Page 1
1
Motorola Small–Signal Transistors, FETs and Diodes Device Data
MAXIMUM RATINGS (T
A
= 25°C)
Rating
Symbol Value Unit
Collector–Base Voltage V
(BR)CBO
60 Vdc
Collector–Emitter Voltage V
(BR)CEO
50 Vdc
Emitter–Base Voltage V
(BR)EBO
7.0 Vdc
Collector Current — Continuous I
C
500 mAdc
Collector Current — Peak I
C(P)
1.0 Adc
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Power Dissipation P
D
200 mW
Junction Temperature T
J
150 °C
Storage Temperature T
stg
–55 ~ +150 °C
ELECTRICAL CHARACTERISTICS (T
A
= 25°C)
Characteristic
Symbol Min Max Unit
Collector–Emitter Breakdown Voltage (IC = 10 mAdc, IB = 0) V
(BR)CEO
50 — Vdc
Collector–Base Breakdown Voltage (IC = 10 µAdc, IE = 0) V
(BR)CBO
60 — Vdc
Emitter–Base Breakdown Voltage (IE = 10 µAdc, IC = 0) V
(BR)EBO
7.0 — Vdc
Collector–Base Cutoff Current (VCB = 20 Vdc, IE = 0) I
CBO
— 0.1 µAdc
DC Current Gain
(1)
(VCE = 10 Vdc, IC = 150 mAdc)
(VCE = 10 Vdc, IC = 500 mAdc)
h
FE1
h
FE2
120
40
240
—
—
Collector–Emitter Saturation Voltage (IC = 300 mAdc, IB = 30 mAdc) V
CE(sat)
— 0.6 Vdc
Output Capacitance (VCB = 10 Vdc, IE = 0, f = 1.0 MHz) C
ob
— 15 pF
1. Pulse Test: Pulse Width ≤ 300 µs, D.C. ≤ 2%.
DEVICE MARKING
Marking Symbol
WR
X
The “X” represents a smaller alpha digit Date Code. The Date Code indicates the actual month
in which the part was manufactured.
Thermal Clad is a trademark of the Bergquist Company
Preferred devices are Motorola recommended choices for future use and best overall value.
Order this document
by MSD602–RT1/D
SEMICONDUCTOR TECHNICAL DATA
Motorola, Inc. 1996
Motorola Preferred Device
CASE 318D–03, STYLE 1
SC–59
2
1
3
COLLECTOR
3
2
BASE1EMITTER
REV 1
Page 2
MSD602-RT1
2
Motorola Small–Signal Transistors, FETs and Diodes Device Data
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the semiconductor packages must
be the correct s ize to i nsure proper solder connection
interface between the board and the package. With the
correct pad geometry, the packages will s elf align when
subjected to a solder reflow process.
mm
inches
2.5–3.0
0.039
1.0
0.094
0.8
0.098–0.118
2.4
0.031
0.95
0.037
0.95
0.037
SC–59 POWER DISSIPATION
The power dissipation of the SC–59 is a function of the pad
size. This can vary from the minimum pad size for soldering
to the pad size given for maximum power dissipation. Power
dissipation for a s urface m ount device is determined by
T
J(max)
, the maximum rated junction temperature of the die,
R
θJA
, the thermal resistance from the device junction to
ambient; and the o perating temperature, TA. Using t he
values provided on the data sheet, PD can be calculated as
follows:
PD =
T
J(max)
– T
A
R
θJA
The values for the equation are found in the maximum
ratings table on the data sheet. Substituting these values into
the equation for an ambient temperature TA of 25°C, one can
calculate the power dissipation of the device which in this
case is 200 milliwatts.
PD =
150°C – 25°C
625°C/W
= 200 milliwatts
The 6 25°C/W assumes the use o f the recommended
footprint on a glass epoxy printed circuit board to achieve a
power dissipation of 200 milliwatts. Another alternative would
be to use a ceramic substrate or an aluminum core board
such as Thermal Clad. Using a board material such as
Thermal Clad, a power dissipation of 400 milliwatts can be
achieved using the same footprint.
SOLDERING PRECAUTIONS
The melting temperature of solder is higher than the rated
temperature of the device. When the entire device is heated
to a high temperature, failure to complete soldering within a
short time could result i n device failure. Therefore, t he
following items s hould always be o bserved in order to
minimize the thermal s tress to w hich t he d evices a re
subjected.
• Always preheat the device.
• The delta temperature between the preheat and
soldering should be 100°C or less.*
• When preheating and soldering, the temperature of the
leads and the case must not exceed the maximum
temperature ratings as shown on the data sheet. When
using infrared heating with the reflow soldering method,
the difference should be a maximum of 10°C.
