The MSC5301B-02 is an LCD driver LSI with a built-in RAM. The device's bit mapping method
offers greater flexibility in which each bit of the display RAM controls each section on the LCD
panel. It can form a graphic display system of 64 x 8 dots in one chip. In addition, the display can
be expanded by using the additional LSIs.
These are pins for the RC oscillation circuit. Connect external resistors and a capacitor as shown
below. When inputting the external clock pulse, input it to OS1 pin. OS2 and f pins should be
left open.
OS
1
R
S
OS
R
2
C
T
T
f
The relation of frame frequency fFR and internal clock frequency ff is shown by the following
equation.
(RC oscillation frequency = internal clock frequency)
ff = 4 x 8 x f
FR
In addition, the relation of frame frequency fFR and frame synchronizing signal frequency
f
is shown by the following equation.
FRAM
f
FRAM
= fFR/2
• CS0 (Pin 30), CS1 (Pin 31)
Chip select input pins. Master and slave modes are determined by CS0 and CS1 as shown in
the table below. A maximum of 4 devices can be connected in this manner. Use the master mode
when using a single chip.
CS0
L
H
L
H
CS1
L
L
H
H
Operation mode
Master mode
Slave mode
Slave mode
Slave mode
H : VCC level
L : GND level
8/15
Page 9
MSC5301B-02¡ Semiconductor
• FRAM (Pin 38)
This is an input and output pin for the frame synchronizing signal to be used for master/slave
configuration. It becomes an output pin in master mode and an input pin in slave mode.
• SI (Pin 34)
This is a serial data input pin of address data (8 bits) and segment data (64 bits). A pull-up
resistor (10 kW - 60 kW) and the Schmitt circuit are contained. The serial data is shifted at the
rising edge of SCK.
• SCK (Pin 35)
This is a shift clock input pin of address data (8 bits) and segment data (64 bits). The serial data
is shifted at the rising edge of SCK pulse. A pull-up resistor (10 kW - 60 kW) and the Schmitt
circuit are contained.
• LATCH (Pin 32)
This is a latch pulse input pin of address data (8 bits) and segment data (64 bits). The latch data
comes through at "H" level of LATCH and the data just before "H" level is latched at "L" level.
A pull-up resistor (10 kW - 60 kW) and the Schmitt circuit are contained.
•A/D (Pin 33)
This is a data select signal input pin of address data (8 bits) and segment data (64 bits). "H" level
is set in the case of address 8-bit input and "L" level is set in the case of segment data 64-bit input.
A pull-up resistor (10 kW - 60 kW) and the Schmitt circuit are contained.
These are power supply pins for this LSI and bias power supply pins for LCD driving.
VCC, which is a power supply pin, is from 4.5V to 5.5V; GND, which is a ground pin, is 0V; V
which is an LCD driving power supply pin, is usually used in the range between 6V and 16V.
V1, V2, V3 and V4 are bias power supply pins for LCD driving and are usually used by
supplying bias voltage from an external source.
DSP
,
9/15
Page 10
MSC5301B-02¡ Semiconductor
• BLK (Pin 37)
This is an input pin to control the LCD panel display.
When a "H" level is input (or when this pin is open), the segment output pins S0 - S63 come to
the levels V2 - V3 and the LCD panel is turned off. In addition, during this period, the data read
from a display RAM is stopped but writing into the display RAM of address and segment data
inputted from the SI pin is available.
When this pin is changed from "H" level to "L", the frame synchronizing signal FRAM is output
within the 2 cycles of an internal clock ff, and it is synchronized at multi-chip. Then, the display
RAM address is set to "000". After 1/8 frame cycle from FRAM signal generation, the output
is applied from the "001" data of the display RAM address to the segment driver. Because the
display RAM contents are undefined at the time the power is turned on, keep this pin to "H"
level (or leave open) until writing data to the RAM is completed. A pull-up resistor (10kW 60kW) and the Schmitt circuit are contained.
• POR (Pin 36)
This is a power-on-reset input pin. When a "H" level is input (or when this pin is open), the
common and segment outputs come to the static light-out state in no relation to the BLK pin
and the segment output pins S0 - S63 become V3 level and the common output pins C0 - C8
become V4 level.
When this pin is changed from "H" level to "L", the frame synchronizing signal FRAM is output
within the 2 cycles of an interval clock ff, and it is synchronized when multiple devices are
connected and is moreover dynamic-operated from the frame B . Then, the display RAM
address is set to "000". After 1/8 frame cycle from FRAM signal generation, the "001" data of
the display RAM address is output to the segment driver. However, because the BLK pin is
usually at "H" level when the power-on-reset is released, reading data from the display RAM
is stopped and light-out segment data is forcibly transferred to the segment output. A pull-up
resistor (10kW - 60kW) and the Schmitt circuit are contained.
• C0 (Pin 13) - C7 (Pin 27)
These are 8-output pins of the common driver which are used for LCD panel driving. The
outputs of 4 levels are obtained (V
and GND are select levels, and V1 and V4 are nonselect
DSP
levels).
• S0 (Pin 47) - S63 (Pin 11)
These are 64-output pins of segment driver which are used for LCD panel driving. The outputs
of 4 levels are obtained (V
and GND are select levels, which correspond to "1" of the display
DSP
RAM data, and V2 and V3 are nonselect levels, which correspond to "0" of the display RAM
data).
