Datasheet msd1819a-rt1-d Datasheet

Page 1
MSD1819A--RT1
General Purpose Amplifier Transistor
NPN Silicon Surface Mount
Features
High hLow V
, 210 -- 460
FE
CE(sat)
,<0.5V
Moisture Sensitivity Level 1ESD Protection: Human Body Model > 4000 V
Machine Model > 400 V
These Devices are Pb--Free, Halogen Free/BFR Free and are RoHS
Compliant
MAXIMUM RATINGS (T
Rating
Collector-Base Voltage V
Collector-Emitter Voltage V
Emitter-Base Voltage V
Collector Current -- Continuous I
Collector Current -- Peak I
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Power Dissipation (Note 1) P
Junction Temperature T
Storage Temperature Range T
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
1. Device mounted on a FR-4 glass epoxy printed circuit board using the
minimum recommended footprint.
=25C)
A
Symbol Value Unit
(BR)CBO
(BR)CEO
(BR)EBO
C
C(P)
D
J
stg
60 Vdc
50 Vdc
7.0 Vdc
100 mAdc
200 mAdc
150 mW
150 C
-- 55 to +150 C
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COLLECTOR
3
1
BASE
1
2
SC--70 (SOT --323)
CASE 419
STYLE 3
2
EMITTER
3
MARKING DIAGRAM
ZR M G
G
1
ZR = Device Code M = Date Code* G = Pb--Free Package
(Note: Microdot may be in either location)
*Date Code orientation may vary depending
upon manufacturing location.
ORDERING INFORMATION
Device Package Shipping
MSD1819A--RT1G SC--70/
SOT--323 (Pb--Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
3000/Tape & Reel
†
Semiconductor Components Industries, LLC, 2010
October, 2010 -- Rev. 7
1 Publication Order Number:
MSD1819A--RT1/D
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MSD1819A--RT1
ELECTRICAL CHARACTERISTICS
Characteristic Symbol Min Max Unit
Collector-Emitter Breakdown Voltage (IC=2.0mAdc,IB=0) V
Collector-Base Breakdown Voltage (IC=10mAdc, IE=0)
Emitter-Base Breakdown Voltage (IE=10mAdc, IE=0)
Collector-Base Cutoff Current (VCB=20Vdc,IE=0) I
Collector-Emitter Cutoff Current (VCE=10Vdc,IB=0) I
DC Current Gain (Note 2)
Collector-Emitter Saturation Voltage (Note 2)
2. Pulse Test: Pulse Width 300 ms, D.C. 2%.
=10Vdc,IC=2.0mAdc)
(V
CE
=2.0Vdc,IC= 100 mAdc)
(V
CE
= 100 mAdc, IB=10mAdc)
(I
C
(BR)CEO
V
(BR)CBO
V
(BR)EBO
CBO
CEO
h
FE1
h
FE2
V
CE(sat)
50 -- Vdc
60 -- Vdc
7.0 -- Vdc
-- 0.1
-- 0.1
210
90
340
--
mA
mA
-- 0.5 Vdc
--
250
200
150
100
, POWER DISSIPATION (mW)
D
P
450
400
350
300
250
200
150
, DC CURRENT GAIN
FE
100
h
50
50
R
= 833C/W
θ
JA
0
TA, AMBIENT TEMPERATURE (C) IC, COLLECTOR CURRENT (A)
Figure 1. Derating Curve Figure 2. Collector Emitter Saturation Voltage
150C(10V)
150C(2V)
25C(10V)
25C(2V)
-- 5 5 C(10V)
-- 5 5 C(2V)
0
IC, COLLECTOR CURRENT (A) IC, COLLECTOR CURRENT (A)
Figure 3. DC Current Gain vs. Collector
Current
150100500-- 5 0
10.10.010.0010.0001
0.30
0.25
0.20
0.15
0.10
, COLLECTOR--EMITTER
SATURATION VOLTAGE (V)
0.05
CE(sat)
V
0
0.95
0.85
0.75
0.65
0.55
TION VOLTAGE (V)
0.45
, BASE --EMITTER SATURA-
0.35
BE(sat)
V
0.25
IC/IB=10
150C
25C
-- 5 5 C
vs. Collector Current
IC/IB=10
-- 5 5 C
25C
150C
Figure 4. Base Emitter Saturation Voltage vs.
Collector Current
10.10.010.0010.0001
10.10.010.0010.0001
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MSD1819A--RT1
, BASE--EMITTER TURN ON VOLTAGE (V)
BE(on)
V
, INPUT CAPACITANCE (pF)
ibo
C
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
-- 5 5 C
25C
150C
IC, COLLECTOR CURRENT (A) IB, BASE CURRENT (A)
Figure 5. Base Emitter Turn--On Voltage vs.
Collector Current
18
17
16
15
14
C
13
12
11
10
9
8 7
(pF)
ibo
Veb, EMITTER BASE VOLTAGE (V)
Figure 7. Input Capacitance
1.2
1.0
0.8
0.6
0.4
0.2
, COLLECTOR--EMITTER VOLTAGE (V)
0
CE
V
10.10.010.0010.0001
500 mA
1mA
10 mA
50 mA
TA=25C
IC= 100 mA
0.010.0010.00010.000010.000001
Figure 6. Collector Saturation Region
6.0
5.5
5.0
4.5
4.0
C
(pF)
3.5
3.0
2.5
2.0
, OUTPUT CAPACITANCE (pF)
obo
1.5
C
6543210
1.0
obo
Vcb, COLLECTOR BASE VOLTAGE (V)
35
40302520151050
Figure 8. Output Capacitance
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0.05 (0.002)
l
D
e1
3
H
E
12
e
A1
MSD1819A--RT1
PACKAGE DIMENSIONS
SC--70 (SOT--323)
CASE 419--04
ISSUE N
E
b
A
A2
L
SOLDERING FOOTPRINT*
0.65
0.025
NOTES:
1. DIMENS IONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
DIMAMIN NOM MAX MIN
A1 0.00 0.05 0.10 0.000 A2 0.70 REF
b 0.30 0.35 0.40 0.012 c 0.10 0.18 0.25 0.004 D 1.80 2.10 2.20 0.071 E 1.15 1.24 1.35 0.045 e 1.20 1.30 1.40 0.047
e1
L
H
E
STYLE 3:
c
PIN 1. BASE
MILLIMETERS
0.80 0.90 1.00 0.032
0.65 BSC
0.38
0.20 0.56
2.00 2.10 2.40 0.079 0.083 0.095
2. EMITTER
3. COLLECTOR
0.65
0.025
INCHES
NOM MAX
0.035 0.040
0.002 0.004
0.028 REF
0.014 0.016
0.007 0.010
0.083 0.087
0.049 0.053
0.051 0.055
0.026 BSC
0.015
0.008 0.022
1.9
0.075
0.9
0.035
0.7
0.028
SCALE 10:1
inches
mm
*For additional information on our Pb--Free strategy and soldering
details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
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