Datasheet MSC1164GS-K, MSC1164SS Datasheet (OKI)

E2C0011-27-Y4

¡ Semiconductor MSC1164

¡ Semiconductor

This version: Nov. 1997

Previous version: Jul. 1996

MSC1164

20-Bit Grid/Anode Driver

GENERAL DESCRIPTION

The MSC1164 is a monolithic IC using the Bi-CMOS process technology for hybridizing CMOS and bipolar transistors on the same chip. The logic portion such as the input stage, shift register and latch is fabricated by CMOS and the output driver requiring a high withstand voltage is fabricated by bipolar transistors.

Since a 32-pin plastic SSOP package is used, the display unit size can be reduced.

FEATURES

The MSC1164 is designed as a VFD grid/anode driver with emitter-follower force output with 20-bit active pull-down and built-in 20-bit shift register and latch.

• Logic Supply Voltage (VCC):5V

• Driver Supply Voltage (VHV) : 65V

• Driver Output Current I

OHVH1

I

OHVH2

I

OHVL

• 20-bit output (with latch circuit)

• 20-bit shift register

• Clock frequency : 4MHz

• Package options:

32-pin plastic SSOP (SSOP32-P-430-1.00-K) (Product name: MSC1164GS-K) 30-pin plastic shrink DIP (SDIP30-P-400-1.78) (Product name: MSC1164SS)

:–40mA (Only one driver output: "H") :–2mA (All driver outputs: "H") :2mA

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¡ Semiconductor MSC1164

BLOCK DIAGRAM

CLK DIN LS

D

R-1

R-2

11

22

CHG CL

V

CC

V

HV

HVO1

HVO2

20-Bit Shift Register

20 20R-20

Q

DOUT

20-Bit Latch

HVO20

GND

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¡ Semiconductor MSC1164

INPUT AND OUTPUT CONFIGURATION

Schematic Diagrams of Logic Portion Input and Output Circuits

Input Pin

Output Pin

INPUT

V

CC

GND

V

CC

V

CC

V

CC

GND

Schematic Diagram of Driver Output Circuit

V

HV

DOUT

GND

V

HV

HVO

GND

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¡ Semiconductor MSC1164

PIN CONFIGURATION (TOP VIEW)

NC

DOUT

LS

CL

V

CC

HVO20

HVO19

HVO18

HVO17

HVO16

HVO15

HVO14

HVO13

HVO12

HVO11

10

11

12

13

14

15

16

1

2

3

4

5

6

7

8

9

32

31

30

29

28

27

26

25

24

23

22

21

20

19

18

17

NC

CHG

DIN

CLK

GND

V

HV

HVO1

HVO2

HVO3

HVO4

HVO5

HVO6

HVO7

HVO8

HVO9

HVO10

NC: No-connection pin

32-Pin Plastic SSOP

NC 1 CHG30

DOUT 2 DIN29

LS 3 CLK28

CL 4 GND27

VCC5V

26

HV

HVO20 6 HVO125

HVO19 7 HVO224

HVO18 8 HVO323

HVO17 9 HVO422

HVO16 10 HVO521

HVO15 11 HVO620

HVO14 12 HVO719

HVO13 13 HVO818

HVO12 14 HVO917

HVO11 15 HVO1016

NC: No-connection pin

30-Pin Plastic Shrink DIP

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¡ Semiconductor MSC1164

PIN DESCRIPTION

Pin SymbolFunction Description

Driver Output Driver output pin, applicable to each bit of shift register.

Driver Power Supply Power supply pin for driver circuit.

Driver GND

Logic GND

26 - 7

27 V

28

HVO1 HVO20

HV

GND

GND pin for the driver circuit. GND pin for the logic circuit.

Clear input pin with pull-up resistor. Normally "H" level. In this

CLClear Input 5

condition, the driver outputs "H" or "L" according to the corresponding latch output level. Setting this pin to "L" enables the driver output to be fixed at "L" irrespective of latch output.

Latch strobe input pin with neither pull-up nor pull-down resistor. When LS is "H", the output of the shift register becomes that of the

LSLatch Strobe Input 4

latch circuit. When LS is "L", the latch circuit holds the contents of the shift register that are immediately before LS goes "L".

