Datasheet MSC23432D-60BS8, MSC23432D-60DS8, MSC23432D-70BS8, MSC23432D-70DS8 Datasheet (OKI)

Semiconductor

MSC23432D-xxBS8/DS8

4,194,304-wo rd x 32-bit DYNAMIC RAM MODULE : FAST PAGE MODE TYPE

This vers i on: Mar. 8. 1999

DESCRIPTION

The MSC23432D-xx BS8/ DS8 i s a ful ly decoded, 4,194, 304-word x 32-bi t CMOS dy nam ic random acc ess mem ory
module com posed of ei ght 16M b DRAMs (4Mx 4) i n SO J pack ages mount ed with ei ght dec oupli ng capac it ors on a
72-pin glass epoxy single in-line package. This module supports any application where high density and large
capacity of storage memory are requi r ed.

FEATURES

· 4,194,304-word x 32- bit organization

· 72-pin Single In-Li ne M emory Module
MSC23432D-xxBS8 : Gold tab
MSC23432D-xxDS8 : Solder tab

· Singl e +5V supply ± 10% tolerance

· Input : TTL compatibl e

· Output : TTL compatible, 3-state

· Refresh : 2048cycles/32ms

· /CAS before /RAS refresh, hidden refresh, /RAS only refresh capability

· Fast page mode c apability

· Multi-bit t est mode capability

PRODUCT FAMILY

Access Time (Max. ) Power Dissipation

Family

t

RAC

t

AA

t

CAC

Cycle

Time

(Min.)

Operating (Max.) Standby (Max.)

MSC23432D-60BS8/DS8 60ns 30ns 15ns 110ns 4840mW
MSC23432D-70BS8/DS8 70ns 35ns 20ns 130ns 4400mW

44mW

Semiconductor MSC23432D

MODULE OUTLINE

1

72

R1.57

6.35

1.04Typ.

1.27±0.1

95.25

2.03Typ.

6.35Typ.

Typ.

6.35

Typ.

10.16

φ

3.18

25.4±0.2

101.19Typ.

107.95±0.2

*1

3.38Typ.

3.17Min.

5.28Max.

+0.1

-0.08

1.27

(Unit : mm )

MSC23432D-xxBS8/DS8

*1 The common size difference of the board width 12.5mm of its height is specified as ±0.2.

The value above 12.5mm is specified as ±0.5.

Semiconductor MSC23432D

PIN C ONFIGURATION

Pin No. Pin Name Pin No. Pin Nam e Pin No. Pin Nam e Pin No. Pin Nam e

1VSS19 A10 37 NC 55 DQ11
2 DQ0 20 DQ4 38 NC 56 DQ27
3 DQ16 21 DQ20 39 V

SS

57 DQ12
4 DQ1 22 DQ5 40 /CAS0 58 DQ28
5 DQ17 23 DQ21 41 /CAS2 59 V

CC

6 DQ2 24 DQ6 42 /CAS3 60 DQ29
7 DQ18 25 DQ22 43 /CAS1 61 DQ13
8 DQ3 26 DQ7 44 /RAS0 62 DQ30
9 DQ19 27 DQ23 45 NC 63 DQ14

10 V

CC

28 A7 46 NC 64 DQ31
11 NC 29 NC 47 /WE 65 DQ 1 5
12 A0 30 V

CC

48 NC 66 NC
13 A1 31 A8 49 DQ8 67 PD1
14 A2 32 A9 50 DQ24 68 PD2
15 A3 33 NC 51 DQ9 69 PD3
16 A4 34 /RAS2 52 DQ25 70 PD4
17 A5 35 NC 53 DQ10 71 NC
18 A6 36 NC 54 DQ26 72 V

