
"L" Input Voltage —

*1

*2

*3

Standby Current I

V

Pin Pull-down Resistance

REF

IH

V

IL

V

OH

V

OL

IH1

Applies to OSC1 pin only.

IH2

IL1

IL2

V

DD1

AOUT bias voltage=0V

At maximum output current

DD2

V

AOUT bias voltage=0V

DS

At maximum output current,

AOUT

V

AOUT bias voltage=0V

R

VREF

MSM9802/03/05-xxx¡ Semiconductor

Min. Max.

——V

2.7 —
— 0.5

2.6 —

DD

V

IH=VDD

REF=VDD

REF

REF

,

=GND,

=GND,

Typ.

—V
—V"H" Output Voltage IOH=–1 mA
—— 0.4
——10"H" Input Current 1 I

——15"H" Input Current 2 I

—–10 —"L" Input Current 1 I

–30–100 –10"L" Input Current 2 I

0.15— 0.5Dynamic Supply Current 1 I

—— 5.5Dynamic Supply Current 2 I

——5

V"L" Output Voltage IOL=2 mA

µAVIH=V

µA

µAVIL=GND
µAInternal pull-up resistor

mA

mA

µATa=–40 to +70°C

——20µATa=70 to 85°C

3.21.4 5AOUT Output Current I

10713

mA

kW—

*1 Applicable to RESET, ST
*2 Dynamic supply current (excluding DAC output current)
*3 Dynamic supply current at maximum output current

27/51

AC Characteristics

Parameter Symbol Condition Unit

Master Clock Duty Cycle f

RESET Input Pulse Width —
RESET Input Time After Power-on

Standby Transition Time
(at end of voice output)

duty

t

w(RST)

t

D(RST)

STP

t

(ST)

Upon entering the stop code

SS

DW

WD

SNS

NAA

NAB

NAC

, t

DAR

DAF

t

STB

BLN

MSM9802/03/05-xxx¡ Semiconductor

(V

=5.0 V, GND=0 V, Ta=–40 to +85°C)

DD

Min. Max.

—50%

40 60
10 —

—

0—
1

40

(note)

=8 kHz

SAM

SAM

SAM

SAM

=8 kHz
=8 kHz
=8 kHz

(note)
(note)
(note)
(note)

(note)

SAM

=8 kHz

(note)

Typ.

—µs
—µs
——t
—0.35 2000

——t

—1—Data Setup Time t
—1—Data Hold Time t

——10NAR Output Time (1) t
375350 400NAR Output Time (2) t
440315 500NAR Output Time (3) t
375350 500NAR Output Time (4) t

6460 68D/A Converter Change Time t

250200 300

375350 500Silence Time Between Phrases t

µsST Signal Setup Time At power-on
µsST Input Pulse Width —

µsST-ST Pulse Interval

µs—
µs—
µsf
µsf
µsf
µsf

ms—

ms—

µsf

(Note) Proportional to master the periods of oscillation frequencies f

The rated values show values when the standard master oscillation frequency is used.

OSC1

and f

OSC2

.

28/51

TIMING DIAGRAMS

g

AC Characteristics at Power-On

MSM9802/03/05-xxx¡ Semiconductor

V

DD

VDDMin

t

D(RST)

RESET (I)

t

W(RST)

NAR (O)

t

STP

ST (O)

AC Characteristics in Standby Status and when the IC is Activated

I5-I0 (I)

t

(ST)

ST (

I

NAR (O)

t

)

DW

t

t

WD

SNS

AOUT (O)

t

DAR

Oscillation start

t

NAA

Voice playback

Standby transition time

D/A converter chan

t

STB

e time

t

DAF

29/51

30/51

MSM9802/03/05-xxx¡ Semiconductor

Playback Timing

AOUT (O)

t

DAR

NAR (O)

ST (

I

)

I5-I0 (I)

1st phrase address 2nd phrase address 3rd phrase address

1st phrase

playback

2nd phrase

playback

3rd phrase

playback

t

NAC

Oscillation start

t

NAB

t

BLN

MSM9802/03/05-xxx¡ Semiconductor

FUNCTIONAL DESCRIPTION

1. Playback Code Specification

The user can specify a maximum of 63 phrases. Table 1.1 shows the settings by the I5-I0 pins.