Shift register input pin with neither pull-up nor pull-down resistor. Display data is input in synchronization with clock. (Positive Logic)

Power supply pin for logic (except driver). V

should be 4.5V to 5.5V.

CC

Logic Power Supply

30 DINData Input

6

V

CC

3 DOUTData Output Serial output pin for shift register.

29 CLKClock Input

Clock input pin. Data of shift register is shifted from one stage to the next at the rising edge of clock.

Test input pin with a pull-down resistor. Normally "L". If CL = "H"

31 CHGTest Input

in this condition, the driver outputs "H" or "L" according to the corresponding latch output.

Note: Pin numbers shown are for 32-pin plastic SSOP.

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¡ Semiconductor MSC1164

ABSOLUTE MAXIMUM RATINGS

Parameter Symbol Condition Rating Unit Note

Logic Supply Voltage V

Driver Supply Voltage V

Input Voltage V

Data Output Voltage V

Driver Driving Frequency f

Power Dissipation P

CC

HV

IN

OD

DRV

D

Applicable to logic supply

voltage pin

Applicable to driver supply

voltage pin

Applicable to all input pins

Applicable to data output pin

Thermal Resistance of

R

Package

Storage Temperature T

j-a

STG

Notes: 1) Maximum Supply Voltage with respect to GND

2) Stresses beyond "Absolute Maximum Rating" may cause permanent damage to the device.

3) Thermal resistance of the package (between junction and atmosphere) The junction temperature (Tj) expressed by the equation below must not exceed 150˚C. Tj=P ¥ Rj–a+Ta (P: Maximum power consumption)

–0.3 to +65 V 1

VCC to 70 V 1, 2

–0.3 to VCC +0.3 V 1

0 to 15 kHz —Duty cycle 50% max

790

mW —Ta £ 25°C

158 °C/W 3—

–55 to +150 °C ——

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¡ Semiconductor MSC1164

RECOMMENDED OPERATING CONDITIONS

Parameter Symbol Condition Max. Unit

Logic Supply Voltage V

High Level Input Voltage V

Low Level Input Voltage V

High Level Driver Output Current

I

OHVH1

OHVH2

Low Level Driver Output Current

CLK Frequency f

CLK Pulse Width t

Data in Setup Time t

Data in Hold Time t

LS Pulse Width t

CLK-LS Delay Time t

LS-CLK Delay Time t

LS-CHG Delay Time t LS-CL Delay Time t

CHG Pulse Width t

WCHG

CL Pulse Width t

Operating Temperature T

CC

HV

IH

IL

OHVL

f

WCLK

DS

DH

WLS

DCL

DLC

DLCG

DLCL

WCL

op

Applicable to logic supply voltage pin

Applicable to driver supply voltage pinDriver Supply Voltage V

Applicable to all input pins

Only one driver output is High

Other driver outputs are High

All driver output pins are HighI

Applicable to all driver output pinsI

See timing diagram

—

Min.

4.5

VCC=4.5V —V3.6

=5.5V —V4.4

V

CC

=4.5V 0.9 V—

V

CC

=5.5V 1.1 V—

V

CC

5.5 V

65 V10

–40 mA—

–2 mA—

2mA—

4 MHz—

—ns75

—ns50

—ns80

—ns50

—ns0

— ms0

— ms2

85 °C–40

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¡ Semiconductor MSC1164

ELECTRICAL CHARACTERISTICS

DC Characteristics

(V

=5V±10%, VHV=10V to 65V, Ta=–40°C to +85°C)

CC

Parameter Symbol Condition Max. Unit

Min.

Typ.

Logic Supply Current

Driver Supply Current

High Level Input Voltage

Low Level Input Voltage

Input Capacitance C

High Level Data Output Voltage

Low Level Data Output Voltage

High Level Data Output Voltage

Low Level Data Output Voltage

V

I

CC1

I

CC2

I

HV1

I

HV2

V

IH

V

IL

IN

ODH1

ODL1

ODH2

ODL2

No load

V

=5.5V

CC

No load

V

=5.5V

CC

—

IO=–20mA

I

=20mA

O

IO=–0.1mA

I

=0.1mA

O

All input: Low

All input: High, All

driver output: High, Ta=25°C

All driver output: Low

All driver output:

High, Ta=25°C

V

=4.5V ——3.15

CC

V

=5.5V ——3.85

CC

VCC=4.5V 1.35——

V

=5.5V 1.65——

CC

Ta=25°CInput Leakage Current I

Ta=25°C

=4.5V ——4.2

V

CC

V

=5.5V ——5.2

CC

VCC=4.5V 0.2——

V

=5.5V 0.2——

CC

V

=4.5V ——3.5

CC

V

=5.5V ——4.5

CC

VCC=4.5V 1.1——

V

=5.5V 1.1——

CC

—

2.3

—

3.4

1.00.5—

1

2.01.3—

±1 mA——

—pF15—

mA

V

High Level Driver Output Voltage

Low Level Driver Output Voltage

AC Characteristics

Parameter Symbol Remarks Max. UnitTyp.Min.

CLK-DOUT Delay Time t

Delay Time Low to High t

Transit Time Low to High t

Delay Time High to Low t

Transit Time High to Low t

OHVH

OHVL

PD

DLH

TLH

DHL

THL

I

=–40mAV

OHV

I

=2mAV

OHV

See timing diagram and test circuit

—V—VHV–4

3.0 V——

(V

=5V, VHV=65V, Ta=25°C)

CC

150 ns100—

1 ms0.3—

5 ms2—

1 ms0.3—

5 ms2—

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¡ Semiconductor MSC1164

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TIMING DIAGRAM

1/f f

CLOCK

DIN

LS

HVO (OTHERS)

CL

HVO (1, 2, 19, 20)

CHG

DOUT

T1/2 T3/4

T(19,20)

T1/2 T3/4

t

WCLKtWCLK

tDHt

DS

tDHt

DS

t

WD

t

PD

t

PD

t

DCLtWLStDLC

t

DLCG

t

WCHG

t

WCHG

t

DLCL

t

WCL

t

WCL

t

DLH

t

DLH

t

DHL

t

DHL

t

DLH

90%

10%

t

TLH

t

TLH

t

THL

t

THL

t

TLH

90%

¡ Semiconductor MSC1164

Test circuit

20pF

65V 5.0V

DIN

CLK

V

CC

V

HV

HVO1

1.5kW

HVO2

HVO20

DOUT

LS

CHG

CL

GND

30pF

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¡ Semiconductor MSC1164

FUNCTIONAL DESCRIPTION

Function Table

CLK

H L

CL CHG

L H

H

L: Low Level, H: High Level, X: Don't Care, NC: Change

R-1DIN

H

R1n

L

R1n

LS

X H

L

LL NCXH

X X

H

R2n R2n

R.X HVO.X

X X

H

L

R-4R-3R-2

R3n R3n

L

H

L

•••••••••••••••

R19n R19n

DOUTR-20

R19n R19n

NOTES ON USE

1. The MSC1164 is designed as a grid/anode driver of VFD. The data applied to the data input pin is read into the shift register at the rising edge of the clock and shifted sequencially to the shift register synchronizing with the clock. The shift register output drives the output driver, passing through the latch and the NOR circuit. Setting the CL pin to "L" makes all driver outputs go into "L". This function can be used for setting display blanking.

2. The contents of the shift register are undefined after power is turned on. Therefore, two or more driver outputs may go into "H" at the same time after power-on. (If it happens, an overloading beyond the power dissipation limit may occur to cause a device break-down.) To avoid this, take the following procedure:

1) Turn on the power of the logic portion while holding the CL pin to "L".

2) Turn on the power of the driver portion.

3) Apply a "L" level signal to the DIN pin and send clock pulses by the specified number

of grids to reset ("L") the entire contents of the shift register.

4) Initialize the driver outputs to "L".

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¡ Semiconductor MSC1164

PACKAGE DIMENSIONS

(Unit : mm)

SSOP32-P-430-1.00-K

Mirror finish

Package material Lead frame material Pin treatment Solder plate thickness Package weight (g)

Epoxy resin 42 alloy Solder plating 5 mm or more

0.60 TYP.

Notes for Mounting the Surface Mount Type Package

The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times).

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¡ Semiconductor MSC1164

(Unit : mm)

SDIP30-P-400-1.78

Package material Lead frame material Pin treatment Solder plate thickness Package weight (g)

Epoxy resin 42 alloy Solder plating 5 mm or more

1.80 TYP.

Notes for Mounting the Surface Mount Type Package

The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times).

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