Datasheet MSM6422-xxGS-K, MSM6422-xxRS Datasheet (OKI)

E2E0016-38-93

¡ Semiconductor

This version: Sep. 1998

Previous version: Mar. 1996

MSM6422¡ Semiconductor

MSM6422

High speed and Simple 4-Bit Microcontroller

GENERAL DESCRIPTION

The MSM6422 is a low-power, single-chip device implemented in complementary metal-oxide
semiconductor technology.
The MSM6422 can be used in place of logic ICs configured around a main CPU, or for small-scale
systems such as home electronic equipment.

FEATURES

• ROM : 2048 words ¥ 8 bits

• RAM : 64 words ¥ 4 bits

• I/O port
Input-output port : 4 ports ¥ 4 bits (pseudo bidirectional configuration)

1 port ¥ 2 bits (pseudo bidirectional configuration)

Input port : 1 port ¥ 1 bit (combined use with an interrupt input)

• Instructions : 63

• Two interrupt sources (1 internal, 1 external)

• Power down features

• Minimum instruction execution time : 952 ns @ 4.2 MHz clock

• Crystal and ceramic oscillation

• Single 5 V power supply

• Package options:
24-pin plastic DIP (DIP24-P-600-2.54) : (Product name : MSM6422-¥¥RS)
24-pin plastic SOP (SOP24-P-430-1.27-K) : (Product name : MSM6422-¥¥GS-K)

¥¥ indicates a code number.

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BLOCK DIAGRAM

MSM6422¡ Semiconductor

RAM

64 ¥ 4 bits

DEC

3 21 010

ACC

C

ALU

HRLRSP

3210 3210 3210

INST

DEC

ROM

2048 ¥ 8 bits

DEC

PC

INT.C

P0P1P3P4P5

P2

12-bitTBC

0/INT

GND V

DD

Timing

&

Control

OSC1 OSC0

RESET

2/10

PIN CONFIGURATION (TOP VIEW)

MSM6422¡ Semiconductor

P2.0/INT

P0.0

P0.1

P0.2

P0.3

P1.0

P1.1

P1.2

P1.3

OSC
OSC

GND

1

2

3

4

5

6

7

8

9

10

1

11

0

12

24

23

22

21

20

19

18

17

16

15
14

13

V

DD

P5.1

P5.0

P4.3

P4.2

P4.1

P4.0

P3.3

P3.2

P3.1
P3.0

RESET

P2.0/INT

P0.0

P0.1

P0.2

P0.3

P1.0

P1.1

P1.2

P1.3

OSC
OSC

GND

24-Pin Plastic DIP

1

2

3

4

5

6

7

8

9

10

1

11

0

12

24

23

22

21

20

19

18

17

16

15
14

13

V

DD

P5.1

P5.0

P4.3

P4.2

P4.1

P4.0

P3.3

P3.2

P3.1
P3.0

RESET

24-Pin Plastic SOP

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PIN DESCRIPTIONS

MSM6422¡ Semiconductor

Pin

2

3

4

5

6

7

8

9

14

15

16

17

18

19

20

21

22

23

1

11

10

13

24

12

Symbol Type Description During reset

P0.0

P0.1

I/O

P0.2

4-bit input-output port

"1"

(pseudo bidirectional configuration)

P0.3

P1.0

P1.1

I/O

4-bit input-output port

"1"

(pseudo bidirectional configuration)P1.2

P1.3

P3.0

P3.1

I/O

4-bit input-output port

"1"

(pseudo bidirectional configuration)P3.2

P3.3

P4.0

P4.1

I/O

4-bit input-output port

"0"

(pseudo bidirectional configuration)P4.2

P4.3

P5.0

I/O

2-bit input-output port

"0"

P5.1 (pseudo bidirectional configuration)

1-bit input port with a latch

The latch is

P2.0/INT I

Combined use with an interrupt input

(falling edge trigger input)

reset to "0".

System clock (SYSCLK) input pin

OSC

0

I

This provides an oscillation circuit with OSC

1

pin.

—

System clock output pin

OSC

1

O

This provides an oscillation circuit with OSC

0

pin.

—

RESET I RESET input pin —

V

DD

GND

I Power supply voltage pins —

Ground pin —I

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ABSOLUTE MAXIMUM RATINGS

MSM6422¡ Semiconductor

Parameter Symbol Condition

Power Supply Voltage V

Input Voltage V

Output Voltage V

DD

I

O

Ta = 25°C

Ta = 25°C per package

Power Dissipation P

Storage Temperature T

D

STG

Ta = 25°C per output

—

RECOMMENDED OPERATING CONDITIONS

Parameter Symbol Condition

f

£ 1 MHz

Power Supply Voltage V

Data-Hold Voltage V

Operating Temperature

Fan Out

DD

DDH

T

op

N

OSC

f

£ 4.2 MHz

OSC

f

OSC

MOS load

TTL load

= 0 Hz

—

Rating

–0.3 to +7

–0.3 to V

–0.3 to V

DD

DD

200 max.