Table 1.1 User-specified Phrases

I5-I0
000000
000001

111111

Code Details

Stop code

User-specified phrase

(63 Phrases)

2. Address Data

If a phrase is input at I5-I0 pins by address data, and if a ST pulse is then applied, voice playback

starts. Figure 2.1 shows voice start timing. Figure 2.2 shows timing when an address other than
a phrase is input.

I5-I0 (I)

ST (

I

NAR (O)

AOUT (O)

)

User phrase

I5-I0 (I)

ST (

I

NAR (O)

AOUT (O)

Oscillation start Voice end

Figure 2.1 Voice Start Timing

Address other than user phrase

)

Oscillation start

Figure 2.2 Timing when Address Other than a Phrase

is Input in Stand-by Mode

31/51

MSM9802/03/05-xxx¡ Semiconductor

p

3. Stop Code

If I5-I0 are set to "000000" during voice playback, and a ST signal is input, playback stops

regardless of whether NAR is at "H" or "L" level, then AOUT becomes 1/2 I

AOUT

. Stop code

becomes valid at the falling edge of ST.

Figure 3.1 shows stop code input timing.

I5-I0 (I)

ST (

I

NAR (O)

AOUT (O)

t

SS

)

Voice sto

User phrase"000000"

Figure 3.1 Stop Code Input Timing

The stop code does not initialize internal units but only stops playback. To initialize an internal

register, use the RESET pin.

32/51

MSM9802/03/05-xxx¡ Semiconductor

4. Generating Pseudo-BUSY Signal through NAR Pin

If the application in use requires a BUSY signal when this IC is used in microcontroller interface

mode, a pseudo-BUSY signal can be generated through the NAR pin by controlling signal timing,
as shown below.

4.1 When edit ROM is not used

01 (Phrase 1) 02 (Phrase 2) 03 (Phrase 3) 04 (Silence phrase of 32 ms or more)

I5-I0

ST

30ms or more 30ms or more 30ms or more

NAR

(Pseudo-BUSY)

AOUT

t

DAR

Phrase 1

Phrase 2 Phrase 3

t

NAB

t

NAB

Silence
phrase

t

NAB

t

STB

t

DAF

4.2 When edit ROM is used

I5-I0

ST

NAR

(Pseudo-BUSY)

AOUT

01

(Phrases 1+2+3)

t

DAR

02 (Silence phrase of 32 ms or more)

30ms or more

Phrase 1

t

BLN

Phrase 2

Phrase
t

BLN

Silence

3

phrase

t

NAB

t

STB

t

DAF

33/51

APPLICATION CIRCUIT

MSM9802/03/05-xxx¡ Semiconductor

+
–

RESET

P1.5
P1.4
P1.3
P1.2
P1.1
P1.0 I0

P2.2
P2.1

MSM83C154 (MCU)

P3.0 NAR

XTAL2XTAL1

Application Circuit in Microcontroller Interface

I5
I4
I3
I2
I1

ST
RESET

OSC3

V

DD

V

REF

AOUT

MSM9802/03/05

CPU/STD

XT/CR

OSC2
OSC1

GND

V

CC

SP

A

IN

STBY
VR

GND

+
–

SP

MSC1157 (Speaker AMP)

SEL

34/51

MSM9802/03/05-xxx¡ Semiconductor

(3) Common

1. Sampling Frequency

As shown in Table 1.1, 7 sampling frequencies are available.
A sampling frequency can be selected and assigned to each phrase in ROM data.

Table 1.1 Sampling Frequency

Sampling Frequency

At standard

oscillation frequency

4.0 kHz f

5.3 kHz f

6.4 kHz f

8.0 kHz f

10.6 kHz f

12.8 kHz f

16.0 kHz f

Ceramic Oscillation

Frequency diving ratio

XT/CR="H"

/1024 f

OSC1

/768 f

OSC1

/640 f

OSC1

/512 f

OSC1

/384 Unavailable

OSC1

/320 Unavailable

OSC1

/256 Unavailable

OSC1

XT/CR="L"

CR Oscillation

/64

OSC2

/48

OSC2

40

OSC2/

/32

OSC2

Note: When RC oscillation is selected, 10.6 kHz, 12.8 kHz, and 16 kHz cannot be selected.

2. Recording/Playback Time

Figure 2.1 below shows memory allocation of the on-chip Mask ROM. About 11 Kbits of data area

is allocated for the Phrase Control Table, Phrase Data Control and Test Data.

Therefore, actual data area for storing sound data equals the total Mask ROM capacity minus 11

Kbits.

