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E2C0032-27-Y2
¡ Semiconductor MSC7166
¡ Semiconductor
This version: Nov. 1997
Previous version: Jul. 1996
MSC7166
16-Bit Grid Driver with 4 to 16-Decoder
GENERAL DESCRIPTION
The MSC7166 is a driver IC designed to directly drive the grids of a vacuum fluorescent display
tube.
Since this IC has a built-in 4 to 16-line decoder and 16 output circuits, a signal device of MSC7166
can replace a set of the following three: two devices of either MSL912 or MSL918 and one device
of either MSM4514 or MSM74HC4514.
Setting the DUTY pin to the "L" level makes all driver outputs go "L". Blanking can be set using
this function.
FEATURES
• Logic supply voltage : 5V
• Driver supply voltage : 65V
• Driver output current I
• Can be directly connected to VF display tube without pull-down resistor
• Built-in 4- to 16-line decoder
• Brightness can be adjusted by DUTY pin
• Package
24-pin plastic SOP (SOP24-P-430-1.27-K) (Product name: MSC7166GS-K)
I
OH
OL
: –40 mA
: 1 mA
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¡ Semiconductor MSC7166
BLOCK DIAGRAM
V
DISP(+)
V
DD
SEL0
SEL1
SEL2
SEL3
4 to 16
DECODER
S 1
S 2
S 3
S 4
S 5
S 6
S 7
S 8
S 9
S10
S11
S12
S13
S14
S15
S16
GRID 1
GRID 2
GRID 3
GRID 4
GRID 5
GRID 6
GRID 7
GRID 8
GRID 9
GRID10
GRID11
GRID12
GRID13
GRID14
GRID15
GRID16
DUTY
V
SS
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¡ Semiconductor MSC7166
INPUT AND OUTPUT CONFIGURATION
Schematic Diagram of Logic Input Circuit
Input
V
SS
Schematic Diagram of Driver Output Citcuit
V
DISP(+)VDISP(+)
V
DD
V
SS
V
DD
V
SS
Output
V
SS
V
SS
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¡ Semiconductor MSC7166
PIN CONFIGURATION (TOP VIEW)
GRID 1
GRID 2
GRID 3
GRID 4
GRID 5
GRID 6
GRID 7
GRID 8
GRID 9
GRID10
GRID11
GRID12
PIN DESCRIPTIONS
10
11
12
1
2
3
4
5
6
7
8
9
24
23
22
21
20
19
18
17
16
15
14
13
V
SS
SEL 0
SEL 1
SEL 2
SEL 3
DUTY
V
DD
V
DISP(+)
GRID 13
GRID 14
GRID 15
GRID 16
24-pin Plastic SOP
Symbol Type Description
SEL0-3
4- to 16-line decoder input pins.
I
The input 4-bit binary signals are converted into hexadecimal signals, then output through
driver output pins.
DUTY
I Duty control signal input pin.
Setting this pin to "L" makes all driver outputs go "L", so this pin can be used for brightness
control.
GRID1-16
O High withstand voltage driver output pins for driving fluorescent display tube.
These pins can directly be connected to the grid of fluorescent display tude without
pull-down resistor.
V
DISP(+)
V
DD
V
SS
—
Power supply pin for the fluorescent display tube driver circuit.
—
Logic power supply pin.
Ground pin.
—
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¡ Semiconductor MSC7166
ABSOLUTE MAXIMUM RATINGS
Parameter Condition Rating UnitSymbol
Logic Supply Voltage
Driver Supply Voltage
Input Voltage
Power Dissipation
Thermal Resistance of Package
Storage Temperature
V
V
DISP(+)
V
P
R
T
DD
IN
D
j-a
STG
Applied to logic supply pin
Applied to driver supply pin
Applied to all input pins –0.3 to V
Ta<25°C
=
—
—
–0.3 to +6.5
–0.3 to +70
+0.3
DD
790
158
–55 to +150
*1,2
*1 The maximum supply voltage for VSS.
*2 Permanent damage to the device may be caused if the voltage is supplied over the the absolute
maximum rating value.
*3 Thermal resistance of the package (between junction and atmosphere).
The junction temperature (Tj) given by the equation indicated below should not exceed 150°C.