SS

Presence Detect Pins

Pin No. Pin Name

MSC23432D

-60BS8/DS8

MSC23432D

-70BS8/DS8

67 PD1 V

SS

V

SS

68 PD2 NC NC
69 PD3 NC V

SS

70 PD4 NC NC

Semiconductor MSC23432D

BLOCK DIAGRAM

/WE

/CAS0

/RAS0

A0-A10

/CAS1

DQ0

A0-A10

DQ

DQDQDQ

/OE

V

CC

/RAS

/CAS

/WE

V

SS

DQ1

DQ2

DQ3

V

CC

VSSC1-C8

A0-A10

DQ

DQ

DQDQ/OE

VCC/RAS

/CAS

/WE

V

SS

DQ4

DQ5

DQ6

DQ7

A0-A10

DQDQDQDQ/OE

V

CC

/RAS

/CAS

/WE

V

SS

DQ8

DQ9

DQ10

DQ11

A0-A10

DQ

DQDQDQ

/OE

/RAS

/CAS

/WE

DQ12

DQ13

DQ14

DQ15

DQ16

A0-A10

DQ

DQDQDQ

/OE

/RAS

/CAS

/WE

DQ17

DQ18

DQ19

VCCVSSVCCV

SS

DQ20

A0-A10

DQ

DQ

DQDQ/OE

/RAS

/CAS

/WE

DQ21

DQ22

DQ23

VCCVSSDQ24

A0-A10

DQDQDQDQ/OE

/RAS

/CAS

/WE

DQ25

DQ26

DQ27

VCCV

SS

DQ28

A0-A10

DQ

DQDQDQ

/OE

/RAS

/CAS

/WE

DQ29

DQ30

DQ31

VCCVSS/CAS2

/RAS2

/CAS3

Semiconductor MSC23432D

ELECTRICAL CHARAC TERISTICS

Absolute Maximum Ratings

Parameter Symbol Rating Unit

Voltage on Any Pin Relative to V

SS

VIN, V

OUT

-0.5 to +7.0 V

Voltage on VCC Supply Relative to V

SS

V

CC

-0.5 to +7.0 V

Short Circuit Output Curr ent I

OS

50 mA
Power Dissipation PD *8W
Operating Temperature T

OPR

0 to +70 °C

Storage Temperature T

STG

-40 to +125 °C

* Ta = 25°C

Recommended Operating Conditions

( Ta = 0°C to +70°C )

Paramete r Symbol Min. Typ. Max. Unit

V

CC

4.5 5.0 5.5 V

Power Supply Voltage

V

SS

000V

Input High Voltage V

IH

2.4 - VCC + 0.5 V

Input Low Voltage V

IL

-0.5 - 0.8 V

Capacitance

( VCC = 5V ± 10%, Ta = 25°C, f = 1 MHz )

Paramete r Symbol Typ. Max. Uni t

Input Capacitance (A0 - A10) C

IN1

-57pF

Input Capacitance (/WE) C

IN2

-65pF

Input Capacitance (/RAS0, /RAS2) C

IN3

-35pF

Input Capacitance (/CAS0- /CAS3) C

IN4

-20pF

I/O Capacitance (DQ0 - DQ31) C

DQ

-16pF

Semiconductor MSC23432D

DC CHARACTERISTICS

(VCC = 5V ± 10%, Ta = 0°C to +70°C )

MSC23432D

-60BS8/DS8

MSC23432D

-70BS8/DS8

Paramete r Symbol Conditi on

Min. Max. Min. Max.

Unit Note

Input Leakage Current I

LI

0V ≤ VIN ≤ 6.5V;
All other pins not
under test = 0V

-80 80 -80 80 µA

Output Leakage Current I

LO

DQ disable
0V ≤ V

OUT

≤ 5.5V

-10 10 -10 10 µA

Output High Voltage V

OH

IOH = -5.0mA 2.4 V

CC

2.4 V

CC

V

Output Low Voltage V

OL

IOL = 4.2mA 0 0.4 0 0.4 V

Average Power
Supply Current
(Operating)

I

CC1

/RAS, /CAS cy cling,
t

RC

= Min.

- 880 - 800 mA 1, 2

/RAS, /CAS = V

IH

-16-16mA1

Power supply current
(Standby)

I

CC2

/RAS, /CAS
≥ V

CC

-0.2V

-8-8mA1

Average Power
Supply Current
(/RAS only refresh)

I

CC3

/RAS cycling,
/CAS = V

IH

,

t

RC

= Min.

- 880 - 800 mA 1, 2

Average Power
Supply Current
(/CAS before /RAS refresh)

I

CC6

/RAS cycling,
/CAS before /RAS

- 880 - 800 mA 1, 2

Average Power
Supply Current
(Fast Page Mode)

I

CC7

/RAS = VIL,
/CAS cycling,
t

PC

= Min.

- 720 - 640 mA 1, 3

Notes: 1. ICC Max. is specified as ICC for output open conditi on.

2. Address can be changed once or less while /RA S = V

IL

.

3. Address can be changed once or less while /CA S = V

IH

.

Semiconductor MSC23432D

AC CHARACTERISTICS (1/ 2)

(VCC = 5V ± 10%, Ta = 0°C to +70°C ) Note: 1, 2, 3, 9, 10

MSC23432D

-60BS8/DS8

MSC23432D

-70BS8/DS8

Paramete r Symbol

Min. Max. Min. Max.