Phrase Control Table Area
Pharase Data Control Area

Test Data Area

User's Area

Figure 2.1 Memory Allocation of On-chip Mask ROM

4K bit
4K bit
3K bit

501K bit (MSM9802)
1013K bit (MSM9803)
2037K bit (MSM9805)

On-chip Mask ROM Capacity
512K bit (MSM9802)
1M bit (MSM9803)
2M bit (MSM9805)

35/51

MSM9802/03/05-xxx¡ Semiconductor

The playback time is obtained by dividing the memory capacity by the bit rate.
The playback time for 8-bit PCM algorithm is obrained by using the following equation.

Playback time [sec] = =

Memory capacity [bit]

Bit rate [bps]

Memory capacity [bit]

Sampling frequency [Hz] ¥ 8 [bit]

For example, if all phrases are stored in the MSM9802 at 8 kHz sampling frequency, the

maximum playback time is as follows.

Playback time =

(512–11) ¥ 1024 [bit]

8000 [Hz] ¥ 8 [bit]

=

8.0 [sec]

Table 2.1 Maximum playback time

Model

MSM9802
MSM9803
MSM9805

ROM capacity

512K bit

1M bit
2M bit

User's area

501K bit
1013K bit
2037K bit

f

SAM

=4.0kHz

16.0

32.4

65.1

Maximum playback time (sec)

f

f

SAM

=6.4kHz

10.0

20.2

40.7

SAM

=8.0kHz

8.0

16.2

32.5

f

SAM

=16.0kHz

4.0

8.1

16.2

3. Playback Method

This IC provides two kinds of playback methods, non-linear PCM algorithm and straight PCM
algorithm. When the 8-bit non-linear PCM algorithm is selected, sound quality can be improved
because a resolution equivalent to 10-bit straight PCM is available around the waveform center.
You can select either non-linear PCM algorithm or straight PCM algorithm for each phrase. Table

3.1 shows the relationship between playback methods and applicable sounds. It is recom­mended to evaluate the sound quality before actual use.

Table 3.1 Relationship between playback methods and applicable sounds

Playback method Applicable sound

8-bit non-linear PCM algorithm Human voice
8-bit straight PCM algorithm BEEP tone, sound effects

36/51

MSM9802/03/05-xxx¡ Semiconductor

4. Phrase Control Table

Because the LSI contains the Phrase Control Table, it is possible to play back multiple phrases in

succession by a single easy control operation like controlling a single regular phrase playback.

Up to 8 combined phrases including a silence can be registered in a single address in the Phrase

Control Table.

Further, you can use the maximum memory space for data storage because it is not required to

have the same phrase data.

To show an example, let's assume that your application needs to speak two similar sentences, "It

is fine today" and "It is rainy today." The two sentences have the common words "it", "is" and

"today". What you have to do is to prepare these common sound data, not in sentences but in

words, and to store each combined phrase data in Phrase Control Table as shown in Table 4.1 and

Figure 4.1

Multiple phrases can be played continuously merely by specifying a desired phrase using an X

address. For an example from Table 4.1, when address "01" is specified, "It is fine today" is played,

and when address"02" is specified, "It is rainy" is played.

Phrase Control Table, a silence can be inserted without using the User's Area.

Minimum time for silence 32 ms
Maximum time for silence 2016 ms
Time unit for setting up silence 32 ms

No.

X-Address

(HEX)

101
202
303

· · ·

62 3E
63 3F

· · ·

Table 4.1 Matrix of the Phrase Control Table

Y-Address

(Up to 8 phrases)

[10]

Silence

[02][01] [03]

Silence

[02][01] [03]

[12]
[21][10][02][01] [11] [12] [22] [03]

It is (silence) fine today.
It is (silence) rainy today.
It is fine becoming cloudy, rainy in some areas today.

Sound Data

· · ·

37/51

MSM9802/03/05-xxx¡ Semiconductor

Figure 4.1 Phrase Combination Matrix for Phrase Control Table

No. X-Address

101
202
303
404
505
606
707
808
909

Phrase Control Table Area

Phrase Addigned

1 [01]
2 [02]
3 Silence (64ms)
4 [12]
5 [03]
6—
7—
8—

Silence time setting

0 Silence time
1 32 ms
2 64 ms

(32ms ¥ n)

it
is

rainy
today

Phrase Data Registration Area

No. Y-Address Phrase

101
202
303

16 10
17 11
18 12
19 13

32 20
33 21
34 22

it

is

today

fine

cloudy

rainy

snowy

ocasionally

becoming

in some areas

63 3F

63 2016 ms

63 3F —

38/51

MSM9802/03/05-xxx¡ Semiconductor

5. RC Oscillation

Figure 5.1 shows an external circuit using RC oscillation. Figure 5.2 shows the RC oscillation
frequency characteristics.