Tj=P ¥ R
+ Ta (P: maximum power consumption of IC)
j-a
*1
*1
*3
V
V
V
mW
°C/W
°C
RECOMMENDED OPERATING CONDITIONS
Parameter
Symbol
Logic Supply Voltage
Driver Supply Voltage
V
DISP(+)
High Level Input Voltage V
Low Level Input Voltage V
High Level Output Current
Low Level Output Current
Operating Temperature T
Input Pulse Rise Time
Input Pulse Fall Time
V
DD
Applied to logic supply pin
Applied to driver supply pin
IH
IL
I
OH
I
OL
op
t
r
t
f
Applied to all driver output pins
Applied to all driver output pins
Condition Min. Max. Unit
Applied to all input pins
Applied to all input pins
Applied to all input pins
Applied to all input pins
—
4.5
8
3.1
—
—
—
–40
—
—
5.5
65
—
1.7
–40
1.0
85
1.0
1.0
V
V
V
V
mA
mA
°C
ms
ms
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¡ Semiconductor MSC7166
ELECTRICAL CHARACTERISTICS
DC Characteristics
Parameter
Logic Supply Current
Driver Supply Current I
High Level Input Current
Low Level Input Current
High Level Output Voltage V
Low Level Output Voltage V
AC Characteristics
Parameter
Delay Time L to H
Transient Time L to H
Delay Time H to L
Transient Time H to L
Symbol
t
DLH
t
TLH
t
DHL
t
THL
Symbol
I
DD1
I
DD2
DISP1
I
DISP2
I
IH
I
IL
OH
OL
=4.5 to 5.5V,V
(V
DD
=8 to 65V,Ta=–40 to +85°C)
DISP(+)
Condition Min. Typ. Max.
No load, 1 output H
No load, DUTY=L
No load, 1 output H
No load, DUTY=L
—
—
—
—
—
—
—
—
V
DISP(+)
–4
=1mA 2.5 V
OL
(V
=4.5 to 5.5V,V
DD
=8 to 65V,Ta=–40 to +85°C)
DISP(+)
Condition Min. Typ. Max.
C
=10pF, See figure below
L
C
=10pF, See figure below
L
C
=10pF, See figure below
L
C
=10pF, See figure below
L
—
—
—
—
—
—
—
—
—
—
—
——I
0.3
2.0
0.3
2.0
4.8
5.0
0.3
1.0
±1
—
1.0
4.0
1.0
4.0
Unit
mA
mA
mA
mA
mA
mA±1
VIOH=–40mA
Unit
ms
ms
ms
ms
DUTY
SELn
GRIDn
10%
t
90%
50%
r
t
f
90%
50%
10%
t
DLH
t
DHL
90% 90%
10%
t
TLH
t
THL
10%
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¡ Semiconductor MSC7166
FUNCTION DESCRIPTION
Functional Table
DUTY
L
H
SEL GRID
X
X
X
X
L
L
L
L
L
L
L
L
L
L
H
L
L
L
L
L
H
L
L
L
LHLLLLLLLLLLLLLL
L
H
L
L
L
L
H
L
L
L
H
H
L
L
LLLHLLLLLLLLLLLL
L
L
H
L
L
L
L
L
H
L
H
L
H
L
LLLLLHLLLL LLLLLL
L
H
H
L
L
L
L
L
L
L
H
H
H
L
LLLLLLLHLLLLLLLL
L
L
L
H
L
L
L
L
L
L
H
L
L
H
LLLLLLLLLHLLLLLL
L
H
L
H
L
L
L
L
L
L
H
H
L
H
LLLLLLLLLLLHLLLL
L
L
H
H
L
L
L
L
L
L
H
L
H
H
LLLLLLLLLLLLLHLL
L
H
H
H
L
L
L
L
L
L
H
H
H
H
LLLLLLLLLLLLLLLH
161514131211109876543213210
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
H
L
L
L
L
L
L
L
L
L
L
L
H
L
L
L
L
L
L
L
L
L
L
L
H
L
L
L
L
L
L
L
L
L
L
L
H
L
L
L
L
L
L
L
L
L
L
L
H
L
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¡ Semiconductor MSC7166
PACKAGE DIMENSIONS
(Unit : mm)
SOP24-P-430-1.27-K
Mirror finish
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5 mm or more
0.58 TYP.
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
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