Datasheet MSC1157MS-K, MSC1157RS Datasheet (OKI)

E2D0048-39-22

¡ Semiconductor MSC1157

¡ Semiconductor

This version: Feb. 1999

Previous version: May. 1997

MSC1157

Speaker Drive Amplifier

GENERAL DESCRIPTION

The MSC1157, designed specifically to operate at a low voltage with low current consumption,
is a power amplifier developed for driving a speaker for a voice IC.
The voltage gains can be adjusted over a range of up to ten. The differential output can directly
drive a speaker without any output coupling capacitors. The MSC 1157, because of its ability to
stand by, is ideally suitable for portable equipment applications powered by a battery.

FEATURES

• Low voltage operation : 2.0 to 6.0 V (Single power supply)

• Low current dissipation
Operating current : 1.6mA without load (typ.)

• Standby function : Current dissipation less than 1 mA in standby

• High output current : 350mA peak

• Differential outputs : A speaker can be directly connected between

differential outputs.

• Adjustable gain : Gain can be adjusted by use of an external resistor.

• Package options:

8-pin plastic DIP (DIP8-P-300-2.54) (Product name : MSC1157RS)
8-pin plastic SOP (SOP8-P-250-1.27-K) (Product name : MSC1157MS-K)
Chip

BLOCK DIAGRAM

STBY

SEL

VR

A

IN

GND

V

CC

Logic

V

CC

52 kW50 kW

+

–

20 kW

100 kW

+

–

5 kW

5 kW

V

SP

SP

CC

1/13

¡ Semiconductor MSC1157

PIN CONFIGURATION (TOP VIEW)

PIN DESCRIPTIONS

Pin

5

4

2

Symbol

V

GND — Ground pin.

Type Description

CC

A

IN

— Power supply pin.

I Signal input pin for analog signal inputs, etc.

VR

A

IN

SP

GND

1

2

3

4

8

SEL

7

STBY

6

SP

5

V

CC

8-Pin Plastic DIP

or

8-Pin Plastic SOP

Digital input pins. Setting these pins configures the standby status. See the table below

for how to set the pins.

7, 8

1

STBY,

SEL

VR O

SEL STBY Status

0 Operation

0 1 Standby

Clock Operation

0 Standby

1 1 Operation

I

Clock Operation

0 Operation

Clock 1 Operation

Clock

Unstable Operation

Applying a clock between 32kHz and 4MHz to either the STBY or the SEL pin leads the IC

to operation status regardless of the status set at the other pin. Applying clocks to both

of the pins at the same time may cause malfunction.

Refer to the section, RECOMMENDED OPERATING CONDITIONS since clock frequencies

are changed by setting the SEL pin.

Bias output pin for internal circuits. This pin is at GND potential during standby.

Connecting a capacitor between VR and the GND pin reduces the pop-up noise at power

on and improves the ripple elimination ratio.

3

6

SP O Speaker output pin. This pin outputs a negative phase with respect to the input signal.

SP O Speaker output pin. This pin outputs a positive phase with respect to the input signal.

2/13

¡ Semiconductor MSC1157

ABSOLUTE MAXIMUM RATINGS

Parameter

Power Supply Voltage V

Symbol

CC

Condition Rating Unit Remark

Ta=25°C –0.3 to +6.5 V V

CC

STBY

Input Voltage V

IN

Ta=25°C –0.3 to VCC+0.3 V

A

IN

, SEL

(*1)

Maximum Output Current I

OMAX

Ta=25°C

±400 mA SP, SP

470 mW DIP type

Power Dissipation P

Junction Temperature

Storage Temperature

T

T

D

jMAX

STG

Ta=25°C

400 mW SOP type

— 125 °C Chip

— –55 to +150 °C

*1 Avoid shorting the output pins (SP and SP) to VCC or GND because the IC may be damaged.

RECOMMENDED OPERATING CONDITIONS

Parameter

Power Supply Voltage V

Load Impedance (*2) RL

Peak Load Current I

"H" Input Voltage V

"L" Input Voltage V

STBY Operating Frequency (*3) f

Operating Temperature Top

Symbol

CC

O-P

IH

IL

STBY

Condition

—

—

—

For STBY and SEL pins

SEL = "L"

At clock input

≥ 2.4 V

V

CC

SEL = "H"

At clock input

≥ 2.4 V

V

CC

—

2.0 6.0 V

8.0 — W

— 350 mA

0.7 V

CC

— 0.3 V

—V

CC

32 k 4.096 M

32 k 1 M

–20 +70 °C

UnitMin. Max.

V

Hz

*2 A speaker of 8 W (standard) or more should be used.
*3 The input of clocks may cause a little noise in output waveforms.

It is recommended to input the DC voltage to inprove voice quality.