• The soldering temperature and time should not exceed
260°C for more than 10 seconds.
• When shifting from preheating to soldering, the
maximum temperature gradient should be 5°C or less.
• After soldering has been completed, the device should
be allowed to cool naturally for at least three minutes.
Gradual cooling should be used as the use of forced
cooling will increase the temperature gradient and result
in latent failure due to mechanical stress.
• Mechanical stress or shock should not be applied during
cooling
* Soldering a device without preheating can cause excessive
thermal shock and stress which can result in damage to the
device.
Page 3
MSD602-RT1
3
Motorola Small–Signal Transistors, FETs and Diodes Device Data
SOLDER STENCIL GUIDELINES
Prior to placing surface mount components onto a printed
circuit board, solder paste must be applied to the pads. A
solder stencil is required to screen the optimum amount of
solder paste onto the footprint. The stencil is made of brass
or stainless steel with a typical thickness of 0.008 inches.
The stencil opening size for the SC–59 package should be
the same as the pad size on the printed circuit board, i.e., a
1:1 registration.
TYPICAL SOLDER HEATING PROFILE
For any given circuit board, there will be a group of control
settings that will give the desired heat pattern. The operator
must set temperatures f or several heating zones, and a
figure for belt speed. Taken together, these control settings
make up a heating “profile” for that particular circuit board.
On m achines c ontrolled b y a computer, the computer
remembers these profiles from one operating session to the
next. Figure 1 shows a typical heating profile for use when
soldering a surface mount device to a printed circuit board.
This profile will vary among soldering systems but it is a good
starting point. Factors that can affect the profile include the
type o f soldering s ystem in u se, d ensity and types of
components on the board, type of solder used, and the type
of board or substrate material being used. This profile shows
temperature versus time. The line on the graph shows the
actual temperature that might be experienced on the surface
of a test board at or near a central solder joint. The two
profiles are based on a high density and a low density board.
The Vitronics SMD310 convection/infrared reflow soldering
system was used to generate this profile. The type of solder
used was 62/36/2 Tin Lead Silver with a melting point
between 177 –189°C. When this type of furnace is used for
solder reflow work, the circuit boards and solder joints tend to
heat first. The components on the board are then heated by
conduction. The circuit board, because it has a large surface
area, absorbs the thermal energy more efficiently, then
distributes this energy to the components. Because of this
effect, t he main body of a c omponent may be up to 3 0
degrees cooler than the adjacent solder joints.
STEP 1
PREHEAT
ZONE 1
“RAMP”
STEP 2
VENT
“SOAK”
STEP 3
HEATING
ZONES 2 & 5
“RAMP”
STEP 4
HEATING
ZONES 3 & 6
“SOAK”
STEP 5
HEATING
ZONES 4 & 7
“SPIKE”
STEP 6
VENT
STEP 7
COOLING
200
°
C
150
°
C
100
°
C
50
°
C
TIME (3 TO 7 MINUTES TOTAL)
T
MAX
SOLDER IS LIQUID FOR
40 TO 80 SECONDS
(DEPENDING ON
MASS OF ASSEMBLY)
205
°
TO 219°C
PEAK AT
SOLDER JOINT
DESIRED CURVE FOR LOW
MASS ASSEMBLIES
DESIRED CURVE FOR HIGH
MASS ASSEMBLIES
100°C
150°C
160
°
C
170
°
C
140
°
C
Figure 1. Typical Solder Heating Profile
Page 4
MSD602-RT1
4
Motorola Small–Signal Transistors, FETs and Diodes Device Data
PACKAGE DIMENSIONS
CASE 318D–03
ISSUE E
STYLE 1:
PIN 1. EMITTER
2. BASE
3. COLLECTOR
S
G
H
D
C
B
L
A
1
3
2
J
K
DIMAMIN MAX MIN MAX
INCHES
2.70 3.10 0.1063 0.1220
MILLIMETERS
B 1.30 1.70 0.0512 0.0669
C 1.00 1.30 0.0394 0.0511
D 0.35 0.50 0.0138 0.0196
G 1.70 2.10 0.0670 0.0826
H 0.013 0.100 0.0005 0.0040
J 0.10 0.26 0.0040 0.0102
K 0.20 0.60 0.0079 0.0236
L 1.25 1.65 0.0493 0.0649
S 2.50 3.00 0.0985 0.1181
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
SC–59
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty , representation or guarantee regarding
the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation consequential or incidental damages. “T ypical” parameters which may be provided in Motorola
data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”
must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of
others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other
applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury
or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola
and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees
arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that
Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal
Opportunity/Affirmative Action Employer.
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MSD602–RT1/D
*MSD602-RT1/D*
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