The MSC1163 is a monolithic IC using the Bi-CMOS process for hybridizing CMOS and bipolar
transistors on the same chip. The logic portion such as the input stage, shift register and latch is
fabricated by CMOS and the output driver requiring a high withstand voltage is fabricated by
bipolar transistors.
Since the 60-pin plastic SSOP package is adopted and the pin configuration allows the circuit
wiring to be formed on the single side PCB, the display unit size can be reduced.
The shift register has a bidirectional configuration; therefore, it is easy to design the circuit wiring
in which devices are arranged so that they are symmetric with respect to the display.
FEATURES
The MSC1163 is designed as a VFD anode driver with emitter-follower output providing 40-bit
active pull-down and built-in 40-bit bidirectional shift register and latch.
Driver output pin, applicable to each bit of shift register
Power supply pin for driver circuit
40
22
39
GND 1
—
GND pin for driver circuit. Connect this pin to GND2 near
the mounted IC so that GND1 and GND2 will be at
common level.
23
38
GND 2
CL24
—
GND pin for the logic circuit (excluding driver circuit)
GND1 and GND2 are not connected inside of the IC.
I
Clear input pin with pull-up resistor. Normally "H" level.
In this condition, the driver outputs "H" or "L" according to
the corresponding latch output level. Setting to "L"
enables the driver output to be fixed at "L" without respect
to latch output.
26
LS
I
Latch strobe input pin with neither pull-up nor pull-down
resistor. When LS is "H", the output of the shift register
becomes that of the latch circuit. When LS is "L", the latch
circuit holds the contents of the shift register before LS
goes "L".
28
R/L
I
Shift direction control pin with a pull-up resistor.
Normally "H", and in this condition, data of bidirectional
shift register is shifted to the direction of R-40 from R-1.
When this pin is "L", bidirectional shift register shifts data
to the direction of R-1 from R-40.
Data Input
Logic Power Supply
29DINShift register input pin with neither pull-up nor pull-down
30
V
CC
31
Data Output
Clock Input
Test InputI
32DOUT
34CLK
36CHG
—
O
I
resistor. Display data is input in synchronization with
clock. (Positive logic)
Power supply pin for logic (except driver)
V
should be 4.5V to 5.5V.
CC
Serial output of bidirectional pin shift register. When R/L
is "H", DOUT outputs R-40's output. When R/L is "L",
DOUT outputs R-1's output.
I
Clock input pin with neither pull-up nor pull-down resistor.
Data of shift register is shifted from one stage to the next
at the rising edge of clock.
Test input pin with a pull-down resistor. Normally "L".
If CL = "H" in this condition, the driver outputs "H" or "L"
according to the corresponding latch output.
If CL = "H", setting CHG to "H" enables the driver output to
be fixed at "H" without respect to latch output.
6/13
Page 7
¡ SemiconductorMSC1163
ABSOLUTE MAXIMUM RATINGS
ParameterSymbolConditionRatingUnitNote
Logic Supply VoltageV
Driver Supply VoltageV
Input VoltageV
Data Output VoltageV
Driver Driving Frequencyf
Power DissipationP
Package Thermal Resistance
Storage TemperatureT
DRV
R
STG
CC
HV
IN
OD
D
j-a
Applicable to logic supply
voltage pin
Applicable to driver supply
voltage pin
Applicable to all input
pins
Applicable to data output
pin
Notes: 1) Maximum Supply Voltage with respect to GND
2) Permanent damage may be caused if the voltage is supplied over the rating.
3) Package Thermal Resistance (between junction and atmosphere)
The junction temperature (Tj) given by the equation indicated below should not
exceed 150°C.
Tj=P ¥ R
+Ta (P: Maximum power consumption)
j–a
–0.3 to +6.5V1
VCC to 70V1, 2
–0.3 to VCC +0.3V1
–0.3 to VCC +0.3V1
0 to 15kHz—Duty cycle 50% max
860
mW—Ta £ 25°C
145°C/W3—
–55 to +150°C——
7/13
Page 8
¡ SemiconductorMSC1163
RECOMMENDED OPERATING CONDITIONS
ParameterSymbolConditionMax.Unit
Logic Supply VoltageV
High Level Input VoltageV
Low Level Input VoltageV
High Level Driver Output
Current
Low Level Driver Output
Current
CLK Frequencyf
CLK Pulse Widtht
Data in Setup Timet
Data in Hold Timet
LS Pulse Widtht
CLK-LS Delay Timet
LS-CLK Delay Timet
LS-CHG Delay Timet
LS-CL Delay Timet
CHG Pulse Widtht
WCHG
CL Pulse Widtht
Operating TemperatureT
CC
HV
IH
IL
OHVH
OHVL
f
WCLK
DS
DH
WLS
DCL
DLC
DLCG
DLCL
WCL
op
Applicable to logic supply voltage pin
Applicable to driver supply voltage pinDriver Supply VoltageV
Applicable to all input
pins
Applicable to all input
pins
Applicable to all driver output pinsI
Applicable to all driver output pinsI
See timing diagram
See timing diagram
See timing diagram
See timing diagram
See timing diagram
See timing diagram
See timing diagram
See timing diagram
See timing diagram
See timing diagram
See timing diagram
—
Min.