R1

OSC1

R2

OSC2

C

OSC3

Figure 5.1 RC Oscillation

500

450

VDD=5 V
C=30 pF

R1=100 kW

400

350

(kHz)

OSC

300

VDD=5 V
C=47 pF

250

200

150

Oscillaiton Frequency f

100

50

0

VDD=3 V
C=47 pF

VDD=3 V
C=30 pF

10 20 30 40 50 60 70

Load Resistance R2 (kW)

Figure 5.2 RC Oscillation Frequency Characteristics

39/51

5.1 Determining RC constants

MSM9802/03/05-xxx¡ Semiconductor

The RC oscillation frequency characteristics are shown in Figure 5.2. If f

is set to 256 kHz, use

osc

the following values as a guide (see Figure 5.2) to set the C and R2 that fit the printed-circuit board
type used.

R1=100 kW, R2=30 kW, C=30 pF

When choosing RC oscillation, the RC oscillation frequency varies according to the fluctuation
of the external C and R2.

5.2 Fluctuation of RC oscillation frequencies

When choosing RC oscillation, the error of RC oscillation frequency due to process variations of

the IC is ±4% maximum, and the fluctuation of the RC oscillation frequency when using a
capacitor (C) of ±1% accuracy and a resistor (R2) of ± 2% accuracy is a maximum of ±7%

approximately.

6. Ceramic Oscillation

Figure 6.1 shows an external circuit using a ceramic oscillator.

OSC1 OSC2

C1 C2

Figure 6.1 Ceramic Oscillation Diagram

40/51

MSM9802/03/05-xxx¡ Semiconductor

For example, the following table shows the optimum load capacitances, power supply voltage
ranges, and operating temperature ranges when ceramic oscillators made by Murata MFG Co.,
Ltd., Kyocera Co., Ltd. and TDK Co., Ltd. are used.

Maker

Murata MFG.KyoceraTDK

Ceramic oscillator

Type

CSA4.09MGU
CST4.09MGWU
CSTCC4.00MG 3.6 to 5.5
CSTCC4.00MGU
PBRC4.00A
KBR-4.0MSB
PBRC4.00B
KBR-4.0MKC

CCR4.00MC3 4.0 –40 to +852.4 to 5.5

Frequency

(MHz)

4.096

4.0

4.0 –20 to +803.1 to 5.5

Optimal load capacity

C1 (pF) C2 (pF)

30 30

Built in Built in

15 15

33 33

Built in Built in

Built in Built in

supply voltage range

(V)

3.0 to 5.5

2.7 to 5.5

Operating

temperature range

(°C)

–40 to +85

(Note) When a 4 MHz ceramic oscillator is used, the playback speed of MSM9802/03/05 is

slower by 2 percent than that of an analysis tool or a demonstration board.

41/51

MSM9802/03/05-xxx¡ Semiconductor

[Hz]

7. Low-Pass Filter

In this IC, all voice outputs are through the built-in low-pass filter (LPF). Figure 7.1 and Table

7.2 show the LPF frequency characteristics and LPF cutoff frequency respectively.

Only the voice output through LPF is enabled in this IC.

20

[dB]

10

0

–10
–20

–30
–40

–50
–60
–70
–80

10

100 1k 10k

Figure. 7.1 LPF Frequency Characteristics (f

Table 7.2 LPF Cutoff Frequency

Sampling Frequency (kHz) Cutoff Frequency (kHz)

(f

(f

4.0

5.3

6.4

8.0

10.6

12.8

16.0

SAM

)

CUT

1.2

1.6

2.0

2.5

3.2

4.0

5.0

SAM

)

=8 kHz)

42/51

8. Standby Transition

MSM9802/03/05-xxx¡ Semiconductor

When playback of a phrase is finished, if playback of the next phrase does not start up within t
(0.25 sec. typ.), the IC enters standby status and the entire operation stops.