50 max.

–55 to +150

Range

3 to 6

4.5 to 5.5

2 to 6

–40 to +85

15

1

Unit

V

V

V

mW

mW

°C

Unit

V

V

V

°C

—

—

5/10

ELECTRICAL CHARACTERISTICS

DC Characteristics

(V

= 5 V ±10%, Ta = –40 to +85°C)

DD

Parameter Symbol Condition Min. Typ. Max. Unit

"H" Input Voltage*1,*2 V

"H" Input Voltage*3,*4 V

"L" Input Voltage V

"H" Output Voltage*1,*5 V

"L" Output Voltage*1

"L" Output Voltage*5

Input Current*3 I

Input Current*2,*4 — — 1/–30

"H" Output Current*1 I

"H" Output Current*1

Input Capacitance C

Output Capacitance C

Power Supply Current

(In Stop Mode)

V

V

IH/IIL

I

IH/IIL

OH

I

OH

I

DDS

OH

OL

OL

IH

IH

IL

I

O

f = 1 MHz, Ta = 25°C

V

= 2 V, no load, Ta = 25°C

DD

Crystal oscillation,

Power Supply Current I

DD

— 2.4 — V

— 4.2 — V

— –0.3 — +0.8 V

IO = –15 mA 4.2 — — V

IO = 1.6 mA — — 0.4 V

IO = 15 mA — — 0.4 V

VI = VDD/0 V — — 15/–15 mA

VI = VDD/0 V mA

VO = 2.4 V –0.1 — — mA

VO = 0.4 V — — –1.2 mA

—5—

—7—

— 0.2 5 mA

No load — 1 100 mA

—612mA

no load, 4.2 MHz

DD

DD

MSM6422¡ Semiconductor

V

V

pF

*1 Applied to P0, P1, P3, P4, and P5
*2 Applied to P2
*3 Applied to OSC

0

*4 Applied to RESET
*5 Applied to OSC

1

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AC Characteristics

Parameter Symbol Condition Min. Typ. Max. Unit

Clock (OSC

Cycle Time t

Input Data Setup Time t

Input Data Hold Time t

Input Data/Input Clock Pulse

Width

Data Delay Time t

) Pulse Width tf

0

OSC

0

t

CY

DS

DH

DW

DR

MSM6422¡ Semiconductor

(V

= 5 V ±10%, Ta = –40 to +85°C)

DD

W

1MC

— 119 — — ns

— 952 — — ns

— 120 — — ns

— 120 — — ns

— 120 — — ns

CL = 15 pF — — t

t

CY

+ 300 ns

CY

P0, P1, P3,
P4, P5

P0, P1, P3,
P4, P5

P2.0/INT

tfWtf

W

INPUT

DATA

tDSt

DH

t

DR

t

DW

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Operating Characteristics

MSM6422¡ Semiconductor

Current (IOH) vs Voltage (VOH) for High
Level Output

(Ta = 25°C)

–1.0
–0.9
–0.8
–0.7

V

= 6 V

DD

–0.6

(mA)

–0.5

OH

I

–0.4
–0.3
–0.2

5 V

4 V

3 V

–0.1

0

012345678910

(V) V

V

OH

Maximum Clock Frequency (f

OSC

) vs

Supply Voltage (VDD)

(Ta = 25°C, CL = 15 pF)

10

9
8
7
6

(MHz)

5

OSC

4

f

3
2
1
0

012345678910

(V)

V

DD

Maximum Clock Frequency (f

OSC

) vs

Ambient Temperature (Ta)

(V

= 5 V, CL = 15 pF)

DD

10

9
8
7
6

(MHz)

5

OSC

4

f

3
2
1
0

–40–20 0 20 40 60 80 120

Ta (°C)

100

Current (IOL) vs Voltage (VOL) for
Low Level Output

(Ta = 25°C)

20
18

6 V

V

= 5 V

DD

16
14
12

(mA)

10

OL

I

8
6

4 V

3 V

4
2

0

12345678910

(V)

OL

Supply Current (IDD) vs Supply Voltage
(VDD)

(Ta = 25°C, no Load)

10 m

500 m

100 m

50 m

(A)

10 m

DD

I

500 n

100 n

5 m

1 m

5 m

1 m

012345678910

V

DD

(V)

f

= 4 MHz

OSC

2 MHz

1 MHz
500 kHz

100 kHz

0 Hz

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PACKAGE DIMENSIONS

DIP24-P-600-2.54

MSM6422¡ Semiconductor

(Unit : mm)

Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)

Epoxy resin
42 alloy
Solder plating
5 mm or more

3.55 TYP.

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SOP24-P-430-1.27-K

Mirror finish

MSM6422¡ Semiconductor

(Unit : mm)

Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)

Epoxy resin
42 alloy
Solder plating
5 mm or more

0.58 TYP.

Notes for Mounting the Surface Mount Type Package

The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).

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