4.5
VCC=4.5V—V3.6
=5.5V—V4.4
V
CC
=4.5V0.9V—
V
CC
=5.5V1.1V—
V
CC
5.5V
65V10
–2mA—
2mA—
4MHz—
—ns75
—ns50
—ns50
—ns80
—ns50
—ns0
—ms0
—ms0
—ms2
—ms2
85°C–40
8/13
Page 9
¡ SemiconductorMSC1163
ELECTRICAL CHARACTERISTICS
DC Characteristics
=5V±10%, VHV=10V to 65V, Ta=–40°C to +85°C)
(V
CC
ParameterSymbolConditionMax.Unit
Min.
Typ.
Logic Supply Current
I
Driver Supply Current
I
High Level Input Voltage
Low Level Input Voltage
Input CapacitanceC
High Level Data Output
Voltage
Low Level Data Output
Voltage
High Level Data Output
Voltage
Low Level Data Output
Voltage
V
V
V
V
I
CC1
I
CC2
HV1
HV2
V
IH
V
IL
IN
IN
ODH1
ODL1
ODH2
ODL2
No load
V
=5.5V
CC
No load
V
=5.5V
CC
—
—
IO=–20mA
I
=20mA
O
IO=–0.1mA
I
=0.1mA
O
All input: Low
All input: High, All
driver output: High, Ta=25°C
All driver output: Low
All driver output:
High, Ta=25°C
V
=4.5V——3.15
CC
V
=5.5V——3.85
CC
VCC=4.5V1.35——
V
=5.5V1.65——
CC
Ta=25°CInput Leakage CurrentI
Ta=25°C
=4.5V——4.2
V
CC
V
=5.5V——5.2
CC
VCC=4.5V0.2——
V
=5.5V0.2——
CC
V
=4.5V——3.5
CC
V
=5.5V——4.5
CC
VCC=4.5V1.1——
V
=5.5V1.1——
CC
—
—
4.3
—
6.65
1.00.5—
1
3.82.45—
±1mA——
—pF15—
mA
mA
mA
V
V
V
V
V
V
V
V
V
V
V
V
High Level Driver Output
Voltage
Low Level Driver Output
Voltage
AC Characteristics
ParameterSymbolConditionMax.UnitTyp.Min.
CLK-DOUT Delay Timet
Delay Time Low to Hight
Transit Time Low to Hight
Delay Time High to Lowt
Transit Time High to Lowt
OHVH
OHVL
PD
DLH
TLH
DHL
THL
I
=–2mAV
OHV
I
=2mAV
OHV
See timing diagram and test circuit
See timing diagram and test circuit
See timing diagram and test circuit
See timing diagram and test circuit
See timing diagram and test circuit
—V—VHV–3
3.0V——
(V
=5V, VHV=65V, Ta=25°C)
CC
150ns100—
1ms0.3—
5ms3—
1ms0.3—
5ms2—
9/13
Page 10
¡ SemiconductorMSC1163
10/13
TIMING DIAGRAM
1/f f
CLOCK
DIN
LS
HVO (OTHERS)
CL
HVO (1, 2, 39, 40)
CHG
DOUT
T1/2T3/4
T39/40T1/2T3/4
t
WCLKtWCLK
tDHt
DS
tDHt
DS
t
WD
t
PD
t
PD
t
DCLtWLStDLC
t
DLCG
t
WCHG
t
WCHG
t
DLCL
t
WCL
t
WCL
t
DLH
t
DLH
t
DHL
t
DHL
t
DLH
90%
10%
10%
t
TLH
t
TLH
t
THL
t
THL
t
TLH
90%
Page 11
¡ SemiconductorMSC1163
Test circuit
20pF
65V5.0V
DIN
CLK
V
CC
V
HV
HVO1
30kW
HVO2
HVO40
DOUT
LS
R/L
CHG
CL
GND1, 2
30pF
11/13
Page 12
¡ SemiconductorMSC1163
FUNCTIONAL DESCRIPTION
Notes on Use
1. The MSC1163GS is designed as an anode driver of VFD.
The data applied to the data input pin is read into the shift register at the rising edge
of the clock and shifted sequencially to the shift register synchronizing with the
clock.
The shift register output drives the output driver, passing through the latch and the
NOR circuit.
Setting the CL pin to "L" makes all driver outputs go into "L". This function can be
used for setting display blanking.
2. The contents of the shift register are undefined after power is turned on.
Therefore, two or more driver outputs may go into "H" at the same time after poweron.
To avoid this, take the following procedure:
1) Turn on the power of the logic portion while holding the CL pin to "L".
2) Turn on the power of the driver portion.
3) Apply a "L" level signal to the DIN pin and send clock pulses by the specified
number of grids to reset ("L") the entire contents of the shift register.
Function Table
LS
X
X
H
H
R-1R/L
H
L
R2n
R2n
R.XHVO.X
X
X
H
L
R1n
R1n
R3n
R3n
R2n
R2n
R4n
R4n
L
H
H
L
R3n
R3n
R5n
R5n
CLK
H
H
L
L
CLCHG
L
H
H
H
DIN
H
L
H
L
X
H
L
L
LLNCXH
L : Low Level, H: High Level, X: Don't Care, NC: No Change
R39n
R39n
H
L
DOUTR-40• • • • • • • •R-4R-3R-2
R39n
R39n
R2n
R2n
12/13
Page 13
¡ SemiconductorMSC1163
PACKAGE DIMENSIONS
(Unit : mm)
SSOP60-P-700-0.65-BK
Mirror finish
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5 mm or more
1.21 TYP.
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
13/13
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