A2 - A0

SW2 - SW1 "L"

SW0

BUSY

AOUT

Figure 8.1 Timing for Voice Playback during D/A Converter Change Time

(Stand-alone Mode)

STB

I5 - I0

ST

NAR

AOUT

Figure 8.2 Timing for Voice Playback during D/A Converter Change Time

(Microcontroller Interface Mode)

If playback is attempted during D/A converter change time as shown in figures 8.1 and 8.2, the
IC exits from standby status and the output from the D/A converter begins going to the
1/2 I

level. When the output reaches 1/2 I

AOUT

, voice playback starts.

AOUT

43/51

MSM9802/03/05-xxx¡ Semiconductor

(

)

9. Voice Output Unit Equivalent Circuit (AOUT, F

Current-Sourcing Type

D/A Converter

V

REF

10kW
(TYP)

Standby Signal

PCM Value

REF

V

Pins)

DD

AOUT

I

AOUT

The above switch positions show those when the circuit is active.

Figure 9.1 Voice Output Unit Equivalent Circuit

44/51

D/A CONVERTER OUTPUT CURRENT CHARACTERISTICS

]

]

MSM9802/03/05-xxx¡ Semiconductor

Power Supply Voltage vs. Output Current Characteristics (Ta=25°C, V

14
12
10

8
6
4
2

AOUT Output Current [mA]

0

0123456

Power Supply Voltage [V

Temperature vs. Output Current Characteristics (VDD=5V, V

14
12
10

8
6
4
2

AOUT Output Current [mA]

0

–50 –25 0 25 50 75 100

AOUT

AOUT

=0V)

=0V)

Ambient Temperature Ta [°C

V

Voltage vs. Output Current Characteristics (Ta=25°C, V

REF

10

8

6

4

2

AOUT Output Current [mA]

0

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
[V]

V

REF

DD

=5V, V

AOUT

=0V)

45/51

PAD CONFIGURATION

MSM9802

Pad Layout

Chip size : X=3.22mm Y=3.17mm

Chip thickness : 350µm ± 30µm
Pad size : 110µm ¥ 110µm

Substrate potential : GND

Y-axis

3 2 1 18 17 16

MSM9802/03/05-xxx¡ Semiconductor

154

(NC)

MSM9802

5

6

8 9 10 11 12

7

14

X-axis

13

Pad Coordinates
(Chip center is located at X=0 and Y=0)

(Unit: µm)

Pad No. Pad Name X-axis Y-axis Pad No. Pad Name X-axis Y-axis

1 I3/ (A0) –415 1385 10 V
2 I4/ (A1) –816 1385 11 OSC1 742 –1333
3 I5/ (A2) –1460 1385 12 OSC2 1349 –1333
4 RESET –1460 1049 13 OSC3 1460 –972
5 XT/CR –1458 –20 14 CPU/STD 1389 183
6 NAR –1460 –899 15 ST/(RND) 1389 1058
7 GND –1460 –1375 16 I0/(SW0) 1389 1385
8V
9 AOUT –585 –1333 18 I2/(SW2) 276 1385

REF

–1135 –1333 17 I1/(SW1) 719 1385

DD

462 –1347

Pad name in parentheses is for stand-alone mode.

46/51

MSM9803

Pad Layout

Chip size : X=3.22mm Y=4.06mm

Chip thickness : 350µm ± 30µm
Pad size : 110µm ¥ 110µm

Substrate potential : GND

Y-axis

3 2 1 18 17 16

MSM9802/03/05-xxx¡ Semiconductor

154

14

X-axis

13

(NC)

5

6

7

MSM9803

8 9 10 11 12

Pad Coordinates
(Chip center is located at X=0 and Y=0)

(Unit: µm)

Pad No. Pad Name X-axis Y-axis Pad No. Pad Name X-axis Y-axis

1 I3/ (A0) –415 1829 10 V
2 I4/ (A1) –816 1829 11 OSC1 742 –1776
3 I5/ (A2) –1460 1829 12 OSC2 1349 –1776
4 RESET –1460 1493 13 OSC3 1460 –1415
5 XT/CR –1458 424 14 CPU/STD 1389 628
6 NAR –1460 –1342 15 ST/(RND) 1389 1502
7 GND –1460 –1818 16 I0/(SW0) 1389 1829
8V
9 AOUT –585 –1776 18 I2/(SW2) 276 1829

REF

–1135 –1776 17 I1/(SW1) 720 1829

DD

452 –1788

Pad name in parentheses is for stand-alone mode.