Unit Note

Random Read or Writ e Cycle Time t

RC

110 - 130 - ns

Fast Page Mode Cycle Time t

PC

40 - 45 - ns

Access Time from /RAS t

RAC

- 60 - 70 ns 4, 5, 6

Access Time from /CAS t

CAC

- 15 - 20 ns 4, 5

Access Time from Column Address t

AA

- 30 - 35 ns 4, 6

Access Time from /CAS Precharge t

CPA

- 35 - 40 ns 4

Output Low Impedance Time from /CAS t

CLZ

0-0-ns4

/CAS to Data Output Buffer Turn-off Delay Time t

OFF

0 15 0 20 ns 7

Transition Time t

T

3 50 3 50 ns 3

Refresh Period t

REF

-32-32ms

/RAS Precharge Tim e t

RP

40 - 50 - ns

/RAS Pulse Width t

RAS

60 10K 70 10K ns

/RAS Pulse Width ( Fast Page Mode) t

RASP

60 100K 70 100K ns

/RAS Hold Time t

RSH

15 - 20 - ns

/CAS Precharge Time (Fast Page Mode) t

CP

10 - 10 - ns

/CAS Pulse Width t

CAS

15 10K 20 10K ns

/CAS Hold Time t

CSH

60 - 70 - ns

/CAS to /RAS Pr echarge Time t

CRP

5-5-ns

/RAS Hold Time from /CAS Precharge t

RHCP

35 - 40 - ns

/RAS to /CAS Delay Time t

RCD

20 45 20 50 ns 5

/RAS to Column Address Delay Time t

RAD

15 30 15 35 ns 6

Row Address Set-up Time t

ASR

0-0-ns

Row Address Hol d Time t

RAH

10 - 10 - ns

Column Address Set-up Time t

ASC

0-0-ns

Column Address Hol d Time t

CAH

15 - 15 - ns

Column Address to /RAS Lead Time t

RAL

30 - 35 - ns

Read Command Set-up Time t

RCS

0-0-ns

Read Command Hold Time t

RCH

0-0-ns8

Read Command Hold Time referenced to /RAS t

RRH

0-0-ns8

Semiconductor MSC23432D

AC Characteristics (2/2)

(VCC = 5V ± 10%, Ta = 0°C to +70°C ) Note: 1, 2, 3, 9, 10

MSC23432D

-60BS8/DS8

MSC23432D

-70BS8/DS8

Paramete r Symbol

Min. Max. Min. Max.

Unit Note

Writ e Command Set-up Time t

WCS

0-0-ns

Writ e Command Hold Time t

WCH

10 - 15 - ns

Writ e Command Pulse Wi dth t

WP

10 - 10 - ns

Writ e Command to /RAS Lead Time t

RWL

15 - 20 - ns

Writ e Command to /CAS Lead Time t

CWL

15 - 20 - ns

Data-in Set-up Time t

DS

0-0-ns

Data-i n Ho ld Time t

DH

10 - 15 - ns

/CAS Active Delay Time from /RAS Precharge t

RPC

5-5-ns

/RAS to /CAS Set-up Time
(/CAS before /RAS)

t

CSR

10 - 10 - ns

/RAS to /CAS Hold Time
(/CAS before /RAS)

t

CHR

10 - 10 - ns

/WE to /RAS Precharge Time
(/CAS before /RAS)

t

WRP

10 - 10 - ns

/WE Hold Time from /RAS
(/CAS before /RAS)

t

WRH

10 - 10 - ns

/RAS to /WE Set-up Time
(Test Mode)

t

WTS

10 - 10 - ns

/RAS to /WE Hold Time
(Test Mode)

t

WTH

10 - 10 - ns

Semiconductor MSC23432D

Notes: 1. A start-up delay of 200µs is required after power-up, followed by a minimum of eight initialization cycles

(/RAS only r efresh or /CAS before /RAS refresh) befor e pr oper devic e oper ation is achieved.

2. The AC characteristic s assumes t

T

= 5ns.

3. V

IH

(Min.) and VIL(Max.) are ref erence lev els f or m easuring input tim ing signals. Transiti on ti me (tT) are

measured between V

IH

and VIL.

4. This parameter is m easured wit h a load circuit equivalent t o 2TTL loads and 100pF.

5. Operation within the t

RCD

(Max.) limit ensures that t

RAC

(Max.) can be met.

t

RCD

(Max.) is specified as a reference point only. If t

RCD

is greater than the specified t

RCD

(Max.) limit, then

the access tim e is controll ed by t

CAC

.

6. Operation within the t

RAD

(Max.) limit ensures that t

RAC

(Max.) can be met.

t

RAD

(Max.) is specified as a reference point only. If t

RAD

is greater than the specified t

RAD

(Max.) limit, then

the access tim e is controll ed by t

AA

.

7. t

OFF

(Max.) define the time at which the output achieves the open circuit condition and are not referenced

to output voltage levels.

8. t

RCH

or t

RRH

must be satisfi ed for a read cycle.

9. The test mode is initiated by perf orming a /WE and /CAS before /RAS ref resh cycle. This mode is
latched and remains in effect until the exit cycle is generated. The test mode specified in this data sheet
is an 8-bit parallel test function. CA0, CA1 and CA10 are not used. In a read cycle, if all int ernal bits are
equal, the DQ pin will indica te a h igh le vel. If an y in ter na l b its ar e n o t equal, the DQ pin will indicat e a low
level. The test mode is cleared and the memory devic e retur ned to its normal operating state by a /RAS
only refresh or /CAS before /RAS refresh cycle.

10. In a test mode read cycle, the value of access time parameters is delayed for 5ns for the specified value.
These parameters should be specifi ed in test m ode cycle by adding the abov e v alue t o the specif ied
value in this data sheet.