3/13

¡ Semiconductor MSC1157

ELECTRICAL CHARACTERISTICS

Unless otherwise specified, Ta=25°C, V

Parameter Symbol Condition UnitMax.Typ.Min.

Input Resistance R

A

IN

Voltage Gain A

IN

A

V1

V2

A

AINÆ(Between SP-SP) 20.512019.46

V3

—kW262014

AINÆSP 14.491413.44

SPÆSP dB+1.580–1.94

VCC=3 V, f=1 kHz

P

OUT1

RL=8 W, THD≥10%

Output Power

VCC=6 V, f=1 kHz

P

OUT2

THD1

Total Harmonic Distortion

THD2

RL=32 W, THD≥10%

V

=3 V, RL=8 W

CC

f=1 kHz, P

=6 V, RL=32 W

V

CC

f=1 kHz, P

=45 mW

OUT

=125 mW

OUT

Ripple Elimination Ratio RR f=1 kHz, C2=4.7 mFdB—4330

Output DC Voltage
(*4)

V

Output Offset Voltage DV

O

signal state

O

In no

Between SP-SP mV±30——

VCC=2 V 0.770.650.53

=6 V 2.732.612.49

V

CC

AIN=VCC or GND

V

OH

I

=–100 mA

OUT

AIN=VCC or GND

Output "L" Voltage

STBY, SEL

Input Current

VR Equivalent Resistance R

Circuit Current During Operation I

Circuit Current During Standby I

V

I

I

CCS

OL

IH

IL

VR

CC

=100 mA

I

OUT

VI=V

CC

VI=GND mA±0.1——

—

VCC=6 V, RL=• mA2.41.61.1

— mA1.0——

CC

=2 to 6 V

CC

mW—178100

mW—440300

%—1.2—

%—0.37—

V

–1.04VCC–1.15Output "H" Voltage

V—V

V0.30.17—

mA±0.1——

kW322518

*4 The typical value of the output voltage in no signal state is determined from the following

equation.

50 kW

VO = (V

CC

– 0.67)

50 kW + 52 kW

4/13

¡ Semiconductor MSC1157

APPLICATION CIRCUIT

+

C4 C3

–

Standby
Select
Input

Standby
Input

Audio
Input

C1

SEL

STBY

A

IN

VR

+

C2

–

V

CC

GND

SP

Speaker

SP

• If parasitic capacitance of 60pF or more exists between GND and the speaker output pin SP or

SP, oscillation may occur. Implement the circuit mount design so as to be less than 60pF.

• C1 is the AC coupling capacitor. Cutoff frequency fc on the low frequency side is determined

by the following equation. Choose a value of C1 according to the bandwidth.

1

fc =

(Hz)

2 ¥ p ¥ C1 ¥ 20k

• Choose a value of C2 that is 80 to 100 times as large as that of C1.

• When the standby function is not used, connect the pins STBY and SEL to VCC or GND.

• It is recommended that the capacitor C4 (approximately 0.1mF) having better high frequency

characteristics and the capacitor C3 (approximately 10mF) be placed between the pins VCC and
GND.

5/13

¡ Semiconductor MSC1157

GAIN ADJUSTMENT

1. Gain Adjustment Using Input Resistance (This approach allows gain adjustment with

fewer external components)

Standby
Select
Input

Standby
Input

Audio
Input

SEL

STBY

C1

R1

A

IN

+

C2

–

VR

V

GND

CC

SP

Speaker

SP

• Cutoff frequency fc on the low frequency side is determined from the equation:

fc =

.

.

1

(Hz)

2 ¥ p ¥ C1 ¥ (R1 + 20k)

• Voltage gain AV1 is determined from the equation:

AV1 =

.

100k

.

(V/V)

R1 + 20k

2. Gain Adjustment Using Feedback Resistance (This approach has the advantage over
the above approach (less noise approach), but the number of components is increased)

Standby
Select
Input

Standby
Input

Audio
Input

SEL

STBY

R1

C1

A

IN

+

–

VR

C2

R2

V

GND

CC

SP

Speaker

SP

• Cutoff frequency fc on the low frequency side is determined from the equation:

fc =

.

.

1

(Hz)

Zin =

.

.

R1 +

2 ¥ p ¥ C1 ¥ Zin

R2 ¥ 20k

(W)

R2 + 120k

• Voltage gain AV1 is determined from the equation:

R1

20k

5

(V/V)

6 ¥ R1

+

R2

AV1 =

.

.

