Page 1
MSD42SWT1G
NPN Silicon General
Purpose High Voltage
Transistor
This NPN Silicon Planar Transis to r is designed for general purpose
amplifier applications. This device is housed in the SC-70/SOT-323
package which is designed for low power surface mount applications.
Features
These Devices are Pb--Free, Halogen Free/BFR Free and are RoHS
Compliant
http://onsemi.com
COLLECTOR
3
MAXIMUM RATINGS (T
Rating
Collector-Base Voltage V
Collector-Emitter Voltage V
Emitter-Base Voltage V
Collector Current -- Continuous I
=25C)
A
Symbol Value Unit
(BR)CBO
(BR)CEO
(BR)EBO
C
300 Vdc
300 Vdc
6.0 Vdc
150 mAdc
THERMAL CHARACTERISTICS
Rating Symbol Max Unit
Power Dissipation (Note 1) P
Junction Temperature T
Storage Temperature Range T
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
D
J
stg
150 mW
150 C
--55 to +150 C
ELECTRICAL CHARACTERISTICS
Characteristic Symbol Min Max Unit
Collector-Emitter Breakdown Voltage
(I
=1.0mAdc,IB=0)
C
Collector-Base Breakdown Voltage
(I
= 100 mAdc, IE=0)
C
Emitter-Base Breakdown Voltage
(I
= 100 mAdc, IE=0)
E
Collector-Base Cutoff Current
Emitter--Base Cutoff Current
DC Current Gain (Note 2)
Collector-Emitter Saturation Voltage
1. Device mountedon a FR-4 glass epoxy printed circuit boardusing the minimum
2. Pulse T est: Pulse Width 300 ms, D.C. 2%.
= 300 Vdc, IE=0)
(V
CB
(V
=6.0Vdc,IB=0)
EB
(V
=10Vdc,IC=1.0mAdc)
CE
=10Vdc,IC=30mAdc)
(V
CE
(Note 2) (I
I
=2.0mAdc)
B
recommended footprint.
= 200 mAdc,
C
V
(BR)CEO
V
(BR)CBO
V
(BR)EBO
I
CBO
I
EBO
h
FE1
h
FE2
V
CE(sat )
300 -- Vdc
300 -- Vdc
6.0 -- Vdc
-- 0.1 mA
-- 0.1 mA
--
2540200
--
-- 0.5 Vdc
1
BASE
1
2
SC-- 70 (SOT--323)
CASE 419
STYLE 3
2
EMITTER
3
MARKING DIAGRAM
D4 M G
G
1
D4 = Device Code
M = Date Code*
G = Pb--Free Package
(Note: Microdot may be in either location)
*Date Code orientation may vary depending
upon manufacturing location.
ORDERING INFORMATION
Device Package Shipping
MSD42SWT1G SC- -70/SOT- -323
(Pb--Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
3000/T ape & Reel
†
Semiconductor Components Industries, LLC, 2010
October, 2010 -- Rev. 2
1 Publication Order Number:
MSD42SWT1/D
Page 2
0.05 (0.002)
a
D
e1
3
H
E
12
e
A1
MSD42SWT1G
PACKAGE DIMENSIONS
SC--70 (SOT--323)
CASE 419 --04
ISSUE N
E
b
A
A2
L
SOLDERING FOOTPRINT*
0.65
0.025
NOTES:
1. DIM ENSIO NING AND TOLER ANCIN G PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
DIMAMIN NOM MAX MIN
A1 0.00 0.05 0.10 0.000
A2 0.70 REF
b 0.30 0.35 0.40 0.012
c 0.10 0.18 0.25 0.004
D 1.80 2.10 2.20 0.071
E 1.15 1.24 1.35 0.045
e 1.20 1.30 1.40 0.047
e1
L
H
E
STYLE 3:
c
PIN 1. BASE
MILLIMETERS
0.80 0.90 1.00 0.032
0.65 BSC
0.38
0.20 0.56 0.008 0.022
2.00 2.10 2.40 0.079 0.083 0.095
2. EMITTER
3. COLLE CTOR
0.65
0.025
INCHES
NOM MAX
0.035 0.040
0.002 0.004
0.028 REF
0.014 0.016
0.007 0.010
0.083 0.087
0.049 0.053
0.051 0.055
0.026 BSC
0.015
1.9
0.075
0.9
0.035
0.7
0.028
SCALE 10:1
inches
mm
*For additional information on our Pb--Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the s uitability of its products for any particular purpose, nor does SCILLC as s ume any
liability arising out of the application or use of any product or c ircuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental
damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specificati ons can and do vary in different applications and actual performance may vary over
time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not c onv ey any l icense under
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MSD425WT1/D
2
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