NOTES ON USE
Note the following when turning power on and off:
The LCD drivers of this IC require a high voltage. For this reason, if a high voltage is applied to
the LCD drivers with the logic power supply floating, excess current flows. This may damage
the IC. Be sure to carry out the following power-on and power-off sequences:
When turning power on:
First VCC ON, next V
When turning power off:
First V
, V4, V3, V2, V1 OFF, next VCC OFF. Or both OFF at the same time.
DSP
, V4, V3, V2, V1 ON. Or both ON at the same time.
DSP
10/15
Page 11
MSC5301B-02¡ Semiconductor
Relation Between LCD Screen Size and Display RAM
This LCD driver has a built-in RAM for the display of 8 ¥ 64 = 512 bits and the address
corresponds to the duty of the LCD.
The data corresponds to the number of dots in the X direction. The relation between the LCD
screen size and the display RAM is shown below.
AddressData
A2
A1
A0
S63S0
0
0
0
0
0
1
0
1
0
0
1
1
1
0
0
1
0
1
1
1
0
1
1
1
C0
C1
C2
C3
C4
C5
C6
C7
1/8 duty
Number of dots in X direction (64)
Relation Between Frame Cycle and Display RAM Data
The output of the display RAM data corresponds to the segment output. The relation between
the frame cycle and the display RAM data is as follows:
First line address
Segment output
(Contents of RAM)
000001010011110111000001
1 frame cycle
11/15
Page 12
MSC5301B-02¡ Semiconductor
Multiple Configuration
This LCD driver can form multiple configuration.
It is possible to form a maximum of 4 devices (a panel of up to 256 ¥ 8 dots in size can be formed)
by using chip select signals CS0 and CS1. The devices in multiple configuration must be
synchronized with one another. In this configuration, one device in the master mode, where the
original oscillation signal f and the synchronous signal FRAM are output, and the other devices
in the slave mode, where the original oscillation signal f and the synchronous signal FRAM are
input, are used in combination.
Refer to items CS0 and CS1 of the pin description on the mode setting method.
The original oscillation signal output pin f of the master mode devices is connected to the OS1
pin of the slave mode device and the synchronizing signal pin FRAM is also connected to the
FRAM pin of the slave mode device.
Connect SI, SCK, LATCH, A/D, POR and BLK of the master mode devices to SI, SCK, LATCH,
A/D, POR and BLK of each of the slave mode devices and connect them to CPU for control.
In addition, connect the devices so that V
, V1, V2, V3, V4 and GND are shared between the
DSP
devices, and connect them to each voltage level divided by resistors.
Address Data Configuration
(MSB)(LSB)
7654 3210
Dummy data 2Upper addressLower address
DM2DM1CS1CS0A2A1A0DM0
2 bits2 bits
3 bits1 bit
Dummy data 1
The lower address, which is the address of the display RAM, corresponds to the common sides
C0 - C7 of LCD panel. Dummy data 1 must be always set to "H".
The upper address corresponds to the logical state of chip select pins CS0 and CS1 and lower
address is set to the chip only with which corresponded.
For the chip to output the common signal (f, FRAM), set both of the upper address 2 bits to "L".
The 2 bits of dummy data can be set to either "L" or "H".
12/15
Page 13
Serial Signal to be Input From CPU
g
The following signals are input from an external CPU to this LCD driver:
- Serial transfer clockÆSCK
- Serial transfer dataÆSI
- Serial transfer latchÆLATCH
- Serial data selectÆA/D
The operations are shown in the following table.
MSC5301B-02¡ Semiconductor
ModeLATCHSI
Address data
input mode
Segment data
input mode
H
L
SCKA/D
Shifts at the
rising edge
Shifts at the
rising edge
8-bit address data is latched
at falling edge (level type)
64-bit segment data is latched
at falling edge (level type)
8-bit address data
Serial input from LSB side
64-bit segment data
The first segment data shifted into the shift
register corresponds to S63.
"1" : Light-on data, "0" : Light-out data
Timing for Serial Signal Transferred From CPU
A/D
SCK
"H" at address data setting"L" at segment data setting
1234567812 36364
SI
LATCH
Dummy
(Always "H")
A0A1A2 CS0 CS1 Dummy DummyS63S62S
LSB
61
MSB
Address data (8 bits)Segment data (64 bits)
Address latch
si
nal
S1S
0
RAM write
signal
Notes:
1. Be sure to set the address before writing the segment data to RAM. Then, write the segment
data to RAM.
2. While the POR pin is "H" (upon power-on reset), neither address data nor segment data can
be entered.
13/15
Page 14
Operation upon Power ON (When Single Device Used)
MSC5301B-02¡ Semiconductor
Dynamic operation (normal operation)Dynamic light-out state
0 - 70 - 0 1 - 70 - 70 - 70 - 7
Frame BFrame BFrame AFrame AFrame BFrame BFrame A
Frame A
CC
V
POR
BLK
f
(External R
and C)
FRAM
Segment signal
output
Common signal output
RAM address0 - 7
14/15
Page 15
PACKAGE DIMENSIONS
QFP100-P-1420-0.65-BK
Mirror finish
MSC5301B-02¡ Semiconductor
(Unit : mm)
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5 mm or more
1.29 TYP.
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
15/15
Loading...
+ hidden pages
You need points to download manuals.
1 point = 1 manual.
You can buy points or you can get point for every manual you upload.