1 +

6/13

¡ Semiconductor MSC1157

OPERATING CHARACTERISTICS

Power Dissipation vs. Ambient Temperature

800

700

600

[mW]

D

500

400

DIP

SOP

300

Power Dissipation P

200

100

0

-30 -20 -10 0 10 20 30 40 50 60 70 80 90 100

Ambient Temperature Ta [°C]

Power Dissipation vs. Output Power

1000

RL=8W

800

VCC=6.0V

Maxiumum Output Amplitude vs. Voltage Supply

12

RL=•

[V]

OM

10

8

6

RL=64W
RL=32W

RL=16W

RL=8W

4

Maximum Output Amplitude V

2

0

1234567

Supply Voltage VCC [V]

Power Dissipation vs. Output Power

1000

RL=16W

800

[mW]

D

600

VCC=4.5V

400

Power Dissipation P

VCC=3.0V

200

0 100 200 300 400 500 600

Output Power P

OUT

[mW]

Power Dissipation vs. Output Power

1000

RL=32W

800

[mW]

D

600

400

[mW]

D

600

VCC=6.0V

400

Power Dissipation P

200

VCC=3.0V

VCC=4.5V

0 100 200 300 400 500 600

Output Power P

OUT

[mW]

Power Dissipation vs. Output Power

1000

RL=64W

800

[mW]

D

600

400

Power Dissipation P

200

VCC=4.5V

VCC=6.0V

VCC=3.0V

0 100 200 300 400 500 600

Output Power P

OUT

[mW]

Power Dissipation P

200

VCC=3.0V

VCC=6.0V

VCC=4.5V

0 100 200 300 400 500 600

Output Power P

OUT

[mW]

7/13

¡ Semiconductor MSC1157

2E-3

1.5E-3

[A]

CC

1E-3

Circuit Current I

5E-4

0 1

2

SP Output

1.8

1.6

1.4

[V]

OL

1.2

1

0.8

0.6

Output "L" Voltage V

0.4

0.2

Circuit Current vs. Voltage Supply

234567

Supply Voltage VCC [V]

Output Voltage vs. Load Current

VCC=2.0V

VCC=3.0V
VCC=6.0V

350

300250200150100500

Load Current I

OUT

[mA]

VR Rise Time vs. Capacitor Value (C2)

10000

1000

100

10

1

VR Rise Time (0 to 90%) [ms]

0.1

Output Voltage vs. Load Current

0

SP Output

-0.2

-0.4

) [V]

O

-V

-0.6

CC

VCC=6.0V

(V

VCC=3.0V

-0.8

OH

-1
VCC=2.0V

-1.2

-1.4

-1.6

Output "H" Voltage V

-1.8

-2

Capacitor C2 [mF]

Load Current I

OUT

[mA]

1010.11E-2

100

350

300250200150100500

2

SP Output

1.8

1.6

1.4

[V]

OL

1.2

1

0.8

0.6

Output "L" Voltage V

0.4

0.2

Output Voltage vs. Load Current

Load Current I

OUT

[mA]

VCC=2.0V

VCC=3.0V
VCC=6.0V

300250200150100500

350

0

SP Output

-0.2

-0.4

) [V]

O

-V

-0.6

CC

(V

VCC=6.0V
VCC=3.0V

-0.8

OH

-1

VCC=2.0V

-1.2

-1.4

-1.6

Output "H" Voltage V

-1.8

-2

Output Voltage vs. Load Current

Load Current I

OUT

[mA]

300250200150100500

350

8/13

¡ Semiconductor MSC1157

]

]

]

Circuit Curent vs. Ambient Temperature

2.4

2.2

2

1.8

1.6

Circuit Current [mA]

1.4

1.2

1

0.8

64

60

56

52

-20

Range of Ambient Temp.

0 20 40 100 140-40

Ambient Temperature [°C

VR Resistance vs. Ambient Temperature

60 80 120

VCC = 6.0V

VCC = 2.0V

48

VR Resistance [kW]

44

40

36

3

[mA]

CCS

2.6

2.2

1.8

1.4

1

0.6

Circuit Current during standby I

0.2

-20

Range of Ambient Temp.

0 20 40 100 140-40

Circuit Current during Standby vs. Ambient Temperature (V

Range of Ambient Temp.