47/51

MSM9805

Pad Layout

Chip size : X=3.22mm Y=5.96mm

Chip thickness : 350µm ± 30µm
Pad size : 110µm ¥ 110µm

Substrate potential : GND

Y-axis

3 2 1 18 17 16

4

MSM9802/03/05-xxx¡ Semiconductor

15

(NC)

5

MSM9805

6

8 9 10 11 12

7

14

X-axis

13

Pad Coordinates
(Chip center is located at X=0 and Y=0)

Pad No. Pad Name X-axis Y-axis Pad No. Pad Name X-axis Y-axis

1 I3/ (A0) –415 2777 10 V

DD

2 I4/ (A1) –816 2777 11 OSC1 742 –2726
3 I5/ (A2) –1460 2777 12 OSC2 1349 –2726
4 RESET –1460 882 13 OSC3 1460 –1532
5 XT/CR –1458 364 14 CPU/STD 1453 267
6 NAR –1460 –1546 15 ST/(RND) 1455 1338
7 GND –1460 –2768 16 I0/(SW0) 1432 2777
8V

REF

–1136 –2726 17 I1/(SW1) 754 2777

9 AOUT –585 –2726 18 I2/(SW2) 312 2777

452 –2723

(Unit: µm)

Pad name in parentheses is for stand-alone mode.

48/51

PACKAGE DIMENSIONS

DIP18-P-300-2.54

MSM9802/03/05-xxx¡ Semiconductor

(Unit : mm)

Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)

Epoxy resin
42 alloy
Solder plating
5 mm or more

1.30 TYP.

49/51

SOP24-P-430-1.27-K

Mirror finish

MSM9802/03/05-xxx¡ Semiconductor

(Unit : mm)

Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)

Epoxy resin
42 alloy
Solder plating
5 mm or more

0.58 TYP.

Notes for Mounting the Surface Mount Type Package

The SOP, QFP, TSOP, TQFP, LQFP, SOJ, QFJ (PLCC), SHP, and BGA are surface mount type
packages, which are very susceptible to heat in reflow mounting and humidity absorbed in
storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person
on the product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).

50/51

SSOP30-P-56-0.65-K

Mirror finish

MSM9802/03/05-xxx¡ Semiconductor

(Unit : mm)

Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)

Epoxy resin
42 alloy
Solder plating
5 mm or more

0.19 TYP.

Notes for Mounting the Surface Mount Type Package

The SOP, QFP, TSOP, TQFP, LQFP, SOJ, QFJ (PLCC), SHP, and BGA are surface mount type
packages, which are very susceptible to heat in reflow mounting and humidity absorbed in
storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person
on the product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).

51/51

E2Y0002-29-62

NOTICE

1. The information contained herein can change without notice owing to product and/or
technical improvements. Before using the product, please make sure that the information
being referred to is up-to-date.

2. The outline of action and examples for application circuits described herein have been
chosen as an explanation for the standard action and performance of the product. When
planning to use the product, please ensure that the external conditions are reflected in the
actual circuit, assembly, and program designs.

3. When designing your product, please use our product below the specified maximum
ratings and within the specified operating ranges including, but not limited to, operating
voltage, power dissipation, and operating temperature.

4. Oki assumes no responsibility or liability whatsoever for any failure or unusual or

unexpected operation resulting from misuse, neglect, improper installation, repair, alteration
or accident, improper handling, or unusual physical or electrical stress including, but not
limited to, exposure to parameters beyond the specified maximum ratings or operation
outside the specified operating range.

5. Neither indemnity against nor license of a third party’s industrial and intellectual property
right, etc. is granted by us in connection with the use of the product and/or the information
and drawings contained herein. No responsibility is assumed by us for any infringement
of a third party’s right which may result from the use thereof.

6. The products listed in this document are intended for use in general electronics equipment
for commercial applications (e.g., office automation, communication equipment,
measurement equipment, consumer electronics, etc.). These products are not authorized
for use in any system or application that requires special or enhanced quality and reliability
characteristics nor in any system or application where the failure of such system or
application may result in the loss or damage of property, or death or injury to humans.
Such applications include, but are not limited to, traffic and automotive equipment, safety
devices, aerospace equipment, nuclear power control, medical equipment, and life-support
systems.

7. Certain products in this document may need government approval before they can be
exported to particular countries. The purchaser assumes the responsibility of determining
the legality of export of these products and will take appropriate and necessary steps at their
own expense for these.

8. No part of the contents contained herein may be reprinted or reproduced without our prior
permission.

9. MS-DOS is a registered trademark of Microsoft Corporation.

Copyright 1999 Oki Electric Industry Co., Ltd.

Printed in Japan