60 80 120

Ambient Temperature [°C

= 6.0V)

CC

-0.2

-20

0 20 40 100 140-40

Ambient Temperature [°C

60 80 120

9/13

¡ Semiconductor MSC1157

]

]

10

Total Harmonic Distortion vs. Output

VCC=3V
RL=16W

VCC=3V
RL=8W

VCC=4.5V
RL=16W

VCC=6V
RL=32W

VCC=4.5V
RL=8W

5

VCC=6V
RL=16W

Total Harmonic Distortion THD [%]

0

0 100 200 300 400 500 600

Output Power P

OUT

[mW]

Total Harmonic Distortion vs. Output

10

VCC=3V
RL=16W

VCC=3V
RL=8W

VCC=4.5V
RL=16W

VCC=6V
RL=32W

VCC=4.5V
RL=8W

f=1kHz

f=3kHz

26

23

20

C1=0.47

mF

17

C1=0.22

[dB]

14

V3

C1=0.1

11

8

C1=0.047

Voltage Gain A

5

2

-1

-4
20

5

Total Harmonic Distortion THD [%]

0

0 100 200 300 400 500 600

Voltage Gain vs. Frequency

mF

mF

mF

100 1k 10k 20k

Frequency f [Hz

SEL V

C1

STBY
A

IN

VR GND

Vi

CC

SP

SP

Output Power P

V

O

[mW]

OUT

Ripple Elimination Ratio vs. Frequency

20

C2=0 mF

10

0

-10

C

2

=

2

.2

m

-20

-30

-40

F

C

2

=

4

.7

m

F

C

2

=

1

0

m

F

C

2

=

2

2

m

F

-50

Ripple Elimination Ratio RR [dB]

-60

-70

-80
50

100 1k 10k 20k

VCC=6V
RL=16W

Frequency f [Hz

SEL V
STBY
A

IN

VR GND

C2

Vi

CC

SP

V

O

SP

10/13

¡ Semiconductor MSC1157

PAD CONFIGURATION

Pad Layout

Chip size : X=2.3mm, Y=2.4mm

Chip thickness : 350±30mm

Pad size (PV aperture) : 110¥110mm
Substrate potential : GND
Pad location diagram

Y-Axis

218 7

3

Pad Coordinates

(Chip center is located at X=0 and Y=0.)

Pad No. Pad Name X-AXIS Y-AXIS

1 VR –133 1035

2A
3 SP –950 –263

4 GND –180 –1027

5V

6 SP 950 –263

7 STBY 985 1035

8 SEL 159 1035

CC

X-Axis

6

5

4

(Unit: µm)

IN

–985 1035

240 –914

11/13

¡ Semiconductor MSC1157

PACKAGE DIMENSIONS

(Unit : mm)

DIP8-P-300-2.54

Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)

Epoxy resin
42 alloy
Solder plating
5 mm or more

0.46 TYP.

12/13

¡ Semiconductor MSC1157

(Unit : mm)

SOP8-P-250-1.27-K

Mirror finish

Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)

Epoxy resin
42 alloy
Solder plating
5 mm or more

0.10 TYP.

Notes for Mounting the Surface Mount Type Package

The SOP, QFP, TSOP, TQFP, LQFP, SOJ, QFJ (PLCC), SHP, and BGA are surface mount type
packages, which are very susceptible to heat in reflow mounting and humidity absorbed in
storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person
on the product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).

13/13

E2Y0002-29-11

NOTICE

1. The information contained herein can change without notice owing to product and/or
technical improvements. Before using the product, please make sure that the information
being referred to is up-to-date.

2. The outline of action and examples for application circuits described herein have been
chosen as an explanation for the standard action and performance of the product. When
planning to use the product, please ensure that the external conditions are reflected in the
actual circuit, assembly, and program designs.

3. When designing your product, please use our product below the specified maximum
ratings and within the specified operating ranges including, but not limited to, operating
voltage, power dissipation, and operating temperature.

4. Oki assumes no responsibility or liability whatsoever for any failure or unusual or

unexpected operation resulting from misuse, neglect, improper installation, repair, alteration
or accident, improper handling, or unusual physical or electrical stress including, but not
limited to, exposure to parameters beyond the specified maximum ratings or operation
outside the specified operating range.

5. Neither indemnity against nor license of a third party’s industrial and intellectual property
right, etc. is granted by us in connection with the use of the product and/or the information
and drawings contained herein. No responsibility is assumed by us for any infringement
of a third party’s right which may result from the use thereof.

6. The products listed in this document are intended for use in general electronics equipment
for commercial applications (e.g., office automation, communication equipment,
measurement equipment, consumer electronics, etc.). These products are not authorized
for use in any system or application that requires special or enhanced quality and reliability
characteristics nor in any system or application where the failure of such system or
application may result in the loss or damage of property, or death or injury to humans.
Such applications include, but are not limited to, traffic and automotive equipment, safety
devices, aerospace equipment, nuclear power control, medical equipment, and life-support
systems.

7. Certain products in this document may need government approval before they can be
exported to particular countries. The purchaser assumes the responsibility of determining
the legality of export of these products and will take appropriate and necessary steps at their
own expense for these.

8. No part of the contents cotained herein may be reprinted or reproduced without our prior
permission.

9. MS-DOS is a registered trademark of Microsoft Corporation.

Copyright 1999 Oki Electric Industry Co., Ltd.

Printed in Japan